Abstract: A compound containing a crosslinkable moiety, a curable prepolymer, a blend, and a polymer sheet obtained therefrom, and an optical waveguide for optical interconnection. The compound is represented by the formula below: Ar—H wherein Ar includes a crosslinkable moiety at one end, a moiety selected from the group consisting of —O—, —S—, —COO—, —CO—, —COS—, —SO2—, and —NH—, and one or two repeating units selected from the group consisting of the following repeating units: wherein A in the repeating unit is carbon or nitrogen, and X is hydrogen or halogen. At least one of the core and the cladding in the optical waveguide includes the polymer sheet.

Abstract: Polycarbonate compositions are disclosed. The compositions comprise a polycarbonate polymer (A) having repeating units derived from at least three different monomers, one monomer being 2-phenyl-3,3-bis(4-hydroxyphenyl)phthalimidine (PPPBP); and the other two monomers having the formula: wherein each Rk is independently a halogen atom, a C1-10 hydrocarbon group, or a C1-10 halogen substituted hydrocarbon group, and n is 0 to 4; and an impact modifier (B). The resulting composition has improved heat resistance and chemical resistance, particularly to Fuel C.

Abstract: A composition for coating food cans is disclosed. The composition comprises a polyester, an acrylic copolymer and a crosslinker; the polyester and acrylic copolymer have been compatibilized in some way, such as through graft copolymerization. Methods for compatibilizing acrylics and polyesters are also disclosed as are methods for coating cans using compositions comprising acrylic and polyesters.

Abstract: Farnesene interpolymer comprises units derived from a farnesene (e.g., ?-farnesene or ?-farnesene) and units derived from at least one vinyl monomer. The farnesene interpolymer can be prepared by copolymerizing the farnesene and at least one vinyl monomer in the presence of a catalyst. In some embodiments, the farnesene is prepared from a sugar by using a microorganism. In other embodiments, the at least one vinyl monomer is ethylene, an ?-olefin, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof.

Abstract: The present invention relates to a resin composition for an optical material comprising (A) a carboxylic acid-modified phenoxy resin, (B) a polymerizable compound and (C) a polymerization initiator, a resin film for an optical material comprising the above resin composition and an optical waveguide having a core part and/or a cladding layer formed by using the same. Provided are a resin composition for an optical material which is excellent in a heat resistance and a transparency and which is soluble in an alkaline aqueous solution, a resin film for an optical material comprising the above resin composition and an optical waveguide produced by using the same.

Abstract: The present invention relates to compositions and methods for producing articles from recycled materials. In one embodiment, a recycled polymeric matrix containing a super adsorbant polymer is thermally and/or chemically treated to produce a modified polymeric matrix. In a preferred embodiment, a modified polymeric matrix is subsequently melt processed with a filler. Articles produced from the modified polymeric matrix and the composites of this invention are useful as building materials, automotive components and consumer goods.

Abstract: The present invention relates to a block copolymer prepared by ATRP, wherein the polymer chain terminal group is structurally modified with the functionally effective group of a lubricant or polymer additive selected from the group consisting of antioxidants, metal deactivators, antiwear and extreme pressure additives and corrosion inhibitors. The invention also relates to a composition comprising the structurally modified block copolymer and a composition of matter subject to oxidative, thermal or light induced degradation, such as lubricants or polymers.

Abstract: Disclosed herein is a two-component structural adhesive based on organic compounds containing radically polymerizable multiple bonds, in particular substituted acrylates and/or methacrylates, which on account of their lack of acids are particularly suited for adhering rare earth permanent magnets based on neodymium-iron-boron.

Abstract: The present invention relates to a plastic composite material and a process for obtaining it. Particularly, the present invention relates to a polymeric composite material comprising an epoxy vinylester resin in which a filler is disupersed, said filler being polyethylene in particulate form, wherein said polyethylene is admixed in an amount less than 55% by weight relative to the epoxy vinylester resin, and a process for obtaining the same in which the resin/styrene mixture and the polyethylene is subjected to a treatment in vacuo and placed under stirring for more than 2 hours.

Abstract: This invention is directed to an adhesive composition having (1) a elastomer component, (2) a resole phenolic resin, and (3) a flame retardant resin that is not (2) a resole phenolic resin. Further, the adhesive compositions of the invention includes (1) a elastomer component and (2) a resole phenolic resin, wherein the (2) resole phenolic resin content is 20 to 50 wt % based on the total amount of the adhesive composition excluding any solvent.

Abstract: Provided is curable resin composition which gives a cured article excellent in chemical resistance, dielectric properties, low water-absorption, heat resistance, flame retardance, and mechanical properties and which is usable in applications such as dielectric materials, insulating materials, heat-resistant materials, and structural materials. The curable resin composition includes a component (A) which is a polyphenylene ether oligomer having a number-average molecular weight of 700 to 4,000 and having a vinyl group at both end and a component (B) which is a solvent-soluble polyfunctional vinylaromatic copolymer which has structural units derived from monomers including a divinylaromatic compound (a) and an ethylvinylaromatic compound (b) and in which the content of repeating units derived from the divinylaromatic compound (a) is 20 mol % or higher, the ratio of the amount (wt. %) of the component (A) to that (wt. %) of the component (B) being (20 to 98):(2 to 80).

Abstract: There is provided: a lightweight peripheral component for audio equipment having a good balance between a large internal loss and excellent mechanical properties, and having excellent thermal resistance, dimensional stability, and an excellent S/N ratio; and a speaker using the same. The peripheral component for audio equipment of the present invention contains a polyphenylene ether-based resin (A), a polystyrene-based resin (B), and a polyolefin-based resin (C).

Abstract: The present invention provides a thermoplastic composition which may be unvulcanized or vulcanized. The thermoplastic composition can be a blend of a thermoplastic engineering resin, a halogenated terpolymer of a C4 to C7 isomonoolefin, a para-alkylstyrene, and a multiolefin. The engineering resin can be a polyamide, such as nylon 6/66 copolymers for example. The isomonoolefin can be an isobutylene for example. The multiolefin can be a C4 to C14 diene, such as isoprene for example.

Abstract: The present invention is a thermosetting bismaleimide resin system comprising a liquid phase and a solid phase where the non-crystallizing liquid phase contains the curing agents diallyl ether of a substantially aromatic radical and a bis(alkenylphenoxy) ether of a substantially aromatic radical along with a substantially aromatic bismaleimide as a particle slurry and optionally a free radical inhibitor. The curing agents are non-crystallizing compositions for use in bismaleimide resin formulations to increase the thermal durability of a cured resin composite as shown by reduced microcracking as measured by reduced weight loss after thermal aging. The present invention resists microcracking over bismaleimide resin systems which incorporate other curing agents or combinations of curing agents. The present invention further provides a bismaleimide resin formulation suitable to make prepregs with reduced crystallization for reduced viscosity supporting improved manufacturing properties and improved tack.

Abstract: A redispersible polymer powder including: a polymer to be redispersed; and an ortho-cresol based condensation product or salt thereof; wherein the ortho-cresol based condensation product or salt thereof includes N-containing units derived from a N-based component incorporated into the ortho-cresol based condensation product or salt thereof during polymerisation.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: A polyphenylene ether resin composition comprising a polyphenylene ether, wherein the polyphenylene ether has a polymer chain comprising recurring units each represented by the following formula (1): and has the following characteristics (a), (b) and (c): (a) when the polyphenylene ether is analyzed by 1H-NMR, the polyphenylene ether exhibits a triplet signal (S1) at 3.55 ppm, wherein the triplet signal (S1) has a relative intensity of 0.05 to 0.25 in terms of the percentage of the integrated intensity of the triplet signal (S1), based on the integrated intensity of a signal (S2) observed at 6.47 ppm; (b) the polyphenylene ether exhibits an absorbance of from 0.01 to 0.40 at a wavelength of 480 nm; and (c) the polyphenylene ether has a weight average molecular weight of from 30,000 to 100,000.

Abstract: Elastomer precursor gum (for any of fluoroelastomer, acrylic acid ester rubber/polyacrylate rubber, ethylene acrylic rubber, silicone, nitrile butyl rubber, hydrogenated nitrile rubber, natural rubber, polyurethane, and styrene butadiene rubber) and non-gum polymer are admixed with optional electrically conductive particulate and/or optional filler to provide either a continuous phase of polymer with dispersed gum portions, a continuous phase of elastomer precursor gum with dispersed polymer portions, or an interpenetrated structure of elastomer precursor gum and polymer. Curing is optionally enabled with techniques such as electron beam radiation.

Abstract: The present invention relates to novolak resins prepared with, inter alia, one or more alkylphenols. The invention further relates to compositions comprising the novolak resins, such as vulcanizable rubber compositions, and to products obtained therewith.

Abstract: A method of making a thermoplastic composition comprises melt mixing a concentrate comprising a first thermoplastic, a second thermoplastic and an additive with a component selected from the group consisting of a third thermoplastic, fire retardant additive, reinforcing agent, electrically conductive filler, non-electrically conductive filler and combinations of two or more of the foregoing.

Abstract: The present invention provides a composition comprising polyphenol and polymer comprising amine groups, wherein at least 0.1% polyphenol by weight of the composition is present as part of a complex with the polymer, and wherein the complex is in the form of particles. Also provided are uses of polymers comprising amine groups for controlling the properties of polyphenol and a method of manufacturing a composition comprising a complex of polyphenol and polymer.

Abstract: A process is described for functionalizing a copolymer comprising units derived from at least one ?-olefin and units derived from at least one diene, which copolymer contains at least one double bond. The process comprises reacting the copolymer with at least one functionalizing agent to introduce polar pendant oxygen-containing functional groups onto the copolymer.

Abstract: A purpose of the present invention is to obtain a hollow extruded article by easy blow molding or extrusion molding to give a draw down resistance and a uniform wall thickness of the article without damaging low gas permeability which is a characteristic property of a liquid-crystalline polymer. A resin composition for extrusion molding which is prepared by melting and kneading 99-70 wt. % of wholly aromatic polyester amide liquid crystal resin (A) having a melting point of 270-370° C. and a melt viscosity at 1000/sec. shear rate of 20-60 Pa·s at Temperature T1 which is higher than 20° C. from said melting point, and containing (I) 1-15 mole % of 6-hydroxy-2-naphthoic acid residue, (II) 40-70 mole % of 4-hydroxybenzoic acid residue, (III) 5-28.5 mole % of aromatic diol residue, (IV) 1-20 mole % of 4-aminophenol residue, and (V) 6-29.5 mole % of aromatic dicarboxylic acid residue; and 1-30 wt. % of epoxy modified polyolefin type resin (B), and has a melt viscosity at 1000/sec.

Abstract: Poly(arylene ether)-poly(alkylene ether) block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a poly(arylene ether), a poly(alkylene ether), and an activated aromatic carbonate.

Abstract: A halogenated aryl ether oligomer is formed by halogenation of an aryl ether oligomer and is useful as a flame retardant for flammable macromolecular materials. Typically, the halogenated aryl ether oligomer comprises the following repeating monomeric units: wherein R is hydrogen or alkyl, especially C1 to C4 alkyl, Hal is halogen, m is at least 1, n is 0 to 3 and x is at least 2.

Abstract: The present invention provides a power and/or telecommunications cable including at least one layer of a material obtained from a composition comprising: a thermoplastic polymer matrix; and a phenolic resin; wherein said phenolic resin is selected from novolac phenol-formaldehyde resins and novolac cyanate ester resins, and wherein said material includes nodules of hardened phenolic resin dispersed throughout the material.

Abstract: A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) polymerizing said ether containing solution in the presence of a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form a novolak type polymer.

Abstract: Polymers with a hydrolytically labile polymer backbones with non-toxic biocompatible diphenolic repeating units having the structure: wherein R9 is an alkyl, aryl or alkylaryl group with up to 18 carbon atoms having a pendent carboxylic acid group or the benzyl ester thereof; and non-toxic biocompatible diphenolic repeating units having the structure: wherein R12 is an alkyl, aryl or alkylaryl group with up to 18 carbon atoms having a pendent carboxylic acid ester group selected from straight and branched alkyl and alkylaryl esters containing up to 18 carbon atoms and ester derivatives of biologically and pharmaceutically active compounds covalently bonded to the polymer, provided that said ester group is not a benzyl group or a group that is removed by hydrogenolysis. Implantable medical devices and treatment methods using the polymers are also disclosed.

Abstract: A conductive thermosetting composition comprises a functionalized poly(arylene ether), an alkenyl aromatic monomer, an acryloyl monomer, and a conductive agent. After curing, the composition exhibits good stiffness, toughness, heat resistance, and conductivity, and it is useful in the fabrication of a variety of conductive components, including the bipolar plates of fuel cells.

Abstract: The subject invention discloses a thermoplastic composition which is comprised of a blend of a thermoplastic resin and an elastomer, wherein said thermoplastic resin is selected from the group consisting of polyphenylene ether and polystyrene, wherein said elastomer is comprised of a conjugated diene selected from 1,3-butadiene and isoprene, wherein said elastomer is highly branched, wherein said elastomer is characterized by having a G? and G? frequency crossover of no more than 4 radians/s at 100° C., wherein the thermoplastic resin is present in an amount which is within the range of about 5 parts by weight to about 95 parts by weight, and wherein the elastomer is present in an amount which is within the range of about 5 parts by weight to about 95 parts by weight, based upon the total weight of the thermoplastic composition.

Abstract: The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer.

Abstract: Liquid rubbers that are ordinarily immiscible in liquid thermoset resins can be made miscible by the addition of at least one non-functional aromatic end-group to the polymer chains of such liquid rubber compositions. Such addition may be initiated by high-temperature peroxides in non-functional aromatic solvents. The liquid rubbers are found to improve the fracture toughness of cured thermoset resins while maintaining dimensional and heat resistance.

Abstract: Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.

Abstract: A resin composition for improving adhesion with polyurethane foam is disclosed which comprises: (a) about 10 to about 80 percent by weight of at least one polyphenylene ether resin; (b) about 20 to about 70 percent by weight of at least one polyolefin polymer; (c) about 1 to about 20 percent by weight of at least one amine compound; and (d) 0 to about 4 percent by weight of at least one adhesion promoter, wherein all percentages are based on the weight of the entire composition. In preferred embodiments, the resin composition further comprises at least one member of the group consisting of polyphenylene ether-polyolefin copolymers, polystyrene-polyolefin copolymers, and polystyrene resins. Also disclosed herein is a method for improving adhesion between a resin composition and polyurethane foam.

Abstract: A thermoplastic composition includes a functionalized poly(arylene ether) and a copolymer of (a) ethylene or an ?-olefin, and (b) an alkyl(meth)acrylate. Optional components in the composition include an impact modifier and a flame retardant. The composition is useful for fabricating wire and cable insulation.

Abstract: A low gloss thermoplastic composition comprises poly(arylene ether), a rubber-modified poly(alkenyl aromatic) resin and an acrylonitrile containing polymer gel.

Abstract: The object of the present invention is to provide a masking member(11) which has good heat resistance and can be used repeatedly. To attain this object, the present invention provides a masking member made of a polymer alloy having a sea-island structure containing polyolefin in a continuous phase and one or more kind(s) of engineering plastic selected from among a group consisting of methyl pentene copolymer, polysulphone, polyethersulphone, polyphenylenesulphide, polyphenyleneether, polyamideimide, polyetherimide, and polyether-etherketone in a dispersed phase.

Abstract: This invention is directed to a processing approach for the rapid and efficient in-situ polymerization of specially prepared precursor mixtures to achieve near-net-shape production of objects/articles with exact dimensions. The process relies on the use of polymerizable compositions comprised of a mixture of a dead polymer, a reactive plasticizer and, optionally, an initiator, which compositions are semi-solid-like prior to curing and induce low shrinkage upon curing as a result of their partially polymerized nature prior to processing. The partially polymerized nature of the precursor mixtures also allows extremely impact-resistant objects/articles to be fabricated. Other desirable engineering property attributes can similarly be achieved via the judicious blending of starting ingredients in formulating the polymerizable (curable) mixtures.

Abstract: A polyphenylene sulfide resin composition including a polyphenylene sulfide resin having a specific amount of oligomers and a specific amount of a functional group, an amorphous thermoplastic resin having a glass transition temperature (Tg) of 120° C. or higher, and an additive having a specific amount of a functional group. The moldings obtained from this polyphenylene sulfide resin composition have a good toughness (impact strength) and weld strength. The use of this polyphenylene sulfide resin composition as a material for secondary battery cases makes it possible to maintain the initial electrolytic performance over a long period of time.

Abstract: An adhesive resin composition comprising, based on the total weight of the composition, a first resin component having one or more glass transition temperatures of about ?15 to about 50° C.; optionally, up to about 49 weight percent of a second resin component having one or more glass transition temperatures greater than about 100° C.; and up to about 50 weight percent of a particulate inorganic filler; wherein a tan ? value of the adhesive resin composition is greater than about 0.2 over a temperature range of about ?15 to about 50° C. when measured at a frequency of 1 Hz. The adhesive resin compostions are of particular utility in suspension assemblies.

Abstract: An alkali-soluble resin having a polyaromatic group and a photosensitive composition comprising the alkali-soluble resin. The alkali-soluble resin comprises the following recurring units: wherein each of R1, R2, and R3, independently, is H or CH3; R4 is a substituted or unsubstituted polyaromatic derivative containing carbon and optionally containing one or more heteroatoms of oxygen, nitrogen and sulfur; X is alkyl, benzyl, or hydroxyl; each of n1 and n2, independently, is an integer of 0–8; and a, b, and c are integers when a and c respectively are not zero.

Abstract: A resin composition comprising 3 to 80 parts by weight of a resol type phenolic resin or 3 to 150 parts by weight of a polyhydric phenol, based on 100 parts by weight of a copolymer (A) of an epoxy group-containing monomer and an ?-olefin, a powder of the resin composition, a laminate having a layer containing the resin composition, and producing method of the laminate.

Abstract: The present invention provides a composition comprising: (a) dielectric material; and (b) porogen comprising at least two fused aromatic rings wherein each of the fused aromatic rings has at least one alkyl substituent thereon and a bond exists between at least two of the alkyl substituents on adjacent aromatic rings. Preferably, the dielectric material is a composition comprising (a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where Q, G, h, I, I, and w are as set forth below and (b) porogen.

Abstract: A high flow polyphenylene ether resin composition comprises a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.17 dl/g and preferably having a particle size of at least about 100 ?m. Fiber reinforced and flame retarded compositions exhibit high HDT values.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arlyene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: Methods to prepare a poly(arylene ether) and poly(alkenyl aromatic) polymeric material having reduced levels of particulate impurities are described. The polymeric material prepared is suitable for use in data storage media applications.

Abstract: The present invention is a process for regenerating a used resin and prevents deterioration in the quality of the resin by adding to the used resin an another resin having given physical properties superior to those of the used resin and then regenerating the resin.

Abstract: This invention provides a composition and method for improving adhesion between a resinous thermoplastic substrate and polyurethane foam, said composition comprising at least one polyphenylene ether, at least one poly(alkenylaromatic) compound, and at least one carboxylic acid containing copolymer and optionally, further comprising at least one curing catalyst. Another embodiment of the invention provides articles derived from the composition of the present invention.

Abstract: The present invention provides plastics with high toughness and the preparation thereof. The plastics with high toughness, which have the balance of stiffness and toughness, stable properties and good processability, are obtained by blending the rubber particles having an average particle size of 20 to 200 nm with the pseudoductile plastics, wherein the weight ratio of the rubber particles to the plastics is from 0.5:99.5 to 70:30. The present invention also provides plastics with both high stiffness and high toughness and the preparation thereof. The plastics with both high stiffness and high toughness, which have also an improved heat resistance and good processability, are prepared by blending the rubber particles having an average particle size of 20 to 500 nm and the crystalline plastics, wherein the amount of the rubber particles added in the plastics matrix is from 0.3 to 5 weight parts.

Abstract: A polymeric network comprises a plurality of monomers that include a cage compound with at least three arms, wherein at least one of the arms has two or more branches, and wherein each of the branches further comprises a reactive group. Monomers in contemplated polymeric networks are covalently coupled to each other via the reactive groups. Particularly contemplated cage compounds include adamantane and diamantane, and especially contemplated branched arms comprise ortho-bis(phenylethynyl)phenyl. Especially contemplated polymeric networks have a dielectric constant of no more than 3.0, and are formed on the surface of a substrate.