Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), phenol resin (C), metal compound (D), and nitrogen oxide ion (E), wherein the metal compound (D) is contained in an amount of 10 to 10,000 ppm calculated as metal and the nitrogen oxide ion (E) is contained in an amount of 50 to 10,000 ppm, relative to the mass of the cationic electrodeposition coating composition. The cationic electrodeposition coating composition exhibits excellent anti-corrosion properties when coated onto untreated steel sheets.

Abstract: A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), metal compound (C), and nitrogen oxide ion (E), wherein metal compound (C) is contained in an amount of 10 to 10,000 ppm calculated as metal, and nitrogen oxide ion (E) is contained in an amount of 50 to 10,000 ppm relative to the mass of the cationic electrodeposition coating composition. A coated article in which an electrodeposition coating film is formed on an untreated steel sheet exhibits excellent corrosion resistance, in particular, excellent hot salt water immersion resistance at 55° C.; and a multilayer coating film formed by a 3-coat 1-bake coating method on the electrodeposition coating film, which is formed on the untreated steel sheet, exhibits excellent corrosion resistance in a combined corrosion cycle test.

Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.

Abstract: The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredients (A) and (B) in combination, and the oxetane compound includes the following ingredient (C): (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at 60° C. or higher; (B) a solid epoxy resin having at least two epoxy groups in one molecule thereof and having a refractive index of 1.6 or more by itself; and (C) an oxetane compound represented by the following general formula (1) in which n is an integer of 1 to 6.

Abstract: A casting resin for switchboards contains bisphenol F fluid epoxy resin. The properties of the casting resin can be significantly improved compared to bisphenol A-based casting resins, in particular regarding glass transition temperature and temperature shock resistance. More specifically, the glass transition temperature is advantageously increased for significantly better performance.

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: A thermosettable composition including (a) a thermosetting resin and (b) at least one toughening agent; wherein the at least one toughening agent is a glycidyl ether based on trimethylolpropane octadecaethoxilate (TMP-18EO).

Abstract: This invention relates to the thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. Similarly, the compositions are useful for mounting onto circuit board semiconductor chips themselves. Reaction products of the compositions of this invention are controllably reworkable when subjected to appropriate conditions. And significantly, unlike many commercial rapid curing underfill sealants (“snap cure underfills”), the inventive compositions possess an exotherm under 300 J/g or demonstrate package stability at 55° C. for 7 days, and therefore do not require special packaging to be transported by air courier, or special approval from international transportation authorities, such as the U.S. Department of Transportation, to permit such air transport.

Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.

Abstract: The invention relates to 2-component adhesives comprising one or more epoxy resins as a first component (E) and one or more amphiphilic epoxy resin hardeners as a second component (H), wherein the first component (E) and the second component (H) are reacted in water in a phase inversion polymerization.

Abstract: The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.

Abstract: The invention relates to curable compositions substantially comprising A) at least one epoxy resin, and B) at least one curing agent comprising a hetero-poly-cyclic ring system comprising at least two amino groups.

Abstract: A method is provided for functionalizing nanoscale fibers including reacting a plurality of nanoscale fibers with at least one epoxide monomer to chemically bond the at least one epoxide monomer to surfaces of the nanoscale fibers to form functionalized nanoscale fibers. Functionalized nanoscale fibers and nanoscale fiber films are also provided.

Abstract: One embodiment of the invention includes product comprising an elastomeric epoxy dry adhesive with a pull-off strength of 1-200 N/cm2 from a substrate and reversibly detached with a peel-off force less than 1 N/cm.

Abstract: Disclosed herein is a curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct. Additionally disclosed is a process comprising agitating a solution of an amine, an epoxy resin, and an elastomer-epoxy adduct as a dispersant at an elevated temperature in an organic medium.

Abstract: Modified epoxy resins comprising the reaction product of rosin and a linking molecule, further reacted with an epoxy resin, are disclosed. Aqueous dispersions and coatings comprising these resins are also disclosed.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: One embodiment of the invention includes a multilayer dry adhesive system capable of reversible joining of rigid substrates.

Abstract: A curable composition includes (A) a (meth)acrylate, (B) a radical polymerization initiator, (C) an epoxidized polyisoprene containing an epoxy group at 0.15 to 2.5 meq/g in the molecule and having a number-average molecular weight of 15000 to 200000, and (D) a curing accelerator. The curable composition shows high elongation and excellent rubber elasticity even in a cured state and has superior compatibility, transparency, waterproofness and flexibility, so that cracks and separation of cured products are reduced. Accordingly, the composition is suitable for use as adhesives, coating agents, encapsulating materials, inks, sealing materials and the like.

Abstract: There is provided an epoxy resin composition for encapsulating a semiconductor comprising an epoxy resin (A), wherein the epoxy resin (A) including: a crystalline epoxy resin (a1) having a melting point of 50° C. to 150° C., an epoxy resin (a2) represented by formula (1), and at least one epoxy resin (a3) selected from an epoxy resin represented by formula (2) and an epoxy resin represented by a formula (3): in which R1's, which may be the same or different, represent a hydrocarbon group having 1 to 4 carbon atoms; R2's, which may be the same or different, represent a hydrogen atom or a hydrocarbon group having 1 to 4 carbon atoms; m is an integer of 0 to 5; and n is an integer of 0 to 6.

Abstract: A curable composition comprising a) an epoxy resin containing on average more than one epoxy group per molecule, and b) as curing agent a hybrid hardener, whereby said hardener is a blend of b1) an aminic compound selected from aliphatic, cycloaliphatic, araliphatic amines, imidazoline group-containing amidoamines based on mono- or polybasic acids, adducts of said amines or amidoamines made from glycidyl compounds, adducts of said amines or amidoamines made from cyclic carbonates, whereby said aminic compound contains, on average per molecule, at least two reactive hydrogen atoms bound to nitrogen atoms, and b2) a DCPD-phenol based novolac, and wherein the DCPD-phenol novolac is used in an amount from 1 to 65 wt %, based on the total weight of the hardener blend b1) and b2), especially useful as protective coatings for metallic and mineral substrates.

Abstract: A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

Abstract: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.

Abstract: A cationically polymerizable composite coating composition comprising: a) a condensation product of at least one hydrolyzable silane having a fluorine-containing group, b) at least one cationically polymerizable organic resin, and c) a cationic initiator, provides, upon curing, substrates with an alkali-resistant, liquid-repellent coating. The composite coating composition may be used in pattern forming methods.

Abstract: One embodiment of the invention includes a method of joining two substrates with multilayer thermo-reversible dry adhesives and separating the two bonded substrates by completely thermally reversing the adhesion via heating.

Abstract: A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement, where the polymeric resin comprises; at least one difunctional epoxy resin; and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: An ink-jet composition for a color filter excellent in storage stability, straightness and sustainability at the time of ejection from a head, wherein a cured layer thereof is excellent in heat resistance, adhesive property, and solvent resistance. The ink-jet ink composition for a color filter is a specific epoxy group-containing polymer (A), a specific epoxy group-containing compound (B) having two or more specific epoxy groups and a polycarboxlic acid derivative (C) in which specific carboxylic acid (c1) having alicyclic hydrocarbon is rendered latent by vinyl ether (c2), wherein the equivalence ratio of carboxyl groups rendered latent by the polycarbonoxylic acid derivative (C) to the total epoxy groups contained in the epoxy-group containing polymer (A) and the epoxy-group containing compound (B) is in the range from 0.7 to 1.1.

Abstract: The present invention inhibits the occurrence of the foreign matters attributable to an adhesive for bonding an injection needle to a needle-base member so as to enhance the yield of a syringe when producing the same. A front-assembly (3) additionally provided at a leading end of an injection cylinder (2) comprises an injection needle (4), a needle-base member (5), a connection hub (6) and a protector cap (7). The injection needle (4) and the needle-base member (5) are fixed to each other with an epoxy adhesive (19). This adhesive (19) contains denatured aliphatic epoxy resin in the amount set to about 10 to about 25 wt % and its viscosity is set to about 20000 to about 40000 mPa·s. This adhesive (19) is heated at a temperature of at least 130 degrees C. for about 20 minutes to cure it. After the front-assembly (3) and the injection cylinder (2) have been sterilized with vapor, the connection hub (6) has a connection portion (17) external fitted and secured to the leading end of the injection cylinder (2).

Abstract: The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Abstract: A new class of compounds, namely diamino alcohols, is described, along with a process for their production and their use as hardeners, or curing agents, for epoxy resin systems, some of which have high glass transition temperatures, Tgs, such as greater than about 120° C.

Abstract: An adamantane derivative of formula (I), a compound of formula (VII) or (VIII), compositions containing them, and optical electronic members using the resin compositions. In the formulas, W represents, for example, a hydrogen atom, X is bonded to a bridge-head adamantane carbon and represents, for example, a group of represented by the general formula (II), Y represents a group of formula (V) or (VI), R1 represents a methyl group or an ethyl group, R2 represents a C1 to C10 hydrocarbon group which may contain O or S, m is an integer of 2 to 4, k is an integer of 0 to (16?m) and p and q are each an integer of 1 to 5.

Abstract: The object of the invention is to provide a resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation comprising (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).

Abstract: A two-component epoxy adhesive composition comprises a) a first component comprising a first epoxy resin and a second epoxy resin being flexibilized by an elastomer, and b) a second component comprising at least one amine compound with one or more primary and/or secondary amino groups having a molecular weight of less than 450 g/mole. The ratio of the total number of amino groups of the amine compound to the total number of epoxy groups of the epoxy resins is from 0.01:1 to 0.5:1. The mixing of components a) and b) results in a wash-off resistant composition upon heat-curing in a crash-stable structural adhesive.

Abstract: An epoxy resin composition comprising (A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210, (B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and (C) an inorganic filler, the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

Abstract: Epoxy resins and mixtures of polyphenolic compounds which comprise cycloaliphatic moieties, processes for the production thereof and mixtures and cured products which comprise these resins and/or mixtures.

Abstract: Disclosed herein are an epoxy resin composition for fiber-reinforced composite materials which has low viscosity, high Tg, high elastic modulus, and excellent fracture toughness and a fiber-reinforced composite material using such an epoxy resin composition which has excellent thermal properties, compressive strength, impact resistance, fatigue resistance, and open-hole tensile strength and which is suitable for producing structural parts of aircraft and the like. The epoxy resin composition comprises at least a given bifunctional epoxy resin as a component (A), a liquid aromatic diamine curing agent as a component (B), and core-shell polymer particles as a component (C), wherein the core-shell polymer particles as the component (C) contain epoxy groups in their shell and have a volume-average particle size of 50 to 300 nm.

Abstract: Precision in thermotherapy is obtained by providing a reverse gelling polymer composition which gels when its temperature is raised towards body temperature. The composition is injected into the blood supply of the tissue being treated, at the beginning of thermotherapy. The temperature increase caused by the heating rapidly gels the composition, which temporarily blocks the flow of blood in the region being treated. This improves the predictability and stability of treatment. On cessation of heating, the composition gradually dissolves, removing the temporary embolization. The use of local heating can also expedite removal of tumors and the like from soft organs, even when the heating itself has no therapeutic effect.

Abstract: An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one seed oil based alkanolamide; wherein the seed oil based alkanolamide is derived from the reaction of (i) at least one of a fatty acid ester, a fatty acid and a fatty acid triglyceride; and (ii) at least one alkanolamine; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.

Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.

Abstract: An epoxy resin composition comprising: (A) an epoxy resin having at least three epoxy groups per molecule and an epoxy equivalent of 170 or lower; (B) an epoxy resin having a phenolic nucleus and two epoxy groups in such an amount that a weight ratio of the epoxy resin (B) to the epoxy resin (A) ranges from 35/65 to 65/35; (C) a phenolic curing agent in such an amount that a molar ratio of phenolic hydroxyl groups to the whole epoxy groups in the composition ranges from 0.5 to 1.5; and (D) an inorganic filler in an amount of from 86 to 92 wt %, based on a total weight of the composition. The composition provides encapsulated semiconductor devices much less warped than those encapsulated with a conventional composition.

Abstract: An activatable material and articles incorporating the same is disclosed. The activatable material includes at least three of epoxy resin; impact modifier; blowing agent; curing agent; and filler. The activatable material is preferably used for sealing, baffling, adhering or reinforcing an article of manufacture such as an automotive vehicle.

Abstract: An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one non-seed oil based alkanolamide; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.

Abstract: Sealant and potting formulations comprising a thioether-functional, oligomeric polythiol prepared by reacting together: (a) a compound having at least two thiol functional groups; and (b) a compound having triple bond functionality are disclosed.

Abstract: A prepreg is provided capable of being a composite material having suitable high heat resistance, impact resistance, and mechanical properties under high temperature and high humidity conditions. As the matrix resin, a composition including a specific epoxy resin component (A), a specific bifunctional epoxy resin (B), a specific tetrafunctional epoxy resin (C), and a specific aromatic amine compound (D) at specific proportions are used. Particularly, as the epoxy resin component (A), one obtained by mixing and heating a bifunctional epoxy resin (a1), a trifunctional epoxy resin (a2), a phenol compound (a3), and a specific polyamide resin (a4) is used so as to be able to solve the above-described problems.

Abstract: It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]: [A] a diglycidyl ether-type epoxy resin having a molecular weight of 1,500 or more; [B] an epoxy resin in which an SP value of a structural unit thereof is greater by 1.5 to 6.5 than an SP value of a structural unit of [A]; [C] a diglycidyl ether-type epoxy resin having a molecular weight of 500 to 1,200; and [D] an epoxy resin curing agent, in a ratio that satisfies the following formulas (1) to (4): 0.2?A/(A+B+C+E)?0.6;??(1), 0.2?B/(A+B+C+E)?0.6;??(2), 0.15?C/(A+B+C+E)?0.4; and??(3), 0?E/(A+B+C+E)?0.2,??(4) wherein A, B, and C represent weights of [A], [B], and [C], respectively, and E represents a weight of an epoxy resin other than [A], [B], and [C].

Abstract: A powder primer composition comprising as essential components (A) a carboxyl group-containing thermosetting polyester resin, (B1) a bisphenol A-type epoxy resin with an epoxy equivalent of 400-2000 g/eq or (B2) a bisphenol-type epoxy resin with an epoxy equivalent of 400-2000 g/eq and (C1) a bisphenol F-type epoxy resin with an epoxy equivalent of 400-2000 g/eq or (C2) a modified epoxy resin containing phenolic hydroxyl groups, obtained by reacting (a) a bifunctional epoxy resin with (b) an excess of a bifunctional phenol. Coating films obtained using the powder primer composition have excellent finished appearance and corrosion resistance.