Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Abstract: An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): wherein R1 and R2 are independently hydrogen or alkyl having 1 to 4 carbon atoms and two or more R1s or two or more R2s are the same or different; a is integer of 0 to 4; b is integer of 0 to 4; c is integer of 0 to 3; and n is average and is number of 0 to 10, (C) a (co)polymer containing butadiene-derived structural unit or its derivative, and (D) an inorganic filler in the amount of 80 wt % to 95 wt % both inclusive in the total epoxy resin composition.

Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.

Abstract: The present invention provides a resin composition for a fiber-reinforced composite material, which has excellent fluidity and impregnation into a fiber base material and which produces a cured product having excellent heat resistance. A resin composition for a fiber-reinforced composite material contains, as essential components, a poly(glycidyloxyaryl) compound (A), a polymerizable monomer (B) which is an unsaturated carboxylic acid or an anhydride thereof and has a molecular weight of 160 or less, an aromatic vinyl compound or a (meth)acrylate (C), and a radical polymerization initiator (D), wherein an equivalent ratio [glycidyloxy group/acid group] of a glycidyloxy group in the component (A) to an acid group in the component (B) is 1/1 to 1/0.48, and a molar ratio [(B)/(C)] of the component (B) to the component (C) is in the range of 1/0.55 to 1/2.

Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Abstract: Provided is a pigment dispersing composition for a color filter including a color material, a resin, and an organic solvent which may dissolve the resin, wherein a modified pigment (D) is contained as the color material which includes, on the surface of a pigment (A), a polymer (P) obtained by polymerizing a polymer (B) containing a polymerizable unsaturated group soluble in a non-aqueous solvent and at least one type of polymerizable unsaturated monomer (C) which is soluble in the non-aqueous solvent and becomes either insoluble or poorly soluble following polymerization, alternatively wherein a modified pigment (D) is contained as the color material which is obtained, under the presence of a pigment (A), a non-aqueous solvent, and a polymer (B) containing a polymerizable unsaturated group soluble in the non-aqueous solvent, by polymerizing at least one type of polymerizable unsaturated monomer (C).

Abstract: An object of the present invention is to provide a composition for the formation of a cured epoxy resin, wherein the composition can suppress a curing reaction at a low temperature to thereby enhance one-pack stability, and can also be subjected to a heating treatment to thereby effectively cure a resin. The present invention provides a composition for the formation of a cured epoxy resin, the composition comprising the following components (A), (B) and (C): (A) an epoxy resin; (B) a clathrate compound of a carboxylic acid derivative represented by formula (I): R(COOH)n??(I); and an imidazole compound represented by formula (II); and (C) a tetrakisphenol type compound represented by formula (III).

Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: A liquid resin composition of the present invention is a liquid resin composition for bonding a semiconductor element on a support, exhibiting a tackiness of 0.05 N or less after heating at 120° C. for 10 min and a tackiness of 1 N or more at 80° C. A semiconductor wafer having an adhesive layer of the present invention is a semiconductor wafer having an adhesive layer in which the adhesive layer is formed from the above liquid resin composition. A process for manufacturing a semiconductor element of the present invention has the application step of applying an adhesive as a liquid resin composition containing a thermosetting resin and a solvent to one side of a wafer; the evaporation step of evaporating said solvent while substantially maintaining a molecular weight of said liquid resin composition to form an adhesive layer; the bonding step of bonding a dicing sheet on one side of said wafer; and the cutting step of cutting said wafer into pieces.

Abstract: A thermosetting resin composition which includes an epoxy-containing component and a curing agent component containing a cyclohexanetricarboxylic anhydride. The cured product of the thermosetting resin composition is excellent in surface hardness, solvent resistance, transparency, and adhesion to substrate, and is useful as a surface protection layer of the substrate.

Abstract: A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition.

Abstract: Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.

Abstract: The present invention relates to a novel epoxy resin having improved heat-resistance, thermal expansion properties and processability, and to a thermosetting resin composition comprising the same. To this end, the present invention provides an epoxy resin of Chemical Formula 1 as disclosed in the Description, an epoxy resin composition comprising the same, and a packaging, substrate and transistor formed thereof. When a composition that contains an epoxy resin with a specific side functional group according to the present invention and/or an epoxy resin with a specific core structure is cured, a filler forms a strong chemical bond with the epoxy resin, thereby maximizing filling effects of the filler for the epoxy resin. Moreover, with the specific core structure, heat resistance and heat expansion properties of a cured product are substantially improved (CTE is reduced), and enhanced glass transition properties, strength and processability are demonstrated.

Abstract: The present invention provides a composition of the modified maleic anhydride and the epoxy resins, including (A) one or more of the epoxy resin mixtures, (B) a modified maleic anhydride copolymer, (C) additives and (D) inorganic filler materials, wherein component (A) the epoxy resin mixture accounts for 35%˜56% by weight of the composition solids, component (B) the modified maleic anhydride copolymer accounts for 44%˜65% by weight of the composition solids, based on 100% by weight of total components (A), (B) and (C).

Abstract: A rubber composition for a tire, in which a specific tackifier is compounded, and tackiness and various physical properties are improved, compared with compounding a petroleum resin or a terpene resin, is provided. The rubber composition for a tire comprising an alkyd resin and a pneumatic tire using the same. It is preferable that a material derived from a resource other than petroleum, particularly, a material derived from animal and/or vegetable, and more particularly, a material derived from an animal oil and/or a vegetable oil is contained in the alkyd resin, and it is preferable that unsaturated polybasic acid is contained in the alkyd resin.

Abstract: The present invention relates to the use of cyclic carbonates of the formula I or a mixture thereof in epoxy resin compositions and also to epoxy resin compositions which comprise such cyclic carbonates. in which R1 and R2 independently of each other are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; R3 and R4 independently of each other are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group; or mixtures thereof, as additives in epoxy resin compositions.

Abstract: The present invention relates to compounds suitable to use as curing agents for epoxy systems which can be obtained by reacting an amine-functional compound with an ?-? unsaturated acid and/or ester and a mono-functional epoxy compound. The invention further relates to coating compositions comprising these curing agents.

Abstract: Curing agent for epoxy resins, consisting of A) 1%-99% by weight of an adduct obtainable by reacting a1) a polyethylene polyamine having up to six nitrogens in the molecule with a2) a monoglycidyl ether, the adduct of a1) and a2) preferably being isolated by removal of the excess polyethylene polyamine, and B) 99%-1% by weight of an adduct obtainable by reacting b1) a diamine or polyamine with b2) styrene, and also curable compositions further comprising an epoxide compound, and the use of these curable compositions for producing moldings and sheetlike structures, and also for applications in the adhesives and sealants sector and for epoxy-resin mortars.

Abstract: Disclosed are adhesive compositions include polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition resins. The adhesives in preferred embodiments exhibit enhanced bonding strength of the adhesive at high temperatures, such as at about 80° C., and enhanced the fire resistance.

Abstract: Modified epoxy resins comprising the reaction product of rosin and a linking molecule, further reacted with an epoxy resin, are disclosed. Aqueous dispersions and coatings comprising these resins are also disclosed.

Abstract: There is provided a method of making a polymer solution comprising polymerizing one or more monomer in a solvent, wherein said monomer comprises one or more ethylenically unsaturated monomer that is a multi-functional Michael donor, and wherein said solvent comprises 40% or more by weight, based on the weight of said solvent, one or more multi-functional Michael donor.

Abstract: A process for producing water-absorbing polymer particles, wherein at least one aliphatic aldehyde or reaction product thereof with an aliphatic alcohol, an aliphatic amine, ammonia, a hypophosphite or a phosphite is added.

Abstract: Polyamines A1 of formula (I) or (II). They can be easily synthesized from readily available raw materials and have no primary amino groups or only a low content of primary amino groups and thus exhibit hardly any blushing. Their viscosity is relatively low, compared with polyamine/polyepoxide adducts of the polyamine on which polyamine A1 is based. Thus epoxy resin compositions can be formulated which that are free of benzyl alcohol and free of blushing.

Abstract: The present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents, and, more specifically, the present invention is in the field of polymer sheets and multiple layer glazing panels comprising infrared absorbing agents that selectively absorb infrared radiation. In various embodiments of the present invention, an interlayer includes lanthanum hexaboride, which effectively absorbs infrared radiation at about 1,000 nanometers, and an epoxy, which stabilizes the lanthanum hexaboride agent.

Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.

Abstract: A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: Epoxy curing agents comprising imidazole-isocyanate adducts, including 1-(aminoalkyl) imidazole-isocyanate adducts and especially 1-(3-aminopropyl) imidazole-isocyanate adducts, and their use as curing agents in heat curable one-component epoxy resin compositions.

Abstract: The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.

Abstract: A curable resin composition, which is a solid resin at ordinary temperatures obtained by reacting an epoxy resin with a (meth)acrylic anhydride, contains an unsaturated resin having a (meth)acryloyl group (A) which has a double bond equivalent weight of 200 to 500, an ester number of 100 to 300, and a hydroxyl number of no more than 130, an ethylenically unsaturated monomer (B), and a radical polymerization initiator (C).

Abstract: An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.

Abstract: Process for production of post-crosslinkable thermoplastic resins by bulk-polymerizing a polymerizable composition (A) comprising (I) a monomer fluid containing a cyclic olefin (?) having two or more metathetical ring-opening reaction sites in the molecule in an amount 10 wt % or above based on the total amount of the monomers or a monomer fluid containing a norbornene monomer and a crosslinking agent, (II) a metathetical polymerization catalyst, and (III) a chain transfer agent; thermoplastic resins obtained by this process. These thermoplastic resins are free from odor due to residual monomers and are excellent in storage stability. Process for producing crosslinked resins and composite materials which comprises laminating the thermoplastic resin to a substrate and then crosslinking the thermoplastic resin.

Abstract: Film-forming materials include nonionic metal coordinating structures. Nonionic metal coordinating structures can coordinate metals, such as metal catalysts and metal substrates. Example film-forming materials can be the product of a poly-functional epoxide and a nucleophilic ligand having a nonionic metal coordinating structure, or the product of a poly-functional alcohol and an electrophilic ligand having a nonionic metal coordinating structure.

Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols and epoxy-phosphorus acid reaction products are disclosed. The binders are useful in primer formulations for automotive applications.

Abstract: Provided herein are one-solution type thermosetting resin compositions that may be useful to form protective films for color filters used in liquid crystal displays or image sensors. According to some embodiments, the resin compositions may include a self-curable copolymer and an epoxy compound. The protective films may exhibit desirable flatness, adhesiveness, transmittance, heat resistance and chemical resistance. Also provided are methods of forming a film on a substrate, and substrates having a film formed thereon. In addition, provided herein are color filters including a film formed from a composition according to an embodiment of the invention, and liquid crystal displays and image sensors including such color filters.

Abstract: The present invention provides a coating composition for cans comprising 100 parts by mass of a neutralized acrylic resin-modified epoxy resin (A), and from 1 to 50 parts by mass of anionic polymer crosslinked fine particles (B), (A) and (B) being dispersed in an aqueous medium, wherein the anionic polymer fine particles (B) are polymer fine particles comprising a polymer having an acid value of from 10 to 120 mg KOH/g and being produced by polymerizing radically polymerizable unsaturated monomers comprising from 2 to 30% by mass of a carboxyl group-containing radically polymerizable unsaturated monomer (b1), from 2 to 30% by mass of a polyvinyl compound (b2) and from 40 to 96% by mass of other radically polymerizable unsaturated monomer (b3) in the presence of water.

Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.

Abstract: The present invention provides a method of making an aqueous coating composition comprising an aqueous dispersion of an epoxy acrylate resin and a polymerized reactive diluent. The aqueous coating composition preferably has a volatile organic compound content of no greater than 0.4 kilogram per liter of solids.

Abstract: A composition includes a cross-linkable epoxy resin, a polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer, and a filler material. The polystyrene-polybutadiene-polymethylmethacrylate tri-block copolymer has a concentration ratio of from about 1:1:1 to about 1:1:1.5.

Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.

Abstract: It is an object of the invention to provide a curable resin composition excellent in mechanical strength, heat resistance, moisture resistance, flexibility, resistance to thermal cycles, resistance to solder reflow, dimensional stability, and the like after curing and providing high adhesion reliability and conduction reliability and an adhesive epoxy resin paste, an adhesive epoxy resin sheet, a conductive connection paste, and a conductive connection sheet using the curable resin composition, and an electronic component joined body. The invention relates to a curable resin composition, which contains an epoxy resin, a solid polymer having a functional group to react with the epoxy group and a curing agent for an epoxy resin, no phase separation structure being observed in a matrix of a resin when a cured product is dyed with a heavy metal and observed with a transmission electron microscope.

Abstract: Curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies, and methods of using curable compositions comprising polythioether polymers and polybasic acid-based polyepoxies are disclosed. Cured, curable compositions exhibit enhanced corrosion resistance and adhesion upon exposure to fuels.

Abstract: The invention relates to preparations based on polymerizable polyether materials and a fluidity improver and to the use thereof in producing dental materials, especially impression materials.

Abstract: Aqueous resinous binders comprising graft copolymers, water-dilutable urethane polyols, epoxy-phosphorus acid reaction products, and an aqueous dispersion comprising the reaction product of trimellitic anhydride and a polyol, wherein the molar ratio of trimellitic anhydride to the polyol in the reaction product ranges from 1:2 to 1:4, and wherein the reaction product is further reacted with an anhydride to form another reaction product are disclosed. The binders are useful in primer formulations for automotive applications.

Abstract: This invention is directed to fluorinated acrylate compositions, which are suitable for use as low shrinkage, low absorbance refractive index matching adhesives for use in “pig-tailing” polymeric integrated waveguides to optical fiber bundles.

Abstract: The invention relates to aqueous coating compositions for producing primer and/or filler layers in a multi-layer coating, in particular in vehicle coating, comprising the following components: A) at least one water-dilutable epoxy resin, B) at least one polyamine curing agent, C) optionally, at least one water-dilutable polyurethane resin, D) water and E) optionally, pigments, fillers, conventional paint additives and/or organic solvents, wherein the polyamine curing agent B) comprises: B1) 5-95% by weight of at least one amino functional compound with at least two secondary and/or primary amino groups and B2) 95-5% by weight of at least one water-dilutable (meth)acrylic copolymer, wherein the percentages by weight of components B1) and B2) are based on the solids and add up to 100% by weight.

Abstract: A 100% non-volatile, one-part liquid underfill encapsulant is disclosed for application to the active side of a large wafer or integrated circuit chip. Upon coating, the encapsulant is converted to a liquefiable, tack-free solid by exposure to radiation, particularly in the UV, visible and infrared spectrum. The underfill-coated wafer exhibits outstanding shelf aging of months without advancement of cure. The large wafer can be singulated into smaller wafer sections and stored for months after which during solder reflow assembly, the wafer connects are fixed and the underfill liquefies, flows out to a fillet and transitions to a thermoset state on heat activated crosslinking.

Abstract: A coated article is obtained by electrodeposition coating using an electrodeposition coating composition, which comprises: (A) a resin component obtained by reacting an epoxy resin, an amino compound and/or a phenolic compound; (B) a resin component having a specific structural unit; (C) a blocked polyisocyanate compound; and (D) at least one rust inhibiting component selected from the group consisting of metal ions selected from zirconium, titanium, cobalt, vanadium, tungsten and molybdenum, oxymetal ions of the metal, and fluorometal ions of the metal.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: Disclosed are adhesive compositions including polymerizable resin, preferably in an amount of from about 10 wt % to about 90 wt % and reactive multifunctional acrylate, preferably in an amount of from about 5 wt % to about 30 wt %. The polymerizable resin can include free radical initiated vinyl addition polymerized resins. The adhesives in preferred embodiments exhibit enhanced bonding strength at high temperatures, such as at about 80° C., and enhanced the fire resistance.