Mixed With Unsaturated Reactant Or Polymer Derived Therefrom Patents (Class 525/529)
  • Patent number: 5414058
    Abstract: A powder coating composition includes one or more crystalline substances the lowest melting point of which is Mp and one or more non-crystalline substances the lowest glass transition point of which is Tg and is lower than Mp, wherein the crystalline and non-crystalline substances are selected from epoxy resins and curing agents and bonded to each other. The bonding is effected by maintaining a powdery mixture containing the crystalline and non-crystalline substances at a temperature higher than Tg but lower than Mp and the softening point of any of the the non-crystalline substances, optionally under a pressure, and cooling and pulverizing the resulting mixture.
    Type: Grant
    Filed: July 15, 1993
    Date of Patent: May 9, 1995
    Assignee: Somar Corporation
    Inventors: Kazuya Ono, Tetsuo Miyake, Mikio Osa, Katuji Kitagawa, Masao Kubo
  • Patent number: 5412002
    Abstract: An epoxy resin composition contains an epoxy resin represented by the formula (I) and a curing accelerator: ##STR1## wherein R.sup.1 stands for ##STR2## where G stands for a glycidyl group, R.sup.2 stands for an alkyl group having 1 to 4 carbon atoms, R.sup.3 and R.sup.4 stand for the same or different groups and each denote a hydrogen atom or a glycidyl group, m and x each denote an integer of 0 to 10, n denotes an integer of 0 to 2, provided that m.gtoreq.x and, if m=0, then x=0, in which case at least one of R.sup.3 and R.sup.4 denotes a glycidyl group on the condition that when m.gtoreq.1 and m>x, R.sup.1 may each stand for different groups.
    Type: Grant
    Filed: December 9, 1992
    Date of Patent: May 2, 1995
    Assignee: Nippon Oil Co., Ltd.
    Inventors: Masami Enomoto, Susumu Kubota, Hitoshi Yuasa, Fumiaki Oshimi, Yutaka Otsuki
  • Patent number: 5385990
    Abstract: A structural adhesive composition containing an epoxy compound, an amine hardener and a hydroxy-substituted aromatic compound having a pKa ranging from about 5 to 9.7 and a boiling point greater than about 210.degree. C. The utilization of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the stated ranges provides for an adhesive composition which develops significant green strength, undergoes minimal sinkage during the bonding and curing process, and is capable of withstanding high temperature conditions.
    Type: Grant
    Filed: November 2, 1992
    Date of Patent: January 31, 1995
    Assignee: Lord Corporation
    Inventors: Kirk J. Abbey, Stephen E. Howe, Beth C. Munoz
  • Patent number: 5385989
    Abstract: A thermal resistance resin dust obtained by a process which comprisesa step of preparing a composition comprising(I) an aromatic hydrocarbon-formaldehyde resin-modified novolak type epoxy resin and(II) a cyanate ester resin composition comprising (a) polyfunctional cyanate esters, prepolymers of said cyanate ester, or prepolymers of said cyanate ester and an amine; or (a) in combination with (b) a monofunctional or polyfunctional maleimide, a prepolymer of said maleimide or a prepolymer of said maleimide and an amine, andoptionally (III) an inorganic filler with cleavage property,a step of curing the composition at a final curing temperature of not less than 200.degree. C. anda step of grinding the cured product, is disclosed.
    Type: Grant
    Filed: July 13, 1994
    Date of Patent: January 31, 1995
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventor: Kazuyuki Ohya
  • Patent number: 5369177
    Abstract: Thermoplastic molding materials containA) from 40 to 99.69% by weight of a polyoxymethylene homo- or copolymer,B) from 0.1 to 2% by weight of at least one stabilizer selected from the group consisting of benzotriazole derivatives or benzophenone derivatives or aromatic benzoate derivatives,C) from 0.1 to 2% by weight of at least one sterically hindered amino compound,D) from 0.005 to 2% by weight of a polyamide,E) from 0 to 2% by weight of an epoxy-containing compound,F) from 0 to 50% by weight of a toughened polymer andG) from 0 to 50% by weight of a fibrous or particulate filler or of a mixture thereof.
    Type: Grant
    Filed: August 30, 1993
    Date of Patent: November 29, 1994
    Assignee: BASF Aktiengesellschaft
    Inventors: Sabine Kielhorn-Bayer, Hartmut Zeiner, Heiner Goerrissen, Dietrich Saenger
  • Patent number: 5364925
    Abstract: An epoxy resin composition useful in an electrical laminate, which composition comprises:(A) an epoxy resin prepared by reacting (A-1) an epoxy resin having an average of more than one, but less than three epoxy groups per molecule and (A-2) a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule at a ratio to provide an epoxy to phenolic equivalent ratio of 1:x;(B) y equivalent of a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule; and(C) at least one catalyst for catalyzing a reaction of Component (A) and Component (B);wherein x and y satisfy the following equations:x.gtoreq.0.01y.gtoreq.0.010.02.ltoreq.x+y<1.00.The disclosed epoxy resin composition, exhibits low viscosity when dissolved in an organic solvent and good heat resistance when cured.
    Type: Grant
    Filed: August 13, 1993
    Date of Patent: November 15, 1994
    Assignee: The Dow Chemical Company
    Inventors: Masahiko Kohno, Takahiko Ohmura
  • Patent number: 5360886
    Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorous atom per molecule.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: November 1, 1994
    Assignee: The Dow Chemical Company
    Inventors: Ha Q. Pham, Michael B. Cavitt, Pamela A. Hardcastle
  • Patent number: 5352745
    Abstract: A novel curable polyphenylene ether resin composition caontains (a) a curable polyphenylene ether resin containing at least a reaction product of a polyphenylene ether with an unsaturated carboxylic acid or an acid anhydride, (b) at least one cyanurate selected from the group consisting of triallyl isocyanurate and triallyl cyanurate, optionally (c) a resin composition comprising an epoxy resin and a curing agent and/or (d) a compound having at least one unsaturated double bond and at least one epoxy group and/or (e) a reinforcement material. The resin composition has excellent film-forming properties, resin flowability in pressing and storage stability. A cured polyphenylene ether resin composition obtained by curing the curable polyphenylene ether resin composition has excellent chemical resistance, heat resistance, dielectric properties and dimensional stability.
    Type: Grant
    Filed: November 3, 1993
    Date of Patent: October 4, 1994
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Teruo Katayose, Yoshiyuki Ishii, Hiroji Oda
  • Patent number: 5350815
    Abstract: A bare copper conductor is provided with a tenaciously adhering epoxy resin by heating and curing in situ on the conductor a coating of a solution of cycloaliphatic epoxy resin, a hardener, stannous octoate as a catalyst, and a phenolic accelerator.
    Type: Grant
    Filed: May 21, 1993
    Date of Patent: September 27, 1994
    Assignee: General Electric Company
    Inventors: Mark Markovitz, William E. Tomak
  • Patent number: 5344899
    Abstract: A phenolic resin is represented by the formula (1) ##STR1## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, m denotes an integer of from 0 to 10 and n denotes 0, 1 or 2. A method for producing the phenolic resin involves reacting in the presence of an acid catalyst 3a,4,7,7a-tetrahydroindene and a phenol represented by the formula (2) ##STR2## wherein R.sup.1 denotes a hydrogen atom or an alkyl group having 1 to 4 carbon atoms and n denotes 0, 1 or 2. An epoxy resin composition for encapsulation contains: (a) a curable epoxy resin, (b) the above phenolic resin, (c) a curing promotor, and (d) an inorganic filler.
    Type: Grant
    Filed: February 16, 1993
    Date of Patent: September 6, 1994
    Assignee: Nippon Oil Co., Ltd.
    Inventors: Masami Enomoto, Susumu Kubota, Fumiaki Oshimi, Hitoshi Yuasa, Yutaka Otsuki
  • Patent number: 5344897
    Abstract: Liquid coating agent based on a polymer containing acetoacetate groups and a polyamine in the form of the corresponding aldimine or ketimine, the polymer containing acetoacetate groups being obtained by reaction of a polyepoxide with water, an amine or a hydroxycarboxylic acid and subsequent esterification or transesterification with acetoacetic acid. These liquid coating agents are particularly suitable as binders in two-component automobile repair fillers or as two-component primers.
    Type: Grant
    Filed: October 29, 1993
    Date of Patent: September 6, 1994
    Assignee: Hoechst AG
    Inventors: Gerhard Brindoepke, Uwe Kubillus, Helmut Plum
  • Patent number: 5332781
    Abstract: Storage-stable suspension comprised of a solid or liquid epoxy resin hardener and a solid or liquid toughener suspended therein is distinguished by excellent homogeneous dispersion of the toughener in the epoxy resin hardener and are suitable for preparing suspensions of curable epoxy resin compositions.
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: July 26, 1994
    Assignee: Ciba-Geigy Corporation
    Inventors: Sameer H. Eldin, Robert P. Peyer, Frans Setiabudi
  • Patent number: 5332785
    Abstract: A liquid coating composition based on a polymer containing acetoacetate groups and a polyamine in the form of the corresponding aldimine or ketimine, the polymer containing acetoacetate groups being obtained by reacting a polyepoxide containing hydroxyl groups, or a polyepoxide which is partially or completely reacted with monocarboxylic acids, with acetoacetic acid derivatives. These liquid coating compositions are suitable in particular as binders in two-component fillers for automotive refinishing or as two-component primers.
    Type: Grant
    Filed: March 29, 1993
    Date of Patent: July 26, 1994
    Assignee: Hoechst Aktiengesellschaft
    Inventor: Gerhard Brindoepke
  • Patent number: 5324797
    Abstract: A thermosetting resinous composition contains (a) a polyfunctional oxazolidinone compound and (b) a polyamine which react with one another a polyurea polymer upon heating without emitting any emanating by-product. A novel class of polyfunctional oxazolidinone compounds and an improved method for producing the same are also disclosed.
    Type: Grant
    Filed: April 26, 1993
    Date of Patent: June 28, 1994
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Toshiyuki Ishii, Hiroyuki Nojiri, Mitsuo Yamada, Ryuzo Mizuguchi
  • Patent number: 5321084
    Abstract: A second order nonlinear optically-active azo monomer comprising a benzimidazole moiety. The monomers can be incorporated into both linear and crosslinked polymers useful in electrooptical devices.
    Type: Grant
    Filed: July 12, 1993
    Date of Patent: June 14, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Elisa M. Cross, Cecil V. Francis
  • Patent number: 5318719
    Abstract: This invention relates to a novel class of biodegradable water-soluble graft copolymers having building, anti-filming, dispersing and threshold crystal inhibiting properties comprising (a) an acid functional monomer and optionally (b) other water-soluble, monoethylenically unsaturated monomers copolymerizable with (a) grafted to a biodegradable substrate comprising polyalkylene oxides and/or polyalkoxylated materials.
    Type: Grant
    Filed: November 12, 1991
    Date of Patent: June 7, 1994
    Assignee: Rohm and Haas Company
    Inventors: Kathleen A. Hughes, Graham Swift
  • Patent number: 5310853
    Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorous atom per molecule.
    Type: Grant
    Filed: January 21, 1993
    Date of Patent: May 10, 1994
    Assignee: The Dow Chemical Company
    Inventors: Ha Q. Pham, Michael B. Cavitt, Pamela A. Hardcastle
  • Patent number: 5310830
    Abstract: Disclosed is a heat-resistant resin composition prepared by mixing a resin composition (A) and polyamine (B), followed by heating the mixture for the hardening, said composition (A) being prepared by heating a mixture of (a) polymaleimide resin represented by a general formula: ##STR1## where R.sub.1 is an organic group having a valency of n, Xa and Xb are the same or different monovalent atoms or groups selected from the group consisting of hydrogen atom, halogen atom and organic group, and n is an integer of 1 to 4, (b) an epoxy resin having at least two epoxy groups in the molecule, and (c) a compound having one alcoholic or phenolic OH group and at least one epoxy group in the molecule.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: May 10, 1994
    Assignee: Konishi Co., Ltd.
    Inventors: Toshinao Okitsu, Shinichi Sato
  • Patent number: 5300595
    Abstract: A thermosetting epoxy resin powder coating composition comprising:(a) an epoxy resin having at least one 1,2-epoxy group per molecule and(b) a physical blend of isocyanuric acid and 2-phenylimidazoline.
    Type: Grant
    Filed: June 3, 1992
    Date of Patent: April 5, 1994
    Assignee: Shell Oil Company
    Inventors: Christian J. C. De Cock, Marianne N. M. Godts, Willem Karzijn, Wouter W. Jongepier
  • Patent number: 5300594
    Abstract: bis(Aminophenoxy)-alpha-substituted stilbenes are prepared by reacting a dihydroxy-alpha-substituted stilbene with a halonitrobenzene in the presence of a basic acting substance such as potassium carbonate and hydrogenating the resulting bis(nitrophenoxy)-alpha-substituted stilbene to convert the nitro groups to amino groups. These compounds are useful as curing agents for epoxy resins.
    Type: Grant
    Filed: May 6, 1993
    Date of Patent: April 5, 1994
    Assignee: The Dow Chemical Company
    Inventors: V. Rao Durvasula, Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5292831
    Abstract: Phenoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.
    Type: Grant
    Filed: July 27, 1992
    Date of Patent: March 8, 1994
    Assignee: The Dow Chemical Company
    Inventors: Jimmy D. Earls, Robert E. Hefner, Jr., Paul M. Puckett
  • Patent number: 5288820
    Abstract: Disclosed are thermosetting or curable coating compositions comprising (1) a film forming polymeric material bearing acetoacetate residues, (2) an amino resin cross-linking or curing material, (3) an organic sulfonic acid cross-linking or curing catalyst, and (4) an epoxide compound selected from limonene monoepoxide, limonene diepoxide and a mixture thereof. The presence of the limonene epoxide inhibit discoloration of the coating composition upon prolonged storage, especially at elevated temperatures.
    Type: Grant
    Filed: March 1, 1993
    Date of Patent: February 22, 1994
    Assignee: Eastman Kodak Company
    Inventors: Franklin D. Rector, Jr., J. Stewart Witzeman
  • Patent number: 5288821
    Abstract: Electrical insulation materials containing a synergistic mixture of either a metal acetylacetonate and a dicyclopentadienyl metal compound, a chromium salt and a dicyclopentadienyl compound, or a chromium salt and a metal acetylacetonate have unexpectedly high levels of corona resistance. The insulation materials preferably are prepared by dissolving the synergistic mixture in an organic resin such as an epoxy resin and then curing the resin.
    Type: Grant
    Filed: July 1, 1992
    Date of Patent: February 22, 1994
    Assignee: Westinghouse Electric Corp.
    Inventors: James D. B. Smith, Allan I. Bennett, Emil M. Fort
  • Patent number: 5283299
    Abstract: Aqueous-based crosslinkable coating composition comprising an aqueous dispersion of at least one polymer having epoxy-reactive functional groups, at least one polyepoxide compound, and at least one metal chelate complex epoxy-cure catalyst.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: February 1, 1994
    Assignee: ICI Americas, Inc.
    Inventors: Valentino J. Tramontano, Milton Lapkin, Scott D. Rothenberger
  • Patent number: 5281675
    Abstract: Novel cyclic imino ether compositions containing one or more mesogenic moieties, when polymerized, result in products having improved properties.
    Type: Grant
    Filed: February 6, 1992
    Date of Patent: January 25, 1994
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5280067
    Abstract: A two-part, thermally curable epoxy composition comprising an epoxy resin; a curing agent prepared from a substituted pentafluoroantimonic acid and a substituted benzene having an amino substituent and an electron-withdrawing substituent on the benzene ring; a polyol; and a toughening agent. The compositions exhibit desirable green strength and pot life.
    Type: Grant
    Filed: August 18, 1992
    Date of Patent: January 18, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventors: Kent S. Tarbutton, Janis Robins, Virginia C. Markevka
  • Patent number: 5274028
    Abstract: In an improved method for producing a surface graft of a hydrophilic polymer upon a preformed solid or semi-solid polymer substrate having hydroperoxide groups along its surface, n-vinyl pyrrolidone is utilized as the surface-grafting monomer, the substrate is selected to be insoluble in n-vinyl pyrrolidone, and the polymerization is carried out in aqueous alkaline conditions utilizing a combination of metal salts to provide a variable valence metal ion in a reduced state capable of oxidizing to suppress homopolymerization of the monomer in the solution.When the substrate is at least partially soluble in the n-vinyl pyrrolidone, an ethylenically unsaturated monomer having a higher reactivity with the substrate than n-vinyl pyrrolidone is added to the alkaline polymerization solution as a "seeding" monomer. Addition of the "seeding" monomer results in a surface-grafted copolymer effectively externalized from the substrate.
    Type: Grant
    Filed: December 6, 1990
    Date of Patent: December 28, 1993
    Assignee: Baxter International Inc.
    Inventors: William J. Bertrand, Stephen L. Coulter, Cary Reich, Paul DeAntonio
  • Patent number: 5268434
    Abstract: An epoxy resin composition useful as a molded article is curable with a combination of curing agents including diamino-alpha-alkylstilbenes and other curing agents wherein the epoxy resin and/or the other curing agents can contain rodlike mesogenic moieties.
    Type: Grant
    Filed: January 5, 1993
    Date of Patent: December 7, 1993
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5264503
    Abstract: An elastomer-modified phenolic composition is provided which is an reaction product of a phenolic compound and about 5 to about 35 weight percent, based on the total weight of the elastomer-modified phenolic compound, of a functionalized elastomer. Further, there is provided a composition comprising an epoxy resin and a curing agent for the epoxy resin comprising the elastomer-modified phenolic composition. The use of the elastomer-modified phenolic curing agent permits the preparation of low-viscosity powder coating formulations for impact-resistant coatings.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: November 23, 1993
    Assignee: Shell Oil Company
    Inventor: Edward J. Marx
  • Patent number: 5264502
    Abstract: An epoxy resin composition useful as a molded article is cured with a combination of curing agents including diamino-alpha-alkylstilbenes and other curing agents wherein the epoxy resin and/or the other curing agent can contain rodlike mesogenic moieties.
    Type: Grant
    Filed: April 10, 1991
    Date of Patent: November 23, 1993
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5260378
    Abstract: The invention relates to a block copolymer according to the general formula A-b-B on the basis of a furan derivative as binding group (b) and the process for the preparation hereof. The furan derivative as binding group (b) is a compound according to formula (I). ##STR1## The block copolymer can simply be prepared in one single reactor and is suitable for use as compatibilizer.
    Type: Grant
    Filed: January 18, 1990
    Date of Patent: November 9, 1993
    Assignee: Stamicarbon B.V.
    Inventors: Alessandro Gandini, Marie C. Salon
  • Patent number: 5250638
    Abstract: An epoxy resin composition comprises the cured reaction product of an epoxy resin and a lactone-imidazole complex. For example, complexes of butyrolactone and caprolactone with 1-isopropyl-2-methyl imidazole were formed wherein the mole ratio of lactone:imidazole ranged from 1:1 to 2:1. The complexes are less reactive than the imidazole alone, giving them an extended pot life. The compositions are useful for making filament windings where an extended working time is required. Other applications include those in which it would be impractical to use the more reactive unmodified imidazole as the sole curing agent.
    Type: Grant
    Filed: October 1, 1992
    Date of Patent: October 5, 1993
    Assignee: Texaco Chemical Company
    Inventors: Wei-Yang Su, Harold G. Waddill
  • Patent number: 5242708
    Abstract: Resurfacing surfaces of highways, roads, etc. to provide skid-resistant surface by preparing polymer concrete composition containing a curable polymer composition containing ethylenically unsaturated polymer having carbon-bonded carboxyl groups and/or hydroxyl groups and at least one reactive thickener comprising Group IIA metal oxide or hydroxide or a polyisocyanate; mixing the resulting mixture with aggregate; coating said surface with the resulting composition; compacting and shaping the resulting composition and curing the compacted, shaped composition on said surface.
    Type: Grant
    Filed: May 11, 1992
    Date of Patent: September 7, 1993
    Assignee: Frank Fekete
    Inventors: Frank Fekete, David T. Thrash
  • Patent number: 5242996
    Abstract: A modified epoxy resin or compound of the formula: ##STR1## wherein A is the backbone reside of a glycidyl ether epoxy resin with removal of the glycidyloxy groups; R.sup.1 and R.sup.2 are independently a hydrogen atom or C.sub.1 -C.sub.12 alkyl; R.sup.3 is a glycidyl group; and n is an integer of greater than 1. A method for producing the modified epoxy resin is also disclosed.
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: September 7, 1993
    Assignee: Nippon Paint Co., Ltd.
    Inventors: Mitsuo Yamada, Kei Aoki, Ryuzo Mizuguchi
  • Patent number: 5241020
    Abstract: Novel blends of polymers are produced by polymerizing interreactive compounds that form polymers in a non-free radical polymerization, and at least one monomer possessing carbon-to-carbon double bonds capable of polymerization by means of a free radical mechanism, in the presence of reactive initiators. In a preferred mode, a reaction mixture is formed comprising the interactive compounds, the monomers, and the reactive initiators. The interactive compounds are reacted in a initial step to form a first polymer connected to the reactive initiator. In a subsequent reaction, free radicals derived from the reactive initiator promote polymerization of the monomers to form a second polymer. The first polymer forms the continuous phase of the blend, while the second polymer comprises the discontinuous phase.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: August 31, 1993
    Inventor: Max Roha
  • Patent number: 5235008
    Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more rodlike mesogenic moieties. These adducts are useful as epoxy resin curing agents.
    Type: Grant
    Filed: August 3, 1990
    Date of Patent: August 10, 1993
    Assignee: The Dow Chemical Company
    Inventors: Robert E. Hefner, Jr., Jimmy D. Earls
  • Patent number: 5232996
    Abstract: A two-part adhesive composition useful for bonding various materials including plastic or thermoplastic substrates. The first part of the adhesive contains an epoxy compound and an acrylate-terminated polyurethane while the second part of the adhesive contains an amine hardener. The presence of the acrylate-terminated polyurethane allows the adhesive composition to be applied to unprepared substrates to form a bond having high strength.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: August 3, 1993
    Assignee: Lord Corporation
    Inventors: Dilip N. Shah, Terrance H. Dawdy
  • Patent number: 5223570
    Abstract: A method for preparing graft polymer dispersions having broad particle size distribution without wildly fluctuating viscosities is disclosed. The method comprises:(a) preparing intermediate graft polyol dispersions containing 30 percent by weight or less solids to achieve a broad distribution of partial sizes in a continuous process and(b) charging the intermediate graft polymer dispersion of (a) to a semi-batch reactor as seeds for further grafting to increase the solids content of the dispersion to above 30 percent by weight. The graft polymer so formed is useful in the production of polyurethanes.
    Type: Grant
    Filed: April 1, 1991
    Date of Patent: June 29, 1993
    Assignee: BASF Corporation
    Inventors: Mao Y. Huang, Kenneth C. Scott, Joseph F. Louvar
  • Patent number: 5210157
    Abstract: A polymeric material used in laminates with metal-comprises an interpenetrating polymer network composed of a cyclic moiety-containing pollyallyl compound optionally with an aromatic difunctional compound (co)polymerized and cross-linked in the presence of a free radical initiator, and an epoxy resin cross-linked with a polyhydric phenol.
    Type: Grant
    Filed: August 7, 1990
    Date of Patent: May 11, 1993
    Assignee: Akzo N.V.
    Inventors: Jan A. J. Schutyser, Antonius J. W. Buser, Pieter H. Zuuring, Hendrik J. Slots
  • Patent number: 5204386
    Abstract: A thixoropic adhesive composition exhibiing good sag resistance is prepared comprising a mixture of a polymer-modified epoxy resin and a rheological control agent. The polymer-modified epoxy resin is preferably a dispersion of acrylic elastomer in an epoxy resin in which the acrylic elastomer particles have added hydroxyl functionality which interacts favorably with rheological control agents, such as fumed silica. Acrylic epoxy resin dispersions containing added hydroxyl functionality give improved rheological control.
    Type: Grant
    Filed: June 9, 1992
    Date of Patent: April 20, 1993
    Assignee: The Dow Chemical Company
    Inventors: Yasemin Ersun-Hallsby, Dwight K. Hoffman, Gerald C. Kolb, Gene D. Rose
  • Patent number: 5202407
    Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorus atom per molecule.
    Type: Grant
    Filed: January 24, 1992
    Date of Patent: April 13, 1993
    Assignee: The Dow Chemical Company
    Inventors: Ha Q. Pham, Michael B. Cavitt, Pamela A. Hardcastle
  • Patent number: 5198509
    Abstract: A composition comprising a lactone-modified alicyclic compound (I), or an epoxidized lactone-modified alicyclic compound (II) of the following formulae: ##STR1## wherein R is an alkyl group, an aromatic group or an alkenyl group having carbon number of from 1 to 30, Y.sup.1 is at least one of the structural groups; ##STR2## Y.sup.2 is at least one of the structural group; ##STR3## X is the structural group; ##STR4## R.sup.a and R.sup.b each independently is hydrogen or a methyl group, c and c' represent a number of from 4 to 8, from n1 to nL represents 0 or a number of more than 0, respectively, and n1+n2+n3+. . . +nL corresponds to the total mole numbers of a lactone introduced into one molecule.These compositions can be made into a heat-curable composition, a photo-curable composition, a polymerizable composition and another photo-curable composition.
    Type: Grant
    Filed: June 8, 1992
    Date of Patent: March 30, 1993
    Assignee: Daicel Chemical Industries, Ltd.
    Inventors: Takaaki Fujiwa, Shin Takemoto, Tomohisa Isobe, Yoshiyuki Harano
  • Patent number: 5189102
    Abstract: A method for producing a vinyl resin comprising the steps of dissolving or dispersing a polymerizable vinyl monomer in a polymerization solvent containing a silicone oil, and polymerizing the polymerizable vinyl monomer in the presence of a polymerization catalyst.
    Type: Grant
    Filed: March 4, 1992
    Date of Patent: February 23, 1993
    Assignee: Ricoh Company, Ltd.
    Inventors: Kazuo Tsubuko, Shinichi Kuramoto, Kazuhiko Umemura, Hidemi Uematsu, Okawara, Makoto
  • Patent number: 5183865
    Abstract: This invention is directed to a shelf-stable, powder composition adapted to form a high T.sub.g, thermally stable, impact resistant thermoset material. The composition consists essentially of a mixture of an allyl-functional prepolymer component and polymaleimide component. The allyl-functional prepolymer component is the reaction product of an aromatic allyl-functional compound and a modifying compound wherein the compounds contain mutually reactive funtionalities such as an aromatic allyl-functional epoxide compound and a modifying amine compound.
    Type: Grant
    Filed: January 16, 1991
    Date of Patent: February 2, 1993
    Assignee: Ford Motor Company
    Inventor: Mohinder S. Chattha
  • Patent number: 5175219
    Abstract: The invention relates to new compounds of the general formula ##STR1## where R is a divalent, optionally branched aliphatic, cyclic or alicyclic hydrocarbon group having from 2 to 10 carbon atoms; R.sup.1 and R.sup.2 are, independently of one another, hydrogen, or aliphatic or aromatic hydrocarbon groups; R.sup.3 is --COOH, --CN, --COOC.sub.2 H.sub.4 --OH, --CONH--NH.sub.2 or --COOR.sup.4 ; R.sup.4 is an aliphatic hydrocarbon group having from 1 to 4 carbon atoms; and n is 2 or 3.
    Type: Grant
    Filed: March 28, 1991
    Date of Patent: December 29, 1992
    Assignee: Schering AG
    Inventors: Christian Burba, Werner Mrotzek
  • Patent number: 5175220
    Abstract: The invention relates to new compounds of the general formulas ##STR1## where R is a divalent, optionally branched aliphatic, cyclic or alicyclic hydrocarbon group having from 2 to 10 carbon atoms; R.sup.1 and R.sup.2 are, independently of one another, hydrogen, or aliphatic or aromatic hydrocarbon groups; R.sup.3 is --COOH, --CN, --COOC.sub.2 H.sub.4 --OH, --CONH--NH.sub.2 or --COOR.sup.4 ; R.sup.4 is an aliphatic hydrocarbon group having from 1 to 4 carbon atoms; and n is 2 or 3.
    Type: Grant
    Filed: January 3, 1992
    Date of Patent: December 29, 1992
    Assignee: Schering AG
    Inventors: Christian Burba, Werner Mrotzek
  • Patent number: 5169910
    Abstract: A composition comprising a curable epoxy resin, a reactive diluent, a curing agent for the epoxy resin, and an isocyanate compound is stable at room temperature for extended periods of time and cures to form a part which has good high-temperature properties.
    Type: Grant
    Filed: August 8, 1990
    Date of Patent: December 8, 1992
    Assignee: Shell Oil Company
    Inventor: Larry S. Corley
  • Patent number: 5153277
    Abstract: A resin composition useful as a matrix resin for a composite material comprises (A) from 30-80% by weight of an amino group-containing unsaturated ester compound obtained by ring-opening addition reacting an epoxy group-containing unsaturated compound (c) with an aromatic polyamine (a) or diamine (b) in an equivalent weight ratio of compound (c) to amino hydrogen atom of polyamine (a) or diamine (b) of from 0.25-0.9:1, (B) from 10-60% by weight of a polyepoxy compound, and (C) from 5-60% by weight of a radically polymerizable cross-linking agent such as p-methyl styrene.
    Type: Grant
    Filed: May 26, 1989
    Date of Patent: October 6, 1992
    Assignee: Nippon Shokubai Kagaku Kogyo Co., Ltd.
    Inventors: Toshio Awaji, Takao Omi, Kenichi Ueda
  • Patent number: 5140091
    Abstract: Disclosed are a composition comprising polyether compounds, obtained by addition copolymerization of a mixture of 4-vinylcyclohexene-1-oxide and a compound having at least two epoxy groups with a compound having at least one active hydrogen atom, and a composition comprising epoxy compounds obtained by epoxidation of the composition of the polyether compounds. The invention also relates to processes for production thereof.The disclosed composition comprising epoxy compounds has a higher softening temperature compared that produced by polymerization of only 4-vinylcyclohexene-1-oxide with a compound having at least one active hydrogen atom.
    Type: Grant
    Filed: December 20, 1990
    Date of Patent: August 18, 1992
    Assignee: Daicel Chemical Industries Ltd.
    Inventors: Katsuhisa Sakai, Hiroyuki Oshima
  • Patent number: 5098791
    Abstract: This invention relates to epoxy vinyl ethers having the formula: ##STR1## wherein R is a polyvalent linear, branched or cyclic hydrocarbon radical having from 2 to 20 carbon atoms, optionally substituted with alkyleneoxy; n has a value of from 1 to 20; p has a value of from 1 to 6; and at least one of Y and Y' is ##STR2## while any remaining Y and Y' can be ##STR3## The invention also relates to the synthesis and uses of the above polyphenyl vinyl ethers.
    Type: Grant
    Filed: August 10, 1990
    Date of Patent: March 24, 1992
    Assignee: ISP Investments Inc.
    Inventors: Kou-Chang Liu, Fulvio J. Vara, James A. Dougherty