Abstract: An epoxy resin composition for insulating a coil which comprises at least one polyfunctional epoxy resin, at least one latent curing catalyst, at least one filler and at least one surfactant, wherein the ceiling is set to the acid anhydride content in the composition at 10% by weight based on the weight of the epoxy resin; and a coil molded out of said resin composition.

Abstract: Ultra high molecular weight epoxy resins are produced in a short time by polymerizing a difunctional epoxy resin having two epoxy group per molecule and a dihydric phenol by heating the difunctional epoxy resin and the dihydric phenol which are present in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1, in an amide solvent, in the presence of a polymerization catalyst, and the ultra high molecular weight epoxy resins are linearly polymerized so highly as to have the capability of being formed into films having high strength.

Abstract: A process for the production of a material having an increased molecular weight relative to the diepoxide starting material the material being either a hydroxy-terminated or an epoxy-terminated material comprisinga) reacting a diepoxide with a dihydroxy compound, in the presence, as catalyst, of a triflate salt of a metal of Group IIA, IIB, IIIA, IIIB, or VIIIA of the Periodic Table of Elements (according to the IUPAC 1970 convention);b) de-activating the triflate salt catalyst; andc) optionally advancing the material produced in step b), with an aromatic diol or phenol.

Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorous atom per molecule.

Abstract: A latent curing agent for epoxy resins in the form of finely divided particles is disclosed, along with its method of preparation. An amine/epoxy adduct is formed in small particles with an encapsulating layer of polyfunctional epoxy or isocyanate on the surface by an emulsion precipitation method.

Abstract: A fluorine-containing thermoplastic elastomer composition comprising a continuous phase of at least one melt-formable thermoplastic fluorocarbon resin and a disperse phase of vulcanizate of a fluorine-containing elastomer having vulcanizable sites selected from the group consisting of epoxy groups, carboxylic acid groups, carboxylic acid derivative groups, sulfonic acid groups and sulfonic acid derivative groups, wherein the disperse phase is from 50 to 90% by weight based on the total amount of the continuous phase and the disperse phase.

Abstract: The present invention relates to poly(ester-ether) compositions and to a process for their preparation. In particular, the invention relates to poly(ester-ether) compositions obtained by reacting a polyester which is prepared from a dicarboxylic acid and an aliphatic diol with a dihydroxy aromatic compound in the presence of a metal catalyst. Incorporation of the dihydroxy aromatic compound into the polyester chain causes an increase in the Tg value and increases the thermal stability of the polyester. These poly(ester-ether) compositions are useful in molded articles of all types.

Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorous atom per molecule.

Abstract: Polyester resins are prepared by reacting a lower alkyl ester of an aromatic dicarboxylic acid with an aliphatic diol to form an aromatic polyester, and which includes (i) subjecting to transesterification reaction conditions in the presence of a titanium compound catalyst a transesterification reaction system having the lower alkyl ester of the aromatic dicarboxylic acid, the aliphatic and between 0.02 to 5.0 mole percent, based on the amount of the lower alkyl ester of the aromatic dicarboxylic acid, of an aromatic sulfonic acid compound represented by the following general formula (I):OH--R--O--Ar--SO.sub.3 M (I)wherein Ar is a p-substituted benzene group or a 2,6-substituted naphthalene group, R is a divalent group selected from among --CH.sub.2 CH(CH.sub.3)--, --CH(CH.sub.3)CH.sub.2 --, --CH.sub.2 CH(CH.sub.3)-- and --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 --, and M is an alkali metal selected from the group consisting of lithium, sodium and potassium.

Abstract: As a curing catalyst of epoxy resins, superacid salts of an N,N'-di- or N,N',N'-trisubstitued urea, the urea component of which is produced by reacting an organic isocyanate and a primary or secondary amine, at least one of which is monofunctional, are soluble in conventional organic solvents compatible with epoxy resins and catalyze the cationic polymerization reaction of epoxy resins at room temperature.

Abstract: Advanced epoxy cationic resins are prepared from an epoxy-based resin containing oxirane groups by converting at least some of the oxirane groups to cationic groups is improved by using as the epoxy-based resin a blend of (I) an epoxy-based resin obtained by reacting in the presence of a suitable catalyst (1) a diglycidylether of an oxyalkylated aromatic or cycloaliphatic diol, such as a condensation product of bisphenol A, ethylene oxide and epichlorohydrin, optionally (2) a diglycidylether of a dihydric phenol, for example a diglycidyl ether of bisphenol A, (3) a dihydric phenol such as bisphenol A, and optionally (4) a capping agent such as p-nonylphenol and (II) a different cationic epoxy-based resin. Such resin blends can be utilized in cathodic electrodeposition coating systems. Use of the diglycidylether of an oxyalkylated diol provides coating compositions with lower viscosity and produces deposition coatings of higher film build and better surface appearance than compositions without this component.

Abstract: Polyketone polymers can be stabilized and rendered more processable by the inclusion of a liquid crystalline diglycidyl compound, e.g., the diglycidyl ether of a 1,4-bis(p-hydroxybenzoyloxy) cyclohydrocarbon.

Abstract: Electrical insulation materials containing a synergistic mixture of either a metal acetylacetonate and a dicyclopentadienyl metal compound, a chromium salt and a dicyclopentadienyl compound, or a chromium salt and a metal acetylacetonate have unexpectedly high levels of corona resistance. The insulation materials preferably are prepared by dissolving the synergistic mixture in an organic resin such as an epoxy resin and then curing the resin.

Abstract: Novel cyclic imino ether compositions containing one or more mesogenic moieties, when polymerized, result in products having improved properties.

Abstract: A process for the preparation of epoxy resins having a specific reproducible content of .alpha.-glycol groups, which process comprises adding at least 0.0085 mol of glycidol or glycidol precursor compound per hydroxy-equivalent of a phenolic compound A which contains 2, 3 or 4 phenolic hydroxyl groups during the reaction of said phenolic compound A with an epihalohydrin which is unsubstituted or substituted in 2- or 3-position by C.sub.1 -C.sub.4 alkyl. The products may be used for surface protection.

Abstract: As a curing catalyst of epoxy resins, superacid salts of an N,N'-di- or N,N',N'-trisubstituted urea, the urea component of which is produced by reacting an organic isocyanate and a primary or secondary amine, at least one of which is monofunctional, are soluble in conventional organic solvents, compatible with epoxy resins and catalyze the cationic polymerization reaction of epoxy resins at room temperature.

Abstract: A thermosetting resinous composition contains (a) a polyfunctional oxazolidinone compound and (b) a polyamine which react with one another a polyurea polymer upon heating without emitting any emanating by-product. A novel class of polyfunctional oxazolidinone compounds and an improved method for producing the same are also disclosed.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more rodlike mesogenic moieties. These adducts are useful as epoxy resin curing agents.

Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorus atom per molecule.

Abstract: An adhesive composition for adhering two substrates includes a mixture of acrylate and epoxy with a tri- or tetrafunctional ketimine as a curing agent. The adhesive composition provides a two-stage cure in which, in a first stage, the adhesive is moisture cured at ambient temperature to provide green strength. In a second stage, the adhesive is post-cured at elevated temperatures to provide a high strength bond. The ketimine is formed form the reaction of diisopropyl ketone and an amine.

Abstract: The products resulting from contacting an organic phosphine or arsine with an inorganic acid having a weak nucleophilic anion provide for relatively stable compositions when admixed with a compound containing an average of more than one vicinal epoxide group per molecule and which optionally contains a compound containing an average of more than one phenolic hydroxyl group per molecule.

Abstract: Cathodic electrocoating binders which are water-dilutable on protonation with an acid are obtainable by reactingA) an epoxy compound or a mixture of epoxy compounds having an epoxide equivalent weight of less than 2,000 withB) a compound which is monofunctional with respect to epoxides and contains aliphatic or phenolic OH groups andC) a secondary amine of 2 to 36 carbon atoms, with the proviso that the reaction product of A), B) and C) still contains free epoxy groups, andD) an amount of an amidoamine containing primary amino groups which is equivalent to or greater than the amount of these free epoxy groups, the said amidoamine being obtainable from a primary diamine and a mono- and/or dicarboxylic acid.

Abstract: Electrical laminates are prepared from prepreg materials prepared by impregnating a substrate with a laminating varnish comprising a solvent solution of a curable composition comprising (A) a mixture of at least one epoxy resin having an average of more than 1 but not more than 2 vicinal epoxy groups per molecule and at least one epoxy resin having an average of more than 2 vicinal epoxy groups per molecules; (B) a mixture of at least one phenolic hydroxyl-containing compound having an average of more than 1 but not more than 2 phenolic hydroxyl groups per molecule and at least one phenolic hydroxyl-containing compound having an average of more than 2 phenolic hydroxyl groups per molecule; and (C) at least one catalyst for effecting the reaction between (A) and (B).

Abstract: This invention relates to new fluorine-containing polyimides, polyamide-acids/esters, polyamides, addition polyimides and imide oligomers which exhibit low melting points, better solubilities, low dielectric constants, superior thermal and thermal oxidative stability, and improved processing characteristics.The products of this invention are characterized by the fact that they are derived from 4,4'-bis[2-(3,4-(dicarboxyphenyl)hexafluoroisopropyl]diphenyl ether dianhydride.

Abstract: Fluorinated polyurethanes containing blocks having a perfluoropolyethereal structure, with rubber-like properties, alternated with stiff structural units are taught. The stiff units are at least partially provided with a double bond of the olefinic type, which is suitable for causing the cross-linking of the polymeric chains with a cross-linking system of the radicalic type.

Abstract: Cathodic electrocoating binders which are water-dilutable on protonation with an acid are obtainable by reactingA) an epoxy compound or a mixture of epoxy compounds having an epoxide equivalent weight of less than 2,000 withB) a compound which is monofunctional with respect to epoxides and contains aliphatic or phenolic OH groups andC) a secondary amine of 2 to 36 carbon atoms, with the proviso that the reaction product of A), B) and C) still contains free epoxy groups, andD) an amount of an amidoamine containing primary amino groups which is equivalent to or greater than the amount of these free epoxy groups, the said amidoamine being obtainable from a primary diamine and a mono- and/or dicarboxylic acid.

Abstract: A glue composition comprises a heat-hardenable resin, urea and possibly one or several glue additives, and is characterized by the presence of an additional gluing compound is polyol having a functionality of at least equal to three. This glue can be used for mineral fibers in the manufacture of insulation products having improved properties.

Abstract: The invention relates to water-dilutable binders for cationic electrocoating finishes. For the preparation of the binders, a di-epoxide compound, together with at least one mono-epoxide compound if desired, is converted by a polyaddition, carried out at 100.degree. to 195.degree. C. and initiated by a monofunctionally reacting initiator carrying either an alcoholic OH group, a phenolic OH group or an SH group, to form an epoxy resin which then subsequently is modified with(A) primary and/or secondary amines or their salts and/or the salt of a tertiary amine, a sulfide/acid mixture or a phosphine/acid mixture and with, if desired,(B) a polyfunctional alcohol, a polycarboxylic acid, a polysulfide or a polyphenol.

Abstract: Fluoroepoxy resins for use in computer composite circuit boards. A "glass state" curing agent containing a fluorinated monoanhydride, a fluorinated dianhydride and a catalyst is compounded at a temperature of about 210.degree. C. The curing agent is blended with di- and tri-functional epoxy resins at 100.degree. C. or higher to give homogeneous fast-curing syrups. Fluoroepoxy resins inherently have low dielectric constants. This method produces a fluoroepoxy resin with higher crosslink densities and higher glass transition temperatures.

Abstract: Electrical laminates are prepared from prepreg materials prepared by impregnating a substrate with a laminating varnish comprising a solvent solution of a curable composition comprising (A) a mixture of at least one epoxy resing having an average of more than 1 but not more than 2 vicinal epoxy groups per molecule and at least one epoxy resin having an average of more than 2 vicinal epoxy groups per molecule; (B) a mixture of at least one phenolic hydroxyl-containing compound having an average of more than 1 but not more than 2 phenolic hydroxyl groups per molecule and at least one phenolic hydroxyl-containing compound having an average of more than 2 phenolic hydroxyl groups per molecule; and (C) at least one catalyst for effecting the reaction between (A) and (B).

Abstract: A powdery adhesive comprised of spherical particles comprising 40 to 90 parts by weight of an epoxy resin component, 10 to 60 parts by weight of a rubber component and a latent curing agent contained inside the particles, the average particle size of the particles being from 0.1 to 500 .mu.m. The powdery adhesive may be prepared by a process comprising a step of preparing a compatible mixture comprising an epoxy resin component, a rubber component and a common organic solvent, a step of emulsifying or suspending the compatible mixture in an aqueous medium to form spherical particles, and a step of causing a phase separation of the epoxy resin component and the rubber component in the spherical particles.

Abstract: Anthraquinones of formula I ##STR1## wherein X is the group --CR.sup.2 R.sup.3 --, where R.sup.2 is H, --CH or C.sub.1 -C.sub.5 -alkyl and R.sup.3 is H or --CN, R.sup.1 is H or C.sub.1 -C.sub.5 -alkyl and R is a direct bond or linear or branched C.sub.1 -C.sub.18 -alkylene which, alone or together with the --CR.sup.2 R.sup.3 -- group, can be interrupted by one or more --O-- when R.sup.2 and/or R.sup.3 are not --CN, and curable compositions comprising (a) an epoxy resin, (b) a hardener if necessary, (c) an anthraquinone of formula I and (d) an amino alcohol. The cured compositions are photosensitive and are suitable for the preparation of coatings and metallic images by electroless metal deposition.

Abstract: Storage stable compositions are disclosed which comprise an epoxide containing compound, a phenolic hydroxyl containing compound, and a catalyst compound for catalyzing the reaction between epoxide groups and aromatic hydroxyl groups which catalyst comprises the product resulting from contacting an onium salt, amine, or amine salt with an acid or a salt of an acid having a weak nucleophilic anion.

Abstract: A cross-linked resin produced by heating a mixture of (a) a bis(2-oxazoline) compound, (b) an aromatic polyamine compound which has at least two amino groups in the molecule and (c) a polyepoxy compound which has at least two epoxy groups in the molecule at elevated temperatures, preferably in the presence of an oxazoline ring-opening polymerization catalyst. The resin shows a high mechanical strength and toughness, a very small water absorption and a very high resistance to heat.

Abstract: The present invention relates to a method for hot curing thermosetting resins and vulcanizable elastomers, based on the use of perfluoropolyethers in the liquid state as heat transfer media.

Abstract: Electrical laminates are prepared from prepreg materials prepared by impregnating a substrate with a laminating varnish comprising a solvent solution of a curable composition comprising (A) a mixture of at least one epoxy resin having an average of more than 1 but not more than 2 vicinal epoxy groups per molecule and at least one epoxy resin having an average of more than 2 vicinal epoxy groups per molecule; (B) a mixture of at least one phenolic hydroxyl-containing compound having an average of more than 1 but not more than 2 phenolic hydroxyl groups per molecule and at least one phenolic hydroxyl-containing compound having an average of more than 2 phenolic hydroxyl groups per molecule; and (C) at least one catalyst for effecting the reaction between (A) and (B).

Abstract: The invention relates to water-dilutable binders for cationic electrocoating finishes. For the preparation of the binders, a di-epoxide compound, together with at least one mono-epoxide compound if desired, is converted by a polyaddition, carried out at 100.degree. to 195.degree. C. and initiated by a monofunctionally reacting initiator carrying either an alcoholic OH group, a phenolic OH group or an SH group, to form an epoxy resin which then subsequently is modified with(A) primary and/or secondary amines or their salts and/or the salt of a tertiary amine, a sulfide/acid mixture or a phosphine/acid mixture and with, if desired,(B) a polyfunctional alcohol, a polycarboxylic acid, a polysulfide or a polyphenol.

Abstract: An epoxy adhesive composition for the bonding of SMC to metal substrates and other SMC parts having an improved cure rate and hence rate of initial lap shear strength development has been discovered. The adhesive composition comprises an epoxy resin and a polyacrylate or polymethacrylate cured with a combination of an amine-functional butadiene-acrylonitrile rubber, at least one aliphatic or aromatic polyamine and at least one polyamide.

Abstract: A rapid curing epoxy resin composition comprising a mixture of(A) A first component comprising a polyepoxide and(B) A second component comprising a mixture of the novel reaction product of(1) an ammonium salt of a non-nucleophilic acid with(2) the reaction product of(a) a bicyclic amide acetal with(b) an amine, and(3) an amine curing agent, is described.

Abstract: The adducts of monoepoxides with selected diamines, preferably m-xylylenediamine, are useful as curing agents for the curing of epoxy resin compositions at very low temperatures (25.degree.-50.degree. F., -4.degree. to 10.degree. C.).

Abstract: A spherical particulate adhesive comprising particles of a partially amine cured epoxy resin as the main component and having an average particle size of 0.3 to 500 .mu.m, in which particles of the epoxy resin contain an at least partially compatible agent homogeneously in the interior thereof. This adhesive is a heat-curable adhesive and has a very high bonding force. After bonding, the adhesive is chemically stable and is especially preferably used for bonding in the field of electronic material, such as liquid crystal display devices, which are apt to be degraded by impurities and for which high-precision bonding is required.

Abstract: A process for the preparation of glycidyl compounds by reacting a compound containing at least one phenolic group with at least the equivalent amount, based on the phenolic group, of a halohydrin in a substantially anhydrous, aprotonic solvent in the presence of a solid, substantially anhydrous catalyst, is described, which process comprises carrying out the reaction at a temperature in the range from 40.degree. to 80.degree. C. in the presence of an alkali metal carbonate, an aprotonic dipolar solvent with a static relative dielectric constant of more than 25 (at 25.degree. C.) and a permanent electric dipole moment of more than 2.5 D being used, an additional feature of said solvent being that the transition energy of the solvatochromic absorption band of the dissolved N-(3,5-diphenyl-4-hydroxyphenyl)-2,4,6-triphenylpyridinium perchlorate is in the range from 168 to 197.4 kJ/mole (at 25.degree. C.), or which process comprises carrying out the reaction at a temperature in the range from 60.degree. to 80.

Abstract: A two-part composition curable by contact of respective parts with one another, comprising: a first part comprising a cationically polymerizable material and a first latent curing component; and a second part comprising a cationically polymerizable material and a second latent curing component which is reactive with the first component to form cations which are curingly effective for the resin. A preferred class of cation species comprises carbenium ions derived from reaction of organic halide compounds, as the first component, with silver salts of non-nucleophilic anions, e.g., SbCl.sub.6.sup.-, SbCl.sub.3.sup.-, SbF.sub.6.sup.-, AsF.sub.6.sup.-, SnCl.sub.5.sup.-, PF.sub.6.sup.-, BF.sub.4.sup.-, CF.sub.3 SO.sub.3.sup.- and ClO.sub.4.sup.-, as the second component, The respective parts of the two-part composition may be applied to matable surfaces which then are contacted to effect rapid bonding cure of the composition.

Abstract: A curing agent for an epoxy resin comprises a cyclodextrin clathrate compound of a compound which is reactive with an epoxy group, a curing agent for an epoxy resin comprising a mixture of a cyclodextrin clathrate compound of a compound which is reactive with an epoxy group with a trace amount of amylase, and methods for the preparation of these curing agents. The curing agents are stable at room temperature, and the curing reaction is initiated under remarkably simple conditions.

Abstract: The present invention provides a process for hardening epoxide resin masses, wherein there is added a solution of dicyandiamide and cyanamide in a weight ratio of from 0 to 10:1 in at least one organic solvent.The present invention also provides a hardener solution for epoxide resin masses, consisting of dicyandiamide and cyanamide in a weight ratio of 0 to 10:1 and at least one organic solvent.

Abstract: Advanced epoxy resins having a low total aliphatic halide content are prepared by reacting an epoxy resin having an average of more than one 1,2-epoxide group per molecule with a material having an average of more than one phenolic hydroxyl group per molecule in the presence of a solvent having at least one aliphatic hydroxide group per molecule and a catalytic quantity of an alkali metal hydroxide. These low aliphatic halide-containing advanced epoxy resins are useful in formulations for preparing laminates, moldings, pottings and coatings for the electronics industry.

Abstract: Solid non-sintering epoxy resin products are prepared by reacting a trihydric phenol such as 1,1,1-tri(hydroxyphenyl)methane with an epihalohydrin such as epichlorohydrin in the presence of an alkali metal hydroxide such as sodium hydroxide. These epoxy resins are non-sintering solid resins useful in the preparation of electrical potting or molding compositions.

Abstract: Novel compositions are prepared by reacting sulfur dioxide with the reaction product of a material having an average of more than one 1,2-epoxide group per molecule such as a diglycidyl ether of bisphenol A with a monoethylenically unsaturated monocarboxylic acid such as methacrylic acid in the presence of an oxidizing agent such as cumene hydroperoxide.

Abstract: Aromatic amines and their alkyl, amide, imide or amide-imide substituted derivatives in the presence of catalytic quantities of phenols, cresols, xylenols, bisphenols, and their like cause epoxide resins to thermoset at ambient temperatures. The resulting crosslinked polymers are useful for two component solution systems which provide corrosion and temperature resistant clear coatings or paints, and can also be used as solventless, liquid, two component systems for casting clear, pigmented or filled parts.

Abstract: A heat stable thermoplastic phenolic resin is prepared by (I) reacting (A) the reaction product of (1) at least one epoxy resin having an average of more than one vicinal epoxy group per molecule such as a diglycidyl ether of bisphenol A with (2) one or more polyhydric phenols such as bisphenol A; and optionally (B) one or more polyhydric phenols such as bisphenol A; with (II) a material having only one vicinal epoxy group per molecule such as the glycidyl ether of t-butyl phenol or mixture of such materials; in the presence of an effective quantity of a suitable catalyst such as ethyltriphenylphosphonium acetate.acetic acid complex.