Abstract: A composition is provided comprising an epoxy resin, a cationic curing agent for the epoxy resin and a surfactant. The surfactant improves the reproducibility of cure rates of the cationic curing agent, particularly when the cationic curing agent is used in the form of an aqueous solution.

Abstract: Polyether polyols are modified by reaction with alkylene oxides and amino alcohol-epoxy resin adducts. The adducts are the reaction product of an epoxy resin and amino alcohol of the formula: ##STR1## wherein: x ranges from 1 to 4,y ranges from 1 to 40, andR is an alkyl of from 1 to 4 carbon atoms.These polyether polyols are used to prepare flexible polyurethane foams.

Abstract: Polycyanate esters of polyhydric phenols are cured with a liquid solution of a coordinating transition metal carboxylate in a monohydric alcohol. Such cured compositions are useful in structural composites, transfer molded encapsulants, filmed structural adhesives and printed wiring boards.

Abstract: A solvent-free curable composition has a long shelf life and consists ofA 100 parts by weight of an epoxy resin andB from 10 to 100 parts by weight of, as a curing agent for the epoxy resin, an aromatic diamine containing ##STR1## groups, with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone. The curable composition is used in particular for the preparation of fiber-reinforced materials.

Abstract: Polycyanate esters of polyhydric phenols are cured with a liquid solution of a coordinating transition metal carboxylate in an alkylphenol. Such cured compositions are useful in structural composites, transfer molded encapsulants, filmed structural adhesives and printed wiring boards.

Abstract: The invention provides a water-reducible coating composition comprising an epoxy resin, an amino group-containing curing agent for the epoxy resin and a watersoluble organic compound which occurs in at least 2 tautomeric forms, in one of which a labile hydrogen atom is linked to a carbon atom and which compound contains at least one carbonyloxy group or sulfonyl group.

Abstract: Advanced epoxy resins are prepared from a liquid diglycidyl ether of bisphenol A and bisphenol A which advanced epoxy resins have an equivalent weight in the range of 3,000 to 3,900 and a weight average molecualr weight of 13,000 to 17,000. When these advanced epoxy resins are formulated into can coating compositions they result in coatings having good wet and dry adhesion.

Abstract: Curable thermosetting resin compositions comprising an epoxy resin having at least two 1,2-epoxy groups per molecule, an aromatic diamine hardener, and as a cure accelerator an aromatic trihydroxy compound are disclosed. The aromatic trihydroxy compound, such as for example, phloroglucinol, n-propyl gallate, or pyrogallol, improves the cure speed of the epoxy/aromatic diamine resin system, while at the same time producing cured compositions having excellent mechanical and thermal properties. The disclosed compositions find particular application in the preparation of composites by, e.g., filament winding procedures.

Abstract: Polymerizable compositions contain (A) a cationically polymerizable material, such as an epoxide resin, a phenoplast or a cyclic vinyl ether, (B) a hydroxy compound such as styreneallyl alcohol copolymer, and (c) an aromatic iodosyl salt of formula ##STR1## where R.sup.3 and R.sup.4, which may be the same or different, each represent a monovalent aromatic radical having from 4 to 25 carbon atoms, x denotes 1, 2 or 3, and Z.sup.x- denotes an x-valent anion of a protic acid.Suitable salts of formula II include diphenyliodosyl hexafluorophosphate and tetrafluoroborate. The compositions may be photopolymerized or they may be thermally polymerized in the presence, as catalyst for the iodosyl salt, of a salt or complex of a d-block transition metal, a stannous salt, an organic peroxide or an activated .alpha.-hydroxy compound.The compositions may be used as surface coatings and adhesives, and in the preparation of printing plates, printed circuits and reinforced composites.

Abstract: Spherical particles of cured epoxy resin having an average size not larger than 50 .mu.m can be produced by adding a water-soluble amine curing agent to an emulsion of uncured epoxy resin.It is possible to prepare spherical particles incorporating a UV absorber or inorganic particles, to dye these particles with an acid dye, and to subject them to electroless plating.In addition, after-treatment of the cured particles enhances their heat resistance and destroys the epoxide groups left unreacted inside each particle.These particles may be used as an ingredient of cosmetic and coating compositions, as a toner of electrostatic copiers, and for other applications.

Abstract: Heat-curable compositions exhibiting improved room temperature pot life and reduced viscosity are obtained from composition comprising (1) a polyepoxide, (2) an aromatic or aliphatic amine, (3) a trihydrocarbyl sulfonium salt, (4) an unsaturated monomer and (5) a free radical curing agent.

Abstract: Heat-curable compositions exhibiting improved room temperature pot life and reduced viscosity are obtained from composition comprising (1) a polyepoxide, (2) an aromatic or aliphatic amine, (3) a trihydrocarbyl sulfonium salt, (4) at least one unsaturated aromatic monomer, (5) an unsaturated co-monomer and (6) a free radical curing agent.

Abstract: A process for preparing polyepoxides having a wide molecular weight distribution comprises reacting a liquid polyepoxide and polyhydric phenol in a first step, and reacting the resulting intermediate with additional polyhydric phenol and polyepoxide in one or more additional steps.

Abstract: Compounds with a plurality of oxirane functional groups can be cured to a fixture in less than one minute with a catalyst composition of a trityl or tropylium salt of a non-nucleophillic anion and a suitable solvent. Typical catalyst salts include trityl tetrafluoroborate, trityl hexachloroantimonate and tropylium hexafluorophosphate. The catalyst composition may conveniently be extended with liquid polymeric vehicles and acidic fillers.

Abstract: Heat curable epoxy-styrene compositions exhibiting improved processability, low viscosity, long pot life, and fire retardancy which when cured with a special acid anhydride/onium salt epoxy curing blend in combination with a free-radical catalyst, yield cured products exhibiting improved physical properties, such as increased heat deflection temperature, increased flexural strength and increased flexibility.

Abstract: Polyglycidyl ethers of the formula ##STR1## wherein: G represents hydrogen, ##STR2## R.sup.1 represents a hydrogen atom, an aliphatic, alicyclic, or aromatic hydrocarbon group, or a 5- or 6-membered oxygen or sulfur atom containing heterocyclic group which groups, other than hydrogen, may be substituted by halogen or the group --OG,R.sup.2 is hydrogen or ##STR3## n is a positive number up to 10, and at least two G groups in the molecule are other than hydrogen. The polyglycidyl ether is produced by condensing alpha-naphthol with an aldehyde, such as acetaldehyde, in the presence of an acid catalyst such as nitric acid, and optionally in the presence of an inert medium such as toluene, to form a novolak-type phenol which is thereafter condensed with an epihalohydrin. The polyglycidyl ethers may be cured with conventional curing agents. Composite materials containing a matrix formed from the cured polyglycidyl ether and a filler dispersed in the matrix have excellent heat resistance and low water absorption.

Abstract: Heat-curable compositions exhibiting improved room temperature pot life and reduced viscosity are obtained from compositions comprising (1) a polyepoxide, (2) an aromatic or aliphatic amine, (3) a trihydrocarbyl sulfonium salt, (4) an unsaturated aromatic monomer and (5) a free radical curing agent.

Abstract: The increase in hydrolyzable halide content in the preparation of advanced epoxy resins is decreased by conducting the advancement in the presence of an unsaturated organic compound.

Abstract: Aryliodonium salts resulting from the condensation of aryliodosotosylates and aryl ketones are provided which are used as photoinitiators to effect deep section UV cures. Deep section photopolymerizable organic materials are also provided which can be used as encapsulating agents to encapsulate a wide variety of electronic components.

Abstract: A mixture consisting of a polymaleimide and a copolymerizable monomer or a prepolymer formed from these two compounds contains, as the polymerization catalyst, an ethane which is substituted by aromatic groups and hydroxyl groups or halogen (cf. formula II), such as benzpinacol. The mixture is stable on storage and heat-curable. It can be cured, while at the same time being shaped to give mouldings, sheet-like structures, laminates, adhesive bonds or foams, for example by casting or compression moulding.

Abstract: Vinyl ester resin compositions containing triazine groups or both triazine and oxazoline groups are prepared by reacting (a) a polyepoxide containing triazine groups, or (b) a polyepoxide containing both triazine and oxazoline groups, or (c) a mixture of (a) and (b) above with (d) about 0.75 to about 1, preferably from about 0.9 to about 1, moles of a monounsaturated monocarboxylic acid or mixture of monounsaturated monocarboxylic acids per epoxide group in the presence of (e) a suitable quantity of a suitable catalyst.

Abstract: An epoxy resin composition comprising (a) an epoxy resin, (b) a lactone obtained by decarboxylation condensation reaction of a saturated alicyclic 1,2-dicarboxylic acid anhydride, and if necessary (c) a curing agent for the epoxy resin and (d) a curing accelerator gives a cured article showing almost no or very slight curing shrinkage.

Abstract: Improved thermally-curable adhesive compositions for bonding articles of poly(butylene terephthalate) together or to other articles are disclosed. The adhesive compositions comprise at least one epoxidic prepolymer having two or more epoxy groups, an aromatic halonium complex salt thermal initiator dissolved in a compatibilizing non-epoxidic organic liquid, a copper carboxylate salt cocatalyst, a polyhydric alcohol, and optionally, silica filler. The adhesive compositions when heated, cure to form an adhesive bond between articles of poly(butylene terephthalate) which exhibits a vastly improved bond strength over presently available epoxy adhesive materials.

Abstract: The advancement method, i.e., the preparation of epoxide resin mixtures by reaction of compounds containing 2 to 4 phenolic hydroxyl groups with a stoichiometric excess of polyepoxide compounds in the presence of a catalyst, comprises adding glycidol as a chain stopper. The products are used in various industrial fields, for example in surface protection.

Abstract: Compositions containing(a) an epoxide resin containing more than one 2,3-epoxypropyl group per average molecule,(b) a boron trifluoride-amine complex which is a latent hardener for epoxide resins, such as BF.sub.3 -ethylamine, and(c) certain oxidants, such as benzoyl peroxide or 2,3-dichloro-5,6-dicyanobenzoquinone, are stable on storage at ambient temperature but cure rapidly when heated above a certain threshold temperature, the oxidant having a marked accelerating effect on the rate of curing.

Abstract: Curable compositions comprising an epoxide resin and an aliphatic amine curing agent are rendered less viscous, and their rate of cure is accelerated, by the addition of an ester of the formula ##STR1## wherein n represents an integer of from 1 to 6,R represents the residue of a mono- or polyhydric alcohol or phenol after removal of n hydroxy groups, andR.sup.1, R.sup.2, and R.sup.3 may be the same or different and each represents a hydrogen or halogen atom or an alkyl group, or one or two of R.sup.1, R.sup.2, and R.sup.3 may alternatively represent an acyloxy group.Typical such esters of formula I include diphenyl carbonate, bis(phenoxycarbonyloxy) polybutadiene, and tris(phenoxycarbonyloxy) poly(oxypropylene). The compositions may be cured at room temperature and are particularly suitable for use as coatings and castings.

Abstract: A curable thermosetting resin, especially suitable for RIM applications, comprising a blend of(a) 100 parts by weight of a polyepoxide, particularly a normally liquid polyepoxide and more particularly a glycidyl polyether of a polyhydric phenol,(b) from about 10 to about 200 parts by weight of at least one ethylenically unsaturated monomer, especially an aromatic monomer, and preferably styrene,(c) a curing amount of an aliphatic or cycloaliphatic polyfunctional amine or a polyamide, and(d) an effective amount of an amine-compatible free-radical initiator.

Abstract: A curable resin is composed ofA. an epoxy resin andB. a pyrylium salt as a catalyst, with or withoutC. a metal chelate or metal salt as a co-catalyst.Preferred pyrylium salts are those of the formula ##STR1## Preferred co-catalysts are acetylacetonates, stearates, benzoates, naphthenates, octoates or phthalates of Cu.sup.++, Co.sup.++, Co.sup.+++, Fe.sup.+++ or Al.sup.+++. The resin compositions may be used to produce coatings and moldings.

Abstract: Curable compositions contain an epoxide resin and a silamine of the general formula ##STR1## wherein R.sup.1 represents the divalent residue of an aromatic or araliphatic diprimary amine after removal of the two primary amino groups,R.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6, which may be the same or different, represent alkyl or aryl groups, andn represents zero or an integer of from 1 to 10.These compositions are stable for prolonged periods in the absence of water, but cure rapidly at room temperature or at elevated temperatures in the presence of water.

Abstract: Curable compositions contain an epoxide resin and, as curing agent, a mixture of(a) a silamine of the general formula ##STR1## wherein either m represents 1, in which case R.sup.1 represents the divalent residue of an aromatic, aliphatic, araliphatic, or cycloaliphatic diprimary amine after removal of two primary amino groups, and n represents zero or an integer of from 1 to 10, or m represents 2, in which case R.sup.1 represents the trivalent residue of an aliphatic triprimary amine after removal of the three primary amino groups, and n represents zero, andR.sup.2, R.sup.3, R.sup.4, R.sup.5, and R.sup.6, which may be the same or different, represent alkyl or aryl groups, and(b) a substantially anhydrous organic acid or a phenol.These compositions are stable for prolonged periods in the absence of water, but cure rapidly at room temperature or at elevated temperatures in the presence of water, which may be as water vapor or liquid water.

Abstract: A process for preparing a thermosetting maleimide type prepolymer which comprises reacting (A) a polyfunctional maleimide compound, (B) a bis-maleimide, (C) a diamine and (D) an epoxy compound. The maleimide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

Abstract: Cationically polymerizable compounds, in particular epoxy compounds, can be polymerized by heating in the presence of a catalyst and a co-catalyst. The catalyst employed is a quaternary ammonium salt of an aromatic-heterocyclic compound which contains 1 or 2 N-atoms, and a complex halide anion, e.g. PF.sub.6.sup..crclbar.. The co-catalyst employed is a diaryl ethane derivative, preferably benzpinacol, a silyl oligomer thereof, an organic per compound or a quinone.

Abstract: The present invention provides an curable composition comprising (1) at least one epoxy compound containing at least one vicinal-epoxy groups, (2) a miscible amount of at least one ethylenically unsaturated monomer and (3) a curing amount of at least one catalyst selected from lithium or Group II metal salts of a non-nucleophilic acid.

Abstract: A curable composition comprising:(A) at least one spiro-orthoester compound having at least one spiro-orthoester group represented by the formula: [I] ##STR1## wherein n is an integer of 3-5, (B) at least one curing agent selected from the group consisting of organic polybasic acids and their anhydrides,(C) optionally, an epoxy compound having at least one epoxy group, and(D) optionally a cationic polymerization catalyst when the composition comprises ingredient (C).Said composition is small in shrinkage on curing, and provides a cured product of high dimensional accuracy when used as a molding material.

Abstract: High molecular weight epoxy resins containing hydrolyzed epoxy groups are prepared by reacting (A) a low molecular weight epoxy resin, and (B) a hydroxyl-containing compound in the presence of (C) a catalyst therefor and (D) an excess quantity of water and thereafter removing the excess water.

Abstract: A process for preparing a thermosetting imide type prepolymer which comprises heating a bis-imide (A) and a diamine (B) in the presence of an organic solvent with a boiling point of 70.degree. to 170.degree. C. and heating the reaction mixture together with an epoxy compound (C). The imide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.

Abstract: High molecular weight epoxy resins containing hydrolyzed epoxy groups are prepared by reacting (A) a low molecular weight epoxy resin and (B) a hydroxyl-containing compound in the presence of (C) water (D) a hydrolysis catalyst and (E) a catalyst for effecting the reaction between (A) and (B).

Abstract: A functionally terminated polybutadiene polymer is reacted with an epoxide to produce an epoxide terminated polybutadiene. A toughening agent and a peroxide free radical initiator are mixed with the epoxy terminated polybutadiene, and upon reaction a tough thermoset resin is produced having advanced chemical, electrical, and thermomechanical properties. Particular improvements are in the resistant-to-moisture and the tensile strain-to-failure properties.

Abstract: Curable epoxy resin compositions which exhibit controllable cure rates are described which utilize catechol derived accelerators in combination with certain curing agents. These accelerators can be employed in single package curable epoxy resin compositions useful in molding and casting applications.

Abstract: Diesters of catechol and ring substituted catechol exhibit enhanced characteristics as accelerators in the cure of epoxy resins when utilized in combination with a cure initiator, such as an oxygen titanate or zirconate.

Abstract: Aryl esters exhibit enhanced characteristics as accelerators in the cure of epoxy resins when utilized in combination with a cure initiator, such as an organic titanate or zirconate.

Abstract: Curable epoxy resin compositions which exhibit controllable cure rates and extended storage life are described which utilize allylethers of catechol as accelerators in combination with certain curing agents. These accelerators can be employed in single package curable epoxy resin compositions useful in molding and casting applications.

Abstract: Curable epoxy resin compositions which exhibit controllable cure rates and extended storage life are described which utilize silyl ethers of catechol as accelerators in combination with certain curing agents. These accelerators can be employed in single package curable epoxy resin compositions useful in molding and casting applications.

Abstract: Antioxidant compositions as described which are the reaction products of a mixture of(a) at least one compound selected from compounds having the formula ##STR1## wherein each Ar is an aromatic group, and R and R.sup.1 are each independently hydrogen, alkyl, substituted alkyl, oxyalkylene or --C(O)--R.sup.2 --COOH groups wherein R.sup.2 is an alkylene or alkenylene group, with the proviso that at least one of the R and R.sup.1 groups must be hydrogen or a group containing at least one substituent reactive with an epoxy group, andAr--NH--Ar--O--R.sup.3 (FORMULA II)wherein Ar is as defined above and R.sup.3 is hydrogen, or a substituted alkyl group containing at least one substituent reactive with an epoxy group, or --C(O)--R.sup.2 --COOH wherein R.sup.2 is an alkylene or alkenylene group, and(b) at least one polyepoxide having at least 2 epoxy groups per molecule.

Abstract: Aromatic onium salts, such as diaryliodonium salts, have been found to be effective thermal initiators for the polymerization of epoxy resins having a viscosity of up to about 100,000 centipoises at 25.degree. C. when used in combination with copper salts. The processable epoxy resin composition can be used in filament winding and pultrusion applications.

Abstract: A method for preparing a resinous condensation product of an allylated phenol and an ethoxyline resin comprising reacting an allylated phenol with an ethoxyline resin in the presence of an acid catalyst and a compound selected from certain ketones and esters.

Abstract: The high temperature stability of devices encapsulated with a flame retardant epoxy molding compound is improved by including in the encapsulant as synergistic flame retardant a halogen-containing organic compound (preferably of the reactive type) and antimony pentoxide. The encapsulant may be prepared from an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, the halogen-containing organic compound (which may be part of the resin or the hardener) and antimony pentoxide. Such encapsulants, when used to encapsulate semiconductor devices, have improved high temperature compatability compared to similar molding compounds with antimony trioxide or antimony tetraoxide.

Abstract: This invention describes new perfluoroalkyl substituted esters, diesters and polyesters which contain at least one cyclic 5-membered anhydride group or two carboxy groups, as well as half amides and half esters thereof; their synthesis and their use as surface-active reactants in polycondensate resin systems.The anhydrides are synthesized by reaction of perfluoroalkyl substituted alcohols or diols with dianhydrides or an anhydrides-acid chloride and have the general structure ##STR1## wherein: Q is the tetra-radical rest of a tri- or tetra-carboxylic acid, which contains at least one 1,2-dicarboxy grouping,X is hydrogen or COOH,R.sub.f is a perfluoroalkyl or perfluoroalkoxy-perfluoroalkyl group of 4 to 18 carbon atoms,a is 1 or 2,A is hydrogen or ##STR2## wherein: m is an integer from 0 to 5, andR.sup.3 is the residue of a R.sub.f substituted alcohol or diol.

Abstract: A novel epoxy resin curing system comprises salicylic acid and methyliminobispropylamine (MIBPA). The resins comprise a vicinal polyepoxide and a curing amount of salicylic acid and MIBPA.

Abstract: Mixtures of approximately equivalent amounts of (a) a glycidylated hydantoin and (b) a mononuclear phenol with 2 or 3 phenolic hydroxyl groups, at least one of the components (a) or (b) being trifunctional. They additionally contain a curing accelerator and on heating form mechanically good and flexible plastics which are stable to hydrolysis and can be used as building materials and foams, for the finishing and coating of textile material and for the preparation of water-permeable membranes.