Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.

Abstract: The invention concerns the use of stannylenes and germylenes of general formula (1) wherein: 1

Abstract: A coating, sealant or adhesive composition curable at ambient temperatures of 40° C. or below comprises an epoxy resin and an amine-functional curing agent. The curing agent comprises a material containing at least two, and preferably at least three, heterocyclic secondary amine group.

Abstract: A process for manufacturing an &agr;-dihydroxy derivative from an aryl allyl ether wherein such &agr;-dihydroxy derivative can be used to prepare an &agr;-halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an &agr;-halohydrin intermediate produced from a halide substitution of an &agr;-dihydroxy derivative which has been obtained by a dihydroxylation reaction of an aryl allyl ether in the presence of an oxidant or in the presence of an oxidant and a catalyst.

Abstract: A pultrusion resin composition comprising about 75 wt % to about 85 wt % of a phenolic resin, about 9 wt % to about 20 wt % of the reaction product of a polyhydroxy compound and an epoxy-functional polysiloxane, about 6 wt % to about 15 wt %, of a phenolic epoxy, and about 0.2 wt % to about 1 wt % of a catalyst, based on total weight of the composition. Pultruded products are formed by drawing fibrous reinforcement through a bath of the pultrusion resin composition.

Abstract: Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1,1,2,2-substituted-1,2-ethane-diol and/or a derivative thereof, and (D) optionally further additives; and wherein said component (C) is a compound of formula (I), wherein each of R1, R2, and R3 independently of the other is unsubstituted phenyl or has one of the meanings of R4; R4 is substituted phenyl optionally substituted &agr;-naphthyl or &bgr;-naphthyl, or an optionally substituted aromatic heterocyclic ring system or each of R1 and R2 and/or R3 and R4 independently of the other form a residue of formula (II), wherein each of R5 and R6 independently of the other is hydrogen or (C1-C4)alkyl; R7 is —(CH2)n— or —S— or —O—; and n is 0, 1, 2, or 3.

Abstract: A perfluoro group-containing compound are represented by the following formula (I): —Rf— is a perfluoro group; and —A represents —OH or a group: or —CyF2y+1 or —CzF2z−1 and a perfluoro group-containing polymerizable compound represented by the following formula (II): R1—O—CH2—CH(OH)—CH2—O—Rf—B  (II) In Formula (II), —Rf— is a perfluoro group; —B is —OH or —O—CH2—CH(OH)—CH2—O—R2, or —CyF2y+1 or —CzF2z−1; and R1 and R2 each is a dehydroxyl residue of a (meth)acryloyl group-containing compound or a vinyl group-containing compound. The hardened polymer from the compound has water-repellency, oil-repellency and adhering ability.

Abstract: The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction of the epoxy resin.

Abstract: Energy cost is reduced and reuse efficiency of epihalohydrin and industrial productivity in the process for preparing an epoxy resin, which uses a recovered epihalohydrin having a low glycidol content, are remarkably improved. In the process for preparing an epoxy resin by reacting a polyhydric phenol compound with epihalohydrin in a water-soluble organic solvent in the presence of an alkali reactive catalyst, first, a first recovered fraction containing a small amount of the by-product glycidol is recovered while continuously distilling a distilled component from the crude reaction product after the completion of the reaction, and then a second recovered fraction containing a small amount of the water-soluble organic solvent is recovered and, furthermore, the second recovered fraction is washed with water to obtain a purified fraction and the purified fraction is used as a raw material for synthesis of the epoxy resin, together with the first recovered fraction.

Abstract: A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may be utilized in an unfilled state which allows the epoxy to remain very viscous and thus increases the speed of the underfill process in comparison to filled epoxy compositions and epoxy compositions containing different accelerator components.

Abstract: An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.

Abstract: The resin system comprises at least two components which can be stored separately and crosslinked with one another at room temperature, preferably without curing accelerators. The first component comprises at least one compound of the formula (I) where A is an unsubstituted or substituted aromatic radical. The second component comprises at least one cyclic anhydride of an organic acid.

Abstract: A fluorine-containing epoxy resin composition comprising a fluorine-containing aromatic epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and preferably at least two epoxy groups, a cationic polymerization catalyst, and optionally a compatibilizing agent having an epoxy group and a fluoromethyl group is coated on discharge openings of an ink jet recording head, followed by exposure to activation energy rays in a given pattern form to form cured coatings with a desired pattern so that the discharge openings can be endowed with ink repellency.

Abstract: A two part system for producing structural reinforcing adhesives is provided wherein one component containing epoxy resin is combined with a second component containing a specified curative system. An aliphatic polyamine, an amidoamine, an alcohol and an adduct of a polyamine and an epoxide are present in the curative system. When a thermally activated blowing agent is utilized, the resulting foam is remarkably uniform in cell structure and has improved strength and modulus. Hollow inorganic microspheres are employed to reduce the density of the thermoset produced from the two part system.

Abstract: The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. The present invention includes the polymerization of epoxy resins, vinyl ethers and other cationically curable monomers.

Abstract: Curable epoxy resin compositions, which are obtainable by heating a composition containing at least one epoxy compound, which contains on average at least one, preferably more than one, 1,2-epoxy group and optionally also one or several hydroxyl groups in the molecule, in the presence of at least one Lewis acid as catalyst, wherein the Lewis acid is a salt of trifluoromethanesulfonic acid or of perchloric acid, the counterion of which carries a 2- to 6-fold positive charge, until the epoxy value, measured in equivalent epoxy/kg (Eq/kg) of the starting material, has been reduced by 1 to 60 percent, preferably by 5 to 50 percent; a process for their preparation, and their use for the preparation of fully cured moulded compositions or coatings.

Abstract: Novel phosphorus element-containing crosslinking agents for epoxy resin compositions based on an isomeric mixture of tris(2-hydroxyphenyl)-phosphine oxide compounds. Epoxy resins cured or crosslinked with the crosslinking agents of this invention yield non-halogenated, ignition resistant epoxy resin formulations. The ignition resistant epoxy resin formulations are advantageously used for making laminates for printed wiring boards and composite materials.

Abstract: This invention relates to an epoxy composition especially designed for use as a primer for sealing and filling small pores in concrete. Advantageously, the composition is a low temperature curing, sag-resistant epoxy primer, which provides good adhesion to concrete and to a polyurea coating applied to the primed concrete. Advantageously the epoxy primer is curable at a temperature below 40° F. and comprises an admixture of two parts, Component A and Component B; wherein Component A comprises a crystallization resistant reactive epoxy resin and Component B comprises an amine curing agent. The resulting primer bonds to concrete at 200 psi or greater, when measured by ASTM D 4541.

Abstract: A resin composition comprising a fluorine-containing aliphatic epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and at lest two epoxy groups, a cationic polymerization catalyst, and optionally a compatibilizing agent having an epoxy group and a fluoromethyl group is applied to a discharge opening surface of an ink jet recording head, followed by irradiation with an activation energy ray in a given pattern to form a cured film in a desired pattern, so that the discharge opening surface is endowed with ink repellency.

Abstract: An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: 1

Abstract: A metal (M) alkyl acid phosphate catalyst for the reaction of an epoxy compound with a carboxyl compound to provide a coating formulation that is stable at room temperature; that is humidity resistant, and non-yellowing, wherein the alkyl acid phosphate has the formula: (RO)n—(P═O)—(OH)m and wherein: a. each R is selected from the group consisting of: i) a C1 to C18 alkly, cycloalkyl, or aryl; ii) a linear or branched C6 to C18 alkyl substituted with —(O—CH2—CH2—)o or —(O—CH—CH3—CH2—)p, wherein o or p is from 1 to 20; iii) a &bgr;-hydroxyethyl compound, R′—X—CH2—CH—OH—CH2—, wherein R′ is a C6 to C18 alkyl or cycloalkyl or aryl, X is either —CH2—, —O— or —COO—; b. n+m=3 and n is between 2 to 1; and c. M is Zn or Sn (II) in a mole equivalent of 0.7 to 1.5 moles per mole of alkyl acid phosphate.

Abstract: The present invention provides a room-temperature curable, reinforced thermosetting epoxy resin composition. The composition includes an epoxy resin first component, and an epoxy resin hardener second component. The epoxy resin component includes an epoxy resin, and may further include an inorganic and/or organic filler component, such as a structural reinforcement component. The epoxy resin hardener component includes an amine-based hardener, and may further include an inorganic and/or organic filler component. Cured reaction products of the composition demonstrate at about room temperature an adhesive strength of at least about 6500 psi, such as about 8000 to about 10000, and a fracture toughness of at least about 10 in-lbs/in2, such as about 20 to about 35 in-lbs/in2. In addition, the cured reaction products of the composition demonstrate a creep resistance at about room temperature at least about 6000 psi of at least about 1 hour.

Abstract: Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R.sub.1, (II) --O--CY--R.sub.1, or (III) --O--CY--X--R.sub.1, the groups being directly bonded to the armoatic or heteroaromatic ring, in a number of 1 to 10 wherein R.sub.1 may be the same or different and is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is O or NH and Y is O or S. Furthermore, an epoxy resin composition comprising the curing catalyst is disclosed.

Abstract: This invention relates to an epoxy resin composition which comprises polyalkyl phenol resins or polyalkyl phenol epoxy resins or both, wherein the polyalkyl phenol resins are represented by formula (I): ##STR1## wherein Ra, Rb and Rc may be the same or different from each other and stand for C.sub.1-5 alkyl styryl or halogen respectively;n is an integer of 0 to 4;k is an integer of 0 to 3;l is an integer of 0 to 4; andm is an integer of 1 to 10;and the polyalkyl phenol epoxy resins, which are obtained by reacting polyalkyl phenol resins of formula (I) with epihalohydrins, are represented by formula (II): ##STR2## wherein G stands for ##STR3## while the other symbols are the same as those defined above. The epoxy resin composition of this invention is able to provide a reactivity at lower temperatures and provide lower viscosity when used as hardener resins, as compared with traditional phenolic novolacs.

Abstract: Provided is an epoxy resin composition comprising a crystalline epoxy resin and an amorphous epoxy curing agent, wherein the crystalline epoxy resin is dispersing uniformly in the amorphous epoxy curing agent as crystallites. The epoxy resin composition is excellent in preservation stability.

Abstract: An epoxy resin composition for sealing a photo-semiconductor element, comprising(A) an epoxy resin,(B) a curing agent and(C) a polyether-modified silicone oil which is represented by the following general formula (1) ##STR1## wherein m, n and a are each independently a number of 1 or more, b is 0 or a positive number, and R is an alkyl group of 1 to 6 carbon atoms or H,and has a weight average molecular weight of 1,000 to 100,000, a silicone unit content {[(m+n+2)/(m+n+2+a+b+1)].times.100} of 10 to 60% and a polyether unit content {[(a+b+1)/(m+n+2+a+b+1)].times.100} of 40 to 90%and a photo-semiconductor device produced by sealing a photo-semiconductor element with the epoxy resin composition.

Abstract: A hardener for epoxy resins is disclosed the use of which imparts improved resistance in the resins to aging on exposure to ultraviolet radiation. The hardener comprises (a) at least one amine selected from the group consisting of trimethylhexamethylenediamine and isophoronediamine and (b) at least one inorganic salt which contains nitrate ion.

Abstract: The present invention relates to polyglycidyl ether compounds containing at least three mono- or divalent radicals A of the general formula wherein R.sub.

Abstract: An elastomeric epoxy composition and curing agents for elastomeric epoxy compositions, the elastomeric epoxy composition being the reaction product of a substituted amide and an epoxy.

Abstract: Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R.sub.1, (II) --O--CY--R.sub.1, or (III) --O--CY--X--R.sub.1, the groups being directly bonded to the armoatic or heteroaromatic ring, in a number of 1 to 10 wherein R.sub.1 may be the same or different and is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is O or NH and Y is O or S. Furthermore, an epoxy resin composition comprising the curing catalyst is disclosed.

Abstract: The present invention relates to linear, cyclic or branched polyorganosiloxanes having, per molecule, at least three siloxy units, including at least one functional unit of formula: ##EQU1## where R.sup.1 represents a C.sub.1 to C.sub.4 alkyl or phenyl radical and X contains a secondary or tertiary cyclic amine functional group bonded to the silicon via an Si--A--C bond where A is a residue comprising a cyclic acetal group. X more specifically represents a monovalent group of formula: ##STR1## The present invention also relates to the use of such polyorganosiloxanes in polymers for improving in particular their photostabilization.

Abstract: A process reaction between: (1) a compound that contains one or more epoxide moieties per molecule, and (2) a compound that contains one or more primary aliphatic hydroxyl groups per molecule; is catalyzed by: (3) a catalyst compound containing one or more trifluoromethanesulfonate moieties and one or more silyl moieties and run at a temperature of no more than 130.degree. C., such that the catalyst preferably catalyzes reaction at the primary aliphatic hydroxyl group, so that the resulting resin does not gel.

Abstract: A class of compounds which inhibits the reaction of a polyepoxide with a curing agent at low temperatures including an epoxy resin composition containinga) a polyepoxide;b) an amine or amide curing agent for the polyepoxide;c) at least about 15 meq (per equivalent of polyepoxide) of a catalyst for the reaction of the polyepoxide with the curing agent; andd) a cure inhibitor selected such that:(1) at about 171.degree. C. the composition has a gel time that is at least about 50 percent longer than a similar composition without the inhibitor, and(2) at about 175.degree. C. and higher the composition cures in no more than about 50 minutessuch that the composition cures rapidly with high cross-link density because it has a high catalyst loading, while the inhibitor lengthens the gel time to permit laminating and other processing.

Abstract: Described is a method of reducing resin bleed of a cyanate ester-containing die attach adhesive produced by curing a liquid resin system that contains cyanate ester monomer or mixtures that include cyanate ester monomer by adding an additive comprising at least one alkylene aromatic compound and curing the liquid resin system with the alkylene aromatic compound . Also disclosed is a die attach adhesive that comprises a resin system with an alkylene aromatic compound.

Abstract: Novel polymers of general formula: ##STR1## wherein where n is a whole number from 2 to 10; R is a spacing group comprising (a) at least one of m methylene units where m is a whole number from 1 to 20, m' methine units where m' is a whole number from 0 to 20, a mixture of m methylene units and m' methine units where m+m'.ltoreq.20, and units of formula --(CH.sub.2 -CHX-O).sub.m" --, where m" is a whole number from 0 to 200 and X is H, CH.sub.3 or C.sub.2 H.sub.5, or (b) an aromatic ring having one, two or three members; R' is H, an alkyl group having no more than 20 carbon atoms, an aryl group having no more than three rings, or a combination thereof; R" is a group containing at least two active hydrogen atoms and having at least two but no more than 20 carbon atoms; and R'" is a group containing at least two active hydrogen atoms and is selected from the group consisting of alkyl, aryl and mixed alkyl-aryl species having from 1 to 200 carbon atoms; polyalkylene oxides; and urea formaldehyde resin.

Abstract: Cyclic acetal derivative of a resole includes the reaction product of an ortho resole compound with a carbonyl compound or a carbonyl compound derivative. The cyclic acetal derivatives of phenolic resole compounds exhibit enhanced storage stability and can be readily activated at elevated temperatures to prepare phenolic based adhesives and coatings.

Abstract: A polypropylene resin composition, which exhibits an excellent coating adherence, high rigidity, high impact strength at low temperatures, prominent heat resistance and excellent appearance of moldings even without effecting a treatment with trichloroethane as a pretreatment step before coating, comprises 30 to 92% by weight crystalline ethylene propylene block copolymer (A), 5 to 30% by weight ethylene-.alpha. olefin copolymer rubber (B), 3 to 20% by weight ethylene-butene-1 copolymer (C) having the following characteristics:(C1) a density of 0.870 to 0.915 g/cm.sup.3,(C2) a melt index at 190.degree. C. of 5 to 30 g/10 minutes, and(C3) a melt peak at 100.degree. C. or higher as determined in the thermogram with increasing temperature by a Differential Scanning Calorimeter (DSC),and 0 to 20% by weight inorganic filler (D).

Abstract: Hot melt adhesive compositions, particularly biodegradable hot melt adhesives are prepared from 10 to 90% by weight of a thermoplastic methylol polyester prepared from the reaction of at least one dicarboxylic acid with a diglycidyl ether, a diglycidyl ester or a combination thereof; 0 to 90% by weight of a compatible tackifier; 0 to 80% by weight of a compatible plasticizer; 0 to 50% by weight of a compatible wax diluent and 0 to 3% by weight of a stabilizer.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Novel aminoplast anchored UV stabilizers are provided. Compared to unanchored stabilizers, the anchored stabilizers disclosed herein have increased compatibility with coating resins and have reduced volatility due to higher molecular weights resulting from anchoring. A process for preparing the anchored stabilizers by the reaction of unanchored stabilizers with alkoxymethylated aminoplasts in a sulfuric acid medium is also provided. The unanchored stabilizers include 2-(2-hydroxyaryl)benzotriazoles, 2-hydroxybenzophenones, 2-(2-hydroxyaryl)-4,6-diaryl-1,3,5-triazines, salicylic acid derivatives, 2-hydroxyoxanilides, and blocked derivatives thereof as well as mixtures of two or more stabilizers. The aminoplasts include alkoxymethylated derivatives of glycolurils, melamines, and benzoguanamines.

Abstract: The present invention relates to textile printing pastes containing modified polyisocyanates, modified polycarbodiimides, or trifunctional polyepoxides as crosslinking agents for the binders present therein.

Abstract: A thermally-curable aromatic amine-epoxy composition comprises(a) at least one polyepoxy compound;(b) a curing amount of at least one aromatic polyamine compound; and(c) a catalytically effective amount of at least one cure accelerator compound which is a .pi.-electron acceptor, and which lowers the cure exotherm peak temperature (as measured by differential scanning calorimetry (DSC) at 10.degree. C. per minute) of the composition by at least about 8 percent relative to the corresponding composition without the cure accelerator. Such accelerator compounds moderate and/or accelerate the thermal curing of aromatic amine-epoxy resins, enabling cure to occur at lower temperatures and/or in shorter time periods than those required for the unaccelerated composition.

Abstract: A curable epoxide composition consists essentially of curable epoxides, dicyandiamide as a curing agent in an amount less than needed to fully cure the epoxides, an imidazole in an amount exceeding that needed as a catalyst and capable of curing the epoxides in combination with the dicyandiamide, a reactivity controller for the imidazole to reduce the curing speed, and a solvent. The use of undesirable solvents such as DMF is reduced. A glass transition temperature greater than 135.degree. C. is obtained in the cured composition and is maximized by balancing the amounts of dicyandiamide, the imidazole, and the reactivity controller.

Abstract: A biodegradable hydroxy-functional polyester is prepared by contacting a hydroxy-functional aliphatic dicarboxylic acid or a mixture of dicarboxylic acids containing hydroxy-functional aliphatic diacids, with a diglycidyl ether or diglycidyl ester in the presence of an onium catalyst in an ether solvent under conditions suitable for forming the polyester.

Abstract: A curing agent for a composition for the production of matt epoxide and hybrid powder coatings which is a mixture comprising:a) salts of phthalic, isophthalic and terephthalic acid and the following guanidines. ##STR1## wherein R, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 may be identical or different radicals selected from the group consisting of H, (cyclo)alkyl and aromatic hydrocarbon radicals having 1-9 carbon atoms and where R.sup.1 with R.sup.2 and R.sup.3 with R.sup.4 each form a ring which contains an oxygen atom as heteroatom, and 0.5-2 mol of the guanidine A) react per mole of acid, andb) pyromellitic acid and/or trimellitic acid, 0.25-2 mol of b) employed per mole of a).

Abstract: A reaction product formed between an epoxy resin, a phenol compound such as bisphenol or the like and an isocyanate compound contains oxazolidone rings and it is a polymeric epoxy resin. Herein is provided an epoxy resin composition comprising said reaction product and a curing agent.The said reaction product contains oxazolidone rings and epoxy groups, and is excellent in heat resistance and adhesive property. Further said reaction product is made into a polymer by the use of the bisphenol compound and at the same time it contains oxazolidone rings; it is excellent in toughness and water resistance. When a tetrabromobisphenol is used as the bisphenol compound, flame retardance is also good.Accordingly, the epoxy resin composition of the present invention is excellent in heat resistance, toughness, adhesive property and water resistance. When a brominated compound is used as the phenol compound, the epoxy resin composition of the invention exhibits an excellent flame retardance.

Abstract: Epoxy molding compositions for surface mount applications are disclosed. The compositions contain multifunctional epoxy resin and multifunctional hardener along with silicone rubber particles, organofunctional silicone fluid and a high loading of silica.

Abstract: A phosphorus-containing wholly aromatic polyester is produced by an interfacial polymerization method which includes the step of reacting a phosphorus-containing bisphenol compound and a bisphenol compound with dicarboxylic acid chlorides. An organic layer containing the dicarboxylic acid chlorides and phase transfer catalyst is added into an alkaline aqueous layer which contains a bisphenol compound.

Abstract: A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound and 0.01 to 50 parts by weight of a metal complex compound of the formulaML.sub.x B.sub.y or M[SR].sub.x B.sub.z,wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, SR is an acid ion of an inorganic acid, B is a Lewis base, x is an integer from 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 or 8 with the proviso that B is not a polyvalent phenolic compound and a process for the polymerization thereof.

Abstract: A thermally curable mixture contains 10-70% by weight of reactive compounds, 0.05-2% by weight of at least one basic catalyst, and at least one solvent. The reactive compounds are consisting essentially of a first reactive compound and a second reactive compound at a molar ratio between 1:1 and 1:10. The first reactive compound is a formamide selected from the group consisting of hydroxyformamides, di-formamides and polyformamides, and the second reactive compound is at least one compound having an epoxy equivalent between 100 and 800 g KOH per mole epoxy group, selected from a group of aromatic di-glycidylethers and aromatic poly-glycidylethers. The basic catalyst is at least one chemical agent selected from the group consisting of tertiary ammonium salts, tertiary aromatic amines, and tertiary heterocyclic amines. The solvent is at least one chemical compound selected from the group consisting of aliphatic alcohols, ether alcohols, diether, and tertiary amides.