Abstract: A method is used for providing sensing data to a control system of a machine. The method may include providing a plurality of virtual sensors, each of which may have a model type, at least one input parameter, and at least one output parameter. The method may also include integrating the plurality of virtual sensors into a virtual sensor network; determining interdependencies among the plurality of virtual sensors; and obtaining operational information of the plurality of virtual sensors. Further, the method may include recording measurement data and performance information of the virtual sensor network and the plurality of virtual sensors; and generating one or more calibration certificate of the virtual sensor network based on the operational information, the measurement data, and the performance information.

Abstract: Content is generated on a host system based on real-time data from a controlled process collected over the internet from a customer's client machine tool control system. The client system may request content from a host website. Instructions associated with the requested content, which may be in the form of an application to be run on the client, is delivered to the client via download over the internet. The client gathers real-time data associated with a controlled process and transmits it to the host, where content based on the data can be generated for the client and/or its owner. Data gathered by the host, and content generated on the basis of the data, may be made accessible to machine tool manufacturers. Also, data received by the host is associated with an identifier defined for each client system. A historical database for given client equipment can thereby be created.

Abstract: A quality control method includes: extracting, from a time series distribution of troubles that have occurred in electronic equipments, a first characteristics of states of occurrence of the troubles; specifying one or more parts included in the electronic equipments, the parts being involved with the troubles; extracting, from another time series distribution of a rate of use corresponding to each of suppliers which supply the specified parts, a second characteristics of the parts; and specifying one or more of the suppliers supplying the parts correlated to the troubles based on a correlation between the extracted first characteristics and the extracted second characteristics.

Abstract: Systems and methods are presented for constructing production plans to achieve one or more production goals, in which a diagnosis engine determines the production plant condition based on a previously executed plan, observations from the plant, and a plant model, and formulates a heuristic based on a diagnostic objective, and with a planner to performing a partial-plan search using the heuristic to construct the plans that will concurrently achieve at least one production goal and facilitate the diagnostic objective.

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of, and system for simulating, verifying, inspecting, characterizing, determining and/or evaluating the lithographic designs, techniques and/or systems, and/or individual functions performed thereby or components used therein. In one embodiment, the present invention is a system and method that accelerates lithography simulation, inspection, characterization and/or evaluation of the optical characteristics and/or properties, as well as the effects and/or interactions of lithographic systems and processing techniques.

Abstract: Techniques are described for monitoring the performance of advanced process control (APC) systems used to control complex industrial processes. By correlating an alarm status of the APC system with an alarm status associated with the service factor (or service factor thresholds), a plant operator can understand how well the APC system performs over time, as well as identify when operator intervention may be required (or alternatively, may be the source of poor plant performance). Accordingly, embodiments of the invention can significantly impact both the reliability and efficiency of complex industrial process, e.g., the production of industrial gases using air separation units (ASUs) and steam methane reformer (SMR) furnaces.

Abstract: As described, a neural network based fault detection and analysis tool may be integrated with a physical (or semi physical) model based fault detection and analysis tool. The physical modeling tool provides a mathematical model of plant processes, e.g., a set of mass/energy balance equations modeling the systems at a specific plant. In contrast, the neural network develops a model of a given set of sensors from process data. One advantage of the neural network based tool is that it does not require fundamental knowledge of the process. However, the neural network is only valid for the conditions for which it was trained (i.e., conditions represented by a set of training data). Therefore, the neural network will occasionally need to be re-trained as the process conditions change. In contrast, the physical modeling tool based tool does not need to be retrained and remains valid for all process conditions accounted for in the fundamental models.

Abstract: The present disclosure relates to systems and processes for detecting and rejecting defective absorbent articles from a converting line. In particular, the systems and methods may utilize feedback from technologies, such as vision systems, sensors, remote input and output stations, and controllers with synchronized embedded clocks to accurately correlate inspection results and measurements from an absorbent article converting process. As such, the systems and methods may accurately apply the use of precision clock synchronization for both instrumentation and control system devices on a non-deterministic communications network. In turn, the clock synchronized control and instrumentation network may be used to control a reject system on converters of absorbent articles. In some embodiments, the controller will reject only defective absorbent articles without the need to reject non-defective absorbent articles.

Abstract: Measuring apparatus and method for monitoring fabrication of a semiconductor wafer by exciting and measuring vibrations of the wafer substrate. A measurable parameter of vibration (e.g. frequency) is indicative of mass of a vibrating region. Mass change caused by wafer treatment is reflected in changes in vibration measurements taken before and after that treatment. The apparatus includes a wafer support e.g. projecting ledge (19), a vibration exciting device e.g. contact probe (28) or pressure differential applicator, and a measurement device e.g. frequency sensor (62).

Abstract: Disclosed are various embodiments of a self healing andon system. One embodiment of the present disclosure includes a system comprising at least one server. The system further includes logic executed on the at least one server that retrieves a defect history associated with a vendor and at least one product from an inbound shipment from a memory. The at least one product is stocked in a materials handling facility, and the defect history is associated with a specified time period. The at least one server extracts at least one inventory defect from the defect history in a computer system and calculates an inventory defect rate. The at least one server imposes remedial measures if the inventory defect rate exceeds a specified threshold of the inventory defect rate.

Abstract: A system for controlling the operation of a printing press used to apply an aqueous printable electrically conductive ink onto a substrate to create electrically conductive traces of such ink includes a probe for contacting the electrical traces and for obtaining a resistance measurement therefrom. A computer receives the resistance measurement, compares such measurement with pre-selected data correlating resistance with acceptable performance criteria for such traces, determines whether such resistance measurement signifies acceptable performance, and signals an appropriate mechanism for identifying those electrical traces which do not meet the acceptable performance criteria. Unacceptable traces are removed from the press prior to further processing. The computer can also signal an ink replenishment or conditioning system, contained in a replaceable cartridge, to correct any abnormalities in the ink properties.

Abstract: Methods and apparatuses for manufacturing photovoltaic products include an assessment of each product in a production line for suitability, and assigning a grade based either on assessment of the product at that step, comparison to statistical analysis of assessment results of previous products at that step or comparison of previous assessment results of past steps compared to statistical analysis of cumulative assessment results of past products at those steps. Products can be associated into groups for processing as a group based on the grades and downstream equipment can be adjusted based on the grade of the group to bring the group within determined tolerances.

Abstract: A server device includes: an abnormality information output unit for storing a plurality of measurement information, which is time sequential information related to information measured in a plurality of manufacturing apparatuses, having manufacturing apparatus identifiers and time information, and storing at least one set of abnormality information indicating an abnormality and one or more measurement information, and outputting one or more abnormality information; a chart composing unit for composing one or more charts from one or more measurement information in pair with one or more abnormality information corresponding to an abnormality information instruction when the instruction, which is an instruction for one or more abnormality information among the one or more abnormality information outputted by the abnormality information output unit, is received; and an output unit for outputting the one or more charts composed by the chart composing unit, so that abnormality analysis can be carried out easily an

Abstract: Paper and continuous web scanners operate at varying and high temperature conditions. Regulating the temperature within the measurement gap between dual scanner heads during measurement and calibration modes of operation by employing air wipe and sheet guide temperature control assures consistent and accuracy sensor measurements of sheet characteristics. Air wipes blow pre-heated air into the measurement and the sheet guides are heated. The air temperature fluctuations that otherwise caused significant adverse effects on the sensors that measure, for example, the basis weight, ash content, and thickness of the moving sheet, are eliminated.

Abstract: A system and method for monitoring product through a batch manufacturing plant is provided. The system includes, a parallel flow mode when product flows concurrently from at least two units to a single unit; and a serial flow mode where product flows from one unit to another at a given time, wherein the batch manufacturing plant is modeled based on the parallel and serial flow modes. A lot association is built based on product flow and a parent/child record is created for lot association. The system also includes a data collection system that collects phase information for every unit and a procedure identifier is used to create a batch identifier, where a batch identifier is associated with each lot on each unit through which product is flowing to and/or from at a given time.

Abstract: Described are methods, systems, and a computer-readable storage medium for controlling a discrete-type manufacturing process (e.g., an injection molding process) with a multivariate model. Data representing process parameters, operating parameters, or both of the manufacturing process are received. The received data is compared with a multivariate model that approximates the manufacturing process to provide a result. Upon the result of the comparing satisfying a condition, one or more values for a set of operating parameters for the manufacturing process are determined. When the one or more determined values for the set of operating parameters satisfies a criterion, at least one operating parameter of the manufacturing process is updated.

Abstract: A control method for a semiconductor manufacturing apparatus, comprising: generating, as log data, a history of operation states of the semiconductor manufacturing apparatus when a wafer is processed by the semiconductor manufacturing apparatus; specifying, based on the log data, processing results in which operation states of the semiconductor manufacturing apparatus are abnormal states out of processing results after the processing of the wafer processed by the semiconductor manufacturing apparatus as abnormal processing results; creating control data for the semiconductor manufacturing apparatus based on the processing results and the abnormal processing results; and controlling the processing by the semiconductor manufacturing apparatus using the control data.

Abstract: A method, and corresponding computer program product and system, defines and uses marker points within a modeled manufacturing process routing that includes multiple sequenced operations. The method includes receiving user input that defines one or more marker points within the modeled manufacturing process routing and between sequential ones of the operations. The marker points define a user-defined point within a manufacturing process and include one of multiple defined types that each define a different use to be made by the marker point. The method also includes detecting if any marker points of a specified one of the defined types have been defined in the manufacturing process routing. If a marker point having the specified one of the defined types is detected, a predefined computing function is executed that uses the detected marker point.

Abstract: A processing system and method for chemical oxide removal (COR) is presented, wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.

Abstract: A quantity of an item referenced within a multilevel bill of material (BOM) is determined. A price bid for the item is received into an application framework from a supplier. The price bid is associated with the item. The cost of the multilevel BOM is determined based on the quantity of the item and the price bid.

Abstract: A method for inputting a foreign substance inspection map created by foreign substance inspection for a wafer surface after each processing process in a wafer processing process, inputting a die sort map created by a die sort test after the wafer processing process, setting region segments in the wafer, setting a region number for each segment, calculating foreign substance density of the region segments, based on the foreign substance inspection map, and plotting the foreign substance density, using the region numbers, to calculate a foreign substance inspection map waveform characteristic amount, calculating failure density in the region segments, based on the die sort map, and plotting the failure density, using the region numbers, to calculate a die sort map waveform characteristic amount, calculating similarity between the foreign substance inspection map waveform characteristic amount and the die sort map waveform characteristic amount, and identifying a processing process cause of failure occurrence.

Abstract: A method for automatically detecting fault conditions and classifying the fault conditions during substrate processing is provided. The method includes collecting processing data by a set of sensors during the substrate processing. The method also includes sending the processing data to a fault detection/classification component. The method further includes performing data manipulation of the processing data by the fault detection/classification component. The method yet also includes executing a comparison between the processing data and a plurality of fault models stored within a fault library. Each fault model of the plurality of fault models represents a set of data characterizing a specific fault condition. Each fault model includes at least a fault signature, a fault boundary, and a set of principal component analysis (PCA) parameters.

Abstract: A method and system are disclosed for assessing the capability of a pilot to operate an aircraft. The system senses the value of at least one operator information parameter for assessing the fitness of the pilot operating the aircraft and at least one aircraft information parameter relating to the position and motion of the aircraft. The operator information parameters include electroencephalogram information, electrocardiogram information, heart rate information, respiratory rate information, eye motion information, eyelid position information, eyelid motion information, expired gas mixture information, blood oxygen content information, blood oxygen saturation information and blood pressure information for the person operating the aircraft, and/or information about actions taken by the person operating the aircraft.

Abstract: Methods are disclosed for generating a representation of flatness defects on a wafer. Data is received describing the thickness of the wafer at a plurality of points on a wafer divided into a plurality of sites. A reference plane is defined for each of the plurality of sites. For each of the sites, an upper plane and a lower plane are defined relative to the reference plane. A determination is made as to which of the plurality of points on the wafer represents a flatness defect by identifying which points are not disposed between the upper plane and lower plane. A representation is then generated depicting a location of each of the flatness defects on the wafer. In some embodiments, a single representation is generated depicting the location of flatness defects on a plurality of wafers.

Abstract: Relating with board numbers of the boards mounted with the logic circuits and mounted places on the boards and in relation to log information to be collected from the logic circuits, analysis information describing information to be processed when the log information is generated, information of a condition for which the log information is to be valid, and information of a condition for which the log information is to be invalid are defined for analyzing failures using the analysis information based on the logic circuits. Upon the realization of the failure analysis based on the logic circuits, the analysis information further describes information of the priority of the log information to realize a thorough analysis of critical failures.

Abstract: A system for tracing a cause of a phenomenon occurring in products produced in a production process chain is provided. The system is provided with a storage unit for storing a virtual attribute in association with corresponding second products, a receiving unit for receiving information for specifying third products in which a phenomenon occurs, a correlation calculation unit for calculating a correlation coefficient between the third products specified by the information for specifying the third products and the group of the second products having a common virtual attribute, for every kind of second products used in the third products, and a cause identification unit for identifying the second products belonging to the kind of the second products for which a maximum correlation coefficient is calculated as the cause of the phenomenon.

Abstract: A system and method for reducing the magnitude of one or more harmonics of one or more uniformity parameters in a cured tire involves selective removal of tire material at one or more track/area locations along first and second bead profiles. Selective removal may occur via ablation at the bead seat, low flange and/or high flange zones to correct for a selected number of harmonics of such parameters as radial, lateral and tangential force variation. Ablation patterns are calculated and implemented on first and second tire beads to achieve desired levels of force reduction at selected angular locations (within the expanse from 0-360 degrees along each tire bead). Ablation patterns may be calculated for implementation at fixed or varied tire rotational speeds and/or fixed or varied levels of laser power.

Abstract: The invention provides an apparatus and methods for creating gate structures on a substrate in real-time using Vacuum Ultra-Violet (VUV) data and Electron Energy Distribution Function (EEDf) data and associated (VUV/EEDf)-related procedures in (VUV/EEDf) etch systems. The (VUV/EEDf)-related procedures can include multi-layer-multi-step processing sequences and (VUV/EEDf)-related models that can include Multi-Input/Multi-Output (MIMO) models.

Abstract: A platform assembly for use in a digital manufacturing system, where the platform assembly comprises a deformable platform having a surface configured to operably receive a deposited material from a deposition head, and at least one mechanism configured to adjust at least a portion of the first surface to compensate for at least one vertical deviation from at least one horizontal axis that the deposition head is directed to move in.

Abstract: Example methods, apparatuses and systems to correlate candidate factors to a predicted fault in a process control system are disclosed. Techniques may include obtaining a value associated with a particular factor corresponding to a process, and predicting a fault based on the value. A set of candidate factors corresponding to the predicted fault may be determined, and a correlation between the predicted fault and at least one factor from the set may be displayed. Different sections of the display may respectively correspond to the predicted fault and to the at least one factor, and the correlation may be indicated by time aligning the different sections. Modifications to one displayed section may result in automatic modification of other sections to maintain the correlation. A user may select one or more candidate factors to be displayed, and may indicate a particular point of a particular section to obtain additional details.

Abstract: A system and method is described for evaluating a wafer fabrication process for forming patterns on a wafer based upon data. Multiple inspection regions are defined on the wafer for analysis. For each inspection region, images of patterns within the inspection region are captured, edges are detected, and lines are registered to lines of a reference pattern automatically generated from the design data. Line widths are determined from the edges. Measured line widths are analyzed to provide statistics and feedback information regarding the fabrication process. In particular embodiments defects are identified as where measured line widths lie outside boundaries determined from the statistics. In particular embodiments, lines of different drawn width and/or orientation are grouped and analyzed separately. Measured line widths may also be grouped for analysis according to geometry such as shape or proximity to other shapes in the inspection region to provide feedback for optical proximity correction rules.

Abstract: A system and method for automatic quality control is provided. A database is maintained storing quality control rules for producing a product, the quality control rules determined via a first computing device associated with a first entity controlling production of the product, the database maintained by a second computing device associated with a second entity for maintaining quality control of the product, the product produced by a plurality of production lines respectively associated with third entities. Quality control data is received at the second computing device from data collection devices at the plurality of production lines, each of the data collection devices enabled to collect the quality control data for the product. At the second computing device, the quality control data is compared with the quality control rules; at least one quality control event is triggered when the quality control data fails at least one of the quality control rules.

Abstract: The present disclosure relates to systems and processes for detecting and rejecting defective absorbent articles from a converting line. In particular, the systems and methods may utilize feedback from technologies, such as vision systems, sensors, remote input and output stations, and controllers with synchronized embedded clocks to accurately correlate inspection results and measurements from an absorbent article converting process. As such, the systems and methods may accurately apply the use of precision clock synchronization for both instrumentation and control system devices on a non-deterministic communications network. In turn, the clock synchronized control and instrumentation network may be used to control a reject system on converters of absorbent articles. In some embodiments, the controller will reject only defective absorbent articles without the need to reject non-defective absorbent articles.

Abstract: A method to enable wafer result prediction from a batch processing tool, includes collecting manufacturing data from a batch of wafers processed in batch in the batch processing tool, to form a batch processing result; defining a degree of freedom of the batch processing result based on the manufacturing data; and performing an optimal curve fitting by trial and error for an optimal function model of the batch processing result based on the batch processing result.

Abstract: According to one embodiment, a manufacturing process monitoring system for monitoring anomaly in a manufacturing process for products, the system includes an information storage section, a selection information section, a reference space formation section and a monitoring section. The information storage section is configured to store previously collected data. The selection information section is configured to create information used in classifying the data stored in the information storage section. The reference space formation section is configured to form a reference space based on data subjected to anomaly monitoring acquired in the manufacturing process and the data classified by the information from the data stored in the information storage section. The monitoring section is configured to monitor anomaly of the data subjected to anomaly monitoring based on the reference space.

Abstract: According to one embodiment, a defect inspection is made on a pattern transferred on substrates to be processed, thereby generating defect image data. When a defect is detected, a defect contour is extracted from the generated image data, the extracted defect contour is reflected on a pattern of the semiconductor integrated circuit and a first drop recipe is generated based on the pattern data on which the defect contour is reflected. A drop recipe used for applying a hardening resin material is updated with the generated first drop recipe.

Abstract: Processing defects arising during processing of a semiconductor wafer prior to back-grinding are reduced with systems and methods of sensor placement. One or more holes are bored into a chuck table for receiving semiconductor wafers, or a support table next to the chuck table. One or more sensors are disposed in the holes for monitoring parameters during a pre-back-grinding (PBG) process. A control box converts a set of signals received from the sensors. A computer-implemented process control tool receives the converted set of signals from the control box and determines whether the PBG process will continue.

Abstract: A system and a method for controlling a semiconductor manufacturing process are disclosed. The method comprises providing a plurality of structured wafers and taking a series of images from the plurality of structured wafers, wherein one image is taken for each structured wafer and wherein the image is taken of a same location for each structured wafer. The method further comprises extracting information of a parameter for each of the series of images and comparing the extracted information.

Abstract: A system for optimizing at least one of a design, production, or testing process of a product in a mass manufacturing process includes: a central processing unit; a network interface operatively connected to the central processing unit; a storage device; a memory including logic for execution by the central processing unit, wherein the logic includes: a server handler made up of a client applet and a client interface servlet which are configured for enabling authorized end-user communication; an error data collection handler configured for gathering error data; an error data classification handler; an analysis handler; a suggested actions report handler; and the system further includes a server database configured for storing, modifying, and deleting data.

Abstract: An apparatus for recognizing and processing information of electronic parts includes a seating unit on which electronic parts are seated and aligned and a part information processing unit disposed adjacent to the seating unit. The part information processing unit is configured to align the electronic parts using the seating unit, recognize a recognition surface of the electronic parts, obtaining part information of the recognized surface, and store the obtained part information.

Abstract: A defect analyzing method according to the present invention includes: acquiring a position and a size of a defect obtained in a defect inspection of a semiconductor device and a waveform of a reflected light in a region which includes the defect, the waveform being obtained in an optical inspection; acquiring process step information which includes a plurality of process steps to manufacture the semiconductor device and a processing content per the process step; performing a process simulation of the semiconductor device based on the position and the size of the defect and the process step information; performing an optical simulation on a result of the process simulation thereby to generate a waveform of a reflected light; calculating a similarity degree between the acquired waveform of the reflected light and the generated waveform of the reflected light; and judging whether or not the calculated similarity degree exceeds a threshold value registered in advance.

Abstract: A CNC machining method that incorporates a dimensional probe that allows inspection after stages of machining to determine actual dimensions with respect to the target dimension allows for corrective measures before advancing to the next step of the process so as to reduce the number of rejects at the end of the machining process. In making a tubular thread that involves initially machining a taper followed by the thread form, the probe and the various cutters are oriented against gauge blocks supported in the chuck jaws. The probe is used to dimensionally inspect the taper that is cut as an initial step before the thread form is produced. Inspection using the probe takes place upon machining the taper and after the thread form is cut using the probe integrated into the machine.

Abstract: A method of measuring planar defects in a substrate may include positioning a sensor proximate to an area configured to receive a substrate.

Abstract: An endpoint detection device, a plasma reactor with the endpoint detection device, and an endpoint detection method are provided. The endpoint detection device includes an OES data operation unit, a data selector, a product generator, an SVM, and an endpoint determiner. The OES data operation unit processes reference OES data by normalization and PCA. The data selector selects part of the linear reference loading vectors and selects part of the selected linear reference loading vectors. The product generator outputs at least one reference product value. The SVM performs regression and outputs a prediction product value. The endpoint determiner detects a process wafer etch or deposition endpoint and outputs a detection signal.

Abstract: Resource exhaustion is anticipated, a cause of the resource exhaustion is identified and options are identified to address the resource exhaustion.

Abstract: A method and system for controlling machining processes are provided. The system includes a computer system communicatively coupled to a database. The computer system is configured to receive data relating to manufactured part processes, identify at least one machining process used to manufacture a part and a parameter of the at least one machining process, receive survey data relating to the manufacturing process parameters used during the at least one machining process, and receive identification data for the manufactured part. The computer is further configured to receive data relating to a design of experiment (DOE), determine an low cycle fatigue (LCF) life distribution, identify process parameters that affect the LCF, and determine an allowable range for each identified process parameters for safe operation. The computer system is further configured to output the process window embodied in a specification associated with at least one of the part and the process.

Abstract: The present invention relates to a defect inspection apparatus for inspecting defects in patterns formed on a semiconductor device, on the GUI of which for the confirmation of the inspection results an area is provided for displaying any one of or facing each other the features amount of defects, and the image during inspection or the reacquired image, and on the GUI of which a means is provided for setting the classification class and importance of the defects, and based on the classification class and the importance of the defects information set by this setting means, the classification conditions or the defect judging conditions are automatically or manually set so that the inspection conditions may be set easily.

Abstract: A defect analysis method of semiconductor device, wherein defect percentage data for each of inspection units within a wafer and information pieces regarding manufacturing conditions for the wafer are loaded into a computer; statistical testing of the defect percentage data with respect to the manufacturing conditions is performed using the computer; and results of the statistical testing are collected for each of the information pieces on the manufacturing conditions and outputted from the computer.

Abstract: The invention provides apparatus and methods for processing substrates using pooled statistically based variance data. The statistically based variance data can include Pooled Polymer De-protection Variance (PPDV) data that can be used to determine micro-bridging defect data, LER defect data, and LWR defect data.

Abstract: A method for defect diagnosis and management, which is implemented in a process for fabricating an article, comprising the following steps: obtaining an inspection image of the article, wherein the inspection image shows at least one defect of the article; retrieving a design layout corresponding to the inspection image, wherein the design layout has a plurality of conductive regions; matching the inspection image and the design layout for correcting the coordinates of the defect on the design layout; and judging the overlaps of the conductive regions so as to obtain a short failure if the defect covers two conductive regions, obtain a open failure if the defect intercepts one of conductive region, or obtain no failure if the defect overlaps one of conductive region but not intercepts or covers another conductive region.