Abstract: A process monitoring system may detect out-of-control situations on the basis of a single criterion for a plurality of different lithography processes. To this end, each data set related to a specific type of lithography process may be processed so as to determine relative data, which may be centered around the same mean value for each of the different process types for a standard control situation.

Abstract: A method for monitoring the manufacture of molded ophthalmic lenses is disclosed. The method monitors the occurrence of predetermined events and records such events in a device history record and a shadow table.

Abstract: The invention discloses a novel application of standard printed circuit board (PCB) assembly modules, electronic assembly, and/or semiconductor assembly equipment for the assembly of consumer products, such as razor cartridges. In addition, nozzles of the pick/place component placement machine of the present invention may be desirably adapted to operate on type of razor cartridge component (e.g., blade, lubricating strip) disposed on a pallet. The adapted nozzle may include adaptors which may have an elongated portion, an angled portion, a tapered portion, a gripper portion, a curved portion, a rounded portion, a pointed tip, a stamper, a marker, a printer, a guide portion, a spring portion, a moveable leg, or any combination thereof, for operating on a razor cartridge component.

Abstract: A method for providing a bin ratio forecast at an early stage of integrated circuit device manufacturing processes is disclosed. The method comprises collecting historical data from one or more processed wafer lots; collect measurement data from one or more skew wafer lots; generating an estimated baseline distribution from the collected historical data and collected measurement data; generating an estimated performance distribution based on one or more specified parameters and the generated estimated baseline distribution; determining a bin ratio forecast by applying a bin definition and a yield degradation factor estimation to the generated estimated performance distribution; determining one or more production targets based on the bin ratio forecast; and processing one or more wafers based on the one or more determined production targets.

Abstract: A cast iron brake caliper with improved fatigue life, and a process and process equipment for pre-stressing a cast iron brake caliper to provide improved fatigue life, is provided. In the process, a load is applied to a cast iron caliper, where the load is high enough to locally yield and plastically deform the cast iron material, but not high enough to cause material failure, such as cracking. Upon load removal, residual compressive stresses in the cast iron caliper lower the mid-point of the stress range the plastically-deformed region of the caliper sees during in-service use, and thereby lowers the peak stress seen in this region, increasing fatigue life. The process permits a cast iron brake caliper to be designed to use less material and thus fit within constrained wheel rim envelopes, without the need to resort to high cost materials or other alternative design strategies.

Abstract: A method, apparatus and program storage device for managing multiple step processes triggered by a signal is disclosed. Status records are created for each process step. When an error occurs, error status record in recorded in the status record. A user may then use the status record to identify the error, take corrective action and restart the process at the appropriate point for reprocessing the signals.

Abstract: Some embodiments for a fault detection apparatus may include one or more monitors to detect at least three operating states of a sensor, such as pass, fail, and inoperative so as to enable a manufacturing facility to differentiate between situations in which a container does not have the appropriate machine-readable label and situations wherein the sensor is actually inoperative. The fail state may be indicative of an object on a conveyor system not matching a predetermined description, identity or characteristic. The pass state may be indicative of an object on a conveyor system matching the predetermined description, identity or characteristic. The inoperative state may be indicative of a sensor output associated with a malfunction in the sensor itself. The fault detection apparatus may also include a fail-to-safe controller configured to detect these operating states.

Abstract: The invention discloses a real-time production performance improving method comprising a real-time monitoring step, a performance satisfaction determination step and a real-time performance improving step. The real-time monitoring step monitors an operation status of a production machine via a monitoring unit, records the monitored operation status into a database and determines whether the operation status of the production machine has changed. The performance satisfaction determination step determines whether the change in the operation status meets a required performance level. This involves the monitoring unit monitoring the at least one production machine to detect a next change in the operation status of the at least one production machine, and the performance satisfaction determination step determining whether the next change in the operation status meets the required performance level. The real-time performance improving step sends information illustrating the problem to an assigned task team.

Abstract: In the method and apparatus of the invention, the process point is taken into account when the condition and performance of a control valve are monitored. In the condition monitoring of the valve, process measurements are used in addition to measurements inside the valve in such a manner that the process measurements identify the operating point at which the valve operates, and the measurements inside the valve are observed at these operating points to detect changes and to determine the condition of the valve. According to an aspect of the invention, the variables representing the operating point of an industrial process are considered when changes in the friction load of the valve and/or the load factor of the actuator are observed.

Abstract: Method and system for determining cumulative foreign object characteristics during fabrication of a composite structure. Images of sequential segments of a composite structure may be recorded during placement of the composite structure. The recorded images may be analyzed for detecting foreign objects on the composite structure. Cumulative foreign object characteristics of the foreign objects detected on the composite structure may be determined, and the cumulative foreign object characteristics may be provided to a user.

Abstract: Management of the holding member that holds the semiconductor substrate is efficiently implemented. Provided is a holding member management apparatus that manages a substrate holding member that holds a semiconductor substrate in a manufacturing apparatus that manufactures a stacked semiconductor apparatus by joining a plurality of semiconductor substrates; comprising a history storing part that stores the usage history of the substrate holding member in association with identification information that specifies the substrate holding member and a holding member specifying part that specifies and outputs identification information of the substrate holding member whose usage is to be suspended based on the usage history stored in the history storing part.

Abstract: A system, method, and computer program product are provided for validating a graphics processor design. In operation, a test image is identified. Additionally, a reference image is automatically selected from a set of reference images. Furthermore, a graphics processor design is validated using the test image and the selected reference image.

Abstract: Method and systems for circuit board manufacture and inspection are provided. A captured image of a circuit board is compared with a target image of a reference circuit board at a similar stage in manufacture. The target image and a captured image are aligned. The captured image is divided into a plurality of image regions. A primary image region within the captured image is selected, and a target image region within the target image is selected and properties of the primary image region and the target image region are compared.

Abstract: A system and method to fabricate three dimensional objects. A set of fabrication tools include at least a coarse deposition head and a fine additive head, a fine subtractive head or both employed concurrently within a single housing. A scanner may also be used within the housing to perform interleaved scanning of the partial fabrication during the fabrication. The process may be adjusted based on the scan results.

Abstract: The invention discloses a process quality prediction system and a method thereof. When a processing apparatus performs a process on a target, the process is measured by a measurement apparatus to receive a process value. The process value and several previous quality data collected from the measurement apparatus are used to predict the quality of the product which is processing inline. The method is composed of a moving window, a stepwise regression scheme and an analysis of covariance (ANCOVA). The drift and shift of process are overcome by the moving window. A key variable set is selected by the stepwise regression scheme and a virtual model is identified by the analysis of covariance.

Abstract: A control system includes at least one part mounter installing parts on a printed circuit board and a control device integrally controlling the operation of the at least one part mounter. The control device controls the part mounter using information about the printed circuit board and information on a production process flow of the printed circuit board. The control device integrally controls the operations of the part mounters, including receiving and storing information on parts that the part mounters install, information on a feeder that supplies the parts, and information on arrangement of the parts on the printed circuit board, receiving and displaying operation information and operation situations from the part mounters, and controlling operations of the part mounters using the stored information and displayed information.

Abstract: Methods and computer storage media provide for the installation of potted inserts and installation validation. According to embodiments described herein, an insert is placed within an insert aperture of a panel or other structure. Potting compound is injected into a potting cavity surrounding the insert through a fill hole in the insert until potting compound overflows from another fill hole. The installation is validated by applying a force to the installed insert at a determined frequency using a mechanical impedance instrument and measuring a response frequency. The response frequency is compared to an acceptable frequency range to determine whether the insert is properly installed.

Abstract: There is described a method and apparatus for tracking the location of web features through a converting process, one application of which can involve tracking paper defects from a paper machine as detected by a camera system, to a winder where the sheet is wound to rolls so that the web defects can be repaired in the winder before making the rolls. The method to track web features is based on pattern identification of inherent sheet variability or defects. The apparatus involves two or more sheet property or defect monitoring web sensors arranged at the same cross directional location at different stages of the converting operation, augmented by tachometers and/or roll diameter sensors. A full automation system for drive control on the winder based on this information is preferably added to make maximum advantage of this information.

Abstract: A system, method and/or computer program product for analyzing a functionality of at least two manufactured products obtain a first characteristic of a first manufactured product. The system acquires a second characteristic of a second manufactured product. The system identifies a common feature between the first characteristic and the second characteristic. The system identifies a distinguishable feature between the first characteristic and the second characteristic. The system determines a cause of a deviation of a functionality in the first manufactured product or the second manufactured product or both manufactured products based on the identified common feature or the identified distinguishable feature or both features.

Abstract: A scalable manufacturing assembly verification system for use in a manufacturing facility to verify assembly of a product, the system comprising assembly process work stations and assembly verification system stations. The assembly process work stations are each configured to provide at least one device configured to aid in assembly of the product. The assembly verification system stations are each located within a different one of the assembly process work stations, with each of the assembly verification system stations including a computing device in communication with the device, and with each computing device including a respective set of business rules corresponding to the assembly process work station within which the computing device is located, wherein each set of the business rules provides assembly verification for the device to error check assembly of the product with the device.

Abstract: The invention relates to a method for monitoring the cooling of a moving metal belt (B) in a cooling section of a continuous processing line by spraying a liquid or a mixture consisting of a gas and a liquid onto the belt, the cooling depending on parameters including the temperature, speed, and current characteristics of a cooling fluid, wherein according to said method: one or more areas are determined in which cooling parameters are such that the local removal of a vapor film on the surface of the hot belt is carried out or capable being carried out, leading to the redampening of the belt; and at least the temperature of the cooling liquid is adjusted as a cooling parameter in the thus-determined area(s) so as to maintain, or return to, a cooling into a vapor film on the surface of the belt, thus resulting in the overheating of the cooling liquid contacting the hot belt.

Abstract: A system for testing electronic circuits is configured to receive a test signal and an ideal response signal and output a test result signal. The system for testing electronic circuits includes a circuit portion to be tested, a comparator and a comparison result recorder. The circuit portion to be tested receives a test signal from a test instrument, and outputs a system response signal. The comparator receives the system response signal from the circuit portion to be tested and receives an ideal response signal from the test instrument. Then, the comparator outputs a comparison result according to the system response signal and the ideal response signal. The comparison result recorder receives and records the comparison result. The comparison result recorder may record comparison results within a period of test time. The test instrument can obtain a record of the comparison results from the comparison result recorder.

Abstract: Analyzers are described that include a conveyance device for transporting containers which contain analyte, each container having identification information; an identification information reader for reading an identification information of a container transported at a first position by the conveyance device; an analyzer body for acquiring an analyte from a container transported at a second position by the conveyance device and analyzing the analyte; and an anomaly notification device for reporting an anomaly if the identification information reader consecutively reads the same identification information. Conveyance device and transport anomaly determination method are also described.

Abstract: Approaches for enhancing web position determination involve phase locking a web movement encoder signal to a sensed web fiducial signal. Fiducials disposed along a longitudinal axis of a substrate are sensed and corresponding sensor signals are generated. An estimated web position is provided by one or more encoder signals. The phase difference between the sensor signals and the encoder signals is calculated and the web position error is determined based on the phase difference. The web position error signal can be fed back to adjust the encoder signals which improves the accuracy of the web position determination.

Abstract: A surface defect data display and management system comprises a risk score calculation unit for calculating the magnitude of an influence a surface defect on a wafer detected by a wafer inspection system or review system has upon a reduction in the yield of a final product as a risk score of the surface defect based on a defect size of the surface defect on the wafer and a pattern concentration obtained from design data of a pattern figure nearby a location corresponding to the position of the surface defect, and a correlation graph and defect image display unit for preparing a correlation graph showing the correlation between the defect size and the risk score of each defect, displaying the prepared correlation graph on the display apparatus and displaying additionally a defect image list of one or more defects selected by using the correlation graph.

Abstract: The present invention provides methods, devices, and systems for analyzing defects in an object such as a semiconductor wafer. In one embodiment, it provides a method of characterizing defects in semiconductor wafers during fabrication in a semiconductor fabrication facility. This method comprises the following actions. The semiconductor wafers are inspected to locate defects. Locations corresponding to the located defects are then stored in a defect file. A dual charged-particle beam system is automatically navigated to the vicinity defect location using information from the defect file. The defect is automatically identified and a charged particle beam image of the defect is then obtained. The charged particle beam image is then analyzed to characterize the defect. A recipe is then determined for further analysis of the defect. The recipe is then automatically executed to cut a portion of the defect using a charged particle beam.

Abstract: A manufacturing execution system (MES) with virtual-metrology capabilities and a manufacturing system including the MES are provided. The MES is built on a middleware architecture (such as an object request broker architecture), and includes an equipment manager, a virtual metrology system (VMS), a statistical process control (SPC) system, an alarm manager and a scheduler. The manufacturing system includes a first process tool, a second process tool, a metrology tool, the aforementioned MES, a first R2R (Run-to-Run) controller and a second R2R controller.

Abstract: The present invention provides a method of correcting coordinates so as to quickly and properly arrange a sample in a field of view in a review apparatus for moving a sample stage onto the specified coordinates to review the sample. A review apparatus according to the present invention, which is a review apparatus for moving a sample stage onto coordinates previously calculated by a checking apparatus to review the sample, has a function of retaining a plurality of coordinate correction tables to correct a deviation between a coordinate value previously calculated by a checking apparatus and an actual sample position detected by the review apparatus. The review apparatus evaluates correction accuracy of the plurality of coordinate correction tables and applies one of the coordinate correction tables with the maximum evaluation value.

Abstract: A method is used for providing sensing data to a control system of a machine. The method may include providing a plurality of virtual sensors, each of which may have a model type, at least one input parameter, and at least one output parameter. The method may also include integrating the plurality of virtual sensors into a virtual sensor network; determining interdependencies among the plurality of virtual sensors; and obtaining operational information of the plurality of virtual sensors. Further, the method may include determining a first condition under which the virtual sensor network is unfit to provide one or more virtual sensor output parameter to the control system based on the determined interdependencies and the operational information; and presenting the determined first condition to the control system.

Abstract: A management system includes a variable-period setting unit that sets a variable period in which quality-control values vary. Then, a retrieving unit retrieves events sandwiching the variable period. The events can be a maintenance of the semiconductor manufacturing device and/or a change of a correction value. An analysis-period setting unit sets an analysis period for analyzing a cause of variation of the quality-control values between the events retrieved by the retrieving unit.

Abstract: A condition of an industrial process is diagnosed based upon process variable information related to a value of a measured process variable. Histogram information is calculated based upon the determined process variable information and time information related to a duration of time the measured process variable has the value. Condition of the industrial process is diagnosed based upon the calculated histogram information.

Abstract: A method and system for controlling and monitoring the quality of concrete based on the concrete's maturity (which is a function of its time-temperature profile, or temperature history). Five different applications or embodiments of the present invention are discussed, namely, Enhanced Maturity, Moisture-Loss Maturity, Improved Maturity, SPC Maturity, Loggers, Readers, and Software. Enhanced Maturity involves a maturity calibration method to account for the water-to-cementitious-materials ratio, air content, and gross unit weight of the concrete. Moisture-Loss Maturity is a method for determining the appropriate time to terminate moisture-loss protection of concrete and concrete structures. Improved Maturity is a method and system for determining the strength of curing concrete using improved maturity calculations.

Abstract: A method of semiconductor fabrication is provided. The method includes providing a model for a device parameter of a wafer as a function of first and second process parameters. The first and second process parameters correspond to different wafer characteristics, respectively. The method includes deriving target values of the first and second process parameters based on a specified target value of the device parameter. The method includes performing a first fabrication process in response to the target value of the first process parameter. The method includes measuring an actual value of the first process parameter thereafter. The method includes updating the model using the actual value of the first process parameter. The method includes deriving a revised target value of the second process parameter using the updated model. The method includes performing a second fabrication process in response to the revised target value of the second process parameter.

Abstract: The present invention relates to a method for determining a selected machining quality of components in a manufacturing process, particularly during metal cutting, having at least the following method steps: determining process-relevant variables by sensors and/or from the data stream in the machine controller, extracting variable curves characteristic for the respective machining process, selecting a number of different characteristics of the extracted variable curves, the linking of which enables a clear assignment to the selected machining quality, and multivariate linking of the selected characteristics to a characteristic pattern correlating with the selected machining quality.

Abstract: A method for filling a carrier tape (10) with electronic components (12) and for removing and replacing defective electronic components (13) from the carrier tape, comprising the steps of: at a filling station (1), loading an electronic component in a pocket (11) of the carrier tape (10), moving said carrier tape (10) forward, automatically detecting that said electronic component which is defective, moving said carrier tape backward, and unloading the defective electronic component (13) from the carrier tape (10), at said filling station (1), filling said packet with a new electronic component.

Abstract: A method of producing a set of parts which may be assembled to form a product generally consisting of programming a CNC machine to selectively execute a first routine to form a set of parts from a first panel of material, and generate a map of the layout of the parts on the first panel, provided with identifying indicia, and a set of labels each provided with machine readable indicia identifying the part and operator readable indicia permitting the operator to identity the part on the map, and a second routine to form selected ones of the set of parts from a second panel of material, loading the first panel on the machine, operating the machine to execute the first routine, attaching each of the generated labels to its corresponding formed part, matching identifying indicia on generated labels and map, removing the set of labeled parts from the worktable, identifying labeled parts deemed defective, machine scanning the machine readable indicia on the labels of produced .

Abstract: An instruction converting unit converts the data form of an instruction of an operation received by a receiving unit to the data form of a safety instrumentation system from the data form of a plant control system. An operation carrying out unit receives the instruction of the operation obtained by the instruction converting unit and an original instruction of the safety instrumentation system to carry out the operations, and preferentially carries out the operation of the original instruction of the safety instrumentation system when both the instructions compete with each other.

Abstract: A method of controlling a result parameter of an IC manufacturing procedure is described. The value of at least one first variable of a process correlated with the result parameter is acquired, and the difference between the predicted value and the target value of the result parameter is calculated from the same using a correlation equation of the first variable and the result parameter. A correcting action is then performed to a subsequent process including at least one second variable correlated with the result parameter, which is based on a correlation equation of the second variable and the result parameter to control the subsequent process and adjust the second variable such that the difference is reduced due to the affect of the second variable to the result parameter. The at least one first variable and the at least one second variable include two or more different physical quantities.

Abstract: A product repair support system is configured to support repair of a product rejected in an inspection based on a prescribed inspection standard. The product repair support system includes: repair information storage part; reference information storage part; and repair condition optimization part. The repair information storage part is configured to store a result of the inspection of the repaired product as repair information. The reference information storage part is configured to store reference information related to the product. The repair condition optimization part is configured to determine appropriateness of a repair condition or selection of the repair condition on basis of the repair information and, in response to a determination of being inappropriate, to optimize data of the repair condition or the selection on basis of at least one of the repair information and the reference information.

Abstract: There is provided a test apparatus for testing a plurality of devices under test. The test apparatus includes a signal input section that applies a test signal to the devices under test so as to cause the devices under test to concurrently output response signals, a combining section that generates a single combination signal by using the response signals output from the devices under test, and a judging section that judges whether the devices under test operate normally with reference to the combination signal.

Abstract: A method for reconfiguring a partially manufactured product for a canceled custom-built order during a manufacturing process includes canceling a custom-built order for a product that has been partially manufactured. The method also includes reading a configuration of the partially manufactured product for the custom-built order that has been canceled, and reading at least one order for a different manufactured product, wherein each order is associated with a target configuration. The method yet further includes reading a set of rules that match a given configuration with one of a set of target configurations and executing the set of rules upon the configuration of the partially manufactured product so as to match the configuration of the partially manufactured product with one of a target configuration of the at least one order.

Abstract: A method and system increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine, which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen.

Abstract: Provided are a process-parameter prognostic system for predicting the shape of a semiconductor structure, a semiconductor fabrication apparatus having the process-parameter prognostic system, and a method of using the same. The process-parameter prognostic system may have a process prediction unit and a process-change point corresponding unit. The process prediction unit and the process-change point corresponding unit may obtain predicted parameters using measured parameters of semiconductor structures and sensor parameters of plasmas corresponding to the semiconductor structures.

Abstract: Provided is a plant protection system, which determines initiation of protective actions for the plant, and more particularly to the plant protection system including four channels which controls systems that shut down the plant or mitigate consequences of abnormal conditions of the plant by detecting non-permissible plant conditions with the result of bistable logic comparing process parameters with their setpoints assigned to each channel. Accordingly, common mode failure and cyber security vulnerability caused by software are removed since the system is composed of FPGA and other types of hardware without central processing units and software in determining the initiation of plant protective actions.

Abstract: A plasma-processing tool for processing a substrate using at least a first process recipe and a second process recipe is provided. The plasma-processing tool includes transducers configured to collect process data streams, each process data stream pertaining to a process parameter being monitored during recipe execution. The tool also includes a logic circuitry configured for receiving a set of meta-data wherein each meta-data includes identification data about the substrate and the process recipe being executed. The logic circuitry is also configured for receiving a set of process data streams, each of which being associated with a specific process recipe. The logic circuitry further includes storing the meta-data and the process data streams associated with the first process recipe as a first file and the meta-data and the process data streams associated with the second process recipe as a second file.

Abstract: A method of determining a segment-specific estimate of a parameter associated with a process control loop includes receiving signal data corresponding to a signal from a process control loop, storing the signal data, partitioning the stored signal data into a plurality of data segments and performing a statistical analysis on a first one of the plurality of data segments selected from the plurality of data segments to generate a first segment-specific parameter estimate.

Abstract: A semiconductor wafer fabrication metrology method in which process steps are characterised by a change in wafer mass, whereby during fabrication mass is used as a measurable parameter to implement statistical process control on the one or more of process steps. In one aspect, the shape of a measured mass distribution is compared with the shape of a predetermined characteristic mass distribution to monitor the process. An determined empirical relationship between a control variable of the process and the characteristic mass change may enable differences between the measured mass distribution and characteristic mass distribution to provide information about the control variable. In another aspect, the relative position of an individual measured wafer mass change in a current distribution provides information about individual wafer problems independently from general process problems.

Abstract: The present invention provides methods, reagents, and apparatus for authenticating products. Methods of the invention are easy to implement but difficult to replicate, simulate, alter, transpose, or tamper with. In particular, the present invention relates to a product authentication code defined by a signature array of a population of entities, and its use thereof.

Abstract: The present invention generally relates to a method for flexible process condition monitoring. In a process that utilizes RF power, the RF power may be applied at different levels during different points in the process. Software may be programmed to facilitate the monitoring of the different points in the process so that the acceptable deviation range of the RF power for each point in the process may be set to different values. For example, one phase of the process may permit a greater range of RF power deviation while a second phase may be much more particular and permit very little deviation. By programming software to permit each phase of the process to be uniquely monitored, a more precise RF process may be obtained.

Abstract: Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed.