Abstract: A circuit layout adjusting method is provided. A data file is generated according to a circuit board engineering drawing. The dada file includes at least one parameter of the circuit board engineering drawing. The data file is imported to a circuit layout drawing. At least one corresponding parameter of the circuit layout drawing are adjusted according to the data file.

Abstract: Techniques for optimizing application specific integrated circuit (ASIC) and other IC pin assignment corresponding to a high density interconnect (HDI) printed circuit board (PCB) layout are provided. Applying the techniques described herein, pin assignments may be systematically and strategically planned, for example, in an effort to reduce the PCB layer count and associated cost, increase signal integrity and speed, reduce the surface area used by an ASIC and its support circuitry, reduce plane perforations, and reduce via crosstalk when compared to conventional designs with an ASIC mounted on a multilayered PCB.

Abstract: An electronic apparatus may include a circuit board, a processor disposed on an upper surface of the circuit board, and a memory disposed on a lower surface of the circuit board, such that the lower surface of the circuit board where the processor is arranged overlaps an area corresponding to where the memory is disposed.

Abstract: Various aspects described herein identify an area in an electronic design, identify a set of track patterns or track pattern groups for the area based on a set of criteria, and iteratively implement the electronic design in the area using at least some of the set of track patterns. These aspects may dynamically or iteratively update the assignment of one or more track patterns to the region based at least in part upon the implementation of the electronic design in the area or one or more attributes of one or more other areas on the same layer as the current layer of interest or on one or more different layers.

Abstract: A method of detailed placement for ICs is provided. The method receives an initial placement and iteratively builds sets of constraints for placement of different groups of cells in the IC design and uses a satisfiability solver to resolve placement violations. In some embodiments, the constraints include mathematical expressions that express timing requirements. The method in some embodiments converts the mathematical expressions into Boolean clauses and sends the clauses to a satisfiability solver that is only capable of solving Boolean clauses. In some embodiments, the method groups several cells in the user design and several sites on the IC fabric and uses the satisfiability solver to resolve all placement issues in the group. The satisfiability solver informs placer after each cell is moved to a different site. The method then dynamically builds more constraints based on the new cell placement and sends the constraints to the satisfiability solver.

Abstract: A method of making a semiconductor device includes arranging a first cell and a second cell, determining, by a processor, a first pattern density of a first cell, determining a second pattern density of a second cell, determining a pattern density gradient from the first pattern density to the second pattern density, determining whether the pattern density gradient exceeds a pattern density gradient threshold, and indicating a design change if the pattern density gradient exceeds than the pattern density gradient threshold.

Abstract: An integrated circuit design optimization procedure to modify a cell feature, such as gate length, models changes in delay as a result of the modification. In the delay change calculation, a characteristic of an event in cell switching behavior, such as the output short-circuit voltage VSC, is determined for the modified cell, where changes in the determined characteristic correlate with changes in delay of the cell due to the modification. Next, a value for delay of the modified cell is determined as a function of the determined characteristic of the event. The procedure can be applied after placement and routing. A timing-constrained, leakage power reduction is described using the delay change model.

Abstract: A datapath extraction tool uses machine-learning models to selectively classify clusters of cells in an integrated circuit design as either datapath logic or non-datapath logic based on cluster features. A support vector machine and a neural network can be used to build compact and run-time efficient models. A cluster is classified as datapath if both the support vector machine and the neural network indicate that it is datapath-like. The cluster features may include automorphism generators for the cell clusters, or physical information based on the cell locations from a previous (e.g., global) placement, such as a ratio of a total cell area for a given cluster to a half-perimeter of a bounding box for the given cluster.

Abstract: A computer-implemented method for generating a layout of a design includes invoking the computer to receive a schematic representation of the design, generating a connection graph associated with the design, comparing the connection graph with a plurality of connection graphs stored in a database and selecting a layout associated with the matching connection graph in generating the layout of the design.

Abstract: Patterns used to detect a failure in a semiconductor chip are analyzed to determine a subset of logic in a design where a semiconductor chip, fabricated based on the design, contains a fault in the subset. Parts of the semiconductor chip can be pre-calculated to identify a key subsection of logic, based on the patterns, with that subsection being stored in a computer readable file. Good-machine simulation is performed on the subsection of logic using truncated rank-ordered simulation. The results are compared to the results of the testing of the physical semiconductor chip.

Abstract: A library of cells for designing an integrated circuit, the library comprises continuous diffusion compatible (CDC) cells. A CDC cell includes a p-doped diffusion region electrically connected to a supply rail and continuous from the left edge to the right edge of the CDC cell; a first polysilicon gate disposed above the p-doped diffusion region and electrically connected to the p-doped diffusion region; an n-doped diffusion region electrically connected to a ground rail and continuous from the left edge to the right edge; a second polysilicon gate disposed above the n-doped diffusion region and electrically connected to the n-doped diffusion region; a left floating polysilicon gate disposed over the p-doped and n-doped diffusion regions and proximal to the left edge; and a right floating polysilicon gate disposed over the p-doped and n-doped diffusion regions and proximal to the right edge.

Abstract: There is described a method for creating a thermally-isolated microstructure on a slab of mono-crystalline silicon which uses a hybrid dry-then-wet etch technique that when controlled, can produce microstructures without any silicon adhering underneath, microstructures having small masses of silicon adhering underneath, and microstructures that are still attached to the slab of mono-crystalline silicon via a waisted silicon body. When creating the microstructures with a waisted silicon body, the thermal isolation of the microstructure can be designed by controlling the depth of the etching and the size of the waist.

Abstract: One embodiment relates to a method of achieving an circuit dimension which is greater than a size of an exposure field of an illumination tool. A first area of a first reticle field and a second area of a second reticle field are defined. An extension zone is created as a region outside the first area, and includes a first layout shape formed on a first design level. A corresponding forbidden zone is created for the second reticle field as a region inside the second area where no layout shape on the first design level is permitted. A second layout shape is formed on a second design level within the forbidden zone. The first and second areas are then abutted. Upon abutment of the first and second areas, the second layout shape overlaps the first layout shape to form a connection between circuitry of the first and second reticle fields.

Abstract: A semiconductor chip is defined to include a logic block area having a first chip level in which layout features are placed according to a first virtual grate, and a second chip level in which layout features are placed according to a second virtual grate. A rational spatial relationship exists between the first and second virtual grates. A number of cells are placed within the logic block area. Each of the number of cells is defined according to an appropriate one of a number of cell phases. The appropriate one of the number of cell phases causes layout features in the first and second chip levels of a given placed cell to be aligned with the first and second virtual grates as positioned within the given placed cell.

Abstract: Systems and methods are disclosed for testing a stack of dies and inserting a repair circuit which, when enabled, compensates for a delay defect in the die stack, particularly where the defect is located in the inter-die data transfer path. Intra-die and inter-die slack values are determined to establish which die or dies in the die stack would benefit from the insertion of a repair circuit.

Abstract: A method comprises: receiving a circuit design comprising networks of first devices fabricated by a first fabrication process; selecting second devices to be fabricated by a second process; substituting the second devices for the first devices in the networks of the circuit design; sorting the second devices within a selected one of the networks by device area from largest device area to smallest device area; and assigning each second device in the selected network to be fabricated in a respective one of a plurality of tiers of a 3D IC for which a total area of second devices previously assigned to that tier is smallest, the second devices being assigned sequentially according to the sorting.

Abstract: An approach for methodology, and an associated system, enabling a prioritizing of devices, circuits, and modules of interest is disclosed. Embodiments include: determining a first electrical layout indicating an electrical performance of a physical layout of an IC design, the first electrical layout indicating a plurality of devices of the physical layout; selecting a subset of the plurality of the devices based on one or more connections of the devices; and generating a second electrical layout indicating the electrical performance of the physical layout, the second electrical layout indicating the selected devices without at least one of the plurality of devices.

Abstract: Methods and systems for improving the reliability of C4 solder ball contacts performed at the design stage to reduce the incidence of thermally-induced failures, including those due to electromigration and thermal cycling.

Abstract: A fixed-outline floorplanning approach for mixed-size modules is disclosed. Firstly, evenly distribute mixed-size circuit modules to whole chip area based on different requirements such as wire-length, routability, or thermal in the global distribution stage. To maintain the global distribution result and satisfy the fixed-outline constraint, generate a slicing tree by recursively applying partition algorithm to divide modules distributed in a given region into several sub-regions. Then, to remove overlap between circuit modules and find a best solution, use bottom-up shape curve merging and top-down back tracing procedure to generate a slicing tree. The shape curve for each leaf in the tree is built first by enumerated packing. Then, the curves in the tree are merged iteratively from bottom to top, and feasible solutions in the shape curve of the root node are identified according to the fixed-outline constraint. Finally, the best solution is determined by a top-down back tracing procedure.

Abstract: A method of generating a simulation model of a predefined fabrication process according to a sample conductive feature includes receiving a geometry configuration and layout design of the conductive feature. A circuit-level simulation model of the sample conductive feature based on the geometry configuration of the sample conductive feature is generated. A hardware processor converts the circuit-level simulation model of the sample conductive feature into at least a first layout bias rule corresponding to a first set of predetermined criteria of the layout design and a second layout bias rule, different from the first layout bias rule, corresponding to a second set of predetermined criteria of the layout design.

Abstract: A method of generating an integrated circuit layout comprises a step of determining a placement of standard cells selected from a standard cell library while permitting boundary conflicts in which incompatible boundary regions of standard cells are placed next to each other. After determining routing connections between the standard cells, the integrated circuit layout is generated. The generation of the integrated circuit layout includes a mapping step of mapping at least one incompatible boundary region to an alternative boundary region to resolve at least one boundary conflict.

Abstract: Multiple level spine routing is disclosed. In some embodiments, in response to receiving a specification of a plurality of nets and a specification of a set of routing tracks available for main spines, a main spine routing track is assigned to each of the plurality of nets based at least in part on a cost function and main spine wires are generated on the assigned main spine routing tracks for each of the plurality of nets.

Abstract: Systems and methods are provided for designing semiconductor device layouts. For example, an initial layout including multiple target features associated with semiconductor devices is received. One or more dummy features are determined to be inserted into the initial layout. The target features and the dummy features are assigned to multiple masks based at least in part on one or more mask-assignment rules. A final layout is generated for fabricating the semiconductor devices.

Abstract: A latch placement tool determines a shape for a cluster of latches from a preliminary layout (or based on a netlist), including an aspect ratio of the shape, and generates a template for placement of the latches in conformity with the shape. Latches are placed around a local clock buffer (LCB) based on latch size, from largest latch first to smallest latch last, and based on their ideal locations given the target aspect ratio. The ideal locations may be further based on the clock driver pin configuration of the LCB. The final template preferably has an aspect ratio that is approximately equal to the aspect ratio of the shape of the cluster, but the latch placement may be constrained by clock routing topology. Latch placement within a cluster can be further optimized by swapping one of the latches with another to minimize total wirelength of the design.

Abstract: An abstract decision module primitive for placement within a logical representation (i.e., a netlist) of a circuit design is described. The decision module primitive receives as inputs alternative solutions for a given function or segment of a netlist. The alternative solutions include functionally equivalent, but structurally different implementations of the function or segment of the netlist. The decision module primitive alternatively selects between connecting one of the inputs to the netlist to provide a complete functional definition for the netlist based on constraint information. The selected input of the decision module may be updated as additional constraint information is determined throughout the various stages of the design process. In addition, alternative solutions for a given function or segment of the netlist may be added to and/or removed from the inputs of a decision module as additional constraint information is identified.

Abstract: Embodiments of present invention include a method and apparatus of estimating power supply of a 3D IC. The method particularly includes obtaining current information and layout information of circuit modules contained in a specific region of the 3D IC, gridding the specific region so as to form at least one three-dimensional grid having a plurality of side edges along chip stacking direction of the 3D IC, determining current of at least one of the plurality of side edges based on the current information and layout information of the circuit modules, and estimating power supply of the 3D IC based on the current of the at least one side edge. With the method and apparatus embodiments of the invention, power supply of a 3D IC may be effectively estimated and analyzed.

Abstract: A region of congestion is detected at a set of layers. The region occupies the same area of each layer in the set. A routing blockage is defined as a tuple corresponding to the region. The tuple includes a set of coordinates to describe an area of the region, a first and a second layer coordinates of a first and a second layer in the set of layers. The routing blockage is applied during an iteration of rough routing. Before an iteration of detailed routing, the routing blockage is removed. Detailed routing is performed using a g-cell in the region. The detailed routing uses a routing capacity saved in the g-cell during the iteration of rough routing due to the routing blockage. A revised IC design is produced where a revised congestion in an area corresponding to the region is reduced.

Abstract: Scheduling of parallel processing for regionally-constrained object placement selects between different balancing schemes. For a small number of movebounds, computations are assigned by balancing the placeable objects. For a small number of objects per movebound, computations are assigned by balancing the movebounds. If there are large numbers of movebounds and objects per movebound, both objects and movebounds are balanced amongst the processors. For object balancing, movebounds are assigned to a processor until an amortized number of objects for the processor exceeds a first limit above an ideal number, or the next movebound would raise the amortized number of objects above a second, greater limit. For object and movebound balancing, movebounds are sorted into descending order, then assigned in the descending order to host processors in successive rounds while reversing the processor order after each round. The invention provides a schedule in polynomial-time while retaining high quality of results.

Abstract: Methods for producing layout data for devices are described. One method includes using a genetic algorithm to determine a structure of a thermally-operated actuator. Another method includes receiving a three-dimensional model of a device, a design-rule set, and parameter ranges. Layout data are produced for devices having various combinations of parameter values in the parameter ranges.

Abstract: A non-transitory computer-readable memory including first data representative of a topology of a circuit including a first circuit element and a second circuit element, and second data representative of a scaling rule for the first circuit element as a function of the second circuit element. A data processing method comprising retrieving first data representative of a topology of a circuit comprising a first circuit element and a second circuit element from a memory, retrieving second data representative of a scaling rule for the first circuit element as a function of the second circuit element from the memory, receiving a user input representative of a scaling factor, generating third data representative of an instance of the second circuit element using the scaling factor, and generating data representative of an instance of the first circuit element using the scaling factor, the scaling rule and the third data.

Abstract: A recursive solution to a bin-packing algorithm provides efficient placement of objects in a physical layout. The algorithm determines requirement vectors for the objects that specify requirement for placement of the object in multiple dimensions, thereby forming a multi-dimensional bin-packing problem. The algorithm assigns the objects to physical partitions or “bins” by recursively exploring partial solutions that place the objects in the partitions by extending the partial solutions via recursion until the objects are placed. The bin-packing algorithm tests requirements vectors for remaining unassigned ones of the objects for both assignment and non-assignment to a current partition in a current partial solution until the current partial solution becomes a complete solution that satisfies the requirement vectors for the plurality of objects.

Abstract: A library of cells for designing an integrated circuit, the library comprises continuous diffusion compatible (CDC) cells. A CDC cell includes a p-doped diffusion region electrically connected to a supply rail and continuous from the left edge to the right edge of the CDC cell; a first polysilicon gate disposed above the p-doped diffusion region and electrically connected to the p-doped diffusion region; an n-doped diffusion region electrically connected to a ground rail and continuous from the left edge to the right edge; a second polysilicon gate disposed above the n-doped diffusion region and electrically connected to the n-doped diffusion region; a left floating polysilicon gate disposed over the p-doped and n-doped diffusion regions and proximal to the left edge; and a right floating polysilicon gate disposed over the p-doped and n-doped diffusion regions and proximal to the right edge.

Abstract: A datapath extraction tool uses machine-learning models to selectively classify clusters of cells in an integrated circuit design as either datapath logic or non-datapath logic based on cluster features. A support vector machine and a neural network can be used to build compact and run-time efficient models. A cluster is classified as datapath if both the support vector machine and the neural network indicate that it is datapath-like. The cluster features may include automorphism generators for the cell clusters, or physical information based on the cell locations from a previous (e.g., global) placement, such as a ratio of a total cell area for a given cluster to a half-perimeter of a bounding box for the given cluster.

Abstract: Various embodiments include computer-implemented methods, computer program products and systems for aligning a set of orthogonal circuit elements in an integrated circuit (IC) layout. In some embodiments, a computer-implemented method for aligning a set of orthogonal circuit elements in an IC layout includes: classifying each orthogonal circuit element in the set of orthogonal circuit elements as including a first space-designated edge and a second space-designated edge; and aligning each orthogonal circuit element on an edge placement grid according to the first space-designated edge and the second space-designated edge, the edge placement grid having a first set of space-designated grid lines separated by a first distance, and a second set of space-designated grid lines separated by a second distance, wherein the first set of space-designated grid lines is separated from the second set of space-designated grid lines by an offset distance.

Abstract: The present disclosure relates to a computer-implemented method for electronic design simulation. The method may include providing, using at least one computing device, an electronic design and associating, using the at least one computing device, one or more identifiers with each constraint solver call utilized in a simulation of the electronic design. The method may further include automatically generating, using the at least one computing device, a coverage model for one of more constraints associated with the electronic design, the coverage model being based upon, at least in part, the one or more identifiers.

Abstract: A hybrid IO cell for use with controlled collapse chip connection, wirebond core limited, wirebond IO limited, and wirebond inline chip designs is provided. A method of designing the hybrid IO cell includes designating a technology, determining a minimum pad width of the technology, and determining a minimum pad spacing of the technology. The method also includes determining a width of the hybrid IO cell based on the minimum pad width and the minimum pad spacing, setting a length of the hybrid IO cell equal to the determined width, and storing a definition of the IO cell in a library stored on a computer useable storage medium.

Abstract: A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

Abstract: The interactive grouping tool offers the flexibility to simplify the schematic diagram of an integrated circuit (IC) design by grouping circuit elements that are not specified to be of interest into entities of any size. Circuit elements of various types and functionalities, including ports and pins, can be combined together into the same entity without modifying the underlying design logic and connectivity. By grouping and hiding the unnecessary details, the tool reduces clutter in a schematic diagram and greatly eases the process of traversing, debugging, and analyzing the schematic diagram. Users can choose to dynamically group the circuit elements on the schematic diagram without going through any compilation or synthesis process. Users can also choose to revert any of the entities back to the original schematic diagram with the ungrouping operation. For specific or batch manipulation of the schematic diagram, the tool provides a scripting interface for users to enter commands.

Abstract: An electronic design automation (EDA) tool for inserting dummy tiles between interconnect lines of an integrated circuit design includes a memory for storing the integrated circuit design and a processor in communication with the memory. The processor identifies those interconnect lines that are at different voltage levels, have a length greater than a predefined threshold length and a spacing less than a predefined threshold spacing, and inserts blockage areas between such interconnect lines. The processor skips the blockage areas and adds dummy tiles only between those interconnect lines that do not meet predetermined criteria.

Abstract: An optical semiconductor unit of the present invention has an LED device provided with an LED (Light Emitting Diode) and a socket to which the LED device is mounted, the LED device has a main body to which the LED is mounted, the main body has a first surface to which block-shaped electrode portions are connected.

Abstract: Methods and apparatuses are described for creating, editing, and viewing a floorplan of a circuit design. Specifically, some embodiments enable a user to perform a graphical operation at an inference point in a circuit design layout, wherein the location of the inference point is determined based on existing graphical objects in the circuit design layout. Some embodiments substantially instantaneously update a congestion indicator in a circuit design layout in response to modifying the circuit design layout. Some embodiments substantially instantaneously update pin locations of a block or partition in response to changing the size or shape of the block or partition. Some embodiments enable a user to view a circuit design layout based on the logical hierarchy, and also based on at least one additional attribute type such as voltage, power, or clock domain.

Abstract: In one embodiment of the invention, a method for designing an integrated circuit is disclosed. The method includes automatically partitioning clock sinks of an integrated circuit design into a plurality of partitions; automatically synthesizing a clock tree from a master clock generator into the plurality of partitions to minimize local clock skew within each of the plurality of partitions; and automatically synthesizing clock de-skew circuitry into each of the plurality of partitions to control clock skew between neighboring partitions.

Abstract: The present disclosure relates to a method of RC extraction that provides for a fast development time and easy maintenance. In some embodiments, the method provides a graphical representation of an integrated chip layout having a plurality of integrated chip components. A plurality of pattern based graphical features are then determined. Respective pattern based graphical features define a structural aspect of an integrated chip component. One of the plurality of integrated chip components is defined as a pattern oriented function having inputs of one or more of the pattern based graphical features. The pattern oriented function determines a shape of the one of the plurality of integrated chip components based upon a relation between the plurality of inputs. By determining a shape of an integrated chip component using a pattern oriented function, the complexity of RC profiles can be reduced.

Abstract: A hybrid clock distribution system uses a distribution fabric to distribute clock signals across longer physical distances and local sub-distribution networks to distribute clock signals more locally and to implement logic functions such as clock gating. A set of tap drivers connect the distribution fabric to the sub-distribution networks. A design tool automatically generates and places the set of tap drivers.

Abstract: An integrated circuit, manufactured by a process having a nominal minimum pitch of metal lines, includes a plurality of metal lines and a plurality of standard cells under the plurality of metal lines. The plurality of metal lines extends along a first direction, and the plurality of metal lines are separated, in a second direction perpendicular to the first direction, by integral multiples of the nominal minimum pitch. At least one of the plurality of standard cells has a cell height along the second direction, and the cell height is a non-integral multiple of the nominal minimum pitch.

Abstract: The technological fabrication of the integrated circuit includes a fabrication of the integrated circuit in a reduced technological version of a native technology including at least a first dimensional compensation applied to the reduced channel length and to the reduced channel width of each transistor originating from a transistor, referred to as a “minimum transistor”, designed in the native technology and having in this native technology an initial channel length equal to a minimum length for the native technology and an initial channel width equal to a minimum width for the native technology. The fabrication obtains a transistor having a channel length equal, to a given precision, to the initial channel length and a channel width equal, to a given precision, to the initial channel width.

Abstract: A method for generating a layout for a semiconductor device is disclosed. The method includes: receiving a first layout. A portion of the first layout is defined as a first FinFET region. The first FinFET region has first and second sides that each extend approximately in a first direction. The method includes performing a first design rule check (DRC) simulation. The method includes obtaining a first DRC simulation result. The method includes defining a second FinFET region by moving the first side in a second direction perpendicular to the first direction. The method includes performing a second DRC simulation. The method includes obtaining a second DRC simulation result. The method includes selecting one of the first and second FinFET regions based on the first and second DRC simulation results. The method includes generating a second layout using the selected FinFET region.

Abstract: Methods and apparatuses for an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment, an integrated Circuit (IC) device comprises a first plurality of signal wires disposed within a substrate a shielding mesh disposed on the substrate. In at least one embodiment, the shielding mesh comprises a first plurality of connected wires for a first reference voltage and a second plurality of connected wires for a second reference voltage. Wherein at least a first portion of each of the first plurality of the signal wires is shielded between one of the first plurality of connected wires and one of the second plurality of connected wires from adjacent signal wires and a second portion of the first plurality of signal wires are adjacent to each other in a region defined by the first and second pluralities of connected wires.

Abstract: A method of evaluating a layout cell for electrostatic discharge (ESD) protection can include identifying at least one feature of the layout cell for use in implementing an integrated circuit (IC) and comparing the at least one feature of the layout cell to an ESD requirement for the IC. The method can include indicating whether the feature of the layout cell complies with the ESD requirement.

Abstract: A method of optimizing a layout of an integrated circuit formed using fin-based cells of a standard cell library is provided. The method includes arranging cell rows of different track heights having standard cells. For each cell row, each of the standard cells includes sub-cell rows with sub-cells of one or more types. The sub-cells are interchangeable with one another to modify a device characteristic of the standard cell. The method also includes evaluating the integrated circuit to determine whether a performance metric of the integrated circuit has been satisfied. The method also includes identifying one or more standard cells to modify a device characteristic of the standard cell for satisfying the performance metric of the integrated circuit. The method further includes modifying the one or more standard cells until the performance metric of the integrated circuit is satisfied.