Abstract: An electronic design automation system combines features of discrete EDA/CAD systems and manufacturing systems into a monolithic system to enable a layperson to efficiently design, construct and have manufactured a specific class of custom electronic device, namely a computer processing unit with embedded software. A Graphical User Interface (GUI) is provided as the front-end to a Computer Aided Design (CAD) server that generates sophisticated control and manufacturing instructions that are delivered to a fabrication supply chain, which produces a specified device that is then transported via managed logistics into inventory and ordering systems at vendors for delivery to a designated customer.

Abstract: A semiconductor integrated circuit includes a delay circuit connected between a source of data bits and a data input terminal of a latch circuit. The delay circuit includes a first delay section formed by connecting logic devices in series corresponding to a number of logic devices included in a clock signal path between a clock signal source and the latch circuit data input. The delay circuit also includes a second delay section having a delay time equal to an interconnect delay time corresponding to a wiring length of the clock signal path.

Abstract: An improved approach for automatically generating physical layout constraints and topology that are visually in-sync with the logic schematic created for simulation is described. The present approach is also directed to an automatic method for transferring topology from logic design to layout.

Abstract: A method of interconnecting blocks of heterogeneous dimensions using a NoC interconnect with sparse mesh topology includes determining a size of a mesh reference grid based on dimensions of the chip, dimensions of the blocks of heterogeneous dimensions, relative placement of the blocks and a number of host ports required for each of the blocks of heterogeneous dimensions, overlaying the blocks of heterogeneous dimensions on the mesh reference grid based on based on a guidance floor plan for placement of the blocks of heterogeneous dimensions, removing ones of a plurality of nodes and corresponding ones of links to the ones of the plurality of nodes which are blocked by the overlaid blocks of heterogeneous dimensions, based on porosity information of the blocks of heterogeneous dimensions, and mapping inter-block communication of the network-on-chip architecture over remaining ones of the nodes and corresponding remaining ones of the links.

Abstract: An integrated circuit includes an active layer including an active pattern diffusion region. The integrated circuit further includes at least one guard band conforming to a shape of the active layer, the at least one guard band comprising a dummy diffusion layer, wherein the guard bans is spaced from the active layer at a first constant spacing in an X-axis direction and a second constant spacing in a Y-axis direction, which is perpendicular to the X-axis direction. The integrated circuit further includes a plurality of dummy diffusion patterns outside the at least one guard band.

Abstract: A method of designing a layout of devices includes designing a layout of gate structures and diffusion regions of a plurality of devices. The method further includes identifying an edge device of the plurality of devices. The method further includes adding a dummy device next to the edge device and a dummy gate structure next to the dummy device, wherein the dummy device shares a diffusion region with the edge device, and wherein a gate structure of the dummy device is considered to be one of two dummy gate structures added next to the edge device.

Abstract: The present invention discloses methods and apparatuses to design an integrated circuit. According to one aspect, the present invention circuit design discloses an iterative process of synthesis and placement where each iteration provides incremental changes on the design of the integrated circuit. The synthesis transform is then made with accurate timing information from the placement, and the process is incrementally iterative toward the final timing enclosure of the design. The incrementally iterative approach of the present invention provides a continuous advancement from synthesis to placement and vice versa, with the incremental improvements on synthesis made with knowledge of current instance placement, and the incremental improvements on placement made with knowledge of current circuit logic.

Abstract: Methods, systems, and techniques for estimating a transient diffusion potential of a diffusive property involve modeling, as a circuit, diffusive behavior of a diffusion region and then simulating operation of the circuit to estimate the transient diffusion potential at a location in the diffusion region by determining circuit potential at a node in the circuit that corresponds to the location in the diffusion region. The circuit has steady-state and transient portions that model the steady-state and transient behavior of the diffusion region, respectively. The transient behavior is modeled using a capacitive circuit element. The diffusive property diffuses linearly within the diffusion region and generation of the diffusive property is distributed within the diffusion region.

Abstract: Systems and methods receive a design of a circuit layout. The circuit layout has some available spaces. Such systems and methods automatically insert capacitor arrays in the specified spaces. Each of the capacitor arrays has capacitor cells, and each of the capacitor cells has capacitor structures and a buried implant. The process of inserting the capacitor arrays comprises a process of forming the capacitor arrays to either: grow the capacitor arrays to the size of the specified spaces; grow the capacitor arrays to a specified capacitance value within the restriction of the length dimension or the width dimension of the specified spaces; or grow the capacitor arrays to a specified capacitance value, irrespective of dimensional length dimension or width dimension limitations (where the only limitations are the dimensions of the specified space).

Abstract: Scheduling of parallel processing for regionally-constrained object placement selects between different balancing schemes. For a small number of movebounds, computations are assigned by balancing the placeable objects. For a small number of objects per movebound, computations are assigned by balancing the movebounds. If there are large numbers of movebounds and objects per movebound, both objects and movebounds are balanced amongst the processors. For object balancing, movebounds are assigned to a processor until an amortized number of objects for the processor exceeds a first limit above an ideal number, or the next movebound would raise the amortized number of objects above a second, greater limit. For object and movebound balancing, movebounds are sorted into descending order, then assigned in the descending order to host processors in successive rounds while reversing the processor order after each round. The invention provides a schedule in polynomial-time while retaining high quality of results.

Abstract: Methods and apparatus of performing floorplanning and routing for function blocks within a die and among multiple die are disclosed. Multiple die together with function blocks within each die may be represented by a flexible hierarchical (FH) tree. An initial floorplan for multiple die may be generated and hot spots between die or among function blocks within a die may be identified. Spacer blocks may be inserted between die, and block inflation may be performed, to remove hot spots. More perturbation of the block positions can be performed on the FH tree to rearrange the blocks and die. After the multiple die floorplanning, a plurality of micro bumps may be mapped to a plurality of pins of blocks of the plurality of die, placement and routing may be performed for the plurality of blocks within each die and connections for the plurality of dies.

Abstract: A method is provided that includes performing a free placement of a system design comprising a plurality of power domains, wherein the power domains are not constrained to physical regions, assigning a physical region to each of the power domains based on the free placement of cells in the power domains, performing a soft cluster placement of the system design with each power domain and corresponding physical region defined as a soft cluster, refining at least one physical region based on the soft cluster placement, redefining cells in at least one power domain based on the soft cluster placement of the cells and the corresponding physical region, and performing a hard cluster placement of the system design with each power domain and corresponding physical region defined as a hard cluster to generate final power domains.

Abstract: A method for synthesizing a clock-tree structure may be applied to a physical design such as an integrated circuit or a printed circuit board to form a symmetrical clock-tree structure, while achieving the effects including minimizing a clock skew, having a process variation tolerance and increasing the synthesizing rate. To prevent a certain level from having too many branches and ensure that the clock-tree structure satisfies the fan-out constraint, a plurality of pseudo sinks are provided such that the result of factorizing the value of the number of the total sinks may satisfy the fan-out constraint. The levels in the clock-tree structure may have equal branch lengths by employing snaking routing, so as to achieve a symmetrical clock-tree structure design and reduce the clock skew of the clock-tree.

Abstract: A floorplanning method for an analog integrated circuit layout is disclosed. A first-type block is defined as a movable and deformable block with rectangle constraint, and a second-type block is defined as a fixed-size block without rectangle constraint. Each block in the floorplan is classified to the first-type or the second-type block. In a shape determination stage, a target shape is determined among candidates of the first-type block, the first-type block accordingly being modified to the target shape, resulting in at least one overlap in the floorplan. In an overlap elimination stage, neighboring blocks of each said overlap are analyzed, the overlap being then eliminated by utilizing surrounding space, resulting in unused space in the floorplan. In an enlargement stage, the unused space is utilized for enlarging the first-type block.

Abstract: Datapath placement defines tiers for placement sets of a cell cluster, assigns cells to the tiers constrained by the datapath width, and then orders cells within each tier. Clusters are identified using machine-learning based datapath extraction. Datapath width is determined by computing a size of a bounding box for cells in the cluster. Placement sets are identified using a breadth-first search beginning with input cells for the cluster. Tiers are initially defined using logic depth assignment. A cell may be assigned to a tier by pulling the cell from the next higher tier to fill an empty location or by pushing an excess cell into the next higher tier. Cells are ordered within each tier using greedy cell assignment according to a wirelength cost function. The datapath placement can be part of an iterative process which applies spreading constraints to the cluster based on computed congestion information.

Abstract: Multiple level spine routing is disclosed. In some embodiments, in response to receiving a specification of a plurality of nets and a specification of a set of routing tracks available for main spines, a main spine routing track is assigned to each of the plurality of nets based at least in part on a cost function and main spine wires are generated on the assigned main spine routing tracks for each of the plurality of nets.

Abstract: Multiple level spine routing is disclosed. In some embodiments, in response to receiving a specification of a net comprising a set of pins, a first wire for routing the net is generated, the set of pins comprising the net is partitioned into one or more groups based at least in part on a cost function, a second wire that connects to the first wire is generated for each group of the net, and a third wire that connects each pin to the second wire of its group is generated for each pin of each group of the net.

Abstract: Among other things, one or more techniques for conditional cell placement are provided herein. In an embodiment, a conditional boundary is created for a first cell. For example, the conditional boundary enables the first cell to be placed relative to a second cell based on a conditional placement rule. In an embodiment, the first cell is placed in a first manner relative to the second cell based in a first scenario. In a second scenario, different than the first scenario, the first cell is placed in a second manner relative to the second cell. In this manner, conditional cell placement is provided, thus providing flexibility and improved layout efficiency with regard to semiconductor fabrication, for example.

Abstract: Solutions for efficiently implementing a via into a multi-level integrated circuit layout are disclosed. In various embodiments, a method of creating a multi-level integrated circuit layout with at least one via is disclosed, the method including: providing at least two layers of the multi-level integrated circuit layout; and selecting a via for connecting the at least two layers, wherein the selecting includes retrieving the via from a via library including a plurality of via types, the plurality of via types prioritized in the via library according to a predicted manufacturing yield for each of the plurality of vias.

Abstract: An abstract decision module primitive for placement within a logical representation (i.e., a netlist) of a circuit design is described. The decision module primitive receives as inputs alternative solutions for a given function or segment of a netlist. The alternative solutions include functionally equivalent, but structurally different implementations of the function or segment of the netlist. The decision module primitive alternatively selects between connecting one of the inputs to the netlist to provide a complete functional definition for the netlist based on constraint information. The selected input of the decision module may be updated as additional constraint information is determined throughout the various stages of the design process. In addition, alternative solutions for a given function or segment of the netlist may be added to and/or removed from the inputs of a decision module as additional constraint information is identified.

Abstract: Solutions for optimizing an integrated circuit layout for implementation in an integrated circuit are disclosed. In one embodiment, a computer-implemented method is disclosed including: obtaining a plurality of hierarchical constraints in mathematical form, the plurality of hierarchical constraints defining a first integrated circuit layout; partitioning the plurality of hierarchical constraints into groups according to one or more partitioning rules; determining whether a boundary condition exists between two of the groups, and distributing a slack or a gap between the two of the groups in the case that the boundary condition exists; creating a plurality of integer linear programming problems associated with each of the groups; determining a solution for each of the plurality of integer linear programming problems; and integrating each solution together to form a second integrated circuit layout.

Abstract: According to example embodiments of inventive concepts, a method of designing a semiconductor integrated circuit includes: creating a marking layer that indicates at least one semiconductor device of a plurality of semiconductor devices that is to be changed in at least one of width, height, and space thereof from an adjacent semiconductor device; and applying the marking layer to a previously created layout to generate a new library of the at least one semiconductor device that is changed in at least one of width, height, and space from an adjacent semiconductor device. The marking layer may be based on a change in characteristics of the at least one semiconductor device of the plurality of semiconductor devices.

Abstract: A semiconductor chip is defined to include a logic block area having a first chip level in which layout features are placed according to a first virtual grate, and a second chip level in which layout features are placed according to a second virtual grate. A rational spatial relationship exists between the first and second virtual grates. A number of cells are placed within the logic block area. Each of the number of cells is defined according to an appropriate one of a number of cell phases. The appropriate one of the number of cell phases causes layout features in the first and second chip levels of a given placed cell to be aligned with the first and second virtual grates as positioned within the given placed cell.

Abstract: A logically hierarchical netlist may be split along physical partition boundaries while retaining information on the logical hierarchy. Nets can be driven to higher levels of hierarchy in order to maintain connectivity and enable the original logical function. A mapping of nets can be created. During the design process merging of physical partitions may result in a new logically hierarchical netlist which retains the hierarchy of the original logically hierarchical netlist. The lowest common hierarchical ancestor (LCA) is identified and then the appropriate cells and nets are included during the merging process.

Abstract: In one embodiment, a method for propagating design constraints between a module and a module instance in a circuit design is provided. A port of the module and a port/pin of the circuit design are determined, between which constraints are to be propagated. The determination of the port/pin includes determining whether or not pin of the module instance corresponding to the port is directly connected to a top-level port of the circuit design. In response to determining that the pin is directly connected to a top-level port, the top-level port is selected as the port/pin. In response to determining that the pin is not directly connected to the top-level port, the pin is selected as the port/pin. Design constraints are propagated between the port and the selected port/pin. The propagated design constraints are stored in a storage device.

Abstract: A computer system selects a signal conductor from an electronic circuit design layout and assigns a first potential to the selected signal conductor. Next, the computer system assigns a second potential to other signal conductors included in the electronic circuit design layout. The computer system then selects a metal fill from the electronic circuit design layout, which is void from carrying an electrical signal, and generates a zero charge equation for the selected metal fill. The zero charge equation establishes that a total charge residing on the selected metal fill is equal to zero. The computer system includes the zero charge equation in a system of equations, which includes grid point potential equations, and solves the system of equations. In turn, the computer system computes capacitance values for the signal conductors based upon the system of equation solutions, and simulates the electronic circuit design layout using the computed capacitance values.

Abstract: An assignment method of terminals of a semiconductor package executed by an assignment supporting apparatus includes: deciding a maximum allowable distance to be a constraint condition regarding a relative distance between each of the pads and a terminal to be assigned to the pad, and extracting one or a plurality of assigned terminal candidates for each of the pads so that the relative distance between each of the pads and a terminal selected for the pad falls within a range of the maximum allowable distance; and deciding one of the terminals as a assigned terminal based on the assigned terminal candidates and assigning the one of the terminals to one of the pads. The process is a process to assign one of the terminals with priority to a pad having a smallest number of assigned terminal candidates in a not-assigned condition based on the assigned terminal candidates.

Abstract: A method of designing a circuit is described. In an embodiment, a physical design implementation for the circuit is created using a plurality of entities. These entities are named “genomes”. Each entity includes a portion of a functional description of the circuit that has been synthesized into a gate-level implementation. An entity is selected to facilitate the physical design implementation meeting a plurality of design constraints. Several steps (e.g., beginning with selection of an entity) of this method are repeated several times to meet the design constraints. As a consequence, the physical design implementation provides more accurate information for use in a final physical design implementation. Moreover, the physical design implementation can be created faster than prior techniques while still allowing a global view of the physical design implementation in meeting design constraints.

Abstract: Methods of designing an IC and a hierarchical design flow generator are disclosed. In one embodiment, the method includes: (1) receiving timing and physical constraints for an IC design at an apparatus, (2) establishing a hierarchical design flow for providing an implementation of the IC design employing the apparatus and (3) partitioning the hierarchical design flow into a late design flow portion and an early design flow portion employing the apparatus, wherein the late design flow portion is substantially the same for different design flow methodologies.

Abstract: A layout system is described comprising a layout unit configured to layout cells in a mask design for a semiconductor chip based on library cells for a specified process node; a non-critical path determination unit configured to determine a non-critical path in the semiconductor chip; a cell determination unit configured to determine a group of cells in the mask design that form a part of the non-critical path and determine the corresponding library cell for at least one of the group of cells; a library cell modifying unit configured to modify one or more corresponding library cells to form a corresponding modified library cell; and a cell replacement unit configured to replace a library cell in the group of cells in the mask design that form a part of the non-critical path with the corresponding modified library cell.

Abstract: The present disclosure provides an integrated circuit design method. In an example, a method includes receiving an integrated circuit design layout that includes an active region feature, a contact feature, and an isolation feature, wherein a portion of the active region feature is disposed between the contact feature and the isolation feature; determining whether a thickness of the portion of the active region feature disposed between the contact feature and the isolation feature is less than a threshold value; and modifying the integrated circuit design layout if the thickness is less than the threshold value, wherein the modifying includes adding a supplementary active region feature adjacent to the portion of the active region feature disposed between the contact feature and the isolation feature.

Abstract: A printed circuit board includes a group of pads suitable to be soldered to a respective group of solder-balls of a device. Each pad of the group has a crack initiation point on its perimeter at a location where cracks in a solder-ball are anticipated to start after that solder-ball is soldered to that pad. For a pad of that group having a microvia located therein, a center of that microvia is located farther than a center of that pad from its crack initiation point. For a pad of that group having a trace merging along a portion of its perimeter, that portion does not include a vicinity of that crack initiation point.

Abstract: An approach for providing conversion of a planar design to a FinFET design is disclosed. Embodiments include: receiving a planar design having a plurality of diffusion regions; overlapping a plurality of parallel fin mandrels with a plurality of evenly-spaced parallel lines of a grid; snapping the diffusion regions to the grid based on the parallel lines; and generating a FinFET design based on the overlapping and the snapping. Embodiments include the parallel lines and the parallel fin mandrels being perpendicular to a poly orientation associated with the planar design, and determining a spacing length between the parallel lines; determining a plurality of edges of the diffusion regions that are parallel to the poly orientation; and cropping the diffusion regions until each of the edges has a length that is a multiple of the spacing length.

Abstract: A method is provided to produce a persistent representation of a annotation to a circuit design comprising: providing a block hierarchy that corresponds to the circuit design; displaying in a computer user interface display a first elaborated view of the circuit design that corresponds to the first instance of a block hierarchy; receiving user input to associate the annotation with a component of the elaborated view of the design; providing in a mirrored block hierarchy; and associating the annotation with the mirrored block hierarchy in computer readable storage media.

Abstract: A computer-readable medium stores a specification for a circuit layout. The specification includes: a configuration of rooms for placing devices, one or more room constraints for the configuration of rooms, one or more groups of devices for the rooms, and one or more device constraints for devices in a same room. The configuration of rooms may include a tree-structure for the rooms. The room constraints may include a common symmetry line for a first room and a second room. The device constraints may include a self-symmetry constraint for a first device about a symmetry line in a first room. The device constraints may include a symmetry constraint for a first device and a second device about a symmetry line in a first room. The devices may include analog or RF (radio frequency) devices.

Abstract: Provided is a hybrid envelope amplifier having improved efficiency, and more particularly, to an envelope amplifier using a dual switching amplifier and having improved efficiency in which power consumption is reduced by controlling a switching current of a switching region according to a magnitude of an envelope input signal, thereby improving efficiency compared to a conventional hybrid envelope amplifier. The envelope amplifier using a dual switching amplifier and having improved efficiency comprises a linear amplifier and a switching amplifier, wherein the switching amplifier includes two or more switching stages that are selectively operated according to a magnitude of an input signal.

Abstract: The present disclosure discloses a power transistor array designed to have a very low resistance. The power transistor array includes a bottom metal layer and a top metal layer. The bottom metal layer includes a plurality of strips, each corresponding to either drain or source strips, the drain and source strips being placed in parallel and alternating with each other. Further, the top metal layer, above the bottom metal layer, includes a plurality of strips. Each strip corresponds to either drain or source strips, the drain and the source strips being placed and alternating with each other. The strips of the top metal layer are oriented at angle with respect to the strips of the bottom metal layer. Moreover, the power transistor includes a plurality of bond pads on the top metal layer, and bond wires with one end attached to the corresponding bond pad.

Abstract: A computer-implemented method for interconnect redundancy of a circuit design comprises the steps of setting Manhattan distance being less than or equal to three pitches; placing a plurality of dummy micro bumps on at least one side of a die including a signal bump formed on the at least one side; determining an interconnecting candidate by selecting from the dummy micro bumps, which is distant from the signal bump by the Manhattan distance; and providing a routing path between the at least one interconnecting candidate and the signal bump.

Abstract: A method for implementing electronic circuit modules on elongated structures of semiconducting materials such as carbon nanotubes, graphene nanoribbons, elongated structures of semiconducting polymers or organic semiconductors, other related materials, and printed electronics strip structures is disclosed. The method provides that a plurality of modules can be implemented on distinct adjacent portions of the same elongated structure of semiconducting materials. In powering the modules, each circuit comprises a chain of electronic components arranged so that each end of the chain can function as a power supply terminal. Larger electronic circuit modules can be created from smaller module, and such a modular hierarchy may be extended to an arbitrary number of levels. In a Computer Aided Design (CAD) applications for nanoelectronics and printed electronics, designs for hierarchies electronic circuit modules can be stored and retrieved from one or more a libraries of circuit designs.

Abstract: A technology specific information to design the integrated circuit is received. A plurality of canonical hierarchical models to capture an integrated circuit capacitance are created. The plurality of canonical hierarchical models includes at least a canonical model to capture a capacitance of a device having a plurality of conductors, and a canonical model to capture a capacitance between at least a portion of the device and one or more other conductors of the integrated circuit. The canonical hierarchical models can be applied to a layout of the integrated circuit. A capacitance for the layout can be determined based on the canonical hierarchical models.

Abstract: An automated layout method allows designing advanced integrated circuits with design rules of high complexity. In particular, a hierarchical constrained layout process is applicable and useful for analog and mixed-signal integrated circuit designs and may be based on an incremental concurrent placement and routing. Use of constraints from multiple levels of a circuit description hierarchy allows computationally efficient processing of logical circuit increments and produces high-quality outcomes. Users such as circuit designers can exercise a high degree of predictability and control over the resulting physical layout construction by either user-specified or computer-generated constraints.

Abstract: This invention provides a semiconductor device structure formed on a conventional semiconductor-on-insulator (SeOI) substrate defined by a pattern defining at least one field-effect transistor having: in the thin film of the SeOI substrate, a source region, a drain region, a channel region, and a front control gate region formed above the channel region; and in the base substrate beneath the buried oxide of the SeOI substrate, a back control gate region, arranged under the channel region and configured to shift the threshold voltage of the transistor in response to bias voltages. This invention also provides patterns defining standard-cell-type circuit structures and data-path-cell type circuit structures that include arrays of the FET patterns provided by this invention. Such circuit structures also include back gate lines connecting the back gate control regions. This invention also provides methods of operating and designing such semiconductor device structures.

Abstract: An automated method for aligning a critical datapath in an integrated circuit design inserts an artificial alignment net in the netlist which interconnects all cells in the bit stack of the datapath. The cells are placed using a wirelength optimization which assigns weights to wire sections based on the alignment direction. The rate of change of the alignment weighting value can vary during different stages of global placement. The invention is particularly suited for a force-directed placer which uses a linear system solver to obtain a globally optimum solution for placement of the cells having some overlap among the cells, and thereafter spreads the cells to reduce the overlap. Pseudo nets are also inserted which interconnect a cell and an expected location of the cell after spreading for that iteration.

Abstract: A system and method are provided for laying out an integrated circuit design into a plurality of circuit layout cells having gaps therebetween, and inserting into each given one of at least a subset of the gaps, a corresponding filler cell selected from a predefined database in dependence upon a desired effect on a performance parameter of at least one circuit cell adjacent to the given gap. The circuit layout cells may be arranged in rows, and in some embodiments the selection of an appropriate filler cell for a given gap depends upon effects desired on a performance parameter of both circuit cells adjacent to the given gap. The predefined filler cells can include, for example, dummy diffusion regions, dummy poly lines, N-well boundary shifts and etch stop layer boundary shifts. In an embodiment, circuit layout cells can be moved in order to accommodate a selected filler cell.

Abstract: A through-hole layout apparatus and method for reducing differences in layout density of through-holes. The through-hole layout apparatus includes an extractor, which extracts an existing through-hole from design data for a semiconductor integrated circuit, a calculator, which calculates a layout density of through-holes in a predetermined region for each through-hole extracted by the extractor, a selector, which selects a through-hole at the center of a predetermined region where the layout density is lower than a predetermined value as a target through-hole from among the through-holes extracted by the extractor and a through-hole adder, which determines a given position in a predetermined region centered on the target through-hole as a placement position at which a through-hole is to be added for each target through-hole selected by the selector.

Abstract: A method includes defining an array including a plurality of unit cells, receiving unit cell density parameters in a computing apparatus, and defining a plurality of sub-arrays of unit cells using the computing apparatus. The computing apparatus defines density features disposed between adjacent sub-arrays. The computing apparatus generates density feature density parameters based on the unit cell density parameters and at least one density limit.

Abstract: In a method of supporting a layout design, a net list of an integrated circuit is divided into net lists of clock domain circuit aggregations. A timing constraint is generated to each of the clock domain circuit aggregations. An arrangement order of the clock domain circuit aggregations is determined to satisfy the timing constraint. A layout of the integrated circuit is generated by carrying out arrangement and wiring of the clock domain circuit aggregations based on the arrangement order.

Abstract: A polishing estimation/evaluation device includes a dividing unit, an overpolished area extracting unit, and a dummy modifying unit. The dividing unit divides a layout of an integrated circuit into a plurality of partial areas. The overpolished area extracting unit refers to an overpolishing condition indicating whether overpolishing occurs in a vicinity of a partial area based on a wiring density in the partial area and a wiring density in surrounding areas of the partial area, and extracts a partial area where the overpolishing occurs from the plurality of partial areas obtained by the division by the dividing unit. The dummy modifying unit modifies dummy wiring in the partial area where the overpolishing occurs extracted by the overpolished area extracting unit and/or dummy wiring in surrounding areas of the partial area to reduce the number of partial areas where the overpolishing occurs.

Abstract: A computer implemented method, data processing system, and computer program product for reworking a plurality of cells initially placed in a circuit design. An expander allocates cells to tiles. The expander determines a high detailed routing cost tile class, wherein the high detailed routing cost tile class is a class of tiles that has high detailed routing costs. The expander selects a cell within a tile of the high detailed routing cost tile class to form a selected cell in a selected tile. The expander applies multiple techniques to reposition these cells at new locations to improve the detailed routability. The expander can place an expanded bounding box around the selected cell, wherein the bounding box extends to at least one tile adjacent the selected tile, and repositions the selected cell within the bounding box to form a modified design to improve the detailed routability. The expander may also inflate and legalize those cells.

Abstract: A method, system, and computer program product for multi-patterning lithography (MPL) aware cell placement in integrated circuit (IC) design are provided in the illustrative embodiments. A global phase of cell movement is performed. A local phase cell movement is performed, wherein the local phase includes moving a color instance of the cell from a plurality of color instances of the cell within a row of cell in the IC design, wherein the global phase and the local phase are each performed before a final placement is produced for the IC design.