Vibratory Mass Patents (Class 73/504.12)
  • Publication number: 20140345379
    Abstract: A micro gyroscope for determining rotational movements about three spatial axes x, y and z, which are perpendicular to one another has a substrate (I) on which a plurality of masses (2, 3) oscillating tangentially about the z axis, which is perpendicular to the substrate (I), are arranged. The oscillating masses (2, 3) are fastened on the substrate (I) by means of springs (5, 6, 8) and tie bolts (7, 9). Driving elements (II) serve to maintain oscillating, tangential vibrations of the masses (2, 3) about the z axis, as a result of which, upon rotation of the substrate (I) about any spatial axis, the masses (2, 3) are subjected to Corolis forces and deflections caused as a result. Sensor elements detect the deflections of the masses (2, 3) on the basis of the Corolis forces generated. Some of the masses (2, 3) oscillating about the z axis are mounted in a tiltable manner substantially about the x axis which runs parallel to the substrate (I).
    Type: Application
    Filed: July 14, 2014
    Publication date: November 27, 2014
    Applicant: Maxim Integrated Products, GMbH
    Inventor: Hanno Hammer
  • Publication number: 20140345378
    Abstract: In a method for operating a rotation rate sensor including a substrate and a seismic mass, the seismic mass is driven in a drive direction in parallel to the main extension plane of the sensor to carry out a drive movement, and, during a rotation of the rotation rate sensor, the seismic mass is moved in a detection direction perpendicular to the drive direction and perpendicular to the rotation rate as a result of the action of force caused by the Coriolis force. The movement in the detection direction has a deflection amplitude, and the rotation rate sensor includes a deflection support element acting on the seismic mass in such a way that the deflection amplitude in the detection direction is increased.
    Type: Application
    Filed: May 8, 2014
    Publication date: November 27, 2014
    Applicant: Robert Bosch GmbH
    Inventors: Thomas NORTHEMANN, Jens STROBEL
  • Publication number: 20140338449
    Abstract: A vibratory gyroscope is provided comprising a plurality of secondary pickoff transducers which are each sensitive to the secondary response mode, wherein: at least two of the secondary pickoff transducers comprise skew transducers designed to be sensitive to the primary mode which produce an induced quadrature signal in response thereto. A method of using the gyroscope is provided comprising the steps of arranging electrical connections between the secondary pickoff transducers and a pickoff amplifier so that in use the induced quadrature signal is substantially rejected by the amplifier in the absence of a fault condition, and the amplifier outputs an induced quadrature signal when a fault condition disconnects one of the skew transducers from the amplifier, and a comparator compares the quadrature output from the pickoff amplifier with a predetermined threshold value and provides a fault indication when the predetermined threshold is exceeded.
    Type: Application
    Filed: November 27, 2012
    Publication date: November 20, 2014
    Applicants: SUMITOMO PRECISION PRODUCTS COMPANY LIMITED, ATLANTIC INERTIAL SYSTEMS LIMITED
    Inventors: Michael Durston, Takafumi Moriguchi, Ryuta Araki
  • Patent number: 8887571
    Abstract: An exposed end of a micromechanical system having at least one beam-shaped element is connected to a further element of the micromechanical system at the other end thereof. To optimize the mechanical properties of the micromechanical system, recesses are provided in the beam-shaped element in such a way that the mass of the beam-shaped elements decreases toward the exposed end.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: November 18, 2014
    Assignee: Siemens Aktiengesellschaft
    Inventors: Marco Dienel, Roman Forke, Dirk Scheibner
  • Publication number: 20140331769
    Abstract: A MEMS sensor comprises a vibrating sensing structure formed from a semiconductor substrate layer (50). The semiconductor substrate layer (50) is mounted on a pedestal comprising an electrically insulating substrate layer (52) bonded to the semiconductor substrate (50) to form a rectangular sensor chip. The pedestal further comprises an electrically insulating spacer layer (54) for mounting the sensor chip to a housing. The electrically insulating spacer layer (54) is octagonal. When the vibrating sensing structure is excited into a cos 2? vibration mode pair, the quadrature bias arising from any mode frequency split is not affected by changes in temperature as a result of the octagonal spacer layer (54).
    Type: Application
    Filed: April 30, 2014
    Publication date: November 13, 2014
    Applicant: Atlantic Inertial Systems Limited
    Inventor: Chris Fell
  • Patent number: 8883535
    Abstract: Methods for the fabrication of a Microelectromechanical Systems (“MEMS”) device are provided. In one embodiment, the MEMS device fabrication method includes forming a via opening extending through a sacrificial layer and into a substrate over which the sacrificial layer has been formed. A body of electrically-conductive material is deposited over the sacrificial layer and into the via opening to produce an unpatterned transducer layer and a filled via in ohmic contact with the unpatterned transducer layer. The unpatterned transducer layer is then patterned to define, at least in part, a primary transducer structure. At least a portion of the sacrificial layer is removed to release at least one movable component of the primary transducer structure. A backside conductor, such as a bond pad, is then produced over a bottom surface of the substrate and electrically coupled to the filled via.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: November 11, 2014
    Assignee: Freescale Semiconductor Inc.
    Inventor: Lianjun Liu
  • Publication number: 20140326070
    Abstract: A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.
    Type: Application
    Filed: July 17, 2014
    Publication date: November 6, 2014
    Applicant: ROBERT BOSCH GMBH
    Inventors: Reinhard Neul, Johannes Classen, Torsten Ohms, Burkhard Kuhlmann, Axel Franke, Oliver Kohn, Daniel Christoph Meisel, Joerg Hauer, Udo-Martin Gomez, Kersten Kehr
  • Patent number: 8875576
    Abstract: An in-plane, monolithically-integrated, inertial device comprising: a support structure and first and second spring mass systems springedly coupled to the support structure. The first spring mass system comprises first and second time domain digital triggers configured to measure rotation and displacement respectively of the support structure about a first axis and along an orthogonal second axis respectively. The second spring mass system comprises third and fourth time domain digital triggers configured to measure acceleration and displacement respectively of the support structure about the second axis and along the first axis respectively.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: November 4, 2014
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Paul D. Swanson, Richard L. Waters
  • Patent number: 8875575
    Abstract: A yaw rate sensor includes: at least one Coriolis element; a drive device connected to the Coriolis element and configured to drive a vibration of the Coriolis element; a detection device having at least one rotor; and a coupling device connected to the detection device and to the Coriolis element. The coupling device is configured to couple a deflection in the plane of vibration of the Coriolis element to the detection device in a direction orthogonal to the vibration, so that when the Coriolis element is deflected a torque for driving the at least one rotor is transmitted from the Coriolis element to the at least one rotor.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: November 4, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Torsten Ohms, Burkhard Kuhlmann, Daniel Christoph Meisel, Rolf Scheben
  • Patent number: 8875574
    Abstract: A coupling structure for a rotation rate sensor apparatus, having at least one first oscillating mass; and having a first frame, surrounding the first oscillating mass, to which the first oscillating mass is coupled; the first frame encompassing four angle elements, each of which angle elements has at least one first limb and one second limb and is respectively coupled with the first limb and with the second limb to another adjacent angle element of the four angle elements. Also described is a further coupling structure for a rotation rate sensor apparatus, to a rotation rate sensor apparatus, to a manufacturing method for a coupling structure for a rotation rate sensor apparatus, and to a manufacturing method for a rotation rate sensor apparatus.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: November 4, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Robert Sattler, Daniel Christoph Meisel, Joerg Hauer
  • Patent number: 8875578
    Abstract: An apparatus includes a microelectromechanical system (MEMS) device including a mass anchored to a substrate. The MEMS device is configured to generate an output signal indicative of motion of the mass with respect to the substrate. The MEMS device includes a feedback module configured to provide a control signal to the MEMS device. The control signal is based on the output signal. The MEMS device is configured to apply a damping force to the mass in response to the control signal.
    Type: Grant
    Filed: October 26, 2011
    Date of Patent: November 4, 2014
    Assignee: Silicon Laboratories Inc.
    Inventor: Eric B. Smith
  • Publication number: 20140318244
    Abstract: A detection circuit (physical quantity detection circuit) includes a digital arithmetic operation circuit (arithmetic operation processing portion) that performs an arithmetic operation process of generating an arithmetic operation signal according to a magnitude of a physical quantity, on the basis of a detection signal corresponding to the physical quantity. The digital arithmetic operation circuit performs an arithmetic operation process including a power supply voltage fluctuation correction process of correcting at least one of the detection signal and a signal which is obtained by a portion of the arithmetic operation process with respect to the detection signal, on the basis of a correction expression using a power supply voltage to be supplied as a variable.
    Type: Application
    Filed: April 23, 2014
    Publication date: October 30, 2014
    Applicant: Seiko Epson Corporation
    Inventor: Akio TSUTSUMI
  • Patent number: 8869615
    Abstract: The present disclosure relates to a vibrating element which is planar parallelly to an electrical crystallographic axis of a piezoelectric material such as quartz. The element comprises a beam holding electrodes, a stationary portion rigidly connected to one end of the beam, and a solid portion rigidly connected to the other end of the beam. The structure with facets from the chemical machining of the element has an axis of symmetry parallel to the electrical axis, and the solid portion has a center of gravity on the axis of symmetry. The useful vibration modes of the vibrating element, according to which the solid portion is reciprocatingly rotated about the axis of symmetry and reciprocatingly moved parallel to the plane of the element, are uncoupled. The measurement of an angular speed by a rate gyroscope including said vibrating elements is more precise.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: October 28, 2014
    Assignee: ONERA (Office National d'Etudes et de Recherche Aerospatiales)
    Inventors: Denis Janiaud, Olivier Le Traon, Claude Chartier, Stève Masson, Jean Guerard, Raphaël Levy, Marc Pernice
  • Patent number: 8869614
    Abstract: A method of controlling an inertial rotation sensor has a vibrating resonator having control channels and detection channels. During an operating stage each control channel (C1, C2) is activated for a control duration and each detection channel (D1, D2) is activated for a detection duration, in which the control and detection durations are applied at an operating ratio. Duyring a starting stage the control and detection durations are applied at a ratio that is modified in comparison with the operating ratio, so as to increase the control duration.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: October 28, 2014
    Assignee: Sagem Defense Securite
    Inventor: Vincent Ragot
  • Publication number: 20140311242
    Abstract: A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor's temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.
    Type: Application
    Filed: January 23, 2014
    Publication date: October 23, 2014
    Applicant: mCube Inc.
    Inventors: TERRENCE LEE, WENHUA ZHANG, SUDHEER SRIDHARAMURTHY, SHINGO YONEOKA
  • Patent number: 8863574
    Abstract: A yaw rate sensor having a substrate and a seismic mass is described, in which the seismic mass is excitable to a working oscillation relative to the substrate via a drive unit, and a Coriolis deflection of the seismic mass is detectable relative to the substrate, in which the yaw rate sensor furthermore has an interrupt interface, the drive unit being configured to reduce a frequency and/or an amplitude of the working oscillation if an interrupt signal is present at the interrupt interface.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: October 21, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Rex Kho, Oliver Kohn, Fouad Bennini, Julian Bartholomeyczik
  • Publication number: 20140305205
    Abstract: Disclosed herein are a self-oscillation circuit and a method thereof. The self-oscillation circuit includes: a gyroscope sensor receiving a driving signal at its input terminal to resonate with and output it; a sensor driver outputting the driving signal for driving the gyroscope sensor; a phase shifter receiving a signal from the gyroscope sensor and shifting a phase of the received signal; and a time delay unit receiving the shifted signal from the phase shifter and delaying it for a predetermined time period, and then feeding the delayed signal back to the sensor driver.
    Type: Application
    Filed: October 17, 2013
    Publication date: October 16, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: Chang Hyun KIM
  • Publication number: 20140305206
    Abstract: A detection device includes a driving circuit that drives a vibrator, and a detection circuit that receives a detection signal from the vibrator and performs a detection process of detecting a physical quantity signal corresponding to a physical quantity from the detection signal. The driving circuit performs intermittent driving in which the vibrator is driven in a driving period, and is not driven in a non-driving period, and the detection circuit performs the detection process of the physical quantity signal in the non-driving period of the intermittent driving.
    Type: Application
    Filed: March 18, 2014
    Publication date: October 16, 2014
    Applicant: Seiko Epson Corporation
    Inventors: Katsuhiko Maki, Takashi Nomiya
  • Publication number: 20140305208
    Abstract: The invention comprises an inertial sensor comprising a frame, a proof mass, a first resonant element, the first resonant element being fixed to the frame and electrostatically coupled to the proof mass, and a second resonant element, the second resonant element being fixed to the frame, adjacent to the first resonant element such that there is substantially no electrostatic coupling between the second resonant element and the proof mass. A coupling is provided between the first resonant element and the second resonant element. A drive means is coupled to the first and second resonant elements for vibrating the first and second resonant elements and a sensor assembly is provided for detecting the amplitude of vibration of at least one of the resonant elements.
    Type: Application
    Filed: November 22, 2012
    Publication date: October 16, 2014
    Inventors: Pradyumna Thiruvenkatanathan, Ashwin Seshia
  • Publication number: 20140305207
    Abstract: The electronic circuit (1) is for driving a resonator (2) of a MEMS resonator device. The resonator includes a mass (m) connected to a spring (k) and a damping element (d), an actuation element (Cact) for actuating the mass via an actuation signal (drive), and a detection element (Cdet) for detecting motion of the mass. The electronic circuit includes a conversion means (3) connected to the detection element to supply a mass oscillation derivative signal (der), a means (4, 5, 6) of comparing the derivative signal amplitude and a reference amplitude (ref) for supplying a control signal (cmd), and a decision unit (7) for supplying a digital actuation signal (drive). The actuation signal includes rectangular pulses determined on the basis of the derivative signal and of the control signal to adapt the mass oscillation amplitude according to the reference amplitude.
    Type: Application
    Filed: April 2, 2014
    Publication date: October 16, 2014
    Applicant: EM Microelectronic-Marin SA
    Inventors: Christophe ENTRINGER, Alexandre DESCHILDRE
  • Patent number: 8857258
    Abstract: An inertial force sensor includes a detector element, a supporting body supporting the detector element, and a case holding the detector element via the first supporting body. The supporting body has flexibility and has a plate shape. The detector element includes a weight, a flexible coupling portion extending along a plane and supporting the weight, a fixing portion holding the weight via the coupling portion, and a detector detecting angular velocities about at least two axes non-parallel to each other. The supporting body extends in parallel with the plane from the detector element, and bends at a bending portion in a direction away from the plane. This inertial force sensor can detect the angular velocities while preventing erroneous detection caused by external impacts and vibrations.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: October 14, 2014
    Assignee: Panasonic Corporation
    Inventors: Hideo Ohkoshi, Shigehiro Yoshiuchi, Tsuyoshi Sakaue
  • Patent number: 8857259
    Abstract: A reading circuit of a gyroscope is provided. The reading circuit includes a driving unit, a high pass filter, a signal processing unit, and a low pass filter. The driving unit generates a resonance signal for a resonator of the gyroscope and generates a demodulation signal for the signal processing unit. The signal processing unit provides a modulation signal to a Coriolis accelerometer of the gyroscope. An input terminal of the high pass filter receives an output signal of the Coriolis accelerometer. The signal processing unit processes and demodulates an output of the high pass filter according to the demodulation signal and outputs a demodulation result to the low pass filter.
    Type: Grant
    Filed: March 26, 2012
    Date of Patent: October 14, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Wen Hsu, Sheng-Ren Chiu, Lu-Po Liao, Shih-Ting Lin
  • Patent number: 8860114
    Abstract: The present disclosure provides an integrated circuit. The integrated circuit includes a substrate having a surface that is defined by a first axis and a second axis perpendicular to the first axis; and a capacitor structure disposed on the substrate. The capacitor structure includes a first conductive component; a second conductive component and a third conductive component symmetrically configured on opposite sides of the first conductive component. The first, second and third conductive components are separated from each other by respective dielectric material.
    Type: Grant
    Filed: March 2, 2012
    Date of Patent: October 14, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsiao-Tsung Yen, Yu-Ling Lin, Chin-Wei Kuo, Ho-Hsiang Chen, Min-Chie Jeng
  • Publication number: 20140298908
    Abstract: A vibration element includes a base section, a support arm extending from the base section, a driving vibration arm extending from the support arm in a direction intersecting with the extending direction of the support arm, a drive section provided to the driving vibration arm, and having a first electrode layer, a second electrode layer, and a first piezoelectric layer disposed between the first electrode layer and the second electrode layer, the first electrode layer being disposed on the driving vibration arm side, and a monitor section adapted to detect a vibration of the driving vibration arm, provided to the driving vibration arm, and having a third electrode layer, a fourth electrode layer, and a second piezoelectric layer disposed between the third electrode layer and the fourth electrode layer, the third electrode layer being disposed on the driving vibration arm side.
    Type: Application
    Filed: April 3, 2014
    Publication date: October 9, 2014
    Applicant: Seiko Epson Corporation
    Inventor: Fumio ICHIKAWA
  • Publication number: 20140298907
    Abstract: A method for evaluating output signals of a rotational rate sensor unit, including providing an n-tuple of angular speed values measured by at least one rotational rate sensor of the rotational rate sensor unit, in a first step; determining an intermediate value as a function of the n-tuple of angular speed values, in a second step; calculating a new change of orientation value as a function of the intermediate value and an earlier change of orientation value stored in a register of the rotational rate sensor unit, in a third step; and storing the new change of orientation value in the register, in a fourth step, repeating the first, second, third, and fourth step until, the new change of orientation value is read out by an external data processing unit connected to the rotational rate sensor unit, and/or, an exceeding of a threshold value is detected.
    Type: Application
    Filed: June 19, 2012
    Publication date: October 9, 2014
    Inventors: Thomas Claus, Julian Bartholomeyczik
  • Patent number: 8850887
    Abstract: A detection circuit includes a synchronous detection circuit (synchronous detection section) that synchronously detects a signal that includes a detection signal of a vibrator (an output signal of an amplifier), a switched capacitor filter (SCF) circuit that filters a signal that has been synchronously detected by the synchronous detection circuit (an output signal of a programmable gain amplifier), and an output buffer that buffers and outputs a signal that has been filtered by the SCF circuit, the gain of the SCF circuit being larger than 1.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: October 7, 2014
    Assignees: Seiko Epson Corporation, Seiko NPC Corporation
    Inventors: Yoshinao Yanagisawa, Masahiro Oshio, Takayuki Kikuchi, Toshihiro Nishida, Masayuki Takahashi
  • Patent number: 8850888
    Abstract: Disclosed herein is an inertial sensor. The inertial sensor 100 according to preferred embodiments of the present invention includes: a membrane 110; a mass body 120 disposed under the membrane 110; a piezoelectric body 130 formed on the membrane 110 to drive the mass body 120; and trenches 140 formed by being collapsed in a thickness direction of the piezoelectric body 130 so as to vertically meet a direction in which the mass body 120 is driven. By this configuration, the trenches are formed by being collapsed in a thickness direction of the piezoelectric body 130 to provide directivity while retaining the rigidity of the piezoelectric body 130 to prevent a wave from being propagated in an unnecessary direction, thereby driving the inertial sensor 100 in a desired specific direction.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: October 7, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Mo Lim, Sung Wook Kim, Sung Jun Lee, Kyo Yeol Lee, Yun Sung Kang
  • Patent number: 8850886
    Abstract: The invention relates to an electromechanic microsensor (MEMS) comprising drive elements which are moved linearly in an x-y plane and disposed on a substrate to determine at least two, preferably three, components of the yaw rate vector of a substrate, wherein two groups of drive elements are driven in directions running essentially at right angles to each other. The MEMS according to the invention is characterized in that the drive elements, which are moved at right angles to each other, are connected to one another to synchronize the movements via a coupling device that is rotatably mounted on the substrate.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: October 7, 2014
    Assignee: Maxim Integrated Products, Inc.
    Inventor: Volker Kempe
  • Publication number: 20140290361
    Abstract: Disclosed herein is an apparatus for driving a gyroscope sensor, including: multi-axis sensing means; detecting circuit means; switching means that is disposed between the axes of the multi-axis sensing means and the detecting circuit means so as to connect or disconnect between the axes of the multi-axis sensing means and the detecting circuit means according to a switching control signal; and control means that controls the switching means such that the axes of the multi-axis sensing means and the detecting circuit means are sequentially connected or disconnected. By providing Integrated detecting circuit means to detect gyro signals on axes from a gyroscope sensor, size can be reduced and power consumption (current) and cost can be saved.
    Type: Application
    Filed: December 24, 2013
    Publication date: October 2, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Tae KIM, Young Kil CHOI, Jun Kyung NA, Seung Chul PYO, Chang Hyun KIM
  • Patent number: 8844356
    Abstract: An inertial force sensor includes a detecting device which detects an inertial force, the detecting device having a first orthogonal arm and a supporting portion, the first orthogonal arm having a first arm and a second arm fixed in a substantially orthogonal direction, and the supporting portion supporting the first arm. The second arm has a folding portion. In this configuration, there is provided a small inertial force sensor which realizes detection of a plurality of different inertial forces and detection of inertial forces of a plurality of detection axes.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: September 30, 2014
    Assignee: Panasonic Corporation
    Inventors: Satoshi Ohuchi, Hiroyuki Aizawa, Jiro Terada, Takami Ishida, Ichirou Satou, Hideo Ohkoshi, Yohei Ashimori
  • Patent number: 8847693
    Abstract: A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: September 30, 2014
    Assignee: Invensense, Inc.
    Inventors: Joseph Seeger, Goksen G. Yaralioglu, Baris Cagdaser
  • Patent number: 8844357
    Abstract: A yaw-rate sensor includes: a substrate having a main extension plane for detecting a yaw rate about a first axis extending parallel to the main extension plane; a first Coriolis element; a second Coriolis element; a third Coriolis element; and a fourth Coriolis element. The first Coriolis element and the fourth Coriolis element are drivable in the same direction parallel to a second axis extending parallel to the main extension plane and perpendicularly to the first axis. The first Coriolis element and the second Coriolis element are drivable in opposite directions parallel to the second axis. The first Coriolis element and the third Coriolis element are drivable in opposite directions parallel to the second axis.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: September 30, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Rolf Scheben, Burkhard Kuhlmann, Thorsten Balslink, Daniel Christoph Meisel, Benjamin Schmidt
  • Publication number: 20140283600
    Abstract: Disclosed herein are a gyro sensor driver and a pulse translation device used thereof. The gyro sensor driver, includes: a phase shifter that delays a signal output from an output terminal of a vibrating sensor to output a phase-shifted signal; a comparator that inverts a signal output from the phase shifter to output a clock signal; a reference voltage generator that generates and outputs reference voltage; and a pulse translator that receives the reference voltage output from the reference voltage generator and the clock signal output from the comparator to generate and output a signal of a predetermined pulse, thereby generating a desired driving signal with low current.
    Type: Application
    Filed: May 24, 2013
    Publication date: September 25, 2014
    Inventors: Sung Tae Kim, Young Kil Choi, Jun Kyung Na, Seung Chul Pyo, Chang Hyun Kim
  • Publication number: 20140283602
    Abstract: A detection element has: first and second fixed parts; first and second vertical beams each connected at first and second ends to the first and second fixed parts, respectively; a horizontal beam connected at first and second ends to centers of the first and second vertical beams, respectively; and four arms each connected at a first end to the horizontal beam and having a weight formed on a second end. The first vertical beam has a first slit formed nearer the first fixed part with respect to its center, a second slit formed nearer the second fixed part with respect to its center, and a coupling portion between these slits. The second vertical beam has a third slit formed nearer the first fixed part with respect to its center, a fourth slit formed nearer the second fixed part with respect to its center, and a coupling portion between these slits.
    Type: Application
    Filed: November 16, 2012
    Publication date: September 25, 2014
    Applicant: Panasonic Corporation
    Inventor: Kensaku Yamamoto
  • Publication number: 20140283601
    Abstract: Methods, structures, devices and systems are disclosed for implementing optomechanical sensors in various configurations by using two optically coupled optical resonators or cavities that can be move or deform relative to each other. The optical coupling between first and second optical cavities to produce an optical resonance that varies with a spacing between the first and second optical cavities and provide the basis for the optomechanical sensing. Compact and integrated optomechanical sensors can be constructed to provide sensitive measurements for a range of applications, including motion sensing and other sensing applications.
    Type: Application
    Filed: October 8, 2012
    Publication date: September 25, 2014
    Inventors: Sunil A. Bhave, David Neil Hutchison
  • Publication number: 20140260611
    Abstract: Various embodiments include feedback circuits for tuning the drive modes of a shell-type gyroscope, while other embodiments include separate circuits for tuning the sense mode of a shell-type gyroscope to reduce or avoid quadrature errors. Still other embodiments include circuits to excite the sense modes (i.e., the out-of-plane modes) of a gyroscope without requiring the application of a rotation to the gyroscope, to ensure that the sense modes are aligned with the sense electrodes.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Analog Devices, Inc.
    Inventors: Houri Johari-Galle, William A. Clark
  • Publication number: 20140260613
    Abstract: A MEMS device includes at least one proof mass, the at least one proof mass is capable of moving to contact at least one target structure. The MEMS device further includes at least one elastic bump stop coupled to the proof mass and situated at a first distance from the target structure. The MEMS device additionally includes at least one secondary bump stop situated at a second distance from the target structure, wherein the second distance is greater than the first distance, and further wherein the at least one elastic bump stop moves to reduce the first distance when a shock is applied.
    Type: Application
    Filed: October 9, 2013
    Publication date: September 18, 2014
    Applicant: Invensense, Inc.
    Inventors: Jin Qiu, Joseph Seeger
  • Publication number: 20140260608
    Abstract: An angular rate sensor (20) includes a single drive mass (24) and distributed sense masses (36, 38, 40, 42) located within a central opening (30) of the drive mass (24). The drive mass (24) is enabled to rotate around the Z-axis (64) under electrostatic stimulus. The sense masses (36, 38, 40, 42) are coupled to the drive mass by spring elements (44, 46, 48, 50) such that oscillatory rotary motion (90) of the drive mass imparts a linear drive motion (92, 94) on the sense masses. The distributed sense masses form two pairs of sense masses, where one pair senses X- and Z-axis angular rate and the other pair senses Y- and Z-axis angular rate. The sense masses are coupled to one another via a centrally located coupler element (34) to ensure that the sense masses of each pair are moving in anti-phase.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Yizhen Lin, Dejan Mijuskovic
  • Publication number: 20140260609
    Abstract: A microelectromechanical device includes: a body; a movable mass, elastically coupled to the body and oscillatable with respect to the body according to a degree of freedom; a frequency detector, configured to detect a current oscillation frequency of the movable mass; and a forcing stage, capacitively coupled to the movable mass and configured to provide energy to the movable mass through forcing signals having a forcing frequency equal to the current oscillation frequency detected by the frequency detector, at least in a first transient operating condition.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: STMICROELECTRONICS S.R.L.
    Inventors: Marco Garbarino, Andrea Donadel, Davide Magnoni, Carlo Valzasina
  • Publication number: 20140260610
    Abstract: A microelectromechanical systems (MEMS) device includes at least two rate sensors (20, 50) suspended above a substrate (30), and configured to oscillate parallel to a surface (40) of the substrate (30). Drive elements (156, 158) in communication with at least one of the rate sensors (20, 50) provide a drive signal (168) exhibiting a drive frequency. One or more coupling spring structures (80, 92, 104, 120) interconnect the rate sensors (20, 50). The coupling spring structures enable oscillation of the rate sensors (20, 50) in a drive direction dictated by the coupling spring structures. The drive direction for the rate sensors (20) is a rotational drive direction (43) associated with a first axis (28), and the drive direction for the rate sensors (50) is a translational drive direction (64) associated with a second axis (24, 26) that is perpendicular to the first axis (28).
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Andrew C. McNeil, Yizhen Lin
  • Publication number: 20140260612
    Abstract: The disclosure provides a composite sensor with high reliability and a method for manufacturing the same. A moving body of an acceleration sensor and an oscillator of an angular velocity sensor are provided on the same sensor wafer, while being partitioned by a wall, and a cap wafer is formed to have a gap that corresponds to each of the sensors. A through hole and a bump are formed in a sensor sealing portion, the acceleration sensor is sealed in an air atmosphere in a first sealing process, and in a second sealing process, the angular velocity sensor is sealed by bringing the sensors and the cap into contact with each other and joining the sensors and the cap in a vacuum atmosphere. Thereafter, a composite sensor wafer is cut, a circuit board and a wiring board are mounted thereon, and a composite sensor is formed.
    Type: Application
    Filed: November 28, 2011
    Publication date: September 18, 2014
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Takanori Aono, Kengo Suzuki, Masahide Hayashi, Heewon Jeong
  • Patent number: 8833161
    Abstract: In one embodiment, an apparatus includes a resonant structure having a plate, a drive electrode and a sense electrode. The resonant structure defines an axis substantially orthogonal to a plane defined by the plate when the resonant structure is not excited. The plate is formed from a piezoelectric material. The drive electrode is configured to excite the resonant structure, and the sense electrode is configured to sense a signal in response to rotation of the resonant structure about the axis.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: September 16, 2014
    Assignee: Sand 9, Inc.
    Inventors: Guiti Zolfagharkhani, Jan H. Kuypers, Alexei Gaidarzhy, Andrew Sparks
  • Patent number: 8833162
    Abstract: A gyroscope is disclosed. The gyroscope comprises a substrate; and a guided mass system. The guided mass system comprises proof-mass and guiding arm. The proof-mass and the guiding arm are disposed in a plane parallel to the substrate. The proof-mass is coupled to the guiding arm. The guiding arm is also coupled to the substrate through a spring. The guiding arm allows motion of the proof-mass to a first direction in the plane. The guiding arm and the proof-mass rotate about a first sense axis. The first sense axis is in the plane and parallel to the first direction. The gyroscope includes an actuator for vibrating the proof-mass in the first direction. The gyroscope also includes a transducer for sensing motion of the proof-mass-normal to the plane in response to angular velocity about a first input axis that is in the plane and orthogonal to the first direction.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: September 16, 2014
    Assignee: InvenSense, Inc.
    Inventors: Joseph Seeger, Ozan Anac
  • Patent number: 8833163
    Abstract: An angular velocity sensor includes: a frame including a pair of first beams extending in a first direction and opposed to each other in a second direction orthogonal to the first direction, a pair of second beams extending in the second direction and opposed to each other in the first direction, and connections between those pairs; a drive unit that vibrates the frame in a first plane, to which the first and second directions belong, in a vibration mode in which when one pair of those pairs move closer to each other, the other move away from each other, and vice versa; a first detector that detects, based on the amount of deformation of the frame in the first plane, an angular velocity around an axis of a third direction orthogonal to the first plane; and a support mechanism including a base portion and joint portions.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: September 16, 2014
    Assignee: Sony Corporation
    Inventor: Junichi Honda
  • Publication number: 20140251009
    Abstract: Systems and methods are provided for improved multifunction sensing. In these embodiments a multifunction sensing device (100) includes a microelectromechanical (MEMS) gyroscope (110) and at least a second sensor (112). The MEMS gyroscope (110) is configured to generate a first clock signal, and the second sensor includes a second clock signal. The multifunction sensing device further includes a reset mechanism (114), the reset mechanism (114) configured to generate a reset signal to set the relative periodic phase alignment of the second clock signal to the first clock signal. Consistently setting the relative periodic phase alignment of the clocks for the other sensor devices (112) to the clock of the MEMS gyroscope (110) can improve the performance of the devices by reducing the probability that varying output offsets will occur in the multiple sensing devices.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Mark E. SCHLARMANN, Deyou FANG, Keith L. KRAVER, Mike A. MARGULES, Hiroto SAHARA
  • Patent number: 8826736
    Abstract: A micromechanical sensor comprising a substrate (5) and at least one mass (6) which is situated on the substrate (5) and which moves relative to the substrate (5) is used to detect motions of the sensor due to an acceleration force and/or Coriolis force which occur(s). The mass (6) and the substrate (5) and/or two masses (5, 7) which move toward one another are connected by at least one bending spring device (6). The bending spring device (6) has a spring bar (9) and a meander (10), provided thereon, having a circle of curvature (K1; K6; K8; K9; K11) whose midpoint (MP1; MP6; MP8; MP9; MP11) and radius of curvature (r1; r6; r8; r9; r11) are inside the meander (10). For reducing stresses that occur, in addition to the radius of curvature (r1; r6; r8; r9; r11) having the inner midpoint (MP1; MP6; MP8; MP9; MP11), the meander (10) has at least one further radius of curvature (r2; r3; r4; r5; r7; r10) having a midpoint (MP2; MP3; MP4; MP5; MP7; MP10) outside the meander (10).
    Type: Grant
    Filed: April 27, 2010
    Date of Patent: September 9, 2014
    Assignee: Maxim Integrated Products, Inc.
    Inventor: Hanno Hammer
  • Patent number: 8826735
    Abstract: A device is provided for resonantly driving a micromechanical system, which includes at least one seismic mass supported by spring vibrations, at least one drive for driving the vibration of the seismic mass and at least one element that is motionally coupled to the seismic mass. Furthermore, the device includes at least one detection element for detecting a relational parameter, that changes with the vibration of the seismic mass, between the motionally coupled element and the detection element, the detection element being equipped to cause an interruption of the vibration drive when a predetermined value of the relational parameter is reached.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: September 9, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Axel Franke, Frank Freund, Daniel Christoph Meisel
  • Patent number: 8826734
    Abstract: An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: September 9, 2014
    Assignee: Panasonic Corporation
    Inventors: Hideo Ohkoshi, Tomohiro Mitani
  • Publication number: 20140245831
    Abstract: A gyro sensor includes a vibrating body, a first spring structure portion that extends in a direction along a first axis and is connected to the vibrating body, first and second vibrating portions that are disposed in parallel to each other in the direction along the first axis and are excited and vibrated in an opposite phase to each other, and a second spring structure portion that extends in the direction along the first axis and is connected to the first and second vibrating portions, in which a first spring constant K1 of the first spring structure portion is smaller than a second spring constant K2 from a middle point at which a length between both ends of the second spring structure portion is equally divided into two to one end of the second spring structure portion.
    Type: Application
    Filed: February 25, 2014
    Publication date: September 4, 2014
    Applicant: Seiko Epson Corporation
    Inventor: Makoto FURUHATA
  • Patent number: 8823007
    Abstract: An integrated MEMS System. CMOS and MEMS devices can be provided in order to form an integrated CMOS-MEMS system. The system can include a silicon substrate layer, a CMOS layer, MEMS and CMOS devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, one which any number of CMOS MEMS devices can be configured. The integrated MEMS devices can include, but not exclusively, an combination of the following types of sensors: magnetic, pressure, humidity, temperature, chemical, biological, or inertial. Furthermore, the overlying WLP layer can be configured to hermetically seal any number of these integrated devices. The present technique provides an easy to use process that relies upon conventional process technology without substantial modifications to conventional equipment and process and reduces off-chip connections, which make the mass production of smaller and thinner units possible.
    Type: Grant
    Filed: October 27, 2010
    Date of Patent: September 2, 2014
    Assignee: mCube Inc.
    Inventor: Xiao “Charles” Yang