Abstract: Disclosed is a measuring device for measuring a physical quantity. The physical quantity could be a pressure and/or a force. The measuring device comprises a circular sensing structure comprising a membrane section which is deflected by force variations acting on the circular sensing structure. A first and second strain gauge are attached to the membrane section. The first strain gauge is configured to measure radial strain in a first surface area of the membrane section. The second strain gauge is configured to measure tangential strain in a second surface area of the membrane section. An increase in force acting on the sensing structure results in shrinking of the first surface area measured by the first strain gauge and stretching of the second surface area measured by the second strain gauge.

Abstract: This disclosure provides example methods, devices and systems associated with flat covered leadless pressure sensor assemblies suitable for operation in extreme environments. In one embodiment, a system may comprise a semiconductor substrate having a first side and a second side; a diaphragm disposed on the first side of the semiconductor substrate; a first cover coupled to the first side of the semiconductor substrate such that it overlays at least the diaphragm, wherein a pressure applied at the first cover is transferred to the diaphragm; and a sensing element disposed on the second side of the semiconductor substrate, wherein the sensing element is used to measure the pressure.

Abstract: A catheter die is provided and includes a device layer defining a cavity and including a piezoresistive pressure sensor operably disposed proximate to the cavity and an insulator having an opening and being disposed on an upper surface of the device layer such that a portion of the piezoresistive pressure sensor is exposed through the opening. The catheter die further includes an insulation layer bonded to a lower surface of the device layer and first and second bond pads, the first bond pad being electrically coupled to the portion of the piezoresistive pressure sensor via the opening and the second bond pad being disposed on the insulation layer.

Abstract: A mechanical-quantity measuring device capable of measuring a strain component in a specific direction with high precision is provided. At least two or more pairs of bridge circuits are formed inside a semiconductor monocrystal substrate and a semiconductor chip, and one of these bridge circuits forms a n-type diffusion resistor in which a direction of a current flow and measuring variation of a resistor value are in parallel with a <100> direction of the semiconductor monocryastal silicon substrate, and an another bridge circuit is composed of combination of p-type diffusion resistors in parallel with a <110> direction.

Abstract: Systems and methods for an internally switched multiple range transducer are provided. In one embodiment, a method comprises receiving, at a first sensor, a pressure, wherein the first sensor is associated with a first pressure range; measuring, at the first sensor, the pressure to generate a first pressure signal; in response to determining that the first pressure signal is not associated with the first pressure range, activating a second sensor, wherein the second sensor is associated with a second pressure range that is different from the first pressure range; and measuring, at the second sensor, the pressure to generate a second pressure signal.

Abstract: Provided is a piezo-resistive pressure sensor that realizes sensitive and accurate measurement of pressure, by reducing the variation of electrical conduction due to thermal variation in piezo resistance elements, without lowering the sensitivity of measurement. Piezo-resistance sections R1, R2, R3 and R4 are arranged on diaphragm 31, near the border between diaphragm 31 and support section 32. By this means, pressure can be measured with high sensitivity. The area of a part where a group of piezo-resistance elements are placed, and the outer shape of that part, are the same between piezo-resistance sections R1, R2, R3 and R4. By this means, piezo-resistance sections R1, R2, R3 and R4 have uniform temperature distribution and reduce the variation of electrical conduction due to thermal variation in piezo resistance elements.

Abstract: A method, device and system for a gage pressure transducer including the making thereof are provided. In one embodiment, a method comprises receiving, at a first diaphragm, a first pressure, wherein the first diaphragm is composed of metal; transferring, from the first diaphragm, to a first sensor, the first pressure using a first oil region, wherein the first oil region is disposed between the first diaphragm and the first sensor; receiving, at the first sensor, the first pressure; measuring, by the first sensor, the first pressure to generate a first pressure signal; and outputting, from the first sensor, to a first header pin, the first pressure signal, wherein the first header pin is electrically coupled to the first sensor using a first conductive glass frit.

Abstract: A novel flexible transducer structure is suitable for attaching to curved surface such as the leading edge of an aircraft wing. The structure comprises a thin flexible sheet of an insulating material with a leadless transducer secured to the sheet. The sheet is then placed over the curved surface and assumes the curvature of the surface. The transducer secured to the sheet provides an output of pressure according the pressure exerted on the sheet. The sheet basically is fabricated from a thin material such as Kapton and is flexible so as to assume the curvature of the surface with the transducer being exposed to pressure applied to the curved surface. The sensor in conjunction with the flexible sheet allows pressure to be measured without disturbing the air flow patterns of the measuring surfaces and because of its construction, is moisture resistant over a large variety of atmospheric conditions.

Abstract: An absolute piezo-resistive pressure sensor system and method employing multiple pressure sensing elements operating simultaneously to detect pressure. Both pressure sensing elements being subject to a common reference pressure within a sealed cavity. The first pressure sensing element detecting an offset voltage resulting from the progressive release of mechanical stress at an assembly interface between the sensing element and a base plate on which the sensing elements are assembled. Electronic circuitry compensates the pressure measured by the second pressure sensing element based on the offset voltage detected by the first pressure sensing element.

Abstract: A pressure/vacuum sensor and method, comprising: driving a MEMS piezoresistive resonator (8) into resonant vibration, applying Joule heating to the resonator (8); and sensing a variable parameter that varies in response to the tendency of the resonant frequency (fo) to depend upon the temperature of the resonator (8), the temperature thereof depending upon the pressure. The variable parameter may be the resonant frequency of the resonator (8), or a change therein, or may be derived from a feedback loop, being for example a time integrated feedback signal (82) or a reading (94) of the sense current (22), the loop keeping the resonant frequency constant in opposition to the above mentioned tendency. A reference MEMS capacitive resonator (62) may be located in the vicinity of the resonator (8) for compensating purposes.

Abstract: A method for manufacturing a Micro-Electro-Mechanical System pressure sensor, including forming a gauge wafer including a diaphragm and a pedestal region. The method includes forming an electrical insulation layer disposed on a second surface of the diaphragm region and forming a plurality of sensing elements patterned on the electrical insulation layer disposed on the second surface in the diaphragm region, forming a cap wafer with a central recess in an inner surface and a plurality of through-wafer embedded vias made of an electrically conductive material in the cap wafer, creating a sealed cavity by coupling the inner recessed surface of the cap wafer to the gauge wafer, such that electrical connections from the sensing elements come out to an outer surface of the cap wafer through the vias, and attaching a spacer wafer with a central aperture to the pedestal region with the central aperture aligned to the diaphragm region.

Abstract: A pressure sensing element may include a diaphragm and a stepped cavity. The pressure sensing element may include a plurality of piezoresistors, which are operable to generate an electrical signal based on an amount of deflection of the diaphragm in response to a sensed pressure of the fluid. The pressure sensing element may be mounted onto a housing substrate using an adhesive so that a portion of the adhesive is attached to walls of a first cavity and to a step surface of the stepped cavity to redistribute thermally induced stresses on the pressure sensing element. The stepped cavity may be included in a MEMS pressure sensing element to reduce or eliminate thermal noise, such as temperature coefficient of offset voltage output (TCO).

Abstract: The present disclosure relates to sensors including pressure sensors. In some cases, the pressure sensor may include a membrane or diaphragm, multiple sense elements connected to one another in a bridge configuration and positioned on the membrane, and an amplifier coupled to an output of the bridge configuration and having an output, where the diaphragm, sense elements and amplifier may be formed on a singled substrate or formed integrally therewith, or both. In one example, the pressure sensor may sense a particular range of pressures applied to the sensor, and/or may include an amplifier that has a selectable gain for amplifying an output of the bridge.

Abstract: A gage pressure transducer comprising a first pressure sensing assembly exposed to a main pressure and a second pressure sensing assembly exposed to a reference pressure. The pressure sensing assemblies comprise half-bridge sensors and means for using an alignment glass plate with each sensor which reduces the amount of oil required for operation, which consequently reduces the back pressures caused by large volumes of oil. The pressure sensor assemblies are hermetically sealed using glass frits, therefore enabling the gage pressure transducer to robustly and accurately measure pressure in harsh environments.

Abstract: A pressure transducer comprising a corrosion resistant metal diaphragm, having an active region, and capable of deflecting when a force is applied to the diaphragm; and a piezoresistive silicon-on-insulator sensor array disposed on a single substrate, the substrate secured to the diaphragm, the sensor array having a first outer sensor near an edge of the diaphragm at a first location and on the active region, a second outer sensor near an edge of the diaphragm at a second location and on the active region, and at least one center sensor substantially overlying a center of the diaphragm, the sensors connected in a bridge array to provide an output voltage proportional to the force applied to the diaphragm. The sensors are dielectrically isolated from the substrate.

Abstract: A system for measuring a multiplicity of pressures as those experienced by a model in a wind tunnel is depicted. The system includes individual sensor devices which are connected to an electronics module. The sensors may be connected to the electronics module via a cable in a first embodiment. In an alternate embodiment, the sensors may be connected to the electronics module via a mating connector located therebetween. A memory component which stores compensation coefficients associated with each of the sensors may also be included in the system to correct errors associated with each sensor. The advantage of the various embodiments is that each sensor does not have any compensation stored thereon and thus, the sensors can be made very small to operate at very high temperatures without any loss of accuracy.

Abstract: A piezoresistive sensor chip element of a pressure sensor has lower face with an outer edge, an adhesion area and a non-adhesion area. The chip has a closed chip cavity for measuring the pressure of a medium flowing around the chip. The upper face of a substrate is fastened only at the adhesion area of the chip. The non-adhesion area extends at least over a circular area arranged centrally on the lower face and covers a third of the lower face's total area and extends over at least one connection area from the circular area to the edge of the lower face. The pressure in the pressure medium can spread through the connection area into a space under the non-adhesion area on the element lower face. The substrate has a recess located centrally under the sensor chip element.

Abstract: There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO2.

Abstract: A method for attaching a first carrier device to a second carrier device includes forming at least one first bond layer and/or solder layer on a first exterior of the first carrier device, a partial surface being framed by the at least one first bond layer and/or solder layer, and placing the first carrier device on the second carrier device and fixedly bonding or soldering the first carrier device to the second carrier device. The at least one first bond layer and/or solder layer includes a first cover area which is larger than a first contact area.

Abstract: In device for side impact recognition in a vehicle, at least one pressure sensor system that produces a signal is provided in a side part of the vehicle, and an evaluation circuit is provided that recognizes a side impact as a function of the signal. In addition, a test device is provided for the at least one pressure sensor system, the at least one test device being configured such that the at least one test device oversamples the signal and then filters it in order to produce a test signal, the test device comparing the signal with a reference value and, as a function of this comparison, recognizing the operability of the at least one pressure sensor system.

Abstract: A piezoresistive sensor chip element of a pressure sensor has lower face with an outer edge, an adhesion area and a non-adhesion area. The chip has a closed chip cavity for measuring the pressure of a medium flowing around the chip. The upper face of a substrate is fastened only at the adhesion area of the chip. The non-adhesion area extends at least over a circular area arranged centrally on the lower face and covers a third of the lower face's total area and extends over at least one connection area from the circular area to the edge of the lower face. The pressure in the pressure medium can spread through the connection area into a space under the non-adhesion area on the element lower face. The substrate has a recess located centrally under the sensor chip element.

Abstract: A semiconductor device includes a substrate including a cavity and a first material layer over at least a portion of sidewalls of the cavity. The semiconductor device includes an oxide layer over the substrate and at least a portion of the sidewalls of the cavity such that the oxide layer lifts off a top portion of the first material layer toward a center of the cavity.

Abstract: A general pressure sensor for an automobile comprising a sensor shell, a silicon piezoresistive sensitive core, a sensor core seat, a signal conditioning circuit, and an automobile electric device interface is disclosed. The silicon piezoresistive sensitive core, the sensor core seat and the signal conditioning circuit are disposed in the inner cavity of the sensor housing. The sensor housing is installed to the automobile electric device interface, and the silicon piezoresistive sensitive core comprises a silicon piezoresistive sensitive element and a glass ring sheet. The silicon piezoresistive sensitive element is welded and fixed to a surface of the glass ring sheet. An insulation oxidation layer is formed on one surface of the glass ring sheet and the silicon piezoresistive sensitive element. The other surface of the glass ring sheet is hermetically fixed to the ring-shape recession surface provided on the sensor core seat.

Abstract: A preloaded pressure sensor module (PPSM) is disclosed, where the PPSM outputs a linear Conductivity Response versus Pressure Force input. The PPSM has a convex or concave profile which is prepared by pressing a flat pressure sensor device onto to a convex or concave base respectively so that the pressure sensitive layer inside the sensor module is bent and displays a preloaded effect.

Abstract: A very robust sensor element for an absolute-pressure measurement is described, which is suitable for high temperatures and able to be miniaturized to a large extent. The micromechanical pressure-sensor element includes a sensor diaphragm having a rear-side pressure connection and at least one dielectrically insulated piezo resistor for signal acquisition. Furthermore, the pressure-sensor element has a front-side reference volume, which is sealed by a cap structure spanning the sensor diaphragm. The cap structure is realized as thin-film structure.

Abstract: A bending transducer for generating electrical energy from deformations includes at least: one deformable support device, on which a first connecting electrode and a second connecting electrode are formed, one piezoelectric element attached to the support device having a least one first electrode and one second electrode, the first connecting electrode being contacted with the first electrode of the piezoelectric element, and the second connecting electrode being contacted with the second electrode of the piezoelectric element. The first connecting electrode and/or the second connecting electrode are applied as a structured conductive layer to the support device in at least some areas.

Abstract: The innovations herein include a compact sensing device that is capable of measuring the conditions (e,g, pressure, temperature) inside a cylinder of an internal combustion engine. Aspects also include a cost-effective method of fabricating the sensing device. An exemplary sensing device includes a substrate, a beam, and piezo-resistive sensing elements. The beam, which is formed on the substrate, is capable of deflecting according to different pressures applied to different beam surfaces. The piezo-resistive sensing elements are coupled to the beam and detect beam deflection. The piezo-resistive sensing elements generate an electrical signal corresponding to the beam deflection.

Abstract: An absolute piezo-resistive pressure sensor system and method employing multiple pressure sensing elements operating simultaneously to detect pressure. Both pressure sensing elements being subject to a common reference pressure within a sealed cavity. The first pressure sensing element detecting an offset voltage resulting from the progressive release of mechanical stress at an assembly interface between the sensing element and a base plate on which the sensing elements are assembled. Electronic circuitry compensates the pressure measured by the second pressure sensing element based on the offset voltage detected by the first pressure sensing element.

Abstract: A pressure sensor micromachined by using microelectronics technologies includes a cavity hermetically sealed on one side by a silicon substrate and on the other side by a diaphragm that is configured to be formed under the effect of the pressure outside the cavity. The sensor includes at least one resistance strain gage fastened to the diaphragm and has resistance that varies as a function of the deformation of the diaphragm. The diaphragm is fastened to the resistance strain gages. The gages are located inside the sealed cavity. The diaphragm has an insulting layer deposited on a sacrificial layer and may cover integrated measurement circuits in the silicon substrate.

Abstract: Pressure sensors having a topside boss and a cavity formed using deep reactive-ion etching (DRIE) or plasma etching. Since the boss is formed on the topside, the boss is aligned to other features on the topside of the pressure sensor, such as a Wheatstone bridge or other circuit elements. Also, since the boss is formed as part of the diaphragm, the boss has a reduced mass and is less susceptible to the effects of gravity and acceleration. These pressure sensors may also have a cavity formed using a DRIE or plasma etch. Use of these etches result in a cavity having edges that are substantially orthogonal to the diaphragm, such that pressure sensor die area is reduced. The use of these etches also permits the use of p-doped wafers, which are compatible with conventional CMOS technologies.

Abstract: An enclosed, flat covered leadless pressure sensor assembly suitable for extreme environment operation including dynamic, ultra-high temperature heating, light and heat flash, and high-speed, flow-related environments. The pressure sensor assembly comprises a substrate comprising a micromachined sensing diaphragm defined on a first side. A cover is attached to the first side of the substrate such that it covers at least the sensing diaphragm. The top surface of the cover is substantially flat, thereby promoting uniformity in the distribution of stress and thermal effects across a top surface of the cover.

Abstract: Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.

Abstract: A micro-deformable piezoresistive material is provided, including a hard plastic body, a micro-deformable rough texture surface, and a plurality of conductive particles. The micro-deformable rough texture surface is formed on a side of the hard plastic body, wherein the maximum deformation of the rough texture surface is far less than the thickness of the hard plastic body. Additionally, the conductive particles are evenly dispersed in the plastic body.

Abstract: A media isolated pressure sensor is disclosed that helps improve performance and reduce cost. In one illustrative embodiment, a pressure sensor may include a carrier having one or more holes defined therein. The carrier may be coupled to a diaphragm on one side, and a pressure sensing die on the other, with the pressure sensing die in fluid communication with the hole in the carrier. The carrier, diaphragm and pressure sense die may form a transfer fluid cavity, which is filled with a pressure transfer fluid. An input pressure from a media to be sensed may be provided to the diaphragm, which transmits the pressure to the pressure sensing die via the pressure transfer fluid. The pressure sensing die remains isolated from the media to be sensed.

Abstract: A method and apparatus are described for fabricating an exposed differential pressure sensor (30) which protects interior electrical components (37) formed on a topside surface of a differential pressure sensor transducer die (31) from corrosive particles using a molding compound (39), but which vents both sides of a piezoresistive transducer sensor diaphragm (33) through a first vent hole (42) formed in an exposed die flag (36) and a second vent hole (38) formed in an exposed cap structure (33), enabling the sensor diaphragm (33) to sense differential pressure variations directly or indirectly through a protective gel.

Abstract: A pressure guiding bump is configured on the center of a pressure gauge to obtain a single “conductivity--pressure” curve feature which is independent from any position wherever a pressure is applied on the guiding bump. When a pressure is applied, the guiding bump guides the pressure against a fixed deformable area to be deformed, whatever the pressure is, the deformed area is nearly a same area. The pressure gauge is extraordinarily adequate to be designed in a weighing machine with parallel connection in between them.

Abstract: A pressure transducer comprising a corrosion resistant metal diaphragm, having an active region, and capable of deflecting when a force is applied to the diaphragm; and a piezoresistive silicon-on-insulator sensor array disposed on a single substrate, the substrate secured to the diaphragm, the sensor array having a first outer sensor near an edge of the diaphragm at a first location and on the active region, a second outer sensor near an edge of the diaphragm at a second location and on the active region, and at least one center sensor substantially overlying a center of the diaphragm, the sensors connected in a bridge array to provide an output voltage proportional to the force applied to the diaphragm. The sensors are dielectrically isolated from the substrate.

Abstract: In a pressure sensing element made of piezoresistors formed into a silicon substrate, thermally-induced stresses on the piezoresistors and thermally-induced voltage offsets can be reduced by thinning the substrate prior to forming the resistors and then forming the resistors into the thinned-out recess. Forming a circular or disk-shaped recess in the substrate and then forming the resistors therein is believed to cause thermally-induced stresses to be evenly distributed and/or cancelled out on all four piezoresistors of a Wheatstone bridge circuit.

Abstract: A pressure sensor is disclosed that may include a minimum amount of fluid coupling packaging. In one illustrative embodiment, a pressure sensor assembly may include a pressure sensor die having a front side and a back side, and a pressure sensing diaphragm. The pressure sensor assembly may further include a housing having a mounting side and a sensing side. The sensing side may define a pressure port. The pressure sensor die may be secured to the housing such that the pressure sensing diaphragm is exposed to the pressure port, and such that front side of the pressure sense die is accessible from outside of the housing.

Abstract: A piezoresistive sensor device and method for making the same are disclosed. The device comprises a silicon wafer having piezoresistive elements and contacts in electrical communication with the elements. The device further comprises a contact glass coupled to the silicon wafer and having apertures aligned with the contacts. The device also comprises a non-conductive frit for mounting the contact glass to a header glass, and a conductive non-lead glass frit disposed in the apertures and in electrical communication with the contacts. The method for making the device comprises bonding a contact glass to a silicon wafer such that apertures in the glass line up with contacts on the wafer, and filling the apertures with a non-lead glass frit such that the frit is in electrical communication with the contacts. The use of a lead free glass frit prevents catastrophic failure of the device in ultra high temperature applications.

Abstract: A gauge includes a housing and a fitting having an inlet, an internal flow path, and an outlet. A sensor is in fluidic communication with the internal flow path and measures a characteristic of a fluid in the flow path. A control unit is in electrical communication with the pressure sensor, receives an output from the pressure sensor and generates a command based on the output received. A stepper motor has a rotor shaft with an indicator needle operatively connected thereto, and is in electrical communication with the control unit. A power supply is in electrical communication with the pressure sensor, the motor and the control unit for supplying power thereto. The control unit transmits the command to the stepper motor, which receives the command from the control unit and drives the rotor shaft according to the command, displaying the sensed characteristic via the needle.

Abstract: There are provided embodiments of a sensing device that comprise a sensing element, a substrate, and a bonding element, each being selected for environments that utilize caustic working fluids such as automotive fuel. Material for use as the bonding element can form molecular bonds with ceramics and glass. In one embodiment, the sensing device comprises a receptacle or cavity, in which are located the sensing element and the bonding element. This configuration facilitates the formation of bonds between the bonding element and each of the sensing element and a peripheral wall of the cavity. Such bonds are configured in a tensile bonding area and a shear bonding area, the combination of which is useful to secure the sensing element in the cavity. The sensing device can further comprise a seal such as an o-ring disposed in annular relation to the substrate to seal the sensing device to a peripheral device such as a fluid fitting, which may be found in a fuel system of an automobile.

Abstract: Pressure sensors having components with reduced variations due to stresses caused by various layers and components that are included in the manufacturing process. In one example, a first stress in a first direction causes a variation in a component. A second stress in a second direction is applied, thereby reducing the variation in the component. The first and second stresses may be caused by a polysilicon layer, while the component may be a resistor in a Wheatstone bridge.

Abstract: A pressure sensor is disclosed that can help isolate the sensor and/or sensor components from a media to be sensed and/or can help reduce sensor damage caused by harsh operating environments. In one illustrative embodiment, the pressure sensor may include a substrate having a pressure sensing die mounted on a first side of the substrate, a first housing member defining a first cavity around the pressure sensing die, and a second housing member defining a second cavity on the second side of the substrate. A passivating agent, such as a gel, can be positioned in both the first cavity and the second cavity to transmit pressure from the media to a pressure sensing element (e.g. diaphragm) while isolating the pressure sensing element and other components from the media. In some cases, the first housing member and/or the second housing member may include an opening for exposing the passivating agent to the media.

Abstract: A media isolated pressure sensor is disclosed that helps improve performance and reduce cost. In one illustrative embodiment, a pressure sensor may include a carrier having one or more holes defined therein. The carrier may be coupled to a diaphragm on one side, and a pressure sensing die on the other, with the pressure sensing die in fluid communication with the hole in the carrier. The carrier, diaphragm and pressure sense die may form a transfer fluid cavity, which is filled with a pressure transfer fluid. An input pressure from a media to be sensed may be provided to the diaphragm, which transmits the pressure to the pressure sensing die via the pressure transfer fluid. The pressure sensing die remains isolated from the media to be sensed.

Abstract: Methods and devices for adhesively bonding a sensor die to a substrate are described. In some cases, a sensor assembly may include a pressure sensor die mounted to a substrate with an adhesive. The pressure sensor die may be fabricated to include a back-side having one or more adhesion features (e.g. recesses or indentations), which increase the surface area of the pressure sensor die that is in contact with the adhesive, to thereby increase the adhesion force therebetween. In some cases, the one or more adhesion features may define a non-planar interface between the pressure sensor die and the adhesive which, in some instances, may reduce the formation and/or propagation of cracks in the adhesive, which also may help increase the adhesion force therebetween.

Abstract: There is disclosed a flat planar pressure transducer which comprises a planar insulative substrate of a rectangular configuration. Disposed on the substrate is an array of conductive areas which extend from a contact terminal area of said substrate to an end of the substrate. There is a leadless sensor module positioned at said contact terminal area, with the contacts of said leadless sensor contacting contact terminals of said contact terminal area. The leadless sensor is enclosed by an enclosure which is coupled to the substrate and surrounds the sensor. The enclosure has a screen positioned on the top surface to prevent particles from entering or damaging the leadless sensor. The above-noted structure forms a very flat, compact pressure transducer which can be utilized in lieu of flex circuit type devices and provides greater mechanical stability as well as a more accurate output.

Abstract: A relative pressure sensor includes: a pressure measuring transducer having a measuring membrane of a semiconductor chip and a platform, wherein, between both of these, a reference pressure chamber is formed; a support body, connected with the platform by means of a pressure-bearing adhesion, wherein a reference pressure path extends through the two former elements into the reference pressure chamber; and a sensor outer body, in which a transducer chamber with a first opening and a second opening is formed. The pressure measuring transducer is brought into the transducer chamber through the first opening, and is held therein by means of the support body. The support body pressure-tightly seals the first opening, and a side of the measuring membrane facing away from the reference pressure chamber is contactable with the media pressure through the second opening.

Abstract: It is an object of the present invention to provide a pressure transducer having a header wherein the header is comprised of a first section and a second section that are offset from each other. Each first and second section has a flexible diaphragm adapted to receive a first and second pressure, respectively. A central channel connects the diaphragms and a pressure sensor, located within the central channel, communicates with the channel and produces an output equal to the difference between the first and second pressures. The resultant device is a low differential pressure transducer which enables one to bring leads from the sensor out while having diaphragms of substantially the same size and diameter, therefore enabling the diaphragms to exhibit the same back pressure and be equally compliant.

Abstract: Dual piezoresistive transducers formed into a single silicon die, are anodically bonded to a pedestal. Two separate pressure ports extend through a plastic housing. The port openings inside the housing are surrounded by a groove having a shape and size that accepts the pedestal. A thin, liquid adhesive is deposited into the groove and allowed to level out. The pedestal is placed into the adhesive and embeds itself therein. Adhesive overflow into the ports is avoided by dimensioning the groove and depositing an amount of adhesive that will fill the groove but not overflow when the pedestal is placed therein. Once the adhesive cures, the adhesive bond strength is greater due to the adhesive being in shear relative to the groove side walls and pedestal sidewalls. The grooved structure provides an apparatus and methodology for precise die mounting and media sealing.