Piezoresistive Patents (Class 73/727)
  • Patent number: 7398693
    Abstract: The present invention generally relates to methods for the rapid thermal processing (RTP) of a substrate. Embodiments of the invention include controlling a thermal process using either a real-time adaptive control algorithm or by using a control algorithm that is selected from a suite of fixed control algorithms designed for a variety of substrate types. Selection of the control algorithm is based on optical properties of the substrate measured during the thermal process. In one embodiment, a combination of control algorithms are used, wherein the majority of lamp groupings are controlled with a fixed control algorithm and a substantially smaller number of lamp zones are controlled by an adaptive control algorithm.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: July 15, 2008
    Assignee: Applied Materials, Inc.
    Inventors: Joseph Michael Ranish, Tarpan Dixit, Dean Jennings, Balasubramanian Ramachandran, Aaron Hunter, Wolfgang Aderhold, Bruce Adams, Wen Teh Chang
  • Patent number: 7392710
    Abstract: The flow meter probe with force sensors has the body of a frustum of a regular pyramid with a force sensor disposed upon each face. The force sensors are mounted in bores defined in the probe body and include a pin that may be displaced in the bore to exert pressure on an electrical transducer. The transducer may be a ceramic, piezoelectric sensor or a Micro-Electro-Mechanical System (MEMS) sensor. The pin has an aerodynamically- or hydrodynamically-shaped head, a cylindrical body, and a frustoconical tail to concentrate force exerted upon the sensor. The head of the pin protrudes slightly above the face of the probe body so that aerodynamic and hydrodynamic forces are exerted directly against the pin, and pin displacement measures the forces directly. A plurality of probes may be placed in the path of fluid flow in a variety of configurations, as desired.
    Type: Grant
    Filed: January 9, 2007
    Date of Patent: July 1, 2008
    Assignee: King Fahd University of Petroleum and Minerals
    Inventors: Rached Ben-Mansour, Muhammad A. Hawwa
  • Patent number: 7392687
    Abstract: A piezoresistive pressure sensor test sample is first provided, and a zero offset of the piezoresistive pressure sensor test sample is measured. Subsequently, a stress deviation corresponding to the zero offset is calculated. Thereafter, at least a piezoresistive pressure sensor under the same process condition as the piezoresistive pressure sensor test sample is formed. When forming the piezoresistive pressure sensor, at least a stress-adjusting thin film is formed on at least a surface of the piezoresistive pressure sensor to calibrate the zero offset of the piezoresistive pressure sensor.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: July 1, 2008
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Ter-Chang Huang, Hung-Yi Lin, Wen-Syang Hsu
  • Publication number: 20080127741
    Abstract: A MEMS based pressure sensor for flow measurements includes a pressure sense die located between a media seal and a conductive seal. Such a system includes a pressure sense die located between a media seal and a conductive seal. A sensing diaphragm is generally associated with the pressure sense die, wherein the sensing diaphragm deflects when a pressure is applied thereto. An impedance circuit is generally embedded with one or more resistors on the sensing diaphragm to which the pressure to be detected is applied. An ASIC is generally associated with the impedance circuit and the sense die, wherein the ASIC is placed on a lead frame for signal conditioning in order to detect a change in the pressure.
    Type: Application
    Filed: December 4, 2006
    Publication date: June 5, 2008
    Inventors: Thirumani A. Selvan, Saravanan Sadasivan
  • Publication number: 20080115584
    Abstract: A fluid sensor is provided for determining a fluid characteristic, having an electronic sensor element that has an active surface for determining the fluid characteristic, having a mounting plate associated with the sensor element, and having a filter device associated with the sensor element for filtering the fluid, in which the active surface of the sensor element is oriented toward the mounting plate and in which the mounting plate is provided with an opening opposite from the active surface of the sensor element. According to an embodiment the invention, an end region of the filter device is accommodated in a sealed fashion in the opening of the mounting plate. Furthermore, the fluid sensor can be used for tire pressure measurement.
    Type: Application
    Filed: October 11, 2007
    Publication date: May 22, 2008
    Inventor: Dieter Mutz
  • Patent number: 7343808
    Abstract: A pressure transducer apparatus including: first and second pluralities of piezoresistors each coupled in Wheatstone bridge configurations, wherein the bridges are coupled together to provide a first output being indicative of a differential pressure; and, a third plurality of piezoresistors coupled in a Wheatstone bridge configuration and being suitable for providing a second output being indicative of an absolute line pressure. A compensator may be employed for adjusting the first output for line pressure variation responsively to the second output.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: March 18, 2008
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Louis DeRosa
  • Patent number: 7337675
    Abstract: A method for measuring average velocity pressure of a stack comprises the following steps. First, a total pressure measuring device is provided. The total pressure measuring device then measures the total pressure at a first location in the stack. Next, physical parameters comprising a distance between the first location and an outlet of the stack, a diameter and shape thereof are obtained. A formula of a static pressure and the average velocity pressure between the outlet and the first location is obtained by comparing the physical parameters to known fluid mechanics data. Finally, the average velocity pressure is obtained from the formula and the total pressure.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: March 4, 2008
    Assignee: Industrial Technology Research Institute
    Inventor: Chien-Ping Huang
  • Patent number: 7331236
    Abstract: A sensor and insertion assembly 2 is used for intravascular measurement of pressure in a living body. The assembly includes, a sensor chip 6 having a substrate body 8 with a recess covered by a pressure sensitive film 10 thereby forming a cavity 12. A piezoelectric element, preferably in the form of a piezoelectric film 14, is arranged in connection with the pressure sensitive film, and energy is applied to the piezoelectric element such that acoustic waves are generated in the element. The piezoelectric element is arranged to generate an output signal, representing the pressure at the film, in dependence on the measured properties of the acoustic waves related to the deflection of the pressure sensitive film.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: February 19, 2008
    Assignee: Radi Medical Systems AB
    Inventors: Leif Smith, Sauli Tulkki
  • Publication number: 20070289388
    Abstract: A pressure transducer includes a diaphragm, having an active region, and capable of deflecting when a force is applied to the diaphragm; and a sensor array disposed on a single substrate, the substrate secured to the diaphragm, the sensor array having a first outer sensor near an edge of the diaphragm at a first location and on the active region, a second outer sensor near an edge of the diaphragm at a second location and on the active region, and at least one center sensor substantially overlying a center of the diaphragm, the sensors connected in a bridge array to provide an output voltage proportional to the force applied to the diaphragm. The sensors are dielectrically isolated from the substrate.
    Type: Application
    Filed: June 15, 2006
    Publication date: December 20, 2007
    Inventor: Anthony D. Kurtz
  • Patent number: 7287433
    Abstract: A pressure sensor for detecting a pressure and for outputting a signal based on the piezoresistance effect includes a substrate having a sensor chip on one side in a thin portion and a concave portion on another side, a piezo-resistor in the sensor chip, a pedestal being attached to the substrate and having a through hole for introducing the pressure to the sensor chip and a gel material filled in the concave portion and the through hole for protecting the sensor chip. A ratio of a diameter of the through hole to a thickness of the pedestal is substantially within a range between 1 and 3.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: October 30, 2007
    Assignee: DENSO CORPORATION
    Inventor: Hiroaki Tanaka
  • Patent number: 7284438
    Abstract: A method and system of providing power to a pressure and temperature sensing element is provided. Polarity switching is added to a current source for a sensor, which includes one piezo-resistive sensing element configured as a single implant square located at an edge of a diaphragm of the element, and which produces pressure and temperature outputs. The piezo-sensing element operates as a piezo-resistive radial element when current is conducted through the element radially with respect to the diaphragm. Conversely, the piezo-sensing element operates as a piezo-resistive tangential element when current is conducted through the element tangentially to the edge of the diaphragm. A difference in the radial and tangential resistances is proportional to an applied pressure, while a sum of the resistances is a function of temperature. By alternating the polarity of power applied to the sensor, a build up of ions resulting from PUD is minimized.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: October 23, 2007
    Assignee: Honeywell International Inc.
    Inventor: Thomas G. Stratton
  • Patent number: 7284440
    Abstract: A pressure transducer apparatus including: first and second pluralities of piezoresistors each coupled in Wheatstone bridge configurations, wherein the bridges are coupled together to provide a first output being indicative of a differential pressure; and, a third plurality of piezoresistors coupled in a Wheatstone bridge configuration and being suitable for providing a second output being indicative of an absolute line pressure. A compensator may be employed for adjusting the first output for line pressure variation responsively to the second output.
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: October 23, 2007
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Louis DeRosa
  • Patent number: 7278319
    Abstract: A pressure and sensing element is provided that includes one piezo-resistive sensing element configured as a single light implant square, and may produce outputs relating to both a pressure and temperature that has been sensed. The piezo-sensing element may operate as a piezo-resistive radial element when a constant current is conducted through the element in the radial direction with respect to the diaphragm. Conversely, the piezo-sensing element may operate as a piezo-resistive tangential element when a constant current is conducted through the element in the tangential direction to the edge of the diaphragm. A difference in the radial and tangential resistances and a corresponding difference in voltage drop are proportional to an applied pressure, while a sum of the same two resistances is a function of temperature.
    Type: Grant
    Filed: November 10, 2005
    Date of Patent: October 9, 2007
    Assignee: Honeywell International Inc.
    Inventor: Russell L. Johnson
  • Patent number: 7260994
    Abstract: A pressure sensing apparatus including a thin disc of a metal having a ceramic material layer and piezoresistive elements formed thereon. A surface of the disc is bonded to a diaphragm assembly on a pressure port base constructed of a low cost metal. The bonding process is performed at low temperatures, (<700° C.), so that the diaphragm assembly and pressure port do not require high temperature corrosion resistance, and can thus be formed of less expensive materials. The inventive apparatus provides a lower cost alternative to conventional high pressure sensors since less material is used, less expensive materials are used, and fabrication is less complex. The inventive apparatus is also more reliable and exhibits greater thermal stability than conventional high pressure sensors.
    Type: Grant
    Filed: November 3, 2005
    Date of Patent: August 28, 2007
    Assignee: Honeywell International Inc.
    Inventors: Reza Oboodi, James Piascik
  • Patent number: 7252008
    Abstract: A micromechanical piezoresistive pressure sensor device having a sensor substrate, in which an essentially rectangular diaphragm region is provided; a piezoresistive resistance device having at least one piezoresistive resistor strip, which runs parallel to the longitudinal edges of the diaphragm device across the entire length of the diaphragm device and onto the surrounding sensor substrate; the piezoresistive resistor strip having a narrow center region and widened end regions and the widened end regions running across the short edges of the diaphragm device.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: August 7, 2007
    Assignee: Robert Bosch GmbH
    Inventors: Joerg Muchow, Hubert Benzel
  • Patent number: 7231828
    Abstract: A high temperature pressure sensing system (transducer) including: a pressure sensing piezoresistive sensor formed by a silicon-on-insulator (SOI) process; a SOI amplifier circuit operatively coupled to the piezoresistive sensor; a SOI gain controller circuit including a plurality of resistances that when selectively coupled to the amplifier adjust a gain of the amplifier; a plurality of off-chip contacts corresponding to the resistances, respectively, for electrically activating the corresponding resistances and using a metallization layer for the SOI sensor and SOI ASIC suitable for high temperature interconnections (bonding); wherein the piezoresistive sensor, amplifier circuit and gain control circuit are suitable for use in environments having a temperature greater than 175 degrees C. and reaching between 250° C. and 300° C., and wherein the entire transducer has a high immunity to nuclear radiation.
    Type: Grant
    Filed: September 23, 2005
    Date of Patent: June 19, 2007
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Wolf S. Landmann, Alexander A. Ned
  • Patent number: 7159466
    Abstract: In a piezo resistance type semiconductor device, a detecting sensitivity and output linearity are improved without increasing a forming region of a diaphragm. In a piezo resistance type semiconductor device having: a diaphragm; a supporting frame which is connected to an external periphery of the diaphragm, supports the diaphragm, and is formed relatively thicker than the diaphragm; and piezo resistance type stress detectors (4a, 4b) each for detecting a stress caused when the detector is distorted by deformation of the diaphragm by application of an acceleration or a pressure in the direction perpendicular to the diaphragm, at least a part of the diaphragm is cut off in a position where it is come into contact with the piezo resistance type stress detector and a groove is formed.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: January 9, 2007
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shin Hasegawa, Kazuo Kokumai
  • Patent number: 7152482
    Abstract: A piezoelectric sensor arranged so as to includes: a transparent piezoelectric element having a piezoelectric property; and a pair of transparent conductor film layers opposed to each other with the piezoelectric element therebetween, the transparent piezoelectric element and the transparent conductor film layers are formed between a pair of transparent substrates, opposed to each other, which serve as pressure transmission means. Consequently, the transparent piezoelectric sensor has an excellent durability. A piezoelectric sensor comprises a piezoelectric element with a piezoelectric property which is made of a piezoelectric material having no Curie point and has a dipole orientation degree of not less than 75%. Consequently, the piezoelectric sensor having an excellent durability and a simple structure is provided at low cost.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: December 26, 2006
    Assignee: National Institute of Advanced Industrial Science & Technology
    Inventors: Naohiro Ueno, Morito Akiyama, Hiroshi Tateyama
  • Patent number: 7127335
    Abstract: A method of estimating the airspeed of an aircraft during low airspeed conditions includes measuring a negative impact pressure using a pitot-static probe on the aircraft. Then, the method includes estimating a non-zero airspeed of the aircraft as a function of the measured negative impact pressure.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: October 24, 2006
    Assignee: Rosemount Aerospace Inc.
    Inventors: Tracey P. Tschepen, Zachary Alexander Caron
  • Patent number: 7073389
    Abstract: An electronic switch of the type uses a piezoresistive Wheatstone bridge configuration to sense pressure. The output of the Wheatstone bridge is applied to an electronic control circuit which contains a comparator. The comparator monitors the output of the bridge and if the output voltage of the bridge exceeds a predetermined value, as indicated by the comparator, a switch is closed to illuminate a lamp indicating to the operator that the pressure has been exceeded. One terminal of a resistor is connected to an output of the bridge. The other terminal of the resistor is coupled to a switch which when operated, causes the resistor to be connected in parallel with one of the arms of the bridge, thereby producing an imbalance of the bridge.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: July 11, 2006
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Wolf S. Landmann
  • Patent number: 7051595
    Abstract: A monolithic multi-functional integrated sensor and method for making the monolithic multi-functional integrated sensor. The monolithic multi-functional integrated sensor includes: a pressure sensor including a plurality of piezoresistors having resistance values which vary with a change in external pressure, the piezoresistors being disposed in a direction so as to be subject to a piezoresistive effect produced by the external pressure at or beyond a predetermined first level; and a temperature sensor including a resistor having a resistance value which varies with a change in temperature, the resistor being disposed in a direction so as to be subject to a piezoresistive effect produced by the external pressure below a predetermined second level.
    Type: Grant
    Filed: June 13, 2005
    Date of Patent: May 30, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-wook Kwon, Jong-hwa Won
  • Patent number: 7034700
    Abstract: An electronic single pole double throw switch has two states. In each state, one of the lamps is on and the other lamp is off. In the electronic switch, the voltage, which is at the output terminal of the lamp that is off is utilized to drive a low voltage regulator which operates electronic circuitry associated with the electronic switch.
    Type: Grant
    Filed: February 11, 2004
    Date of Patent: April 25, 2006
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Wolf S. Landmann, Richard Martin
  • Patent number: 6993974
    Abstract: A sensor and guide wire assembly (21; 31; 41) for intravascular measurements of physiological variables in a living body includes a core wire (22; 32; 42) and sensor element (23; 33; 43). The sensor element (23; 33; 43) includes basically a mounting base (24; 34; 44) and a pressure sensitive end portion (25; 35; 45) whose upper side is provided with a pressure sensitive device, such as a membrane (26; 36; 46). The mounting base (24; 34; 44) extends downwards from the end opposite to the pressure sensitive end (25; 35; 45), such that, when the sensor element (23; 33; 43) is mounted on the core wire (22; 32; 42), a clearance (27; 37; 47) is formed below the pressure sensitive end (25; 35; 45).
    Type: Grant
    Filed: July 2, 2003
    Date of Patent: February 7, 2006
    Assignee: Radi Medical Systems AB
    Inventors: Lars Tenerz, Mattias Tullberg
  • Patent number: 6978678
    Abstract: The invention relates to a pressure sensor comprising a sensor element (2) having a flat membrane (4) which is transformed at its edge into a hollow-cylindrical ring (6) so that a central recess (20) is provided at the lower side (10) of the membrane (4). On the upper side (8) of the membrane (4) a resistance arrangement consisting of electric resistors is disposed. A sleeve (54) projects into the recess (20) and supports a first elastomeric sealing ring (66) which is tightly arranged at the circumferential area of the recess (20). Furthermore the sleeve (54) supports a second elastomeric sealing ring (68) which serves for sealing at a feeding tube for pressure fluid formed in a component part to which the pressure sensor is mountable. The sleeve (54) is rigidly connected to a disk (56) which is attached with its outer edge (58) to a casing (26) enclosing the sensor element (2).
    Type: Grant
    Filed: June 23, 2004
    Date of Patent: December 27, 2005
    Assignee: WIKA Alexander Wiegand GmbH & Co. KG
    Inventors: Franz-Josef Lohmeier, Joachim Ballmann, Andreas Trützler, Peter Fürst, Uwe Vonau, Jurgen Pleyer, Niki Speier
  • Patent number: 6973835
    Abstract: In manufacturing a pressure sensor a recess that will form part of the sensor cavity is formed in a lower silicon substrate. An SOI-wafer having a monocrystalline silicon layer on top of a substrate is bonded to the lower silicon substrate closing the recess and forming the cavity. The supporting substrate of the SOI-wafer is then etched away, the portion of the monocrystalline layer located above the recess forming the sensor diaphragm. The oxide layer of the SOI-wafer here acts as an “ideal” etch stop in the case where the substrate wafer is removed by dry (plasma) or wet etching using e.g. KOH. This is due to high etch selectivity between silicon and oxide for some etch processes and it results in a diaphragm having a very accurately defined and uniform thickness. The cavity is evacuated by forming a opening to the cavity and then sealing the cavity by closing the opening using LPCVD. Sensor paths for sensing the deflection of the diaphragm are applied on the outer or inner surface of the diaphragm.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: December 13, 2005
    Assignee: Silex Microsystems AB
    Inventors: Pelle Rangsten, Edvard Kalvesten, Marianne Mechbach
  • Patent number: 6962085
    Abstract: A pressure detector such as a combustion pressure sensor includes a pressure-sensitive element disposed in a cylindrical housing. Electrical signals responsive to pressure applied to the pressure-responsive element are generated in the element and led to output terminals through conductor patterns formed on the surface of a connecting member disposed between the pressure-responsive element and the output terminals. The conductor patterns may be formed in grooves formed on the surface of the connecting member. In place of the connecting member, a disc-shaped thin conductive member made of an anisotropiccally conductive material may be used.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: November 8, 2005
    Assignee: Denso Corporation
    Inventors: Teruo Oda, Inao Toyoda
  • Patent number: 6907789
    Abstract: A sensor package is disclosed. The sensor package includes a housing that has a recess and a sealing member epoxied within the recess of the housing. The housing also has small EDM holes to allow conductive output wires to feed through the housing. The sealing member provides a seal for the holes of the conductive outputs of the sensor package. The sensor package further includes a sensing die, which detects a pressure, and outputs an electrical signal through the output wires.
    Type: Grant
    Filed: May 6, 2002
    Date of Patent: June 21, 2005
    Assignee: Honeywell International Inc.
    Inventor: Joel J. Bodin
  • Patent number: 6883381
    Abstract: An acceleration sensor includes a deflectable pressure measuring diaphragm and a counter-structure, which is deflectable as against the pressure measuring diaphragm. The acceleration sensor includes a detection means for detecting a deflection of the pressure measuring diaphragm as against the counter-structure. Further, a test mass is connected to the pressure measuring diaphragm or the counter-structure in order to be deflected from an idle position depending on an acceleration applied. The deflection of the test mass results in a change of the distance between the pressure measuring diaphragm and the counter-structure, which is detectable by the detection means.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: April 26, 2005
    Assignee: Infineon Technologies AG
    Inventors: Stefan Kolb, Wolfgang Werner
  • Publication number: 20040168519
    Abstract: An entirely surface micromachined free hanging strain-gauge pressure sensor is disclosed. The sensing element consists of a 80 &mgr;m long H-shaped double ended supported force transducing beam (16). The beam is located beneath and at one end attached to a square polysilicon diaphragm (14) and at the other end to the cavity edge. The sensor according to the invention enables a combination of high pressure sensitivity and miniature chip size as well as good environmental isolation. The pressure sensitivity for the sensor with a H-shaped force transducing beam, 0.4 &mgr;m thick was found to be 5 &mgr;V/V/mmHg.
    Type: Application
    Filed: April 16, 2004
    Publication date: September 2, 2004
    Inventors: Edvard Kalvensten, Patrik Melvas, Goran Stemme
  • Patent number: 6782755
    Abstract: A surface-micromachined high-pressure sensor, formed by forming a cavity using a sacrificial layer. The sacrificial layer can be reflowed to make the edges of the cavity more rounded. The material that is used for the diaphragm can be silicon nitride, or multiple layers including silicon nitride and other materials. The pressure sensor is intended to be used in high pressure applications, e.g. pressure is higher than 6000, 10,000 or 30,000 P.S.I.
    Type: Grant
    Filed: July 6, 2001
    Date of Patent: August 31, 2004
    Assignees: California Institute of Technology, Schlumberger Technology Corporation
    Inventors: Yu-Chong Tai, Yong Xu, Fukang Jiang
  • Patent number: 6755084
    Abstract: In a pressure sensor in which a frame shaped protruding potion is formed on a surface side of a substrate by means of an etching process, and a blocking plate is connected to an upper part of the protruding portion, to form a standard pressure chamber, a recess is formed on at least one of the substrate and the blocking plate that constitute the standard pressure chamber, to increase the height of the standard pressure chamber, thereby preventing the lowering of pressure detection accuracy due to foreign substances within the standard pressure chamber.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: June 29, 2004
    Assignee: Hitachi Unisia Automotive, Ltd.
    Inventors: Masao Tsukada, Koichi Kusuyama
  • Patent number: 6745633
    Abstract: A pressure sensor 1′ comprising a housing 10′ having a pressure introduction hole 12, a pressure sensing element 22 composed of a semiconductor element having piezoresistance effect, a holder 30 having fixed thereto the pressure sensing element 22, a guide member 98, a seal member 99 and a connector case 70, the pressure sensor element 22 and holder 30 joined in airtight manner to create a reference pressure chamber 72. On the holder 30 of the pressure sensor body is mounted a circuit board 40 having electrode pads, the electrode pads connected to connectors 80 fixed to the connector case 70 via conductive spring bodies 50. The guide member 98 supports holder 30, and in the opening 100 of the guide member 98 is placed the seal member 99.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: June 8, 2004
    Assignee: Fujikoki Corporation
    Inventors: Keiji Sasaki, Hitoshi Nagase, Isao Okura
  • Publication number: 20040103723
    Abstract: A sensor (1) is provided in the region of the connecting socket (3) for the connecting cable (5) with an integrated identification unit (6) which can be electrically queried and contacted through a separate pole of the connecting cable (5), on the one hand, and through the cable shield of the connecting cable (5), on the other hand, whereby the sensitivity of the sensor (1) can be coded and queried from the outside via the connecting cable (5) by means of the identification unit (6).
    Type: Application
    Filed: September 17, 2003
    Publication date: June 3, 2004
    Inventor: Paul Kirschbaum
  • Patent number: 6742397
    Abstract: A high pressure sensor is provided with a single-piece pressure port machined from stainless steel and has no internal gaskets or seals. A housing surrounds the pressure port along a portion of its axial length. The housing and pressure port have mating configurations that prevent axial rotation when the pressure port is inserted into the assembled position in the housing. A retaining ring locks the pressure port axially with respect to the housing and is fixed in place by a fixative, such as epoxy.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: June 1, 2004
    Assignee: Invensys Sensor Systems
    Inventor: Gregory D. Parker
  • Patent number: 6742994
    Abstract: A reciprocating pump which is capable of detecting abnormalities in the sucking and discharging of fluid, such as the exhaustion of oil or the clogging of oil on the discharge side, by making use of detecting means which is inexpensive and relatively simple in structure and which can be operated without being detrimentally influenced by the bubbles that may be included in the fluid, while making it possible to minimize the noise generated by external vibrations. In this reciprocating pump, where the sucking and discharging of fluid are effected by making use of a reciprocating member, malfunction-detecting means formed of a piezoelectric element is provided for detecting a pressure fluctuation on a discharge side of the pump, and the pressure fluctuation of fluid being delivered from an discharging port is transmitted via a rigid pressure-receiving member to the piezoelectric element.
    Type: Grant
    Filed: May 9, 2002
    Date of Patent: June 1, 2004
    Assignee: Kioritz Corporation
    Inventors: Yoshiaki Hironaka, Tadashige Kondo, Kiyoshige Enomoto
  • Patent number: 6718829
    Abstract: The full bridge circuit in a pressure sensor including semiconductor piezoelectric resistive elements in a pressure detection structure is connected to a filter. That is, first and second output terminals of the full bridge circuit is connected to a capacitor. One end of the capacitor is connected to the first output terminal through a first resistor. The other end of the capacitor is connected to the second output terminal through a second resistor. In an exhaust system of an engine, the pressure of the exhaust gas is detected to detect clogging in the black smoke removing unit. The filter removes the pulsate component in the detection signal derived from the pulsate component in the exhaust gas.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: April 13, 2004
    Assignee: Denso Corporation
    Inventors: Hironobu Baba, Kazuyoshi Nagase, Yukihiro Kato
  • Patent number: 6698294
    Abstract: A pressure cell contains a base body (1), a membrane (2) that is arranged on the base body (1) and can be deformed by a pressure to be measured, as well as a first and a second temperature sensor. The second temperature sensor is spaced apart from the first temperature sensor in the direction of a temperature gradient. Temperature shocks of the measuring cell can be determined and compensated by monitoring the difference between the temperatures measured by the sensors or changes in the temperatures measured by a sensor.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: March 2, 2004
    Assignee: Vega Grieshaber KG
    Inventors: Joern Jacob, Ewald Boehler
  • Patent number: 6694818
    Abstract: A semiconductor sensor chip is interposed between a sensor case and a housing. A first pressure is introduced from the sensor case and applied to a rear surface of the sensor chip, while a second pressure is introduced from the housing and applied to a front surface of the sensor chip. The sensor chip detects a pressure difference between the first and the second pressures and converts it into an electrical signal. The sensor chip is hermetically mounted in a depressed portion formed in the sensor case by charging a sealing material from holes formed around the depressed portion. The charging holes are positioned between terminals electrically connecting the sensor chip to an outside circuit to avoid enlarging the pressure sensor size by forming the charging holes.
    Type: Grant
    Filed: July 16, 2001
    Date of Patent: February 24, 2004
    Assignee: Denso Corporation
    Inventors: Kenji Chikuan, Michitake Kuroda
  • Patent number: 6688182
    Abstract: A differential and absolute transducer are secured to a Pyrex glass header by means of a glass metal frit or other suitable interface. One of the sensors measures absolute pressure and the sensor is a sealed cavity, while the other sensor is designed to measure differential pressure and the sensor is an aperture which permits the pressure media to reach both sides of the sensor. The header itself has a through hole connected to a tube over which the differential sensor is affixed. The Pyrex glass is chosen to match the coefficient expansion of the sensors. The header in turn is attached to an adapter that enables static pressure to be applied to both sensors simultaneously and total pressure applied to the differential sensor, thus permitting the measurement of the difference between the total pressure and the static pressure.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: February 10, 2004
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Joseph Van De Weert
  • Patent number: 6686634
    Abstract: In an integrated pressure sensor including a semiconductor substrate having a p type single crystal silicon substrate and an n type epitaxial layer of which a portion is etched by electrochemical etching to have a diaphragm, an impurity diffusion layer piercing the n type epitaxial layer at least defining the diaphragm is formed for isolation. An etching wire is formed on the surface of the n type epitaxial layer with insulation and the first end of the etching wire extends to the inside of the surface and is connected to the n type epitaxial layer. The second opposite end extends to an edge of the semiconductor substrate. The etching wire does not cross the impurity layer inside the surface of the semiconductor substrate to prevent the etching wire from short-circuiting with the impurity diffusion layer during the electrochemical etching.
    Type: Grant
    Filed: August 16, 2002
    Date of Patent: February 3, 2004
    Assignee: Denso Corporation
    Inventor: Seiichiro Ishio
  • Publication number: 20030230147
    Abstract: A microelectromechanical device and method of fabricating the same, including a layer of patterned and deposited metal or mechanical-quality, doped polysilicon inserted between the appropriate device element layers, which provides a conductive layer to prevent the microelectromechanical device's output from drifting. The conductive layer may encapsulate of the device's sensing or active elements, or may selectively cover only certain of the device's elements. Further, coupling the metal or mechanical-quality, doped polysilicon to the same voltage source as the device's substrate contact may place the conductive layer at the voltage of the substrate, which may function as a Faraday shield, attracting undesired, migrating ions from interfering with the output of the device.
    Type: Application
    Filed: June 17, 2002
    Publication date: December 18, 2003
    Applicant: Honeywell International Inc.
    Inventors: Thomas G. Stratton, Gary R. Gardner, Curtis H. Rahn
  • Patent number: 6652740
    Abstract: An apparatus for determining hydraulic pressure within a pressure sensing fluid filter assembly includes a pressure-sensing polymer thick film transducer associated with an oil filter assembly. Preferably, pressure sensors are provided on both the oil inlet and outlet areas of the filter. The pressure-sensing transducers send signals to a control module, which may compare pressure readouts at the inlet and outlet sides of the filter. Based on the pressure in the filter, the on-board sensing system will detect a clogged filter condition, and if necessary, the control module will send a signal to an in-dash display terminal, to indicate that an oil change is needed.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: November 25, 2003
    Assignee: Honeywell International Inc.
    Inventor: Jeffrey N. Schoess
  • Patent number: 6643976
    Abstract: A pressure sensor device is described that has a diaphragm acted upon by a working medium, on a first side, and a sensor chip, which is disposed on a second side of the diaphragm that is remote from the working medium. There is formed in the sensor chip a measuring bridge having four sensor elements, which form two pairs disposed parallel, and the pairs are disposed at right angles to one another. The sensor elements are disposed such that they are closely spaced apart from one another in the edge region of the sensor chip that faces toward the central point of the diaphragm.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: November 11, 2003
    Assignee: First Sensor Technology GmbH
    Inventors: Johannes Ante, Christian Geiger, Markus Gilch, Hans-Peter Landgraf, Andreas Ott
  • Patent number: 6640644
    Abstract: Tilt and vibration sensor and method for forming the sensor with a piezoresistive membrane having a weight affixed proximate its center for detecting the tilt and vibration of a body. The membrane may include four piezoresistors placed proximate the edges of the membrane at the points of maximum stress when the membrane is subject to a uniform applied pressure. The piezoresistors may form a Wheatstone bridge circuit to generate a first and second output voltage in response to changes in resistance of the piezoresistors under the uniform applied pressure. The first output voltage may be indicative of the angle of inclination of a body and the second output voltage may be indicative of the vibration of the body. The membrane may be fabricated from a silicon wafer using known photolithography and etching processes. The membrane may be connected with a voltage source and secured within an appropriate housing to be placed in an operational environment.
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: November 4, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: Pedro G Mireles, Jose L Almaraz
  • Patent number: 6626044
    Abstract: A sensor having freeze resistant features is disclosed. The sensor includes a sensor die and a buffer member that are assembled for attachment to a process fluid conduit. The buffer member defines an opening in fluid communication with the process fluid. The sensor die has a flexible diaphragm, and a capillary channel establishes fluid communication between the diaphragm area of the sensor die and the opening in the buffer member.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: September 30, 2003
    Assignee: Honeywell International Inc.
    Inventors: Michael J. Haji-Sheikh, Richard Alan Davis, Mark Robert Plagens, Carl Edward Stewart, Gilberto Morales
  • Patent number: 6622564
    Abstract: A pressure sensor is provided, in which dead space is not formed under the diaphragm so that air or fluid will not be remained in the dead space. The pressure sensor having a passage for flowing fluid from one end to the other end thereof comprises a sensor head having a pressure sensitive area responsive to the fluid pressure and a diaphragm having a pressure receiving surface for receiving the fluid pressure directly, wherein the pressure receiving surface is disposed so as to protrude to the inside of the passage, and the pressure sensitive area is disposed on the opposite surface from the pressure receiving surface of the diaphragm.
    Type: Grant
    Filed: October 30, 2001
    Date of Patent: September 23, 2003
    Assignee: Surpass Industry Co., Ltd.
    Inventor: Hiroshi Imai
  • Patent number: 6625029
    Abstract: A sensor unit S for water heating systems, particularly for water boilers, is designed with a single housing H as a combined relative pressure and temperature sensor and has a ceramic support element C carrying an electronic circuit E including separate circuit zones E1, E2 for detecting the pressure and the temperature of the water, the support element including an active functional element M and being directly contacted by the water. The water contact area of said ceramic support element is separated from the electronic circuit E by a seal in the housing H.
    Type: Grant
    Filed: October 6, 2001
    Date of Patent: September 23, 2003
    Assignee: SKG Italiana SpA
    Inventor: Michele Bernini
  • Patent number: 6619132
    Abstract: A pressure sensor (1) has a circuit board (5) having a circuit portion (11) for amplifying an electric signal detected by a pressure detecting element (2C) and attached with an IC die (16), and a terminal (12) for inputting and outputting the electric signal from the circuit portion (11). The circuit portion (11) and the terminal (12) have a frame (11A, 12D) formed by a metal plate, the metal plate being provided with resin molds (14, 15). The circuit portion (11) and the terminal (12) are continuously formed, so that steps for soldering etc. is not necessary.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: September 16, 2003
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Atsushi Imai, Kouzou Yamagishi, Yoshihiro Tomomatsu
  • Publication number: 20030164046
    Abstract: A piezoelectric sensor includes a carrier, a piezoelectric measurement sensing element arranged on the carrier, a covering layer covering the measurement sensing element and an electronic evaluation unit. The measurement sensing element is formed by a piezoelectric layer. The carrier has a first contact layer electrically connected to the piezoelectric layer and the covering layer has a second contact layer electrically connected to the piezoelectric layer. The electronic evaluation unit is able to determine a mechanical loading of the piezoelectric layer by evaluating the difference of electrical potential between the first contact layer and the second contact layer.
    Type: Application
    Filed: March 4, 2003
    Publication date: September 4, 2003
    Inventor: Peter Apel
  • Patent number: 6612179
    Abstract: A combination absolute and differential pressure sensing device including a plurality of absolute pressure transducers, each transducer including a plurality of half bridge piezoresistive structures and a device for selectively coupling at least one of the plurality of half bridge piezoresistive structures of a first one of the absolute pressure transducers to at least one resistor to form a half-active full bridge structure adapted to measure an absolute pressure and at least one other of the plurality of half bridge piezoresistive structures of the first one of the plurality of absolute pressure transducers to at least one of the half bridge piezoresistive structure of a second one of the plurality of absolute pressure transducers to form a full bridge structure adapted to measure a differential pressure.
    Type: Grant
    Filed: June 23, 1999
    Date of Patent: September 2, 2003
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Anthony D. Kurtz