Heat Sink Patents (Class D13/179)
  • Heat sink with visible logo
    Patent number: 6870735
    Abstract: A heat sink is for an element to be cooled has a thermally conductive base and a plurality of thermally conductive pins or fins extending substantially perpendicular from the base, said pins or fins being arranged in a predetermined pattern. The pins at least partially frame thermally conductive projections extending substantially perpendicular from said base which forming a discernable logo having an upper surface and sides for providing plural cooling surfaces. In this instance the 3-D logo performs cooling of the components within a package.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: March 22, 2005
    Assignee: JDS Uniphase Corporation
    Inventors: Ronald R. Genova, Duane S. Stackhouse
  • Heat-dissipation fins
    Patent number: D500745
    Type: Grant
    Filed: May 25, 2004
    Date of Patent: January 11, 2005
    Assignee: Cooler Master Co., Ltd.
    Inventors: Qiang-Fei Duan, Pai-Ling Kao
  • Electronic component cooling apparatus
    Patent number: D501450
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: February 1, 2005
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Thermal module
    Patent number: D509194
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: September 6, 2005
    Assignee: ASUSTek Computer Inc.
    Inventors: Chi-Chang Lin, Chih-Yuan Cheng, Heng-Tsung Wang
  • Heat sink cap
    Patent number: D509482
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: September 13, 2005
    Assignee: Datech Technology Co., Ltd.
    Inventor: Hung-Chu Huang
  • Heat sink
    Patent number: D509483
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: September 13, 2005
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Heat sink
    Patent number: D509484
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: September 13, 2005
    Assignee: Fujikura Ltd.
    Inventors: Masataka Mochizuki, Koichi Mashiko
  • Heat sink
    Patent number: D509485
    Type: Grant
    Filed: June 7, 2004
    Date of Patent: September 13, 2005
    Assignee: Fujikura Ltd.
    Inventors: Masataka Mochizuki, Koichi Mashiko
  • Heat sink
    Patent number: D509486
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: September 13, 2005
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Fang-Xiang Yu, Meng-Tzu Lee, Shu-Ho Lin, Ming-Kun Cao
  • Heat dissipation device
    Patent number: D509806
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: September 20, 2005
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Hsieh-Kun Lee, Xue-Wen Peng, Rui-Hua Chen
  • Thermal module
    Patent number: D510324
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: October 4, 2005
    Assignee: ASUSTek Computer Inc.
    Inventors: Chi-Chang Lin, Chih-Yuan Cheng, Heng-Tsung Wang
  • Thermal module
    Patent number: D510325
    Type: Grant
    Filed: December 31, 2003
    Date of Patent: October 4, 2005
    Assignee: ASUSTek Computer Inc.
    Inventors: Chi-Chang Lin, Chih-Yuan Cheng, Heng-Tsung Wang
  • Electronic component cooling apparatus
    Patent number: D511326
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: November 8, 2005
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Heat sink
    Patent number: D511327
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: November 8, 2005
    Assignee: Giga-Byte Technology Co., Ltd.
    Inventors: Mou-Ming Ma, Shiang-Chich Tseng, Tung-Shan Lee, Yi-Song Liu, Chia-Min Chou
  • Clip for heat sink
    Patent number: D514529
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: February 7, 2006
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Fang-Xiang Yu, Shu-Ho Lin, Meng-Tzu Lee
  • Electronic component cooling apparatus
    Patent number: D516526
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: March 7, 2006
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Heat sink
    Patent number: D529450
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: October 3, 2006
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Masashi Miyazawa, Tomoaki Ikeda, Toshiki Ogawara
  • Heat sink
    Patent number: D529873
    Type: Grant
    Filed: September 26, 2005
    Date of Patent: October 10, 2006
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Li He, Tsung-Lung Lee
  • Power controller heat sink
    Patent number: D529874
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: October 10, 2006
    Assignee: Watlow Electric Manufacturing Company
    Inventors: Keith D. Ness, Theodore T. Von Arx
  • Heat sink fins
    Patent number: D530682
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: October 24, 2006
    Assignee: Molex Incorporated
    Inventors: Michael O'Sullivan, Eric Lotter
  • Spherical heat sink
    Patent number: D530683
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: October 24, 2006
    Inventors: Nelson Rivas, Joseph Abdale
  • Power controller heat sink
    Patent number: D531138
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: October 31, 2006
    Assignee: Watlow Electric Manufacturing Company
    Inventors: Keith D. Ness, Theodore T. Von Arx
  • Memory card heat sink
    Patent number: D531965
    Type: Grant
    Filed: October 28, 2004
    Date of Patent: November 14, 2006
    Assignee: Mushkin, Inc.
    Inventor: D. George Stathakis
  • Heat sink
    Patent number: D533145
    Type: Grant
    Filed: August 4, 2005
    Date of Patent: December 5, 2006
    Assignee: Molex Incorporated
    Inventors: Michael O'Sullivan, Eric Lotter
  • Heat sink
    Patent number: D537418
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: February 27, 2007
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Masayuki Iijima, Haruhisa Maruyama
  • Radiator for a chipset of a graphic card
    Patent number: D540750
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: April 17, 2007
    Assignee: Zalman Tech Co., Ltd.
    Inventor: Sang Cheol Lee
  • Electronic component cooling apparatus
    Patent number: D541229
    Type: Grant
    Filed: November 10, 2004
    Date of Patent: April 24, 2007
    Assignee: Sanyo Denki Co., Ltd.
    Inventors: Michinori Watanabe, Toshiki Ogawara, Haruhisa Maruyama
  • Radiator for a chipset of a graphic card
    Patent number: D541230
    Type: Grant
    Filed: January 27, 2005
    Date of Patent: April 24, 2007
    Assignee: Zalman Tech Co., Ltd.
    Inventor: Sang Cheol Lee
  • Radiator
    Patent number: D541231
    Type: Grant
    Filed: November 23, 2005
    Date of Patent: April 24, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiji Urano, Yoshimitsu Aizono, Shigeru Narakino
  • Radiator for electronic parts
    Patent number: D541232
    Type: Grant
    Filed: December 19, 2005
    Date of Patent: April 24, 2007
    Assignee: Zalman Tech Co., Ltd.
    Inventors: Sang Cheol Lee, Sun Gyu Yoon, Sang Jun Jung
  • Radiator for a heat generating components in electronic equipment
    Patent number: D484854
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: January 6, 2004
    Assignee: Zalman Tech Co., Ltd.
    Inventor: Sang-cheol Lee
  • Radiator for a heat generating components in electronic equipment
    Patent number: D485241
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: January 13, 2004
    Assignee: Zalman Tech Co., Ltd.
    Inventor: Sang-cheol Lee
  • Radiator
    Patent number: D485535
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: January 20, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kyo Niwatsukino, Seiji Urano, Shigeru Narakino, Fuminori Hirakawa, Toshihiko Matsuda, Shinya Koga, Yoshimitsu Aizono, Toshisuke Sakai, Toshiyuki Kubota, Makoto Nishida
  • Heat pipe heat sink assembly
    Patent number: D486129
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: February 3, 2004
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chun-Chi Chen, JianJun Zhang, Chin Hsien Lan
  • Radiator
    Patent number: D486455
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: February 10, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kyo Niwatsukino, Seiji Urano, Shigeru Narakino, Fuminori Hirakawa, Toshihiko Matsuda, Shinya Koga, Yoshimitsu Aizono, Toshisuke Sakai, Toshiyuki Kubota, Makoto Nishida
  • Heat pipe heat sink assembly
    Patent number: D487885
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: March 30, 2004
    Assignee: Datech Technology Co., Ltd.
    Inventor: Wei-Feng Fan
  • Inside-out heat sink
    Patent number: D490382
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: May 25, 2004
    Assignee: Xanoptix, Inc.
    Inventor: Roger Dugas
  • Heat sink with a three-dimensional curved surface
    Patent number: D490383
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: May 25, 2004
    Assignee: Delta Electronics, Inc.
    Inventors: Li-Kuang Tan, Yu-Hung Huang, Kuo-Cheng Lin, Wen-Shi Huang
  • Radiator
    Patent number: D490781
    Type: Grant
    Filed: January 27, 2003
    Date of Patent: June 1, 2004
    Assignee: Matsushita Electric Industrial Co., LTD
    Inventors: Kyo Niwatsukino, Seiji Urano, Shigeru Narakino, Fuminori Hirakawa, Toshihiko Matsuda, Shinya Koga, Yoshimitsu Aizono, Toshisuke Sakai, Toshiyuki Kubota, Makoto Nishida
  • Thermal efficient heat sink for electronic devices
    Patent number: D492265
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: June 29, 2004
    Assignee: Datech Technology Co., Ltd.
    Inventor: Chin-Yueh Chu
  • Frame of cooler
    Patent number: D492654
    Type: Grant
    Filed: July 5, 2002
    Date of Patent: July 6, 2004
    Assignee: Delta Electronics Inc.
    Inventors: Tsung-Yu Lei, Fu-Hau Tsai, Kuo-Cheng Lin, Wen-Shi Huang
  • Fastener device for a heat sink
    Patent number: D492655
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: July 6, 2004
    Assignee: Datech Technology Co., Ltd.
    Inventor: Che-Min Yu
  • Heat-conducting block of VGA chipset cooling device
    Patent number: D493151
    Type: Grant
    Filed: April 15, 2003
    Date of Patent: July 20, 2004
    Assignee: Zalman Tech Co., Ltd.
    Inventor: Sang-cheol Lee
  • Seat of heating radiator
    Patent number: D494146
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: August 10, 2004
    Assignee: Datech Technology Co., Ltd.
    Inventor: Chi-Hsu Lin
  • Frame for a cooling fan
    Patent number: D494548
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: August 17, 2004
    Assignee: Delta Electronics, Inc.
    Inventors: Fu-Hau Tsai, Tsung-Yu Lei, Kuo-Cheng Lin, Wen-Shi Huang
  • Supporting block of VGA chipset cooling device
    Patent number: D494549
    Type: Grant
    Filed: April 14, 2003
    Date of Patent: August 17, 2004
    Assignee: Zalman Tech Co., Ltd.
    Inventor: Sang-cheol Lee
  • Heat sink
    Patent number: D496006
    Type: Grant
    Filed: September 12, 2002
    Date of Patent: September 14, 2004
    Assignee: DaTech Technology Co., Ltd.
    Inventors: Ching-Feng Tsai, Ping Tsang Ho
  • Light emitting diode
    Patent number: D496007
    Type: Grant
    Filed: August 26, 2003
    Date of Patent: September 14, 2004
    Assignee: Nichia Corporation
    Inventor: Toshiyuki Hoshiba
  • Double-winged radiator for central processing unit
    Patent number: D496338
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: September 21, 2004
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Chih-peng Chen, Hsin-cheng Lin
  • Heat sink module
    Patent number: D497348
    Type: Grant
    Filed: May 14, 2003
    Date of Patent: October 19, 2004
    Assignee: Delta Electronics, Inc.
    Inventors: James Hong, Alex Hsia, Chen Chin-Ming