Abstract: The method of fabricating metal microstructures includes the following steps: a) taking a substrate that has a conductive strike surface; b) to d) forming a first resin mould by UV photolithography, the apertures in the first resin mould revealing the conductive strike surface of the substrate; e) electroforming the first element by galvanic deposition of a first metal material in the apertures of the first resin mould, f) removing the first mould around the first element to expose the conductive strike surface of the substrate; g) to i) forming a new resin mould by UV photolithography, the apertures in the new resin mould revealing the first element, and the conductive strike surface of the substrate; j) electroforming the second element by galvanic deposition of a second metal material in the apertures of the new resin mould to form said metal microstructure; k) separating said metal microstructure from the substrate and from said new mould.

Abstract: A surface treatment for metal surfaces can be used to create one or more desired effects, such as functional, tactile, or cosmetic effects. In one embodiment, the treatment involves selectively masking a portion of the surface using a photolithographic process. The mask can protect the masked portion of the surface during subsequent treatment processes such as texturizing and anodization. The mask can result in the creation of a surface having contrasting effects. A pattern can be formed by the contrasting effects in the shape of a distinct graphic, such as a logo or text.

Abstract: Disclosed is a nanostructured device for the in-situ capture of fluid samples at selectable times. The device includes a porous anodic alumina substrate having a plurality of elongated pores and an erodible capping material covering the pores. The device is transported into and through a geological reservoir while suspended in an injected carrier fluid. The device can optionally include a polymeric coating to improve minimize flocculation and sedimentation and prevent adhesion to surfaces in the reservoir. Upon erosion of the capping material, the fluids can diffuse into and fill each exposed pore. After a period of time, the hot water of the medium causes swelling and closure of the pore, effectively locking the fluid sample inside the pore. The device may be retrieved and analyzed to determine the composition and properties of the captured fluids.

Abstract: A metal surface treated to have two anodized layers or regions may be used in electronic devices. The surface treatment may include performing a first anodization process to create a first anodized layer, removing the first anodized layer at select locations, and performing a second anodization process to create a second anodized layer at the select locations. The first and second anodized regions may have different decorative properties, such as color, and different structural properties, such as degree of abrasion resistance. One of the anodization processes may be hard anodization and the other may be standard anodization.

Abstract: A partial plating method capable of applying fine hard gold plating, a laser plating device capable of applying partial plating to a minute region with high positional precision, and a plated member. The partial plating method comprising plating a region to be plated by projecting a laser beam having a wavelength of 330 nm or more and 450 nm or less. A laser plating device comprises a plating tank, a laser oscillator for emitting a laser beam, a conveying device for conveying a member to be plated, a photoelectronic sensor for detecting the position of a positioning hole of the member to be plated, and a galvanometer scanner having a galvanometer mirror capable of scanning the laser beam. The plated member is applied with fine spot plating by the laser plating device.

Abstract: A metal component for one or more of a fitting, a piece of furniture and a household appliance. The metal component includes a coating, at least in sections, the coating including one of a hardness-containing composite material and a ceramic-metal composite material.

Abstract: Anodized aluminum cookware having an exposed copper base or ring is formed by anodizing the completed vessel using a protective cap to cover most of the copper. The portion of copper that is exposed to the anodizing bath only tarnishes slightly and is preferably polished off after a protective lacquer is applied, creating a clean even margin with the anodized aluminum portion of the vessel.

Abstract: An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.

Abstract: Electroplating systems that include a plurality of electrodes, a power supply operably coupled to the plurality of electrodes, a platen for bearing a substrate on which metal features are to be formed, and an electrode support are disclosed. The electrode support may be configured for suspending the electrode assembly over an upper surface of the substrate disposed on the platen in spaced relation to and in alignment with the substrate or for supporting the electrode assembly in a stationary position over the substrate when the voltage is applied across the plurality of electrodes. The electrodes may be adjacent, mutually spaced and electrically isolated and connected in series so as to be oppositely polarized when the voltage is applied thereacross or may be connected so as to have alternating polarities when the voltage is applied thereacross.

Abstract: The disclosure relates to processes for the electrochemical modification of electron emitting materials such as carbon nanotubes. The processes improve the oxidation resistance of the electron emitting materials when they are fired in an oxygen-containing atmosphere such as air. The disclosure also relates to the preparation of cathodes or cathode assemblies, for use in a field emission device, wherein are contained an electron field emitter made from such electron emitting material.

Abstract: Electronic devices may be provided with antenna structures. The antenna structures may be used in wirelessly transmitting and receiving radio-frequency signals. Antenna structures may be formed from molded dielectric substrates. Patterned conductive material may be formed on the dielectric substrates. The dielectric substrates may be formed from molded materials such as glass or ceramic. Sheets of dielectric or dielectric powder may be compressed to form a dielectric substrate of a desired shape. The patterned conductive material may be formed from metallic paint or other conductors. A hollow antenna chamber may be formed by joining molded dielectric structures. An antenna such as an indirectly-fed loop antenna or other antennas may be formed from the molded dielectric substrates and patterned conductors.

Abstract: A method of forming anodic titanium oxide layers having dual-color appearance includes the following steps: providing a cleaned substrate; depositing a titanium film on the substrate; forming a mask of a desired pattern covering a portion of the substrate; carrying out a first anodization by immersing the substrate in an electrolytic solution as anode; applying a first direct-current voltage to produce a first titanium oxide layer; removing the mask; carrying out a second anodization by immersing the substrate in the electrolytic solution as anode; applying a second direct-current voltage having a value smaller than that of the first voltage to produce a second titanium oxide layer; and cleaning the coated substrate. The instant disclosure also includes an article made by the above method.

Abstract: A composition comprising a source of metal ions and at least one leveling agent comprising a linear or branched, polymeric imidazolium compound comprising the structural unit of formula L1 (L1) wherein R1, R2, R3 are each independently selected from an H atom and an organic radical having from 1 to 20 carbon atoms, R4 is a divalent, trivalent or mutlivalent organic radical which does not comprise a hydroxyl group in the ? or ? position relative to the nitrogen atom of the imidazole rings is an integer.

Abstract: A metal surface treated to have two anodized layers or regions may be used in electronic devices. The surface treatment may include performing a first anodization process to create a first anodized layer, removing the first anodized layer at select locations, and performing a second anodization process to create a second anodized layer at the select locations. The first and second anodized regions may have different decorative properties, such as color, and different structural properties, such as degree of abrasion resistance. One of the anodization processes may be hard anodization and the other may be standard anodization.

Abstract: The present invention relates to a process for manufacturing an electrochromic article comprising the following successive steps: (a) the deposition of a layer of an electrochromic compound on the surface of a transparent or translucent electrically conductive substrate, said layer of electrochromic compound covering only one portion of the surface of said electrically conductive substrate and leaving free at least one other portion thereof, (b) the deposition of a redox agent which is a reducing agent or an oxidizing agent for the electrochromic compound, on the portion of the surface of the electrically conductive substrate not covered by the layer of electrochromic compound, (c) the contacting of the layer of electrochromic compound, deposited in step (a), and of the layer of redox agent, deposited in step (b), with a liquid electrolyte for a sufficient time to enable the reduction or the oxidation of the electrochromic compound by the redox agent, and (d) the removal of the electrolyte by rinsing and/or d

Abstract: A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the via feature comprises an opening in the front surface of the substrate, a sidewall extending from the front surface of the substrate inward, and a bottom. The method comprises contacting the semiconductor integrated circuit device substrate with an electrolytic copper deposition chemistry comprising (a) a source of copper ions and (b) a leveler compound, wherein the leveler compound is a reaction product of a dipyridyl compound and an alkylating agent; and supplying electrical current to the electrolytic deposition chemistry to deposit copper metal onto the bottom and sidewall of the via feature, thereby yielding a copper filled via feature.

Abstract: A method for fabricating a nanostructure utilizes a templated monocrystalline substrate. The templated monocrystalline substrate is energetically (i.e., preferably thermally) treated, with an optional precleaning and an optional amorphous material layer located thereupon, to form a template structured monocrystalline substrate that includes the monocrystalline substrate with a plurality of epitaxially aligned contiguous monocrystalline pillars extending therefrom. The monocrystalline substrate and the plurality of epitaxially aligned contiguous monocrystalline pillars may comprise the same or different monocrystalline materials.

Abstract: A metal part is surface treated using anodization and plating processes to produce different finishes on selective regions of the metal part. The different finishes can contrast in decorative appearance (such as color, shininess and texture) and structural properties (such as wear resistance).

Abstract: The invention relates to a method for coating a cooling element (1) mainly made of copper, provided with water cooling pipes (2) and used particularly in connection with metallurgic furnaces or the like, wherein the cooling element includes a fire surface (3) that is in contact with molten metal, suspension or process gas; side surfaces (6) and an outer surface (7), so that at least part of the fire surface (3) is coated by a corrosion resistant coating (5).

Abstract: A plating apparatus has an ashing unit (300) configured to perform an ashing process on a resist (502) applied on a surface of a seed layer (500) formed on a substrate (W), and a pre-wetting section (26) configured to provide hydrophilicity to a surface of the substrate after the ashing process. The plating apparatus includes a pre-soaking section (28) configured to bring the surface of the substrate into contact with a treatment solution to clean or activate a surface of the seed layer formed on the substrate. The plating apparatus also includes a plating unit (34) configured to bring the surface of the substrate into a plating solution in a plating tank while the resist is used as a mask so as to form a plated film (504) on the surface of the seed layer formed on the substrate.

Abstract: Anodized electroplated aluminum structures and methods for making the same are disclosed. Cosmetic structures according to embodiments of the invention are provided by electroplating a non-cosmetic structure with aluminum and then anodizing the electroplated aluminum. This produces cosmetic structures that may possess desired structural and cosmetic properties and that may be suitable for use as housing or support members of electronic devices.

Abstract: Bioelectrodes, methods of making bioelectrodes and methods of using bioelectrodes are provided. The bioelectrodes have an electrically-conductive substrate coated with an electroconductive polymer. The bioelectrode exhibits ohmic behavior over a range of about 1 Hz to about 100 KHz, where ohmic behavior means that the value of the impedance is independent of the signal frequency over the range of interest. The bioelectrode can transmit or receive an electrical signal between the electrically conductive substrate and the biological component through the conductive polymer.

Abstract: A laminate is prepared in which adjacent internal electrodes are electrically insulated from each other at an end surface at which the internal electrodes are exposed, a space between the adjacent internal electrodes, which is measured in the thickness direction of insulating layers, is about 10 ?m or less when a withdrawn distance of the adjacent internal electrodes from the end surface is about 1 ?m or less, and is about 20 ?m or less when a protruding length of the adjacent internal electrodes from the end surface is at least about 0.1 ?m. In an electroplating step, electroplating deposits deposited on the ends of the adjacent internal electrodes are grown so as to be connected to each other.

Abstract: The invention relates generally to electrodeposition apparatus and methods. When depositing films via electrodeposition, where the substrate has an inherent resistivity, for example, sheet resistance in a thin film, methods and apparatus of the invention are used to electrodeposit materials onto the substrate by forming a plurality of ohmic contacts to the substrate surface and thereby overcome the inherent resistance and electrodeposit uniform films. Methods and apparatus of the invention find particular use in solar cell fabrication.

Abstract: A system may include an optical element including a surface defining a recess, conductive material disposed within the recess, and a solder mask disposed over a portion of the conductive material. The solder mask may define an aperture through which light from the optical element may pass. Some aspects provide creation of an optical element including a surface defining a recess, deposition of conductive material on the surface such that a portion of the deposited conductive material is disposed within the recess, and substantial planarization of the surface to expose the portion of the conductive material disposed within the recess.

Abstract: A method of bonding a metal to a substrate is disclosed herein. The method involves forming a nano-brush on a surface of the substrate, where the nano-brush includes a plurality of nano-wires extending above the substrate surface. In a molten state, the metal is introduced onto the substrate surface, and the metal surrounds the nano-wires. Upon cooling, the metal surrounding the nano-wires solidifies, and during the solidifying, at least a mechanical interlock is formed between the metal and the substrate.

Abstract: One embodiment relates to a substrate carrier for use in electroplating a plurality of substrates. The substrate carrier comprises a non-conductive carrier body on which the substrates are to be held. Electrically-conductive lines are embedded within the carrier body, and a plurality of contact clips are coupled to the electrically-conductive lines embedded within the carrier body. The contact clips hold the substrates in place and electrically couple the substrates to the electrically-conductive lines. The non-conductive carrier body is continuous so as to be impermeable to flow of electroplating solution through the non-conductive carrier body. Other embodiments, aspects and features are also disclosed.

Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.

Abstract: A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide represented by formula (I) or derivatives of a polyaminoamide of formula (I) obtainable by complete or partial protonation, N-quarternisation or acylation.

Abstract: A method for forming a multi-dimensional microstructure, such as but not limited to a three dimensional (3-D) microstructure coil for use in a data transducer of a data storage device. In accordance with some embodiments, the method generally includes providing a base region comprising a first conductive pathway embedded in a first dielectric material; etching a plurality of via regions in the first dielectric material that are each partially filled with a first seed layer that contacts the embedded first conductive pathway; and using the first seed layer to form a conductive pillar in each of the plurality of via regions, wherein each conductive pillar comprises a substantially vertical sidewall that extends to a first distance above the base region.

Abstract: Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

Abstract: The present invention relates to an inflammable mat board for an architecture and a method for manufacturing the same, and in particular to a mat board which is characterized in that in an inflammable mat board for architecture, a mat shaped board is manufactured in such a way that a metallic thread made from an iron, a nonferrous metal, a waste can and a waste tin plate, etc. is tangled like a cotton ball in a thin sheet shape, so it is possible to recycle materials, and an inflammability can be enhanced, and a heat insulation effect can be maximized, and a recycling rate can be enhanced in terms of a material management, and the production of wastes can be advantageously minimized, thus contributing a lot to a green growth policy of the world.

Abstract: A transparent conductive material, including a substantially transparent carbon nanotube layer, and a metal layer deposited onto the carbon nanotube layer, in which the metal layer increases an electrical conductance of the transparent conductive material without substantially reducing an optical transmittance of the transparent conductive material.

Abstract: A demisable fuel supply system for a satellite includes a pressurized aluminum alloy tank with an aluminum alloy propellant management device therein. The propellant management device (PMD) can have any capillary action surface tension fluid transport features known in the art. Selected inner surfaces of the tank and the PMD are covered with a titanium based coating to guarantee propellant wettability and corrosion resistance of the fuel supply system.

Abstract: A method of filling copper in a non-through hole on a substrate that has been treated to render it conductive, which comprises plating said substrate in an acidic copper plating bath comprising a water-soluble copper salt, sulfuric acid and a filling additive that is a polymer having the activities of both of a brightener and a leveler.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.

Abstract: A method of forming a metal pattern includes forming a precursor layer including a metal precursor on a substrate, irradiating a light on the precursor layer to form a metal seed layer having a predetermined pattern, and electroless-plating the metal seed layer to form a metal pattern layer.

Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Abstract: A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.

Abstract: Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structural elements spaced from one another by gaps that are effectively less than minimum features sizes associated with the individual layers used to form the structures. In some embodiments, features or protrusions formed on different layers on opposing surfaces are offset along the axis of layer stacking so as to bring the features into positions that are closer than allowed by the minimum features sizes associated with individual layers. In other embodiments, interference is used to create effective spacings that are less than the minimum features sizes.

Abstract: A method for the electrochemical plating or marking of metals includes providing a metal surface, providing an electroplating solution at the metal surface, and electroplating the metal surface with the electroplating solution. A top layer of the metal surface comprises an oxide scale. The method can also include masking a portion of the metal surface with a masking material. The electroplating solution can be provided at the metal surface by an electroplating brush, the oxide scale of the metal surface can be comprised primarily of magnetite and hematite, and the material comprising the metal surface can be steel.

Abstract: Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.

Abstract: A plating processing method comprises performing a continuous electrolytic plating of the surface of a film having a surface resistivity in the range of 1 ?f/Sq to 1000 ?/Sq, wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in the range of 0.5 cm to 15 cm.

Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:

Abstract: A method of activating a copper seed layer during a plating process is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the workpiece, relative movement between the workpiece and the workpiece-surface-influencing device is established so that an additive in the electrolyte solution disposed on the workpiece and which is adsorbed onto the top surface is removed or otherwise its amount or concentration changed with respect to the additive on the cavity surface of the workpiece. Plating of the conductive material can place prior to, during and after usage of the workpiece-surface-influencing device, particularly after the workpiece surface influencing device no longer contacts any portion of the top surface of the workpiece, to achieve desirable semiconductor structures.

Abstract: A composition for plating copper includes an electrolyte solution, an accelerator, a suppressor and a leveler. The electrolyte solution includes a soluble copper salt, sulfuric acid and hydrochloric acid. The accelerator includes about 20 to about 60 ppm of a disulfide compound. The suppressor includes about 40 to about 100 ppm of a polyethyleneoxide (PEO)-polypropyleneoxide (PPO)-polyethyleneoxide (PEO) triblock copolymer. The PEO-PPO-PEO triblock copolymer has a weight average molecular weight of about 300 to about 10,000. The leveler includes about 0.01 to about 100 ppm of arylated polyethyleneimine.

Abstract: A stencil with pattern includes a porous material and a masking pattern layer disposed on the porous material. The masking pattern layer includes a patterned mask area covering a portion of the porous material. When electroplating or etching is performed, the stencil with pattern is laminated with a workpiece so that the patterned mask area covers a portion of a working surface of the workpiece, and is placed into an electroplating tank or etch tank. The portion of the working surface not covered by the patterned mask area undergoes electroplating or etching reaction, resulting in electroplated or etched pattern on the workpiece. There may also be a screen structure interposed between the porous material and the masking pattern layer. The method of forming a pattern on a workpiece using the stencil with pattern has advantages of simplified process, significant time-to-product reduction, and product yield enhancement.

Abstract: It is to provide a method for manufacturing a metal electrode having transition metal oxide coating layer and a metal electrode manufactured thereby, which eliminates a contact resistance problem and simultaneously improves electric conductivity of the electrode by using a one body electrode, which is not requiring separate current collector and binder, and further maintains pseudo-capacitance from the redox reaction by coating the metal surface with a transition metal oxide.