Abstract: Provided are a wiring substrate; a multi-piece wiring substrate array; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate includes a substrate main body, which has first and second main surfaces, side surfaces, a groove surface, and a fracture surface; and a notch which has a concave shape in plan view, and which is provided on a side surface on a side toward the first main surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has first curved portions on opposite sides of the notch, the first curved portions being convex toward the first main surface in side view; and also has a second curved portion on a second-main-surface side of the notch, the second curved portion being convex toward the second main surface of the substrate main body in side view.

Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.

Abstract: In one embodiment, a touch sensor includes a substrate comprising a first surface. The touch sensor also includes a plurality of first electrodes comprising one or more conductive materials on the first surface. The touch sensor further includes a dielectric layer attached at least indirectly to the first electrodes and at least a portion of the first surface. The dielectric layer is configured to face an electronic display panel with an air gap between the dielectric layer and the electronic display panel. The dielectric layer has a refractive index of less than approximately 1.5.

Abstract: The cartridge includes a sensor structure that has multiple sensors positioned on a substrate. The cartridge also includes a common channel defined in the substrate such that a fluid flowing in the common channel contacts each of the sensors as a result of the fluid flowing from an inlet of the common channel to an outlet of the common channel.

Abstract: In manufacturing multilayer plastic laminates for printed circuits, a press with two surfaces exerts pressure under vacuum on a stack of laminates, the packs, alternated with separator plates made of anodized aluminum. The packs include prepreg layers. The metalizations present on the two sides of each pack are portions of a copper strip repeatedly folded 180° around each pack and each separator plate. A strong current circulates in the copper strip which heats the strip with resistive behavior: the heat causes the close fixing of the various layers. An auxiliary heater is applied to each surface of the press by element of an interposed insulating plate. This includes an aluminum plate with equidistant longitudinal holes containing the same number of armored candle-like resistors, connected in parallel. A main power supply provides direct current to the copper strip, two secondary power supplies provide alternating current to the two auxiliary heaters.

Abstract: An electrostatic discharge (ESD) protection circuit for protecting a protected circuit is coupled to an input pad. The ESD circuit includes a nanotube switch electrically having a control. The switch is coupled to the protected circuit and to a discharge path. The nanotube switch is controllable, in response to electrical stimulation of the control, between a de-activated state and an activated state. The activated state creates a current path so that a signal on the input pad flows to the discharge path to cause the signal at the input pad to remain within a predefined operable range for the protected circuit. The nanotube switch, the input pad, and the protected circuit may be on a semiconductor chip. The nanotube switch may be on a chip carrier. The deactivated and activated states may be volatile or non-volatile depending on the embodiment.

Abstract: A high frequency module having a surface acoustic wave device and a method of manufacturing the same are provided. The high frequency module includes a substrate provided with a top ground pattern at both upper ends and provided with, inside thereof, an inner ground pattern electrically connected to the top ground pattern through a via electrode; at least one SAW device installed on the substrate; a molding layer formed on the substrate to cover the SAW device and provided with a groove at both ends to expose the top ground pattern; and an electromagnetic wave shield layer formed to cover a surface of the molding layer including an inside of the groove.

Abstract: A display apparatus includes a substrate including a display area, an encapsulation member facing the substrate, a pad unit around the display area of the substrate, the pad unit including a contact area and an exposure area that is spaced apart from the contact area, and a flexible printed circuit (FPC) that is connected to the contact area of the pad unit and is curved towards the encapsulation member.

Abstract: A nanocoaxial sensor includes an outer conductor, an inner conductor, a nanoporous dielectric material disposed between the outer and inner conductors, a nanocavity sized to allow target species to enter the nanocavity between the outer and inner conductors.

Abstract: A system and method for forming conductive lines on a substrate comprising depositing a precursor onto at least a portion of the substrate, depositing a thin layer of conductive material over the precursor, forming a negative-patterned mask over a portion of the thin layer of conductive material to form an exposed pattern, forming conductive lines in the exposed pattern, removing the patterned mask thereby uncovering an exposed portion of the conductive layer that substantially corresponds to the negative pattern portion, and removing the exposed portion of the conductive layer so as to uncover substrate that substantially corresponds to the exposed portion.

Abstract: An electrical conductor, such as a wire or catheter, which is coated circumferentially with a ferromagnetic material in a selected region, is fed from a high frequency alternating current source. The ferromagnetic material has a quick response in heating and cooling to the controllable power delivery. The ferromagnetic material can be used for separating tissue, coagulation, tissue destruction or achieving other desired tissue effects in numerous surgical procedures.

Abstract: There is provided a microchip for chemical reaction in which a solid-phase reagent whose reagent composition can be identified based on appearance is contained.

Abstract: Disclosed is an apparatus for detaching a component from a mounting surface to which the component is attached by an adhesive. The apparatus includes a right-angled hook, a curved hook, a connecting body and an adjusting member. On one side of the component, the right-angled hook protrudes into a first space between the component and the mounting surface. On another side of the component, the curved hook protrudes into a second space between the component and the mounting surface. The connecting body connects the right-angled hook and the curved hook. In response to a thermal process, the adhesion of the adhesive is reduced, and an adjustment of the adjusting member allows the curved hook to provide a shear force in order to detach the component from the mounting surface. A method for detaching a component from a mounting surface is also disclosed.

Abstract: An electronic component includes a frame-shaped supporting body including a heat-curable resin and surrounding a functional unit on one main surface of a substrate and so as to be separated from a periphery of the substrate on an inner side and in which a lid member is fixed to the supporting body such that an opening of the frame-shaped supporting body is sealed. The frame-shaped supporting body includes a frame-shaped supporting body main body, a first protrusion that protrudes toward an inside from the supporting body main body and a second protrusion that protrudes toward an outside from the supporting body main body at a portion where the supporting body main body and the first protrusion are continuous with each other.

Abstract: The present invention relates to a method for providing a reflective coating (114) to a substrate (104) for a light-emitting device (112), comprising the steps of: providing (201) a substrate (104) having a first surface portion (116) with a first surface material and a second surface portion (106, 108) with a second surface material different from the first surface material; applying (202) a reflective compound (401) configured to attach to said first surface material to form a bond with the substrate (104) in the first surface portion (116) that is stronger than a bond between the reflective compound (401) and the substrate (104) in the second surface portion (106, 108); curing (203) said reflective compound (401) to form a reflective coating (114) having said bond between the reflective coating (114) and the substrate (104) in the first surface portion (116); and subjecting said substrate (104) to a mechanical treatment with such an intensity as to remove (205) said reflective coating (114) from said secon

Abstract: In one embodiment of the invention, a system in package (SiP) is described which includes a plurality of device components with different form factors embedded within a molding compound layer. A surface for each of the device components is coplanar with a surface of the molding compound layer, and a single redistribution layer (RDL) formed on the coplanar surfaces of the molding compound layer and the plurality of device components. An active device die is electrically bonded to the single RDL directly vertically adjacent the plurality of device components. In an embodiment, the SiP is electrically connected to a circuit board with the active device die between the single RDL and the circuit board. In an embodiment, the SiP is electrically connected to a circuit board with the active device die over the single RDL and the circuit board.

Abstract: A sensor includes an enclosure having a housing and a lower cassette that cooperate to provide a sealed volume in which an optical sensor assembly is enclosed and protected. The optical sensor assembly includes a circuit board with a light source and a light detector. The sensor assembly further includes a light pipe that guides light from the sensor onto a target and a lens guides reflected light from the target onto the light detector. Lower ends of the light pipe and the lens are supported by a recess in the lower cassette. Upper ends of the light pipe and the lens are supported by an upper cassette. The upper cassette is positively located and mounted to the circuit board and received in an internal receptacle in the lower cassette. Mounting the lower cassette to the housing encloses the optical sensor assembly in the proper alignment.

Abstract: There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips.

Abstract: Forming antenna structures having several conductor turns (wire, foil, conductive material) on a an antenna substrate (carrier layer or film or web), removing the antenna structures individually from the antenna substrate using pick & place gantry or by means of die punching, laser cutting or laminating, and transferring the antenna structure with it's end portions (termination ends) in a fixed position for mounting onto or into selected transponder sites on an inlay substrate, and connecting the aligned termination ends of the antenna structure to an RFID (radio frequency identification) chip or chip module disposed on or in the inlay substrate. A contact transfer process is capable of transferring several antenna structures simultaneously to several transponder sites.

Abstract: Disclosed are appendage mountable electronic systems and related methods for covering and conforming to an appendage surface. A flexible or stretchable substrate has an inner surface for receiving an appendage, including an appendage having a curved surface, and an opposed outer surface that is accessible to external surfaces. A stretchable or flexible electronic device is supported by the substrate inner and/or outer surface, depending on the application of interest. The electronic device in combination with the substrate provides a net bending stiffness to facilitate conformal contact between the inner surface and a surface of the appendage provided within the enclosure. In an aspect, the system is capable of surface flipping without adversely impacting electronic device functionality, such as electronic devices comprising arrays of sensors, actuators, or both sensors and actuators.

Abstract: A method of manufacturing an optical module includes the steps of applying the invisible light onto the resin member and the optical device, observing, with use of a camera, a part of the resin member located at the optical fiber coupling plane and an image formed at the optical fiber coupling plane by the optical device active layer while applying the invisible light onto the resin member and the optical device, aligning positions of the resin member and the circuit board with respect to each other while observing the part of the resin member located at the optical fiber coupling plane and the image formed at the optical fiber coupling plane, and fixing the resin member to the circuit board while maintaining the aligned positions of the resin member and the circuit board.

Abstract: A method for forming a frame attachment interconnect between a substrate and a frame is disclosed. The method can include applying a composite material (e.g., epoxy-glass prepreg) to a surface of a substrate. The composite material can have one or more holes disposed to substantially align with a corresponding pad on the surface of the substrate. A metal disc is placed in each hole of the composite material on top of the corresponding pad. A frame member can be placed on top of the composite material and the metal discs. The frame member can have one or more pads disposed to substantially align with the metal discs. The substrate, composite material, metal discs and frame combination can be cured in a controlled atmosphere that can include a vacuum and a predetermined temperature to create discrete electrical connections between adjacent pads but with each encapsulated and electrically isolated.

Abstract: A flex-rigid wiring board including a rigid substrate including a rigid base material and a conductor layer, and a flexible substrate having a conductor layer. The conductor layer of the flexible substrate is electrically connected to the conductor layer of the rigid substrate. The rigid substrate has a recessed portion which is formed on a surface of the rigid substrate and which accommodates an electronic component.

Abstract: A method of generating a hole or the like in an electrically insulating or semiconducting substrate, includes a) providing a substrate; b) melting a volume of material of the substrate; c) removing the molten volume of material by applying a voltage across the substrate using two electrodes, thereby applying a defined amount of electrical energy to the substrate and dissipating the electrical energy from the substrate, wherein the rate of dissipating the applied electrical energy is controlled by at least one current and/or power modulating element, the at least one current and/or power modulating element being part of the electrical connection between the voltage source and the electrodes, and wherein the current and/or power modulating element is a resistor, a capacitor, an inductor or any combination of the foregoing, with the proviso that, if there is only one current and/or power modulating element, it is not an ohmic resistor.

Abstract: Provided is a method of roll-to-roll processing of semiconductor parts, the method including: supplying to a processing unit a first material uncoiled from a first roll for processing at the processing unit; connecting a leading board to a leading portion of the first material before the processing so that the first material led by the leading board is processed during transfer in the processing unit along a path; cutting the leading board from the leading portion of the first material after the processing; and if a terminal edge of the first material begins to be processed at the processing unit, connecting another leading board to a leading portion of a second material uncoiled from a second roll and supplying the second material to the processing unit for processing.

Abstract: The present invention provides method of manufacture for a printed wiring board. The printed wiring board constructed according to the teachings of the present invention includes a printed wiring board dielectric layer having conductive foils located on at least two sides thereof. The printed wiring board further includes a solid core conductive material interconnecting the conductive foils.

Abstract: A mounting assembly is configured for mounting electronics in a ceiling or wall without requiring access to interior portions of the ceiling or wall. The mounting assembly comprises a collar, at least two arms and at least two threaded screws. The collar fits around and attaches to the electronics housing. The at least two arms are each independently compressed to engage the ceiling and are coupled to the collar to support the collar in the ceiling.

Abstract: A flexible printed circuit connector structure and assembly method. A panel with a back side that is parallel to a first plane and a flexible printed circuit backer that has a base and a backing structure. The base is attached to the back side of the panel. The backing structure depends from the base and extends along a second plane that forms an angle with the first plane. A first flexible circuit side of the flexible printed circuit is attached to a first side and an opposite second side of the backing structure. The flexible printed circuit has exposed conductors on a second flexible circuit side that is opposite the first flexible circuit side.

Abstract: A manufacturing method of identifiable print circuit board includes a step of “disposing an identifier”, by providing a base plate, defining a surface of the base plate as a manufacturing surface, and disposing a primary identifier on the manufacturing surface; a step of “piling”, by sequentially piling up an insulating layer and a circuit layer with a penetrating area on the manufacturing surface, with the penetrating area in alignment with the position of the primary identifier; and a step of “lamination”, by laminating the base plate, the insulating layer, and the circuit layer at a temperature not less than 150° C. and a pressure not less than 280 psi to obtain a print circuit board.

Abstract: An interactive printed article includes a cover and a plurality of printed leaves on which a plurality of touchpoints are distributed. A particular printed leaf among the plurality of printed leaves includes first and second viewed surfaces and first and second inner surfaces and has a touch sensor incorporated therein proximate to a touchpoint among the plurality of touchpoints. At least one of the first and second viewed surfaces has content printed thereon, and at least one of the first and second inner surfaces has a conductive trace formed thereon. The interactive printed article further includes an electronics package electrically coupled to the conductive trace that initiates presentation of a particular presentation corresponding to the touchpoint in response to detection via the touch sensor of selection of the touchpoint.

Abstract: The invention discloses a flexible printed circuit board, a chip on film and a manufacturing method. The flexible printed circuit board used for hot pressing includes an insulating substrate with long edges; the insulating substrate is provided with a plurality of pins used for hot pressing; the pins of the flexible printed circuit board used for hot pressing are along the long edge of the insulating substrate; the spacing between two adjacent pins is gradually reduced from both ends to the middle. In the invention, after hot lamination, the spacing between the pins can almost keep constant and is equivalent to the expansion result of the LCD panel; thus, better electrical connection of the pins and the leads of the LCD panel can be ensured, and electrical contact is more reliable.

Abstract: A method of forming a structure such as a print head or a printer including the print head having a flex circuit with a plurality of deformed (i.e., contoured, shaped, or embossed) conductive flexible printed circuit (flex circuit) pads. A plurality of flex circuit pads can be aligned with a plurality of piezoelectric elements of an ink jet print head. Within a press such as a stack press, pressure can be applied to deform the plurality of flex circuit pads and to establish electrical contact between the plurality of flex circuit pads and the plurality of piezoelectric elements. Deforming the plurality of flex circuit pads in situ during the press operation can reduce costs by eliminating a separate embossing stage performed during the manufacture or formation of the flex circuit.

Abstract: An electroless Cu layer is formed on each side of a packaging substrate containing a core, at least one front metal interconnect layer, and at least one backside metal interconnect layer. A photoresist is applied on both electroless Cu layers and lithographically patterned. First electrolytic Cu portions are formed on exposed surfaces of the electroless Cu layers, followed by formation of electrolytic Ni portions and second electrolytic Cu portions. The electrolytic Ni portions provide enhanced resistance to electromigration, while the second electrolytic Cu portions provide an adhesion layer for a solder mask and serves as an oxidation protection layer. Some of the first electrolytic Cu may be masked by lithographic means to block formation of electrolytic Ni portions and second electrolytic Cu portions thereupon as needed. Optionally, the electrolytic Ni portions may be formed directly on electroless Cu layers.

Abstract: A method for manufacturing a FPCB includes following steps. A support device and an unfinished FPCB are provided. The unfinished FPCB includes a substrate, a conductive trace layer, and a solder mask layer in sequence. The conductive trace layer includes exposed connecting terminals. The unfinished FPCB is divided into an effective region and an unwanted region surrounding the effective region. A blinded groove is formed at the unwanted region. The connecting terminals are located in the effective region. The unfinished FPCB is put on the support device. A heating device is inserted into the blinded groove to heat the substrate and the support device to adhere together and then the heating device is removed. A tin cream layer is dispensed on each connecting terminal. An electronic component is mounted on each tin cream layer. The unfinished FPCB is cut to separate the effective region from the unwanted region.

Abstract: A wire grid polarizer capable of improving light efficiency by applying a nano-wire grid pattern optimized to a LCD panel, a method of manufacturing thereof, and a liquid crystal display panel and a liquid crystal display device provided with the wire grid polarizer are provided. The wire grid polarizer of the present invention has a plurality of areas, and a shape of a wire grid pattern of an area among the plurality of areas is different from those of the other areas.

Abstract: A method of making a heat radiating structure for high-power LED comprises: (1) preparing a PCB board, a heat conducting plate having a heat conducting column at one side thereof and a heat radiating plate; (2) providing a locating hole penetrating both sides of the PCB board, and welding a copper plate to one side of the PCB board, while soldering an electrode welding leg to the other side of the PCB board; (3) putting the heat conducting column into the locating hole, and soldering the copper plate and the heat conducting plate together; (4) placing the one-piece of the heat conducting plate and the PCB board produced by the step (3) on a pressing equipment to adjust the height of the conducting column; (5) pasting the inner side of the heat radiating plate on the other side of the heat conducting plate fixedly.

Abstract: The present invention relates to the apparatus and method for optical interconnection. The present invention provides an optical interconnection structure comprising: a substrate on which double side perforated multi-hole through a predetermined region is formed; bottom hole which is etched and tapered for optical fiber array is bigger than upper hole which is etched for the optical devices. The present invention provides the optical interconnection structure that can facilitate the optical interconnection between the active optoelectronic devices that transmit/receive the optical signals and the optical fiber array, making it possible to align easily and acutely between the optical devices and optical fiber array.

Abstract: A fabricating method of an embedded package structure is provided. The method includes combining a first board and a second board to form an integrated panel; forming a first circuit structure on the first board and forming a second circuit structure on the second board; separating the first board from the second board; electrically disposing an embedded element on the first circuit structure; forming at least one conductive bump on the second circuit structure; and providing a semi-cured film and performing a laminating process to laminate the first circuit structure on the first board, the semi-cured film, and the second circuit structure on the second board, wherein the semi-cured film encapsulates the embedded element, and after the laminating process is performed, the at least one conductive bump pierces through the semi-cured film and is electrically connected to the first circuit structure.

Abstract: An apparatus includes an optical Input/Output (I/O) connector, which has a central axis that is mounted in a plane and which is configured to connect to external optical fibers for transferring input optical signals to the apparatus and output optical signals from the apparatus. A first optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the input optical signals from the optical I/O connector to respective optical detectors. A second optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the output optical signals from respective optical emitters to the optical connector. A light rotation module is configured to bend and transfer the input and output optical signals between the optical I/O connector and the perpendicularly-mounted first and second optical ferrules.

Abstract: A device and manufacturing method for a rotation sensor device includes a holding device, an oscillating mass, and a spring, via which the oscillating mass is connected to the holding device. The spring is designed so that the oscillating mass can be set into an oscillating movement around an oscillation axis with respect to the holding device with the aid of a drive. The steps include: producing a layer sequence having a first layer made of semiconductor material and/or metal and a second layer made of semiconductor material and/or a metal, a boundary surface of the first layer, at least partially being covered by an insulating layer; structuring the spring out of the first layer; and structuring at least one oscillating mass subunit of the oscillating mass, which can be set into the oscillating movement around the oscillation axis with the aid of the drive, out of the second layer.

Abstract: A first tier die is provided having a thermal management floorplan with a heat region having an area for thermal coupling to a heat sink, a second tier die is provided, shaped and dimensioned to be stackable into a multi-tier stack with the first tier die and, when stacked in the multi-tier stack, to not substantially overlap the heat region. A heat sink is provided, and a thermal coupling element, the heat sink, a stack having the first tier die and the second tier die, and the heat sink are arranged to form the multi-tier stacked integrated circuit. In the arrangement, the thermal coupling element is located to form a thermal path from the heat region of the first tier die to the heat sink.

Abstract: Plating stub resonance in a circuit board may be mitigated by increasing surface roughness of the plating stub conductor. Roughening the plating stub increases its resistance due to the skin effect at higher frequencies, which decreases the quality factor of the transmission line and consequently increases the damping factor, to reduce any resonance that would occur in the plating stub as formed prior to roughening. The surface roughness can be increased in a variety of ways, including chemical processes, by selectively applying a laser beam, or by applying an etch-resistance material in selected locations.

Abstract: A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.

Abstract: Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

Abstract: A superconducting integrated circuit, comprising a plurality of superconducting circuit elements, each having a variation in operating voltage over time; a common power line; and a plurality of bias circuits, each connected to the common power line, and to a respective superconducting circuit element, wherein each respective bias circuit is superconducting during at least one time portion of the operation of a respective superconducting circuit element, and is configured to supply the variation in operating voltage over time to the respective superconducting circuit element.

Abstract: A display mirror assembly for a vehicle having a front shield including a first side and a second side. A partially reflective, partially transmissive element is mounted on the first side. A rear shield is disposed behind the front shield. A display module is mounted between the front shield and the rear shield and includes in order from the front shield: a display; an optic block; a heat sink having an edge lit PCB mounted along a top edge thereof; and a PCB. The front shield is secured to at least one component of the display module with a first retaining feature and the rear shield is secured to at least one component of the display module with a second retaining feature. A housing at least partially surrounds the front shield, display module, and rear shield.

Abstract: This disclosure provides systems, methods, and apparatus for metal-insulator-metal capacitors on glass substrates. In one aspect, an apparatus may include a glass substrate, with the glass substrate defining at least one via in the glass substrate. A first electrode layer may be disposed over surfaces of the glass substrate, including surfaces of the at least one via. A dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the dielectric layer, with the dielectric layer electrically isolating the first electrode layer from the second electrode layer.

Abstract: A circuit board and a semiconductor module with high endurance against thermal cycles, and which is hard to be broken under thermal cycles, even if thick metal circuit board and thick metal heat sink are used, corresponding to high power operation of a semiconductor chip are provided. This circuit board includes, an insulating-ceramic substrate, a metal circuit plate bonded to one face of the insulating-ceramic substrate, a metal heat sink bonded to another face of the insulating-ceramic substrate, wherein (t12?t22)/tc2/K<1.5, where, a thickness of the insulating ceramics substrate is tc, a thickness of the metal circuit plate is t1, a thickness of the metal heat sink is t2, and an internal fracture toughness value of the insulating ceramics substrate is K.

Abstract: A universal platform may be used to create a family of LED light bulbs with lower costs. One universal platform includes a lamp base, a lamp holder, and a driver. Different upper bulb portions may be assembled on this universal platform. An alternate universal platform include a lamp base, a lamp holder, a heat sink, a driver shell, a driver, a PCB, and one or more LEDs. Different diffusers may be connected to this platform to produce different bulb designs. The bulbs may include an optional diffuser for producing omnidirectional light.

Abstract: An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.