Patents Assigned to Advanced Semiconductor Engineering
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240178158
    Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring structure, and are electrically connected to each other through the wiring structure. The first underfill is disposed in a first space between the first electronic device and the wiring structure. The second underfill is disposed in a second space between the second electronic device and the wiring structure. The stiff bonding material is disposed in a central gap between the first electronic device and the second electronic device. The stiff bonding material is different from the first underfill and the second underfill.
    Type: Application
    Filed: February 6, 2024
    Publication date: May 30, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-Hsien KE, Teck-Chong LEE, Chih-Pin HUNG
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11997888
    Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: May 28, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11996373
    Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.
    Type: Grant
    Filed: February 14, 2023
    Date of Patent: May 28, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jenchun Chen, An-Ping Chien
  • Electronic devices
    Patent number: 11997783
    Abstract: The present disclosure provides an electronic device. The electronic device includes a first insulating layer, a first antenna pattern, a second insulating layer, and a second antenna pattern. The first antenna pattern is configured to operate at a first frequency and at least partially disposed over the first insulating layer. The second insulating layer is disposed over the first insulating layer. The second antenna pattern is configured to operate at a second frequency different from the first frequency and at least partially disposed over the second insulating layer. A dielectric constant of the first insulating layer is different from a dielectric constant of the second insulating layer.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: May 28, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Po-An Lin, Huei-Shyong Cho, Shih-Wen Lu
  • Package substrate and method for manufacturing the same
    Patent number: 11997798
    Abstract: A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.
    Type: Grant
    Filed: August 30, 2022
    Date of Patent: May 28, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wu Chou Hsu, Hsing Kuo Tien, Chih-Cheng Lee, Min-Yao Chen
  • RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME
    Publication number: 20240168238
    Abstract: A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao Hsuan CHUANG, Huang-Hsien CHANG
  • PACKAGE STRUCTURE WITH INTERPOSER ENCAPSULATED BY AN ENCAPSULANT
    Publication number: 20240170396
    Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yung-Shun CHANG, Sheng-Wen YANG, Teck-Chong LEE, Yen-Liang HUANG
  • ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240170829
    Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • PACKAGE STRUCTURE
    Publication number: 20240170437
    Abstract: A package structure is disclosed. The package structure includes a first substrate, a second substrate, a gap, and a directing structure. The second substrate is disposed under the first substrate. The gap is between the first substrate and the second substrate. The gap includes a first region and a second region. The first region is configured to accommodate a filling material. The directing structure is disposed in a flow path of the filling material and configured to reduce a migration of the filling material from the first region to the second region.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Fu KUO, Shang Min CHUANG, Ching Hung CHUANG, Hsu Feng TSENG, Jia Zhen WANG
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20240170364
    Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes at least one electronic component, a heat source, and a heat dissipation element. The heat source is adjacent to the electronic component. The heat dissipation element is disposed adjacent to the heat source and the electronic component. The heat dissipation element includes a heat transmitting structure configured to reduce heat, which is from the heat source, through the heat dissipation element, and transmitting in a direction toward the electronic component.
    Type: Application
    Filed: November 23, 2022
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hung-Hsien HUANG, Wen Chun WU, Chih-Pin HUNG
  • METHOD OF MANUFACTURING CIRCUIT PATTERN STRUCTURE AND MEASUREMENT METHOD
    Publication number: 20240170345
    Abstract: A method of manufacturing a circuit pattern structure, a measurement method, and a circuit pattern structure are provided. The method of manufacturing the circuit pattern structure includes: forming a dielectric layer; forming at least one first pad at least partially in the dielectric layer; forming a second pad adjacent to the at least one first pad and having a height greater than that of the at least one first pad.
    Type: Application
    Filed: November 17, 2022
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Kai LIN, Chih-Cheng LEE
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20240170603
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Yi WU, Chang Chin TSAI, Bo-Yu HUANG, Ying-Chung CHEN
  • SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20240170302
    Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chenghan SHE
  • Electronic device
    Patent number: 11991827
    Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: May 21, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chun-Yen Ting, Pao-Nan Lee, Hung-Chun Kuo, Jung Jui Kang, Chang Chi Lee
  • Optical module
    Patent number: 11988553
    Abstract: An optical module is disclosed. The optical module includes a carrier, an optical emitter disposed over the carrier, and a monitor disposed over the carrier and configured to adjust a property of a first light emitted from the optical emitter.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: May 21, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo Sin Huang, Tien-Chia Liu, Ko-Fan Tsai, Cheng-Te Chou, Yan-Te Chou
  • Electronic device
    Patent number: 11990385
    Abstract: An electronic device is provided. The electronic device includes an electronic component and a heat dissipation structure. The electronic component has a passive surface and a plurality of conductive vias exposed from the passive surface. The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: May 21, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Li-Chieh Hung, Hung-Chun Kuo
  • EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20240164021
    Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.
    Type: Application
    Filed: January 23, 2024
    Publication date: May 16, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Fan CHEN, Chien-Hao WANG
  • ELECTRONIC DEVICE
    Publication number: 20240162612
    Abstract: The present disclosure provides an electronic device. The electronic device includes a first transceiving element, a second transceiving element disposed over the first transceiving element, and a radiating structure configured to radiate a first EM wave having a lower frequency and a second EM wave having a higher frequency. The first transceiving element and the second transceiving element are collectively configured to provide a higher gain or bandwidth for the first EM wave than for the second EM wave.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-An LIN, Guan-Wei CHEN, Shih-Wen LU
  • Optoelectronic package and method of manufacturing the same
    Patent number: 11982853
    Abstract: An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.
    Type: Grant
    Filed: October 1, 2021
    Date of Patent: May 14, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jr-Wei Lin, Mei-Ju Lu
  • Electronic module having transducers radiating ultrasonic waves
    Patent number: 11985479
    Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.
    Type: Grant
    Filed: February 14, 2023
    Date of Patent: May 14, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih Lung Lin, Kuei-Hao Tseng, Kai Hung Wang