Patents Assigned to Advanced Semiconductor Engineering
  • PACKAGE STRUCTURE, OPTICAL STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230317589
    Abstract: A package structure includes a first die, a second die, an encapsulant and at least one electrical contact. The first die has an active surface. The second die is disposed on the first die, and has an active surface and a backside surface opposite to the active surface. The active surface of the second die is closer to the active surface of the first die than the backside surface of the second die is. The encapsulant encapsulates the first die and the second die, and has a top surface far away from the active surface of the first die. The electrical contact is exposed from the top surface of the encapsulant and is configured for connecting at least one conductive wire.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yu-Ying Lee
  • ELECTRONIC DEVICE WITH MAGNETIC ASSEMBLY
    Publication number: 20230301591
    Abstract: An electronic device is provided. The electronic device includes a flexible body having a first portion and a second portion, an electronic component in the first portion and the second portion of the flexible body, a first magnetic element in the first portion of the flexible body and a second magnetic element in the second portion of the flexible body. The first magnetic and the second magnetic generate a repulsive force with each other when the flexible body is bent and the first portion and the second portion of the flexible body are moved toward each other.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 28, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chao Wei LIU
  • ELECTRONIC DEVICE
    Publication number: 20230305605
    Abstract: An electronic device is disclosed. The electronic device includes a first part, a second part adjacent to the first part and a rotational shaft. The rotational shaft includes an antenna and configured to allow the first part and the second part to rotate about a rotation axis defined by the rotational shaft.
    Type: Application
    Filed: March 24, 2022
    Publication date: September 28, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yi CHEN
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20230307380
    Abstract: A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first electronic component and supported by the support component.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 28, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Nan LIN, Ming-Chiang LEE, Yung-I YEH
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230298985
    Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S 11 parameter of the connector is less than ?20 dB.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 21, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yuanhao YU, Cheng Yuan CHEN, Chun Chen CHEN, Jiming LI, Chien-Wen TU
  • SEMICONDUCTOR PACKAGE INCLUDING ANTENNA SUBSTRATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230299462
    Abstract: A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.
    Type: Application
    Filed: May 30, 2023
    Publication date: September 21, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Han-Chee YEN
  • ELECTRONIC DEVICE
    Publication number: 20230275000
    Abstract: An electronic device is provided. The electronic device includes an electronic component and a heat dissipation structure. The electronic component has a passive surface and a plurality of conductive vias exposed from the passive surface. The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Li-Chieh HUNG, Hung-Chun KUO
  • ELECTRONIC DEVICE
    Publication number: 20230274998
    Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.
    Type: Application
    Filed: February 25, 2022
    Publication date: August 31, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-Chih PAN, Hung-Chun KUO
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230268295
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a carrier having a first side and a second side adjacent to the first side. The semiconductor device also includes a first antenna adjacent to the first side and configured to operate at a first frequency and a second antenna adjacent to the second side and configured to operate at a second frequency different from the first frequency. An method of manufacturing a semiconductor device is also provided.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Shyue-Long LOUH
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20230268638
    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first antenna pattern disposed at a first elevation and a second antenna pattern disposed at a second elevation different from the first elevation. The first antenna pattern and the second antenna pattern define an air cavity. The semiconductor device package also includes a circuit layer. The air cavity is between the first antenna pattern, the second antenna pattern, and the circuit layer.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yu HO, Meng-Wei HSIEH
  • ELECTRONIC DEVICE
    Publication number: 20230268293
    Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE
  • SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230268314
    Abstract: A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a package component having a first mounting surface and a second mounting surface; and a first electronic component having a first conductive pad signal communicatively mounted on the first mounting surface through a first type connector; wherein the first type connector comprises a first solder composition having a lower melting point layer sandwiched between a pair of higher melting point layers, wherein the lower melting point layer is composed of alloys capable of forming a room temperature eutectic.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shan-Bo WANG, Chin-Li KAO, An-Hsuan HSU
  • ELECTRONIC DEVICE WITH FRAME COMPONENT
    Publication number: 20230268254
    Abstract: An electronic device is provided. The electronic device includes a circuit pattern layer. The circuit pattern layer includes a first surface, a second surface recessed with respect to the first surface; and a third surface recessed with respect to the first surface and adjacent to and spaced apart from the second surface. The second surface and the third surface are mis-aligned with each other.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Hui-Chen HSU
  • ELECTRONIC DEVICE
    Publication number: 20230269866
    Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.
    Type: Application
    Filed: February 24, 2022
    Publication date: August 24, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Jhen CIOU, Jenchun CHEN, Chang-Fu LU, Pai-Sheng SHIH
  • WIRING STRUCTURE
    Publication number: 20230268264
    Abstract: A wiring structure includes a test pattern layer. The test pattern layer includes a test circuit pattern and a heat dissipating structure. The heat dissipating structure is disposed adjacent to the test circuit pattern, and is configured to reduce temperature rise of the test circuit pattern when a power is applied to the test circuit pattern.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ting Wei HSU
  • ELECTRONIC STRUCTURE
    Publication number: 20230260957
    Abstract: An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the packaging structure. The underfill is disposed in the gap. The protrusion structure is disposed in the gap, and is configured to facilitate the distributing of the underfill in the gap.
    Type: Application
    Filed: February 11, 2022
    Publication date: August 17, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-Jen CHENG, Wei-Jen WANG, Fu-Yuan CHEN
  • SEMICONDUCTOR DEVICE PACKAGES INCLUDING AN INDUCTOR AND A CAPACITOR
    Publication number: 20230261036
    Abstract: A semiconductor device package includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a dielectric layer, a third patterned conductive layer and a connector. The substrate has a top surface. The first patterned conductive layer is on the top surface of the substrate. The second patterned conductive layer contacts the first patterned conductive layer. The second patterned conductive layer includes a first portion, a second portion and a third portion. The second portion is connected between the first portion and the third portion. The dielectric layer is on the top surface of the substrate. The dielectric layer covers the first patterned conductive layer and surrounds the second portion and the third portion of the second patterned conductive layer. The first portion of the second patterned conductive layer is disposed on the dielectric layer.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Teck-Chong LEE
  • ELECTRONIC PACKAGE
    Publication number: 20230253299
    Abstract: An electronic package is provided. The electronic package includes an electronic component and a leadframe. The electronic component has a passive surface. The leadframe includes a first patterned part under the electronic component and configured to provide a power to the electronic component by the passive surface.
    Type: Application
    Filed: February 10, 2022
    Publication date: August 10, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO
  • ELECTRONIC PACKAGE
    Publication number: 20230253305
    Abstract: An electronic package is provided. The electronic package includes a power regulating component, an electronic component, and a circuit structure. The circuit structure separates the power regulating component and the electronic component. The circuit structure is configured to provide a first power to the power regulating component. The power regulating component is configured to provide a second power to the electronic component through the circuit structure.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 10, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chiung-Ying KUO, Hung-Chun KUO
  • ELECTRONIC PACKAGE
    Publication number: 20230253302
    Abstract: An electronic package is disclosed. The electronic package includes an electronic component and a plurality of power regulating components. The plurality of power regulating components includes a first power regulating component and a second power regulating component. A first power path is established from the first power regulating component to a backside surface of the electronic component. A second power path is established from the second power regulating component to the backside surface of the electronic component.
    Type: Application
    Filed: February 10, 2022
    Publication date: August 10, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Nan LEE, Chen-Chao WANG, Chang Chi LEE