Patents Assigned to Advanced Semiconductor Engineering
  • ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230115954
    Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.
    Type: Application
    Filed: October 13, 2021
    Publication date: April 13, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: En Hao HSU, Kuo Hwa TZENG, Chia-Pin CHEN, Chi Long TSAI
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230114278
    Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate and an interconnection. The second substrate is arranged above the first substrate and has an opening. The interconnection passes through the opening and connects to the first substrate and the second substrate.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 13, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chao Wei LIU
  • METHOD OF MANUFACTURING ELECTRICAL PACKAGE
    Publication number: 20230106612
    Abstract: A method for manufacturing an electrical package is provided. The method include: providing a substrate having a first surface and a second surface opposite to the first surface, wherein the second surface has a first level difference; forming an adhesive layer on the second surface of the substrate, wherein the adhesive layer is configured to cover the second surface and provides a third surface spaced apart from the second surface of the substrate, wherein the third surface has a second level difference; disposing a tape on the third surface of the adhesive layer; and performing a removing operation on the first surface of the substrate; wherein the second level difference is smaller than the first level difference.
    Type: Application
    Filed: October 5, 2021
    Publication date: April 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen-Pin HUANG, Fu Tang CHU, Pei I CHANG, Chia Hao CHEN, Tsuan Ching KUO
  • SEMICONDUCTOR PACKAGE SHIELDING STRUCTURE
    Publication number: 20230104397
    Abstract: A selective EMI shielding structure for a semiconductor package and a method of fabrication thereof is disclosed. The semiconductor package, comprising: a substrate having a first face; at least one first electronic component mounted adjacent to a first region of the first face; a least one second electronic component mounted adjacent to a second region of the first face; and an encapsulant disposed over the first and the second electronic components, wherein the encapsulant covers directly over the first electronic component, and wherein the encapsulant covers the second electronic component through a layer of conductive material.
    Type: Application
    Filed: October 1, 2021
    Publication date: April 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Meng-Jen WANG, Chien-Yuan TSENG, Hung Chen KUO, Ying-Hao WEI, Chia-Feng HSU, Yuan-Long CHIAO
  • OPTOELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230103713
    Abstract: An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.
    Type: Application
    Filed: October 1, 2021
    Publication date: April 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU
  • OPTOELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230105803
    Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.
    Type: Application
    Filed: October 1, 2021
    Publication date: April 6, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Mei-Ju LU, Jr-Wei LIN, Chang-Feng YOU
  • ELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230096703
    Abstract: An electronic package structure and a method of manufacturing an electronic package structure are provided. The electronic package structure includes a substrate, a conductive element, and a support structure. The substrate has a bottom surface and a lateral surface angled with the bottom surface. The conductive element is on the lateral surface of the substrate. The support structure is on the bottom surface of the substrate and configured to space the bottom surface from an external carrier. A lateral surface of the support structure is spaced apart from the lateral surface of the substrate by a first distance.
    Type: Application
    Filed: September 30, 2021
    Publication date: March 30, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yu-Ying LEE
  • ELECTRONIC PACKAGE
    Publication number: 20230097299
    Abstract: An electronic package includes a carrier, a protection layer and an electronic component. The carrier includes a dielectric layer and a pad in contact with the dielectric layer. The protection layer at least partially covers the pad. The electronic component is located over the protection layer and electrically connected to the pad. At least one portion of the protection layer under the electronic component is substantially conformal with a profile of the pad or with a profile of the dielectric layer.
    Type: Application
    Filed: September 16, 2021
    Publication date: March 30, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: You-Lung YEN, Bernd Karl APPELT
  • SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE PILLARS AND REINFORCING AND ENCAPSULATING LAYERS
    Publication number: 20230094668
    Abstract: A semiconductor device package includes a redistribution layer, a plurality of conductive pillars, a reinforcing layer and an encapsulant. The conductive pillars are in direct contact with the first redistribution layer. The reinforcing layer surrounds a lateral surface of the conductive pillars. The encapsulant encapsulates the first redistribution layer and the reinforcing layer. The conductive pillars are separated from each other by the reinforcing layer.
    Type: Application
    Filed: December 6, 2022
    Publication date: March 30, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ya Fang CHAN, Yuan-Feng CHIANG
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20230092873
    Abstract: A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a substrate having a first face and an opposing second face, wherein the first face is mounted with a first semiconductor component and a plurality of connectors; and a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors.
    Type: Application
    Filed: September 23, 2021
    Publication date: March 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chanyuan LIU, Kuo-Hsien LIAO, Yu-Hsiang SUN
  • SEMICONDUCTOR DEVICE PACKAGE INCLUDING PROMOTERS AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230088723
    Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230092252
    Abstract: A semiconductor package structure includes a semiconductor die and at least one pillar structure. The semiconductor die has an upper surface and includes at least one conductive pad disposed adjacent to the upper surface. The pillar structure is electrically connected to the conductive pad of the semiconductor die, and defines a recess portion recessed from a side surface of the pillar structure. A conductivity of the pillar structure is greater than a conductivity of the conductive pad.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yung-Shun CHANG, Meng-Wei HSIEH, Teck-Chong LEE
  • ANTENNA MODULE AND SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20230086019
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • PHOTONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230077877
    Abstract: A photonic package and a method of manufacturing a photonic package are provided. The photonic package includes a carrier, an electronic component, and a photonic component. The carrier has a first surface and a recess portion exposed from the first surface. The electronic component is disposed in recessed portion. The photonic component is disposed on and electrically connected to the electronic component and is configured to communicate optical signals.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 16, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hung-Yi LIN
  • OPTOELECTRONIC DEVICE
    Publication number: 20230081194
    Abstract: An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 16, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU, Jung Jui KANG
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230078564
    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.
    Type: Application
    Filed: November 18, 2022
    Publication date: March 16, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hung-Yi LIN, Meng-Wei HSIEH, Yu-Pin TSAI
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230075336
    Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Cheng-Yuan KUNG
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230075021
    Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The electronic device includes a first carrier having a first surface, an interposer disposed over the first surface of the first carrier, wherein the interposer has a first thickness and a second thickness in a direction substantially perpendicular to the first surface of the first carrier; and a plurality of electrical connections between the first carrier and the interposer and configured to compensate a difference between the first thickness and the second thickness of the interposer.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ching-Feng CHENG
  • OPTICAL ADAPTIVE DEVICE AND WEARABLE DEVICE
    Publication number: 20230074105
    Abstract: The present disclosure provides an optical adaptive device and a wearable device. The optical adaptive device includes a carrier, a first light adjusting element, and a second light adjusting element. The first light adjusting element is in or on the carrier and configured to focus a first light from a first article on a visual area. The second light adjusting element is in or on the carrier and configured to focus a second light from a second article on the visual area. The second article is further away from the area than the first article.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ko-Fan TSAI, Tien-Chia LIU, Kuo Sin HUANG, Cheng-Te CHOU
  • ELECTRONIC MODULE AND OPTICAL DEVICE
    Publication number: 20230062337
    Abstract: The present disclosure provides an electronic module includes a light source configured to radiate a first light beam having a first wavelength and a converting device configured to receive the first light beam and to convert the first light beam to a second light beam having a second wavelength different from the first wavelength. The electronic module also includes a connection element configured to transmit the first light beam from the light source to the converting device and adapted to a predetermined geometric relationship between the light source and the converting device to meet a condition of total internal reflection.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Chieh TANG, Ying-Chung CHEN