Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
Type:
Application
Filed:
August 27, 2021
Publication date:
March 2, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic package is provided. The electronic package includes a first circuit structure, a second circuit structure, and an underfill. The second circuit structure is disposed over the first circuit structure. The underfill is disposed between the first circuit structure and the second circuit structure. An inner portion of the underfill has an inner lateral surface adjacent to and is substantially conformal with a lateral surface of the second circuit structure. A first top end of the inner lateral surface is not level with a top surface of the second circuit structure. An outer portion of the underfill has a second top end higher than the first top end.
Type:
Application
Filed:
August 27, 2021
Publication date:
March 2, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.
Type:
Application
Filed:
September 2, 2021
Publication date:
March 2, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic device includes a first electronic component, an encapsulant and a second electronic component. The encapsulant encapsulates the first electronic component. The second electronic component is disposed over the first electronic component and separated from the encapsulant. The second electronic component is configured to receive a power from the first electronic component.
Type:
Application
Filed:
August 27, 2021
Publication date:
March 2, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic package structure, an electronic substrate, and a method of manufacturing an electronic package structure are provided. The electronic package structure includes a substrate. The substrate includes a bonding region and an alignment structure. The bonding region is located at a side of the substrate and configured to bond with an electronic component. The alignment structure is located at the side of the substrate and out of the bonding region and configured to providing a fiducial mark for position-aligning, wherein the alignment structure comprises a first region and a second region visually distinct from the first region.
Type:
Application
Filed:
August 27, 2021
Publication date:
March 2, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.
Type:
Application
Filed:
August 19, 2021
Publication date:
February 23, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.
Type:
Application
Filed:
August 19, 2021
Publication date:
February 23, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.
Type:
Application
Filed:
August 20, 2021
Publication date:
February 23, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.
Type:
Application
Filed:
August 19, 2021
Publication date:
February 23, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic carrier and a method of manufacturing an electronic carrier are provided. The electronic carrier includes a first interconnection structure and a second interconnection structure. The first interconnection structure includes a first patterned conductive layer having a first pattern density. The second interconnection structure is laminated to the first interconnection structure and includes a second patterned conductive layer having a second pattern density higher than the first pattern density. The first interconnection structure is electrically coupled to the second interconnection structure through a first non-soldering joint between and outside of the first interconnection structure and the second interconnection structure.
Type:
Application
Filed:
August 13, 2021
Publication date:
February 16, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An optical element is provided. The optical device includes a carrier, a first receiver, and a second receiver. The first receiver is disposed on the carrier and configured to receive a first light. The second receiver is disposed on the carrier and configured to receive a second light. The first light and the second light have different frequency bands.
Type:
Application
Filed:
August 12, 2021
Publication date:
February 16, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.
Type:
Application
Filed:
August 6, 2021
Publication date:
February 9, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: A wearable device is provided. The wearable device includes an electronic component and an encapsulant. The encapsulant includes a low-penetrability region encapsulating the electronic component and a high-penetrability region physically separated from the electronic component.
Type:
Application
Filed:
August 6, 2021
Publication date:
February 9, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier and an antenna element. The carrier includes a plurality of pads and has a surface exposing the pads. The antenna element is disposed above the pads. A lateral surface of one of the pads is farther from a central axis of the antenna element substantially perpendicular to the surface than from a lateral surface of the antenna element.
Type:
Application
Filed:
August 6, 2021
Publication date:
February 9, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.
Type:
Application
Filed:
August 6, 2021
Publication date:
February 9, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
Type:
Application
Filed:
August 6, 2021
Publication date:
February 9, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: An electronic package includes a patterned conductive layer and at least one conductive protrusion on the patterned conductive layer. The at least one conductive protrusion has a first top surface. The patterned conductive layer and the at least one conductive protrusion define a space. The electronic package further includes a first electronic component disposed in the space and a plurality of conductive pillars on the first electronic component. The conductive pillars have a second top surface. The first top surface is substantially level with the second top surface.
Type:
Application
Filed:
August 5, 2021
Publication date:
February 9, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Inventors:
You-Lung YEN, Bernd Karl APPELT, Kay Stefan ESSIG
Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.
Type:
Application
Filed:
October 18, 2022
Publication date:
February 9, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Inventors:
Ming-Tau HUANG, Kuei-Hao TSENG, Hung-I LIN
Abstract: A method of manufacturing a semiconductor structure is provided. The method includes the following operations: providing a semiconductor substrate; performing a first cutting operation along a first set of cutting lines of the semiconductor substrate; and performing a second cutting operation along a second set of cutting lines of the semiconductor substrate later than performing the first cutting operation, wherein the second set of cutting lines are arranged interlacedly with the first set of cutting lines along a first direction.
Type:
Application
Filed:
July 30, 2021
Publication date:
February 2, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Inventors:
Bo Hua CHEN, Yan Ting SHEN, Tsung Chi WU, Tai-Hung KUO
Abstract: A electronic package and a method of manufacturing the same are provided. The electronic package includes an electronic component, a thermal spreading element, and an encapsulant. The electronic component has a first surface. The thermal spreading element is disposed over the electronic component and has a first surface facing the first surface of the electronic component. The encapsulant covers the electronic component and has a first surface closer to the first surface of the thermal spreading element than the first surface of the electronic component.
Type:
Application
Filed:
July 30, 2021
Publication date:
February 2, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.