Abstract: An approach to use silicided bit line contacts that do not short to the underlying substrate in memory devices. The approach provides for silicide formation in the bit line contact area, using a process that benefits from being self-aligned to the oxide-nitride-oxide (ONO) nitride edges. A further benefit of the approach is that the bit line contact implant and rapid temperature anneal process can be eliminated. This approach is applicable to embedded flash, integrating high density devices and advanced logic processes.
Type:
Application
Filed:
April 17, 2017
Publication date:
August 31, 2017
Applicant:
Cypress Semiconductor Corporation
Inventors:
Ching-Huang LU, Simon S. Chan, Hidehiko Shiraiwa, Lei Xue
Abstract: Apparatuses and methods of distinguishing between a finger and a stylus proximate to a touch surface are described. One apparatus includes a first circuit to obtain capacitance measurements of sense elements when a conductive object is proximate to a touch surface. The apparatus also includes a second circuit coupled to the first circuit. The second circuit is operable to detect whether the conductive object activates the first sense element, second sense element, or both, in view of the capacitance measurements. To distinguish between a stylus and a finger as the conductive object, the second circuit determines the conductive object as being the stylus when the second sense element is activated and the first sense element is not activated and determines the conductive object as being the finger when the first sense element and the second sense element are activated.
Abstract: A semiconductor device includes a polysilicon substrate, a first oxide layer formed on the polysilicon substrate, an oxygen-rich nitride layer formed on the first oxide layer, a second oxide layer formed on the oxygen-rich nitride layer, and an oxygen-poor nitride layer formed on the second oxide layer.
Type:
Grant
Filed:
August 11, 2015
Date of Patent:
August 29, 2017
Assignee:
CYPRESS SEMICONDUCTOR CORPORATION
Inventors:
Fredrick B. Jenne, Krishnaswamy Ramkumar
Abstract: A capacitance-sensing circuit may include a channel input associated with measuring a capacitance of a unit cell of a capacitive sense array. The capacitance-sensing circuit may also include a capacitive hardware baseliner that is coupled to the channel input. The capacitive hardware baseliner may generate a baseline current using a baseline capacitor and may provide the baseline current to the channel input.
Type:
Grant
Filed:
March 26, 2015
Date of Patent:
August 29, 2017
Assignee:
CYPRESS SEMICONDUCTOR CORPORATION
Inventors:
Denis Ellis, Roman Ogirko, Kaveh Hosseini, Brendan Lawton, Timothy Williams, Gabriel Rowe
Abstract: Apparatuses and methods of pulse shaping a pulse signal for programming and erasing a Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) memory cell are described. In one method a pulse shape of a pulse signal is controlled to include four or more phases for programming or erasing a SONOS memory cell. A write cycle is performed to program or erase the SONOS memory with the pulse signal with the four or more phases.
Type:
Grant
Filed:
June 27, 2016
Date of Patent:
August 29, 2017
Assignee:
CYPRESS SEMICONDUCTOR CORPORATION
Inventors:
Venkatraman Prabhakar, Long T Hinh, Sarath Chandran Puthenthermadam, Kaveh Shakeri
Abstract: A charge trap memory device is provided. In one embodiment, the charge trap memory device includes a semiconductor material structure having a vertical channel extending from a first diffusion region formed in a semiconducting material to a second diffusion region formed over the first diffusion region, the vertical channel electrically connecting the first diffusion region to the second diffusion region. A tunnel dielectric layer is disposed on the vertical channel, a multi-layer charge-trapping region including a first deuterated layer disposed on the tunnel dielectric layer, a first nitride layer disposed on the first deuterated layer, and a second nitride layer comprising a deuterium-free trap-dense, oxygen-lean nitride disposed on the first nitride layer. The second nitride layer includes a majority of charge traps distributed in the multi-layer charge-trapping region.
Abstract: Manufacturing of semiconductor devices often involves performed photolithography to pattern and etch the various features of those devices. Such photolithography involves masking and focusing light onto a surface of the semiconductor device for exposing and etching the features of the semiconductor devices. However, due to design specifications and other causes, the semiconductor devices may not have a perfectly flat light-incident surface. Rather, some areas of the semiconductor device may be raised or lowered relative to other areas of the semiconductor device. Therefore, focusing the light on one area causes another to become unfocused. By carefully designing a photomask to cause phase shifts of the light transmitted therethrough, focus across all areas of the semiconductor device can be achieved during photolithography, which results in sharp and accurate patterns formed on the semiconductor device.
Abstract: A method of operating a memory interface circuit involves selectively operating the memory interface in either a synchronous mode or an asynchronous mode, the synchronous mode controlled by a first clock signal; in asynchronous mode, controlling an address latch for latching an address of a memory location in a memory array, the address latch controlled by an asynchronous address control signal synchronized to a second clock signal that is faster than a third clock signal used to operate the memory array.
Abstract: A touch-sense device includes an overlay, such as a rough overlay or a compliant overlay, on a sensing layer. Use of the overlay changes a response of the sensing layer so that a light press is more distinguishable from a strong press by sensing electronics. Distinguishing the light press from the strong press enables the sensing electronics to report additional information in response to a press. In one example, a sensor signal of the sensing layer attains a first magnitude for a light press, and a second magnitude for a strong press, enabling the strong press to be distinguished. In another example, a sensor signal has a second edge in response to a strong press, and detection of the second edge enables the strong press to be distinguished. In various embodiments, a surface of the overlay has protrusions and/or cavities and/or is compressible.
Abstract: Disclosed herein is a semiconductor device including a first dielectric disposed over a channel region of a transistor formed in a substrate and a gate disposed over the first dielectric. The semiconductor device further includes a second dielectric disposed vertically, substantially perpendicular to the substrate, at an edge of the gate, and a spacer disposed proximate to the second dielectric. The spacer includes a cross-section with a perimeter that includes a top curved portion and a vertical portion that is substantially perpendicular to the substrate. Further, disclosed herein, are methods associated with the fabrication of the aforementioned semiconductor device.
Abstract: The present method of forming an electronic structure includes providing a tantalum base layer and depositing a layer of copper on the tantalum layer, the deposition being undertaken by physical vapor deposition with the temperature of the base layer at 50.degree. C. or less, with the deposition taking place at a power level of 300 W or less.
Type:
Grant
Filed:
June 24, 2014
Date of Patent:
August 8, 2017
Assignee:
Cypress Semiconductor Corporation
Inventors:
Wen Yu, Stephen B. Robie, Jeremias D. Romero
Abstract: Techniques for power Field Effect Transistor (power-FET) gate drivers are described herein. In an example embodiment, a device comprises a Universal Serial Bus (USB) subsystem that is disposed in a monolithic integrated circuit (IC). The USB subsystem comprises a gate-driver circuit configured to selectively control an external N-channel power-FET or an external P-channel power-FET.
Abstract: Embodiments described herein generally relate to methods of manufacturing n-type lightly doped drains and p-type lightly doped drains. In one method, photoresist mask is used to etch a transistor, and the mask is left in place (i.e., reused) to protect other devices and poly while a high energy implantation is performed in alignment with the photoresist mask, such that the implantation is adjacent to the etched transistor. One example of a high energy implantation is forming lightly doped source and dram regions. This technique of reusing a photoresist mask can be employed for creating lightly doped source and drain regions of one conductivity followed by using the technique a second time to create lightly doped source and drain regions of the complementary conductivity type. This may prevent use of at least one hard mask during manufacturing.
Abstract: A data writing method for writing data to a flash memory includes writing an initial value to the data storage area, determining whether or not the writing of the initial value is performed normally based on a write flag, writing data to the data storage area when the writing is performed normally, and erasing a block including the data storage area when the writing is not performed normally. An initial value is written to the data storage area before writing data, so that whether or not an error correction code storage area contains the initial value may be confirmed. An erase operation of the block is performed only when the error correction code storage area does not contain the initial value, so that the number of times of erasure of the block may be reduced and the life of the product may be increased.
Abstract: Memory cells including embedded SONOS based non-volatile memory (NVM) and MOS transistors and methods of forming the same are described. Generally, the method includes: forming a gate stack of a NVM transistor in a NVM region of a substrate including the NVM region and a plurality of MOS regions; and depositing a high-k dielectric material over the gate stack of the NVM transistor and the plurality of MOS regions to concurrently form a blocking dielectric comprising the high-k dielectric material in the gate stack of the NVM transistor and high-k gate dielectrics in the plurality of MOS regions. In one embodiment, a first metal layer is deposited over the high-k dielectric material and patterned to concurrently form a metal gate over the gate stack of the NVM transistor, and a metal gate of a field effect transistor in one of the MOS regions.
Abstract: A reconfigurable circuit includes a plurality of processing elements and an input/output data interface unit, and the reconfigurable circuit is configured to control connections of the plurality of processing elements for each context. The input/output data interface unit is configured to hold operation input data which is input to the plurality of processing elements and operation output data which is output from the plurality of processing elements. The input/output data interface unit includes a plurality of ports, and a plurality of registers. The registers are configured to be connected to the plurality of ports, and to include m (m being an integer of 2 or more) number of banks in a depth direction.
Abstract: Target device monitoring systems and methods are presented. In one embodiment, a host emulation target device control method includes receiving high level express interface direction to change a design element value. The design element values are associated with an operating target device. Design element values corresponding to the direction are created. The design element values are also forwarded to the operating target device in real time.
Type:
Grant
Filed:
March 28, 2008
Date of Patent:
August 1, 2017
Assignee:
Cypress Semiconductor Corporation
Inventors:
Kenneth Ogami, Andrew Best, Marat Zhaksilikov
Abstract: A programmable device, having an analog component coupled with an analog bus and a digital component coupled with a digital bus together with a set of 10 pads, each of which capable of being coupled to a bus line of one segment of the analog bus as well as to at least one digital bus line, and where the analog bus is capable of being used to connect a pair of the pads to each other.
Type:
Grant
Filed:
November 13, 2014
Date of Patent:
August 1, 2017
Assignee:
Cypress Semiconductor Corporation
Inventors:
Timothy J. Williams, David G. Wright, Harold Kutz, Eashwar Thiagarajan, Warren S. Snyder, Mark E Hastings
Abstract: Scaling a charge trap memory device and the article made thereby. In one embodiment, the charge trap memory device includes a substrate having a source region, a drain region, and a channel region electrically connecting the source and drain. A tunnel dielectric layer is disposed above the substrate over the channel region, and a multi-layer charge-trapping region disposed on the tunnel dielectric layer. The multi-layer charge-trapping region includes a first deuterated layer disposed on the tunnel dielectric layer, a first nitride layer disposed on the first deuterated layer and a second nitride layer.