Abstract: Disclosed herein are system, apparatus, methods and/or combinations and sub-combinations thereof, for using a read data strobe signal received at a host device from a peripheral device to convey variable latency (flow) control or report an error in the data content read from the peripheral device. Reception of the read data strobe signal before a predetermined maximum latency time, provides variable latency control back to the host by indicating when valid data is available for capture. If the read data strobe signal is not received before expiration of a predetermined maximum latency time, the peripheral controller is indicating a read data error back to the host.

Abstract: Systems and methods for driving a non-volatile memory device in a standby operating condition are disclosed. A standby detection circuit detects whether the non-volatile memory system is in a standby condition. In response to determining that the non-volatile memory system is in a standby condition, a bias control circuit provides bias currents to drivers of the non-volatile memory system in a standby mode.

Abstract: A programmable system includes a programmable analog system that is reconfigurable to perform various analog operations, and includes a programmable digital system that is reconfigurable to perform various digital operations. The programmable system also includes a microcontroller capable of reconfiguring and controlling the programmable analog system and the programmable digital system. The programmable digital system is configured to control the programmable analog system autonomously of the microcontroller.

Abstract: A method of programming a memory system by selectively applying a program voltage to a selected wordline connected to a memory transistor to be programmed. A first bias voltage is applied to a first wordline adjacent to the source side of the selected wordline. The first bias voltage is also applied to a second wordline adjacent to the drain side of the selected wordline. A second bias voltage is applied to a third wordline adjacent to the drain side of the second wordline. A third bias voltage is applied to a fourth wordline adjacent to the source side of the first wordline. A pass voltage is also applied to the remaining wordlines that do not have one of a bias voltage and a program voltage applied, the pass voltage a selected voltage level.

Abstract: An embodiment of a semiconductor memory device including a multi-layer charge storing layer and methods of forming the same are described. Generally, the device includes a channel formed from a semiconducting material overlying a surface on a substrate connecting a source and a drain of the memory device; a tunnel oxide layer overlying the channel; and a multi-layer charge storing layer including an oxygen-rich, first oxynitride layer on the tunnel oxide layer in which a stoichiometric composition of the first oxynitride layer results in it being substantially trap free, and an oxygen-lean, second oxynitride layer on the first oxynitride layer in which a stoichiometric composition of the second oxynitride layer results in it being trap dense. In one embodiment, the device comprises a non-planar transistor including a gate having multiple surfaces abutting the channel, and the gate comprises the tunnel oxide layer and the multi-layer charge storing layer.

Abstract: A semiconductor device includes a first semiconductor chip having a pad electrode formed on an upper surface thereof; a resin section sealing the first semiconductor chip with the upper surface and a side surface of the first semiconductor chip being covered and a lower surface of the first semiconductor chip being exposed; a columnar electrode communicating between the upper surface and the lower surface of the resin section with the upper surface and the lower surface of the columnar electrode being exposed on the resin section and at least a part of the side surface of the columnar electrode being covered; and a bonding wire connecting the pad electrode and the columnar electrode with a part of the bonding wire being embedded in the columnar electrode as one end of the bonding wire being exposed on the lower surface of the columnar electrode and the remaining part of the bonding wire being covered with the resin section, and a method for manufacturing the same.

Abstract: A capacitive sensor includes a switching capacitor circuit, a comparator, and a charge dissipation circuit. The switching capacitor circuit reciprocally couples a sensing capacitor in series with a modulation capacitor during a first switching phase and discharges the sensing capacitor during a second switching phase. The comparator is coupled to compare a voltage potential on the modulation capacitor to a reference and to generate a modulation signal in response. The charge dissipation circuit is coupled to the modulation capacitor to selectively discharge the modulation capacitor in response to the modulation signal.

Abstract: A circuit includes a biasing circuit that includes a load circuit coupled to a first node. The biasing circuit can output a biasing signal on the first node. The biasing circuit also includes a timer component and a current source. An input of the timer component is coupled to receive an isolation signal. The current source is configured to inject current for a period of time into the load circuit in response to a transition of the ISO signal between a high voltage and a low voltage. The biasing circuit also includes circuitry to generate an isolation delayed (ISO_DEL) signal. The ISO_DEL signal has a high voltage in response to the biasing signal being within a first threshold level and the ISO_DEL signal has a low voltage in response to the biasing signal being within a second threshold level. The biasing circuit outputs the ISO_DEL signal.

Abstract: A semiconductor device which includes a first semiconductor chip 10, a first electrode 12 formed on the first semiconductor chip 10, a second semiconductor chip 20 to which the first semiconductor chip 10 is mounted, a second electrode 22 with a protrusion 24, which is formed on the second semiconductor chip 20, and a solder bump 14 which bonds the first electrode 12 and the second electrode 22 to cover at least a part of a side surface of the protrusion 24, and a method for manufacturing thereof are provided.

Abstract: A system and method for providing electrical isolation between closely spaced devices in a high density integrated circuit (IC) are disclosed herein. An integrated circuit (IC) comprising a substrate, a first device, a second device, and a trench in the substrate and a method of fabricating the same are also discussed. The trench is self-aligned between the first and second devices and comprises a first filled portion and a second filled portion. The first fined portion of the trench comprises a dielectric material that forms a buried trench isolation for providing electrical isolation between the first and second devices. The self-aligned placement of the buried trench isolation allows for higher packing density without negatively affecting the operation of closely spaced devices in a high density IC.

Abstract: A capacitive sensor array includes a second sensor element intersecting a first sensor element to form an intersection associated with a unit cell. The second sensor element includes, within the unit cell: a first primary trace crossing the unit cell and a second primary trace crossing the unit cell, a first secondary trace connecting the first primary trace and the second primary trace, and a first tertiary trace branching away from the first secondary trace between the first primary trace and the second primary trace. An area of the first sensor element is greater than an area of the second sensor element within the unit cell.

Abstract: Various aspects provide for a new combination of non-volatile memory architecture and memory processing technology. A memory cell has a gate node, a source node and a drain node. The gate node is connected to a wordline of the memory, the source node is connected to a local source line of the memory, and the drain node is connected to a local data line of the memory. A channel-based processing component programs the memory cell and inhibits programming of a second memory cell on the wordline of the memory. The channel-based processing component also grounds the local source line and the local data line in conjunction with programming the memory cell, and floats a second local source line and a second local data line connected to the second memory cell in conjunction with inhibiting programming of the second memory cell.

Abstract: An integrated circuit comprises a first poly-silicon region including a first poly-silicon layer, a second poly-silicon layer disposed over the first poly-silicon layer, a first poly-silicon finger associated with the first poly-silicon layer, and a second poly-silicon finger associated with the second poly-silicon layer. The first poly-silicon finger and the second poly-silicon finger are oriented in a substantially orthogonal manner relative to each other. The integrated circuit comprises a second poly-silicon gate region including the first poly-silicon layer. The first polysilicon gate region and the second polysilicon gate region each have different poly-silicon gate structures.

Abstract: An embodiment of a nonvolatile charge trap memory device is described. In one embodiment, the device comprises a channel comprising silicon overlying a surface on a substrate electrically connecting a first diffusion region and a second diffusion region of the memory device, and a gate stack intersecting and overlying at least a portion of the channel, the gate stack comprising a tunnel oxide abutting the channel, a split charge-trapping region abutting the tunnel oxide, and a multi-layer blocking dielectric abutting the split charge-trapping region. The split charge-trapping region includes a first charge-trapping layer comprising a nitride closer to the tunnel oxide, and a second charge-trapping layer comprising a nitride overlying the first charge-trapping layer. The multi-layer blocking dielectric comprises at least a high-K dielectric layer.

Abstract: A system and method for programming a memory device with debug data upon a system failure is disclosed herein. For example, the system can include a timer device, a buffer, a register, and a memory device. The buffer can be configured to receive debug data. The register can be configured to receive memory address information. Also, the memory device can be configured to store the debug data from the buffer at a memory address corresponding to the memory address information when a timer value of the timer device reaches zero. Further, the system can include a processing unit configured to provide the timer value to the timer device and the memory address information to the register.

Abstract: A non-volatile memory and methods of operating the same to reduce disturbs is provided. In one embodiment, the method includes coupling a first positive high voltage to a first global wordline in a first row of an array of memory cells, and coupling a second negative high voltage (VNEG) to a first bitline in a first column of the array to apply a bias to a non-volatile memory transistor in a selected memory cell to program the selected memory cell. A margin voltage having a magnitude less than VNEG is coupled to a second global wordline in a second row of the array, and an inhibit voltage coupled to a second bitline in a second column of the array to reduce a bias applied to a non-volatile memory transistor in an unselected memory cell to reduce program disturb of data programmed in the unselected memory cell due to programming.

Abstract: A DC-DC converter includes an input terminal Pin receiving an voltage input, switching circuits connected in parallel between the input terminal Pin and ground, an output terminal Pout from which converted voltage is output, and a controller that turns the switching circuits on in a predetermined cycle by inputting, into each of the switching circuits, a control signal that turns the switching circuits on individually.

Abstract: The present claimed subject matter is directed to memory device that includes substrate, a tunneling layer over the substrate, a floating gate over the tunneling layer, a dielectric over the floating gate and including silicon oxynitride, and a control gate over the dielectric.

Abstract: Methods and structures for stack type semiconductor packaging are disclosed. In one embodiment, a semiconductor device includes a semiconductor chip mounted onto a substrate, a first resin molding portion formed on the substrate for sealing the semiconductor chip, and a through metal mounted on the substrate so as to pierce the first resin molding portion around the semiconductor chip. The semiconductor device further comprises an upper metal electrically coupled with the through metal and mounted on the first resin molding portion to extend from the through metal toward the semiconductor chip along an upper surface of the first resin molding portion, where the through metal and the upper metal are formed into an integral structure.

Abstract: Embodiments of the present technology are directed toward gate sidewall engineering of field effect transistors. The techniques include formation of a blocking dielectric region and nitridation of a surface thereof. After nitridation of the blocking dielectric region, a gate region is formed thereon and the sidewalls of the gate region are oxidized to round off gate sharp corners and reduce the electrical field at the gate corners.