Abstract: The present invention provides a semiconductor device that has a shorter distance between the bit lines and easily achieves higher storage capacity and density. The semiconductor device includes: first bit lines formed on a substrate; an insulating layer that is provided between the first bit lines and in a groove in the substrate, and has a higher upper face than the first bit lines; channel layers that are provided on both side faces of the insulating layer, and are coupled to the respective first bit lines; and charge storage layers that are provided on the opposite side faces of the channel layers from the side faces on which the insulating layers are formed.

Abstract: Embodiments of the present invention include a data storage device and a method for storing data in a hash table. The data storage device can include a first memory device, a second memory device, and a processing device. The first memory device is configured to store one or more data elements. The second memory device is configured to store one or more status bits at one or more respective table indices. In addition, each of the table indices is mapped to a corresponding table index in the first memory device. The processing device is configured to calculate one or more hash values based on the one or more data elements.

Abstract: Methods are provided for fabricating memory devices. A method comprises fabricating charge-trapping stacks overlying a silicon substrate and forming bit line regions in the substrate between the charge trapping stacks. Insulating elements are formed overlying the bit line regions between the stacks. The charge-trapping stacks are etched to form two complementary charge storage nodes and to expose portions of the silicon substrate. Silicon is grown on the exposed silicon substrate by selective epitaxial growth and is oxidized. A control gate layer is formed overlying the complementary charge storage nodes and the oxidized epitaxially-grown silicon.

Abstract: Embodiments of the present invention include an acoustic processing device, a method for acoustic signal processing, and a speech recognition system. The speech processing device can include a processing unit, a histogram pruning unit, and a pre-pruning unit. The processing unit is configured to calculate one or more Hidden Markov Model (HMM) pruning thresholds. The histogram pruning unit is configured to prune one or more HMM states to generate one or more active HMM states. The pruning is based on the one or more pruning thresholds. The pre-pruning unit is configured to prune the one or more active HMM states based on an adjustable pre-pruning threshold. Further, the adjustable pre-pruning threshold is based on the one or more pruning thresholds.

Abstract: A semiconductor memory includes a sense amplifier which operates in response to activation of a sense amplifier enable signal and determines logic held in a nonvolatile memory cell according to a voltage of a bit line, the voltage varying with a cell current flowing through a real cell transistor, a replica cell transistor coupled in series between a first node and a ground line, and a timing generation unit. The timing generation unit activates the sense amplifier enable signal when the first node coupled to the ground line via the replica cell transistor changes from a high level to a low level. The replica cell transistor includes a control gate receiving a constant voltage and a floating gate coupled to the control gate. Thus, the activation timing of the sense amplifier can be optimally set in accordance with the electric characteristic of the memory cell.

Abstract: An integrated circuit (IC) device can include a static random access memory (SRAM) section comprising a plurality of memory banks; and an interface comprising physical connections for more than eight memory channels, the connections for each memory channel including an address section including connections for SRAM control inputs and a complete address to access the memory banks, and a data section including data inputs and outputs (data IOs) to transfer data for one memory bank.

Abstract: A current supply is coupled to a light source. The current supply is further coupled to a controller. The controller is configured to provide a stochastic control signal to the current supply, wherein the stochastic control signal controls a light intensity output of the light source.

Abstract: A memory device is provided. The memory device includes a preamble memory and a memory controller. The preamble memory is arranged to store a read preamble such that the read preamble includes a training pattern that is suitable for aligning a capture point for read data. Further, the training pattern is programmable such that the training pattern can be altered at least once subsequent to manufacture of the preamble memory. In response to a read command, the memory controller provides the read preamble stored in the preamble memory, as well as the read data.

Abstract: A method of controlling the thickness of gate oxides in an integrated CMOS process which includes performing a two-step gate oxidation process to concurrently oxidize and therefore consume at least a first portion of the cap layer of the NV gate stack to form a blocking oxide and form a gate oxide of at least one metal-oxide-semiconductor (MOS) transistor in the second region, wherein the gate oxide of the at least one MOS transistor is formed during both a first oxidation step and a second oxidation step of the gate oxidation process.

Abstract: An apparatus comprising a stylus with a dynamically switch tip shield is provided. The apparatus includes an elongated stylus housing having an end, a conductive tip disposed at least partially inside the stylus housing and extending from the end, a force sensor coupled to the conductive tip and configured to detect contact between the conductive tip and an object, a tip shield coupled with the stylus housing and extending from the end, and a switch coupled to the tip shield and the conductive tip. The force sensor may be an inductive sensor, a capacitive sensor, a piezo sensor, a force sensing resistor sensor, or an optical sensor.

Abstract: A method in accordance with one embodiment of the invention may include receiving a first encryption key. A second encryption key may be generated, and a first data packet containing the second encryption key may be generated and at least part of the first data packet encrypted using the first encryption key. A second data packet may be generated and at least part of the second data packet encrypted using the second encryption key.

Abstract: Embodiments described herein generally relate to landing gate pads for contacts and manufacturing methods therefor. A bridge is formed between two features to allow a contact to be disposed, at least partially, on the bridge. Landing the contact on the bridge avoids additional manufacturing steps to create a target for a contact.

Abstract: Optical navigation sensors and methods are provided for use in an input device. In one embodiment, the input device comprises: (i) a button configured to in a first mode of operation of the input device receive user input when a surface of the button is pressed; (ii) an optical navigation sensor (ONS) configured to in a second mode of operation of the input device illuminate an object in proximity to the surface of the button and to sense and provide input related to motion of the object; and (iii) means for disabling input from the ONS in the first mode of operation. Other embodiments are also disclosed.

Abstract: A semiconductor component and a method for manufacturing the semiconductor component that are suitable for use with low temperature processing. A semiconductor substrate is provided and an optional layer of silicon nitride is formed on the semiconductor substrate using Atomic Layer Deposition (ALD). A layer of dielectric material is formed on the silicon nitride layer using Sub-Atmospheric Chemical Vapor Deposition (SACVD) at a temperature below about 450° C. When the optional layer of silicon nitride is not present, the SACVD dielectric material is formed on the semiconductor substrate. A contact hole having sidewalls is formed through the SACVD dielectric layer, through the silicon nitride layer, and exposes a portion of the semiconductor substrate. A layer of tungsten nitride is formed on the exposed portion of the semiconductor substrate and along the sidewalls of the contact hole. Tungsten is formed on the layer of tungsten nitride.

Abstract: A semiconductor device in accordance with one embodiment of the invention can include a semiconductor substrate having a groove, a bit line, a pocket implantation region, a bottom insulating membrane, and a charge accumulation region. The bit line is formed on a side of the groove in the semiconductor substrate and acts as a source and a drain. The pocket implantation region is formed to touch (or contact) the bit line, has a similar conductivity type as the semiconductor substrate, and has a dopant concentration higher than that of the semiconductor substrate. The bottom insulating membrane is formed on and touches (or contacts) a side surface of the groove. The charge accumulation layer is formed on and touches (or contacts) a side surface of the bottom insulating membrane.

Abstract: A method of fabricating a memory device is described. Generally, the method includes: forming on a surface of a substrate a dielectric stack including a tunneling dielectric and a charge-trapping layer overlying the tunneling dielectric; forming a cap layer overlying the dielectric stack, wherein the cap layer comprises a multi-layer cap layer including at least a first cap layer overlying the charge-trapping layer, and a second cap layer overlying the first cap layer; patterning the cap layer and the dielectric stack to form a gate stack of a memory device; removing the second cap layer; and performing an oxidation process to oxidize the first cap layer to form a blocking oxide overlying the charge-trapping layer, wherein the oxidation process consumes the first cap layer. Other embodiments are also described.

Abstract: Methods and systems of fabricating a wordline protection structure are described. As described, the wordline protection structure includes a polysilicon structure formed adjacent to a memory core region. The polysilicon structure includes first doped region positioned on a core side of the polysilicon structure and a second doped region positioned on a spine side of the polysilicon structure. An un-doped region positioned between the first and second doped regions. A conductive layer is formed on top of the polysilicon structure and arranged so that it does not contact the un-doped region at either the transition between the first doped region and the un-doped region or the second doped region and un-doped region.

Abstract: Embodiments of the present invention include a method for multi-chip packaging. For example, the method includes positioning a first integrated circuit (IC) on a substrate package based on a first set of reference markers in physical contact with the substrate package and confirming an alignment of the first IC based on a second set of reference markers in physical contact with the substrate package. A second IC is stacked onto first IC based on the first set of reference markers. An alignment of the second IC is confirmed based on the second set of reference markers, where the second set of reference markers is disposed at a different location on the substrate package than the first set of reference markers.

Abstract: An embodiment of the present invention is directed to a method of forming a memory cell. The method includes etching a trench in a substrate and filling the trench with an oxide to form a shallow trench isolation (STI) region. A portion of an active region of the substrate that comes in contact with the STI region forms a bitline-STI edge. The method further includes forming a gate structure over the active region of the substrate and over the STI region. The gate structure has a first width substantially over the center of the active region of the substrate and a second width substantially over the bitline-STI edge, and the second width is greater than the first width.

Abstract: A method and apparatus for mixed wire bonding and staggered bonding pad placement. A first plurality of bonding pads is arranged on a semiconductor device. A second plurality of bonding pads is also arranged on the semiconductor device. The bonding pads of the second plurality of bonding pads are arranged in a staggered pattern, such that the first and second pluralities of bonding pads form one of a plurality of double rows of bonding pads on the semiconductor device.