Abstract: A semiconductor device includes first and second flexible substrates each with first and second peripheral edges. First and second dies are attached on respective surfaces of the flexible substrates and are each respectively electrically connected to first and second metal traces. A first crimping structure electrically connects the first metal traces to the second metal traces and crimps together the first peripheral edges of the first and second substrates. A second crimping structure electrically connects the first metal traces to the second metal traces and crimps together the second peripheral edges of the first and second substrates.

Abstract: An electronic device comprises a first component susceptible to a wearout effect, operation of which first component depends on an operating parameter, and a second component having an on-state and an off-state. The electronic device further comprises a time estimator for updating an estimate of an accumulated time the second component was in the on-state; and a controller for controlling the operating parameter on the basis of the accumulated time estimate so as to respond to the expected wearout effect. The first component and the second component may be the same, or the first component may have an on-state correlated to the on-state of the second component. The operating parameter may, for example, be a level or amplitude or correction value of one of the following: a voltage applied at the first component, an electric current fed to the first component, and a power provided to the first component. A method of operating such an electronic device is also disclosed.

Abstract: A processor in a data processing system executes a permutation instruction which identifies a first source register, at least one other source register, and a destination register. The first source register stores at least one in-range index value for the at least one other source register and at least one out-of-range index value for the at least one other source register. The at least one other source register stores a plurality of vector element values, wherein each in-range index value indicates which vector element value of the at least one other source register is to be stored into a corresponding vector element of the destination register. Each out-of-range index value is used to indicate which one of at least two predetermined constant values is to be stored into a corresponding vector element of the destination register. Partial table lookups using a permutation instruction shortens the time required to retrieve data.

Abstract: An integrated circuit comprises channel estimation module for generating at least one channel estimation signal based on at least one of a plurality of pilot signals within concurrent resource elements. The channel estimation module comprising extension module arranged to receive a demodulation reference signal comprises the plurality of pilot signals and to add an extension to the demodulation reference signal, inverse discrete Fourier transform (IDFT) module arranged to perform an inverse discrete Fourier transform function on the extended demodulation reference signal to generate a time domain reference signal, reference signal separation module arranged to separate out at least one pilot signal component from the time domain reference signal. The channel estimation module further comprises and discrete Fourier transform (DFT) module arranged to perform a discrete Fourier transform function on the at least one pilot signal component to generate at least one extended channel estimation signal.

Abstract: A packaged leadless semiconductor device (20) includes a heat sink flange (24) to which semiconductor dies (26) are coupled using a high temperature die attach process. The semiconductor device (20) further includes a frame structure (28) pre-formed with bent terminal pads (44). The frame structure (28) is combined with the flange (24) so that a lower surface (36) of the flange (24) and a lower section (54) of each terminal pad (44) are in coplanar alignment, and so that an upper section (52) of each terminal pad (44) overlies the flange (24). Interconnects (30) interconnect the die (26) with the upper section (52) of the terminal pad (44). An encapsulant (32) encases the frame structure (28), flange (24), die (26), and interconnects (30) with the lower section (54) of each terminal pad (44) and the lower surface (36) of the flange (24) remaining exposed from the encapsulant (32).

Abstract: A data processing system includes a plurality of data processors, debug logic, and linking logic. The debug logic is coupled to each data processor of the plurality of data processors, and is for providing an instruction for exiting debug mode to the plurality of data processors. The linking logic is coupled to the debug logic and to each of the plurality of data processors. The linking logic is for linking selected ones of the plurality of data processors with each other and to the debug logic. The debug logic provides the instruction for exiting the debug mode when the selected ones of the plurality of data processors are linked in parallel by the linking logic.

Abstract: In one or more embodiments, a data processing system can include at least one core capable of executing instructions of an instruction set architecture and a triggered memory map access (tMMA) system coupled to the at least one core. The tMMA system can receive one or more events and, in response, perform one or more actions. For example, the actions can include transactions which can include a write to a an address of the memory map, a read from an address of the memory map, a read followed by write to two respective addresses of the memory map, and/or a fetch transaction. A result of a transaction (e.g., data read, data written, error, etc.) can be used in generating a trace message. For example, the tMMA system can generate a trace message that includes the result of the transaction and send the trace message to a trace message bus.

Abstract: An integrated circuit device comprises at least one power gating arrangement, including at least one gated power domain and at least one power gating component operably coupled between at least one node of the at least one gated power domain and at least a first power supply node. The at least one power gating component is arranged to selectively couple the at least one node of the at least one gated power domain to the at least first power supply node.

Abstract: An integrated circuit device comprises a cut-through forwarding module. The cut-through forwarding module comprises at least one receiver component arranged to receive data to be forwarded, and at least one transmitter component arranged to transmit data stored within at least one transmitter buffer thereof. The cut-through forwarding module further comprises at least one delimiter component arranged to trigger a transmission of frame data within the at least one transmitter buffer, upon receipt of a first number of data elements of a respective data frame by the at least one receiver component, the first number of data elements comprising a first predefined integer value.

Abstract: In accordance with at least one embodiment, a non-volatile memory (NVM) and method is disclosed for detecting latent slow erase bits. At least a portion of an array of NVM cells is erased with a reduced erase bias. The reduced erase bias has a reduced level relative to a normal erase bias. A least erased bit (LEB) threshold voltage level of the least erased bit (LEB) is determined. An erase verify is performed at an adjusted erase verify read threshold voltage level. The adjusted erase verify read threshold voltage level is a predetermined amount lower than the LEB read threshold voltage level. A number of failing bits is determined. The failing bits are bits with a threshold voltage above the adjusted erase verify level. The NVM is rejected in response to the number of failing bits being less than a failing bits threshold.

Abstract: A cache management system employs a replacement policy in a manner that manages concurrent accesses to cache. The cache management system comprises a cache, a replacement policy storage for storing replacement statuses of cache lines of the cache, and an update module. The update module, comprising access filtering and a concurrent update handling, determines how updates to the replacement policy storage are handled. In a multi-threaded compute environment, a concurrent access to shared cache causes a selective update to the replacement policy storage.

Abstract: An integrated circuit includes a transducer and transducer circuitry and additional elements useful in testing the transducer and transducer circuitry. A first power supply terminal and a second power supply terminal are for being directly connected to an external power supply terminal. A power bus is connected to the first power supply terminal. A logic function is for determining if the second power supply terminal is receiving power and if an automatic calibration test of the transducer and transducer circuitry has been run. An automatic calibration is for running an automatic calibration test on the transducer and transducer circuitry if the logic means determines that the second power supply terminal is receiving power and the automatic calibration test of the transducer and transducer circuitry has not been run.

Abstract: A counters array system comprises a memory device having a plurality of addressable memory locations for storing counter-values; a plurality of delta-counter devices. Each delta-counter device is operable to hold a maximum delta-value corresponding to a maximum number of occurrences of an event during a time duration between two counter scans controlled by a scan control unit. Each delta-counter device has an input connected to receive a signal from an event source corresponding to an occurrence of the event, and an output connected to provide a delta-value representing an accumulated number of occurrences of the event to a delta-count update circuit. The delta-count update circuit is connected to the memory device and the counter scan control unit, and being arranged to receive the delta-value and an address of a corresponding counter-value, read the counter-value from the memory device, and provide an updated counter-value incremented by the delta-value to the memory device.

Abstract: A technique for updating filter coefficients of an adaptive filter includes filtering a signal with an adaptive filter, whose filter coefficients are grouped into filter blocks. In this case a number of the filter blocks is less than or equal to a number of the filter coefficients. During each update period, the filter coefficients for less than all of the filter blocks are updated based on a network echo path impulse response.

Abstract: A semiconductor package and method of assembling a semiconductor package includes encapsulating a first pre-packaged semiconductor die stacked on top of and interconnected with a second semiconductor die. The first packaged semiconductor die is positioned and fixed relative to a lead frame with a temporary carrier such as tape. The second semiconductor die is attached and interconnected directly to the first packaged semiconductor die and lead frame. The interconnected first packaged die and second semiconductor die, and lead frame are encapsulated to form the semiconductor package. Different types of semiconductor packages such as quad flat no-lead (QFN) and ball grid array (BGA) may be formed, which provide increased input/output (I/O) count and functionality.

Abstract: An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.

Abstract: A very low intermediate frequency (VLIF) receiver comprising a first and second mixer circuits, characterised in that receiver comprises a means of estimating the energy in a desired signal band; a means of estimating the energy in a band of frequencies comprising the desired signal band; and a means of altering a VLIF of the receiver according to the ratio of the energy in a desired signal band and the energy in the band of frequencies comprising the desired signal band.

Abstract: A device being a micro-system and/or a nano-system which includes a first substrate, having at least one lower electrode and at least one dielectric layer, and includes an intermediate substrate extending across a main plane of the device and including a moving portion. The intermediate substrate is attached, outside the moving portion, by molecular bonding to the first substrate. The moving portion faces at least a portion of the lower electrode. The device also includes an upper substrate, attached to the intermediate substrate. The moving portion is movable between the lower electrode and the upper substrate. The first, intermediate, and upper substrates extend in a plane parallel to the main plane of the device. The lower electrode detects a component of the movement of the moving portion perpendicular to the plane of the device.

Abstract: A technique for computer-aided design layer checking of an integrated circuit design includes generating a representation of a device (e.g., a parameterized cell). Computer-aided design (CAD) layers are sequentially removed from the parameterized cell and a determination is made as to whether expected errors are detected or missed by an associated deck. The associated deck is then modified to detect the expected errors that are missed.

Abstract: A micro-electromechanical systems (MEMS) transducer (400) is adapted to use lateral axis vibration of the drive mass (210) to generate non-planar oscillations of a coupling mass (220) in response to Coriolis forces created from in-plane rotation, which in turn generate non-planar motions of a symmetric teeter-totter sense mass (230) which are detected as a capacitive difference signal by capacitive electrodes (403, 404) formed on the substrate (402) below the sense mass (230).