Abstract: A method of regulating an output voltage of an alternator. The method comprises measuring first and second external contacts of the alternator regulator module operably coupled to first and second output contacts of the alternator respectively during an ON state of an excitation cycle for the alternator, measuring a second voltage across the first and second external contacts of the alternator regulator module during an OFF state of an excitation cycle for the alternator, deriving an average voltage value of the first and second voltage measurements, and deriving an offset value based at least partly on the derived average voltage value. The method further comprises measuring an instantaneous voltage across the first and second external contacts of the alternator regulator module, and configuring a control signal for regulating the output voltage of the alternator based at least partly on the instantaneous voltage measurement and the derived offset value.

Abstract: Provided are a system and method for generating final result checking for a test case. A test case is executed for a coherent memory system having a processor core. An event log is generated for the processor core. The event log is analyzed. The test case for the core is annotated with a checker for performing expected data checking for physical addresses modified by the processor core.

Abstract: A method of assembling semiconductor devices with semiconductor dies of alternative different configurations uses the same substrate panel. The dies of the selected configuration are placed in an array, mounted, and connected to internal electrical contact pads on a first face of the panel using main fiducial markings and an array of subsidiary fiducial markings corresponding universally to arrays of semiconductor dies of the different alternative configurations. The pitch of the subsidiary fiducial markings is equal to the spacing between adjacent rows of the internal electrical contact pads on the panel and is a sub-multiple of the pitch of the array of dies.

Abstract: A device comprising a first detector, comprising an output, disposed at a first location of an integrated circuit chip and configured to determine a first temperature information, a chip heater, comprising an input to receive a control signal, disposed at a second location of the integrated circuit and configured to heat an area of the integrated circuit device that includes the first location and the second location, based upon the control signal, and a heater controller comprising a first input coupled to the output of the first detector to receive the first temperature information, and an output coupled to the input of the chip heater, the heater controller configured to generate the control signal based upon the first temperature information.

Abstract: A packaged RF device is provided that can provide improved performance and flexibility though the use of flexible circuit leads. The RF device includes at least one integrated circuit (IC) die configured to implement the RF device. The IC die is contained inside a package. In accordance with the embodiments described herein, a flexible circuit is implemented as a lead. Specifically, the flexible circuit lead is coupled to the at least one IC die inside the package and extends to outside the package, the flexible circuit lead thus providing an electrical connection to the at least one IC die inside the package.

Abstract: A multi-partition networking device comprising a primary partition running on a first set of hardware resources and a secondary partition running on a further set of hardware resources. The multi-partition networking device is arranged to operate in a first operating state, whereby the first set of hardware resources are in an active state and the primary partition is arranged to process network traffic, and the further set of hardware resources are in a standby state. The multi-partition networking device is further arranged to transition to a second operating state upon detection of a suspicious condition within the primary partition, whereby the further set of hardware resources are transitioned from a standby state to an active state, and to transition to a third operating state upon detection of a failure condition within the primary partition, whereby processing of network traffic is transferred to the secondary partition.

Abstract: An electronic fault detection unit is provided that has a first register, a second register, a comparator circuit, and a timer circuit. The first and second register can be written from a first software portion, and a second software portion, respectively. The comparator circuit is arranged to detect that both the first and second register have been written, verify a relationship between first data written to the first register and second data written to the second register, and signal a fault upon said verification failing. The timer circuit is arranged to signal a fault if said verification of the comparator circuit does not occur within a time limit.

Abstract: A circuit includes an evaluation node through which current flows from a voltage source node to a sensed switch when the sensed switch is closed. First and second control switches are disposed between the voltage source node and the evaluation node to switch between first and second current paths for the current. The current passes through the first control switch when flowing along the first current path. The second control switch is coupled to a control terminal of the first control switch to deactivate the first control switch and allow the current to flow through the second current path. Multiple passive circuit elements are configured to establish first and second current levels for the current. The passive circuit elements are disposed between the voltage source node and the evaluation node in a circuit arrangement in which no current path to ground is present when the sensed switch is open.

Abstract: A semiconductor device is assembled from a lead frame. The device has a semiconductor die mounted on a flag of the lead frame. A mold compound forms a housing that covers the die. Lead fingers surround the die. Each lead finger has an inner lead length that is covered by the housing and an outer lead length that protrudes from the housing. The inner lead length extends from an edge of the housing towards the die. The inner lead length has an intermediate region that has been bent to form a notch. Bond wires electrically connect electrodes of the die to respective inner lead lengths.

Abstract: An electronic design automation (EDA) tool for increasing the fault coverage of an integrated circuit (IC) design includes a processor that inserts at least one XOR gate, an AND gate, an OR gate and a multiplexer between observation test points and an existing first scan flip-flop of the IC design. The XOR gate provides an observation test signal to the first scan flip-flop by way of the AND gate, the OR gate, and the multiplexer such that the observation test signal covers the presence of faults at the observation test points. The first scan flip-flop outputs a data input signal, a set of test patterns, and a first set of test signals based on the observation test signal to indicate whether the IC design is faulty or not. A testable IC that can be structurally tested is fabricated using the IC design.

Abstract: A charge pump circuit includes a delay circuit, a transistor, and a capacitor. The charge pump receives an input signal and outputs an output signal. The delay circuit receives a first signal based on the input signal and outputs a first delayed signal. The transistor includes a gate, a first channel node, and a second channel node. The first channel node receives the first signal. The second channel node is connected to the output and to a first plate of the capacitor. A second plate of the capacitor receives a second signal based on the first delayed signal. The charge pump circuit is adapted to operate such that the voltage range of the output signal is greater than the voltage range of the input signal.

Abstract: An oscillator circuit for providing an output clock signal is described. The oscillator circuit comprising a voltage reference, a first current source, first capacitor, first capacitor switch, second current source, second capacitor, second capacitor switch, first comparator, second comparator and flip-flop. The first comparator comprises a first chopper-stabilized comparator switchable between a compare phase and a zeroing phase in dependence on the output clock signal and arranged to operate in the compare phase in a first half-phase of the output clock signal to provide a first comparator output from comparing the first capacitor voltage to the reference voltage and in the zeroing phase in the second half-phase.

Abstract: A fail-safe booting system suitable for a system-on-chip (SOC) automatically detects and rectifies failures in power-on reset (POR) configuration or boot loader fetch operations. If a failure due to a boot loader fetch occurs, a POR configuration and boot loader are fetched from a different non-volatile memory. The reloading takes place from further different non-volatile memory sources if the boot loader fetch fails again. The automated system operates in accordance with a state machine, and does not involve any manual, on-board switch selection or manual re-programming.

Abstract: An embodiment of a radio-frequency (RF) device includes at least one transistor, a package, and a surface-mountable capacitor. The package contains the at least one transistor and includes at least one termination. The surface-mountable capacitor is coupled in a shunt configuration between the at least one transistor and a power supply terminal of the device to decouple the at least one transistor from a power supply.

Abstract: Fluorine is located in selective portions of a gate oxide to adjust characteristics of the gate oxide. In some embodiments, the fluorine promotes oxidation which increases the thickness of the selective portion of the gate oxide. In some embodiments, the fluorine lowers the dielectric constant of the oxide at the selective portion. In some examples, having fluorine at selective portions of a select gate oxide of a non volatile memory may reduce program disturb of the memory.

Abstract: A method of assembling a semiconductor package includes attaching a semiconductor die to a frame having a strip or panel form. The semiconductor die has at least one stud bump. The die and the stud bump are covered with a first encapsulation material, and then at least a portion of the stud bump is exposed. At least one die conductive member is formed on the first encapsulation material and electrically coupled to the stud bump. The die conductive member is covered with a second encapsulation material, and then at least a portion of the die conductive member is exposed. At least one grid array conductive member is formed on the second encapsulation material and electrically coupled to the die conductive member. Finally, at least one solder ball is attached to the at least one grid array conductive member.

Abstract: A semiconductor device includes a die having first contact pads and a second contact pad. Signal leads, each having embedded portion and an exposed portion, are electrically connected to respective ones of the first contact pads. A power bar extends in an area between the signal lead embedded portions and the die and has a first side opposing the signal leads and a second side opposing the die. The power bar is electrically connected to the second contact pad. An electrically grounded ground bar extends at least partially in the area. The ground bar has a first portion between the signal lead embedded portions and the first side of the power bar, and a second portion between the second side of the power bar and the die.

Abstract: A semiconductor pressure sensor device having a pressure-sensing die electrically connected to a microcontrol unit (MCU) using either through silicon vias (TSVs) or flip-chip bumps. An active surface of the pressure-sensing die is in facing relationship with the MCU. These embodiments avoid the need to used bonds to electrically connect the pressure-sensing die to the MCU, thereby saving time, reducing size, and reducing cost.

Abstract: Systems and methods are provided for monitoring operation of MEMS accelerometers (100). In these embodiments a control loop (112) having a forward path (114) is coupled a MEMS transducer (110), and a test signal generator (124) and test signal detector (126) is provided. The test signal generator (124) is configured to generate a test signal and apply the test signal to the forward path (114) of the control loop (112) during operation of the MEMS accelerometer transducer (110). The test signal detector (126) is configured to receive an output signal from the control loop and detect the effects of the test signal in the output signal. Finally, the test signal detector (126) is further configured to generate a monitor output indicative of the operation of the sensing device to provide for the continuous monitoring of the operation of the MEMS accelerometer (100).

Abstract: A method and apparatus are described for integrating dual gate oxide (DGO) transistor devices (50, 52) and core transistor devices (51, 53) on a single substrate (15) having a silicon germanium channel layer (21) in the PMOS device areas (112, 113), where each DGO transistor device (50, 52) includes a metal gate (25), an upper gate oxide region (60, 84) formed from a second, relatively higher high-k metal oxide layer (24), and a lower gate oxide region (58, 84) formed from a first relatively lower high-k layer (22), and where each core transistor device (51, 53) includes a metal gate (25) and a core gate dielectric layer (72, 98) formed from only the second, relatively higher high-k metal oxide layer (24).