Abstract: A temperature coefficient factor circuit is provided which generates a current which varies with temperature according to a programmable temperature coefficient factor. The temperature coefficient factor circuit comprises a first current source providing a first current with a positive temperature coefficient factor, a second current source providing a second current with a negative temperature coefficient factor, a common terminal, a first programmable amplifying current mirror, a second programmable amplifying current mirror and a current output circuit. The first programmable amplifying current mirror provides in dependence of a control signal ctrl an amplified first current to the common terminal. The second programmable amplifying current mirror conducts away in dependence of the control signal ctrl an amplified second current from the common terminal. The current output circuit provides the output current based on a difference current between the amplified first current and the amplified second current.

Abstract: A system performance control component, and method therefor, for configuring at least one system performance parameter within a signal processing system. The system performance control component is arranged to receive an indication of an address of a memory access performed by at least one signal processing component, compare the received indication of an address of a memory access to at least one address value, and configure at least one system performance parameter based at least partly on the comparison of the received indication of an address of a memory access to at least one address value.

Abstract: A method of testing simultaneous multi-threaded operation of a shared execution resource in a processor includes running test patterns including irritator threads and non-irritator threads that try to simultaneously use the shared execution resource. Synchronizing the starts of the access of the irritator threads and the non-irritator threads to the shared execution resource includes the initial instructions of the irritator thread disabling execution of the irritator thread using a thread management register, and the initial instructions of the non-irritator thread enabling the irritator thread using the thread management register and starting execution of the non-irritator thread. Ending access to the shared execution resource includes the irritator thread communicating to the non-irritator thread an address of an end of the irritator thread loop, and the non-irritator thread moving the irritator thread out of the loop using thread restart.

Abstract: A system and method for packaging a semiconductor device that includes a structure to reduce electromagnetic coupling is presented. The semiconductor device has a substrate on which a first circuit and a second circuit with inputs and outputs are formed proximate to each other. An isolation structure of electrically conductive material is located between components of the first and second circuits, the isolation structure being configured to reduce inductive coupling between those components during an operation of the semiconductor device. The isolation structure may be positioned on or over exterior surfaces of the semiconductor device housing or inside the housing. In one embodiment, the isolation structure includes a first leg extending transverse to the surface of the substrate and a first cross member connected to and projecting from the first leg over the substrate.

Abstract: A lead frame has a trace embedded in an encapsulant and a plurality of stubs (i) embedded in the encapsulant and (ii) connected to and extending from the trace at different locations along the length of the trace. The stubs inhibit the formation of cracks that may otherwise form along the trace due to thermal or mechanical bending of the lead frame, especially cracks that tend to occur along the four linear edge traces located at the periphery of some conventional embedded lead frames.

Abstract: Spare gate cells for inclusion in an integrated circuit have multiple inputs and outputs and are capable of selectively performing, concurrently, multiple logic functions on signals appearing at the inputs. Selection of required logic functions depends on the connections of at least one of the inputs of the spare cell. One of the outputs is fed back to an input of the spare gate cell to provide certain functionality while other outputs are set to a fixed logical value. The spare gate cell may be configured to perform NOR, OR and inverter operations on inputs simultaneously.

Abstract: A detection circuit for an alternator regulator, and method therefor. The detection circuit comprises an input circuit arranged to receive a phase signal from an alternator regulator and to output an attenuated sense signal representative of the received phase signal, a detection component operably coupled to the input circuit and arranged to receive the attenuated sense signal output by the input circuit, and a blocking capacitance operably coupled between the input circuit and the detection component and arranged to block a DC component of the attenuated sense signal. The detection component is arranged to compare the received attenuated sense signal to at least one reference voltage signal, and to output a signal representative of a frequency of the phase signal from the alternator regulator based at least partly on the comparison of the received attenuated sense signal to the at least one reference voltage signal.

Abstract: A system on chip having two or more responder units and two or more protection units is provided. Each of the responder units comprises a set of responder elements. Each of the protection units is associated with and protects one of the responder units and is arranged to provide a group mapping. The group mapping assigns one or more group identifiers to each of the responder elements of the respective responder unit.

Abstract: A method of calculating at least one delay timing value for at least one setup timing stage within an integrated circuit design includes applying Negative/Positive Bias Temperature Instability (N/PBTI) compensation margins to delay values for elements within the at least one setup timing stage, and calculating the at least one delay timing value for the at least one setup timing stage based at least partly on the N/PBTI compensated delay values. The method further includes identifying at least partially equivalent elements within parallel timing paths of the at least one setup timing stage, and applying reduced N/PBTI compensation margins to delay values for the identified at least partially equivalent elements within parallel timing paths of the at least one setup timing stage.

Abstract: An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.

Abstract: A circuit performs a method for controlling turn-off of a semiconductor switching element. The method includes determining at least one operating parameter for the semiconductor switching element during an operating cycle and determining a gate discharge current based on the at least one operating parameter. The method further includes supplying the gate discharge current to a gate of the semiconductor switching element during a subsequent operating cycle to turn off the semiconductor switching element.

Abstract: A data processing device maintains register map information that maps accesses to architectural registers, as identified by instructions being executed, to physical registers of the data processing device. In response to determining that an instruction, such as a speculatively-executing conditional branch, indicates a checkpoint, the data processing device stores the register map information for subsequent retrieval depending on the resolution of the instruction. In addition, in response to the checkpoint indication the data processing device generates new register map information such that accesses to the architectural registers are mapped to different physical registers. The data processing device maintains a list, referred to as a free register list, of physical registers available to be mapped to an architectural registers.

Abstract: An IC includes: a substrate having a thick oxide portion and a thin oxide portion; a load circuit disposed on the thin oxide portion and coupled between a supply node and a virtual supply node; and a current source circuit and protection circuit disposed on the substrate. The current source circuit has an output coupled to the virtual supply node and is operable to provide a voltage at the virtual supply node. The protection circuit includes a sensing portion and a protection portion. The sensing portion is coupled to the virtual supply node and is operable to detect the voltage at the virtual supply node. The protection portion is coupled to the sensing portion and is operable, in response to the sensed voltage, to prevent a difference in voltage between the voltage at the virtual supply node and a second voltage at the supply node from exceeding a maximum voltage.

Abstract: An integrated circuit (IC) die has an active side and an inactive side, opposite the active side. A recess is formed within the interior of the inactive side and extends partially through the integrated circuit towards the active side. The IC die is part of a packaged IC device, where the die is attached to a package component such as a lead frame, substrate, or another die, using die attach adhesive that fills the recess, thereby providing a more reliable bond between the IC die and the package component.

Abstract: Methods and systems are disclosed for interconnecting die-to-die-port (DTDP) host devices and DTDP expansion devices for combined system-in-package (SiP) solutions. Interconnect circuitry having a plurality of ports is configured to provide communication from the host device to the expansion device so that the expansion device appears to be resident on the host device. Further, direct circuit interconnection blocks (e.g., using copper pillar (CuP) connectors) can be used to improve connectivity and performance. In addition, level shift circuitry can be utilized within expansion devices to allow for standardized interconnect signals and supply voltages to be provided by DTDP host devices to DTDP expansion devices.

Abstract: The invention pertains to a method for ranking paths for power optimization of an integrated circuit design, comprising identifying a plurality of paths of the integrated circuit design, each path comprising one or more instances of electronic devices providing an instance power estimate for each instance in the identified paths providing, for each identified path, at least one weighted power estimate based on the instance power estimates for instances in the path, and providing a ranking of the paths based on the least one weighted power estimate. The invention also pertains to a corresponding computer program product.

Abstract: The invention relates to an apparatus for transfer of data elements between a bus controller, such as a CPU, and a memory controller. An address translator is arranged to receive a write address from the CPU, to modify the write address and to send the modified write address to the memory controller. An ECC calculator is arranged to receive write input data associated with the write address, from the CPU, and to generate an error correction code on the basis of the write input data. A concatenator is arranged to receive the write input data from the CPU, and to receive the error correction code from the ECC calculator, and to concatenate the write input data and the error correction code to obtain write output data, and to send the write output data to the memory controller.

Abstract: A RF power amplifier module comprises a die with a RF power transistor and the RF power transistor comprises a control terminal, a transistor output terminal and a transistor reference terminal. The RF power amplifier module further comprises a module input terminal, a module output terminal and at least two module reference terminals being electrically coupled to the control terminal, the transistor output terminal and the transistor reference terminal, respectively. The RF power amplifier module further comprises an electrically isolating layer and a heat conducting element. The die is in thermal contact with the heat conducting element via the electrically isolating layer in order to transfer heat during operation of the RF power transistor to the heat conducting element.

Abstract: A sub-assembly for a packaged integrated circuit (IC) device has a planar substrate. The substrate's top side has multiple sets electrically connected bond posts arranged in corresponding nested contour zones. Each contour zone includes a different bond post of each bond-post set. The bottom side has a different set of pad connectors electrically connected to the each top-side bond-post set. The sub-assembly can be used for different IC packages having IC dies of different sizes, with different contours of bond posts available for electrical connection depending on the size of the IC die.

Abstract: A system for managing data packets has multiple cores, a data buffer, a hardware accelerator, and an interrupt controller. The interrupt controller transmits a first interrupt signal to a first one of the cores based on a first hardware signal received from the hardware accelerator. The first core creates a copy of buffer descriptors (BD) of a buffer descriptor ring that correspond to the data packets in the data buffer in a first virtual queue and indicates to the hardware accelerator that the data packets are processed. If there are additional data packets, the interrupt controller transmits a second interrupt signal to a second core, which performs the same steps as performed by the first core. The first and the second cores simultaneously process the data packets associated with the BDs in the first and second virtual queues, respectively.