Abstract: An improved DBS receiver front end architecture having a tuner chip and a demodulator/decoder chip. The tuner chip has reduced-power features which allow the incorporation of an on-chip voltage regulator. The tuner chip is a direct conversion tuner with on-chip tuning frequency generation and reduced power interface signals. The on-chip voltage regulator provides a constant power supply for nonlinear components of the tuner and frequency generation circuitry to minimize phase noise. Broadly speaking, the present invention concerns a DBS receiver front end which includes a tuner chip and a demodulator/decoder chip. The tuner chip includes an on-chip voltage regulator, in addition to a tuning oscillator, a charge pump, a downconverter, and a lowpass filter. The on-chip voltage regulator is operable to provide a stable power supply to the tuning oscillator and the charge pump.

Abstract: An MPEG decoder system and method for decoding frames of a video sequence. The MPEG decoder includes frame reconstruction or decoder logic which operates to reconstruct a bi-directionally encoded (B) frame with minimal memory requirements. The MPEG decoder operates to decode or reconstruct the frame twice, once during each field display period. The picture reconstruction unit operates to decode or reconstruct the B frame twice, once each during a first field time and a second field time. The first field time substantially corresponds to the time when the first or top field of the picture is displayed, and the second field time substantially corresponds to the time when the second or bottom field of the picture is displayed. This obviates the necessity of storing the reconstructed B frame data, thus reducing memory requirements.

Abstract: An electronic system utilizing at least one integrated circuit including a semiconductor integrated circuit chip housed in a package providing external electrical connections for the circuit chip. The system package has only a limited number of external connections available for such use. The system package includes an internal buss, or plurality of busses, which are electrically connected to the circuit chip and to selected external connections or the package to improve the efficiency of utilization of external connections on the package, as well as improving operating characteristics of the integrated circuit chip by improvements to voltage and current distributions to the chip, and also eliminating in some cases the consequences of a poor quality of external electrical connection to the system package itself.

Abstract: A method, and resulting product, are disclosed for selectively forming polycrystalline silicon over exposed portions of a single crystal silicon substrate. The method includes inhibiting the formation of such polycrystalline silicon over adjacent silicon oxide surfaces; and the resulting product of such a process. The polycrystalline silicon is selectively deposited over the single crystal silicon substrate by first forming a thin layer of a lattice mismatched material over the single crystal silicon surface, and then depositing a layer of polycrystalline silicon over the lattice mismatched material. Preferably, the thin lattice mismatched layer comprises a silicon/germanium (SiGe) alloy.

Abstract: A plurality of devices communicate information over a wireless network at radio frequencies. The information includes digital audio, video and data. Bandwidth among the devices is dynamically allocated, the allocation being based upon the needs of the devices. One embodiment of the wireless network is a Time Division Multiple Access network. Another embodiment is a wireless Ethernet. Yet another embodiment is a Frequency Division Multiplexed network.

Abstract: A polishing apparatus and method is disclosed, whereby fluid is delivered at dissimilar flow rates and pressures across a wafer. The fluid is delivered either directly to the wafer or through a polishing pad. Changing the fluid delivery allows the removal properties of the fluid to polish material from the wafer surface based on the location of that material relative to the center of the wafer. The fluid delivery system and the polishing pad oscillate relative to a rotating wafer. The radius of oscillation is relatively small compared to the size of the wafer to allow removal along one or more concentric rings and/or circles across the wafer.

Abstract: An instruction swap is implemented in a dual pipelined microprocessor to make instruction flow smoother upon resource or structural conflicts in executing an instruction. Instructions are accessed in an even and odd pair with an even instruction proceeding an odd instruction. The accessed instructions are stored in Read/Decode registers for decoding and execution. The even and odd instructions are swapped in the registers and in execution when the preceding even instruction encounters an execution conflict or a branch.

Abstract: A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct a flow of air or fluid over the heat sink. In one embodiment, the heat sink includes a heat sink layer formed from a powdered metal. In another embodiment, the heat sink layer is contoured with a selected combination of bumps, indentations and holes. In yet another embodiment, the heat sink includes a stack of such heat sink layers which are mechanically interfitted and thermally coupled.

Abstract: This invention concerns a novel Viterbi decoding apparatus and method in which a novel survivor weight unit (SWU) implements a normalized survivor weight calculation method with permutations. This method permutes a vector of survivor weights in a manner which permits calculation of weights by specialized dual add-compare-select units. The specialization of the butterfly computation unit allows for a reduction of storage and computation requirements.

Abstract: A single leadframe package having stacked integrated chips mounted therein provides multiple electrical functions. The leadframe package construction includes a leadframe die having a substantially smaller outer peripheral dimension than a first integrated circuit chip mounted face down thereon for supporting from below the first integrated chip without obstructing its bond pads. A second integrated circuit is supported from below in a backside to backside configuration by the first integrated circuit without obstructing the bond pads of the second integrated circuit. A plurality of substantially short conductive wires interconnect electrically the first and second integrated circuit chips with selective ones of a plurality of leadframe conductors. An encapsulating material molds the construction into the single leadframe package.

Abstract: Disclosed is a partitioning procedure for designing MPEG decoders, AC-3 decoders, and decoders for other audio/video standards. The procedure provides that some specified decoding functionality be implemented exclusively in the form of hardware and certain other specified decoding functionality be provided exclusively as firmware or software. A video decoder designed according to this procedure includes the following elements: (a) firmware or software for implementing, in conjunction with a CPU, video header processing functions; and (b) hardware for implementing preparsing assist, macroblock reconstruction, and video display control functions. An audio decoder designed according to this procedure includes the following elements: (a) firmware or software for implementing, in conjunction with a CPU, decoding fields containing parameters for processing the audio data; and (b) hardware for implementing matrixing and windowing functions on the audio data.

Abstract: Improved manufacturability, yield, and reliability are achieved during wirebonding of a semiconductor die of reduced size by employing two rows of staggered conductive connectors, or bond pads, for wirebonding the die to a semiconductor package. An outer row of conductive connectors is positioned closer to the edge of the die than an inner row of conductive connectors and includes a greater number of connectors than the inner row. The die can be wirebonded to a package substrate having either a single row of bondfingers or multiple rows of bondfingers. In one embodiment, bond wires attaching the inner row of conductive pad connectors to the package substrate have a greater loop height than bond wires attaching the outer row of conductive pad connectors to the package substrate.

Abstract: An integrated circuit structure with input/output gate voltage regulation and parasitic zener and junction diodes for protection against damage resulting from electrostatic discharge (ESD) events. The circuit includes a first protective FET connected between an input/output pad and a ground potential of the integrated circuit. A diode voltage regulator is also connected between the gate of the first protective FET and a reference potential of the integrated circuit. The first protective FET receives a voltage from its gate-drain overlap capacitance during an ESD event. The diode is operative during an ESD event to provide a sufficient voltage to the first FET gate to permit a desired ESD current flow through the first protective FET. In one embodiment the first FET is an NMOS device and the diode voltage regulator is a series of p-n forward biased diodes.

Abstract: A physical design automation system for producing a highest fitness cell placement for an integrated circuit chip includes a decomposition/recomposition processor for decomposing a cell placement optimization process into a plurality of tasks and recomposing the highest fitness cell placement from results of performing the tasks. A plurality of worker processors independently perform the tasks and produce results. A host processor distributively assigns the tasks to the worker processors in response to work requests received therefrom. Each worker processor sends a work request to the host processor after completing a task. The host processor maintains a list of unassigned tasks, assigned tasks and completed tasks, and revises the list to redesignate assigned tasks as unassigned tasks upon determining that the list includes no unassigned tasks and at least one assigned task, thus making the system immune to the failure of one or more processors.

Abstract: A DBS receiver front end which converts the received signal directly to the baseband representation and maintains a high performance with a new techniques for tracking and counteracting frequency drift, and correcting I/Q angular error and amplitude imbalance. The DBS receiver front end comprises a tuner and a demodulator/decoder. The tuner receives a high frequency signal and converts it to a baseband signal having a frequency offset error. In one embodiment, the DBS receiver front end includes a demodulator/decoder which digitally performs I/Q angular error correction. The tuner converts the high frequency signal to a baseband signal having an in-phase and a quadrature-phase component. Ideally, the components are separated by ninety degrees, but typically an angular error exists. The demodulator/decoder includes an adaptive equalizer for correcting the angular error. Having the equalizer allows for relaxed tolerances in the tuner.

Abstract: A system for computing an affinity for relocating a cell on a surface of a semiconductor chip is disclosed herein. The cell is located within a region and belongs to a net of cells. The system initially computes a weight associated with all cells in the net. The sytem then sums the weights of all cells in the net containing the cell for all cells located inside the region and at positions greater than and less than edges of the region and computes the affinity for moving the cell to points on the surface greater than, equal to, and less than the current position of the cell based on the weight sums from said summing function. The computing function further comprises combining the affinities determined based on weight sums with other affinities. The summing function further comprises computing a relationship between the amount of rows and columns of regions on the semiconductor chip surface, and the affinity computation function comprises combining the relationship with the weight sums.

Abstract: A programmable, byte wise, multimedia bitstream parser comprises an input data organizer, a data management buffer, a register file, a logical unit and a microprogram controller. A data source alternatively provides a bitstream to a parallel or serial port and the input data organizer, which includes a serial to parallel converter and a multiplexer, arranges the incoming data into a parallel stream of bytes for passage to the data management buffer. Status flags are associated with each byte passing through the management buffer to facilitate data processing, including start code and context identification and error handling. The register file includes counters and intermediate data buffers for processing a plurality of layers with data quantities which are not predetermined by syntax. Additionally, the register file is provided in tandem for dual context processing.

Abstract: Methods and systems of automatically generating synthesis scripts and hierarchical flow/connectivity diagrams are provided. The user inputs design constraints, clock characteristics, technology files, and HDL code. The system handles cores, megafunctions, hardmacs, and black boxes appropriately for synthesis. During synthesis, individual modules in the HDL code may change. The system manages these incremental changes by generating incremental scripts which 1) compile, map and model the modules that have been changed and 2) characterize, compile and model the modules that have been changed in the hierarchy under that instance. During the iterative design process, new hierarchical flow diagrams may be generated to understand the full effect of the incremental changes.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: A communications receiver system is presented for detecting burst errors and providing erasure information to the block decoder, thereby effectively doubling the conventional correction capability of the block decoder with only a minimal increase in complexity. In one embodiment, this mechanism takes the form of a circuit which re-encodes the output of the inner decoder, compares it with the received sequence of code symbols, and flags a portion of the inner decoder output for erasure when an excessive number of code symbol errors are detected. In a second embodiment, this mechanism takes the form of a circuit which makes hard symbol decisions on the channel signal, compares the hard decisions to the channel signal to determine a noise level, and thereafter flags the channel output in regions with excessive noise levels.