Patents Assigned to Micronics
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Patent number: 8746117Abstract: Provided is a printer in which a cut-off paper is pushed into a paper stacking portion without an additional power source while reducing the maximum load applied to driving means for driving a movable blade. A printer includes a movable blade for cutting a paper disposed between a fixed blade and a movable blade as it moves in a forward direction and separating a printed part as a cut-off paper; driving means for moving the movable blade in a reciprocating manner; a pushing member which is driven to push a cut-off paper in a thickness direction of the cut-off paper; a paper stacking portion for stacking the cut-off paper pushed by the pushing member; and a driving force transferring mechanism for transferring a driving force of the driving means to the pushing member to drive the pushing member.Type: GrantFiled: April 4, 2012Date of Patent: June 10, 2014Assignee: Star Micronics Co., Ltd.Inventors: Tomoyuki Kondo, Takeshi Ogawa
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Patent number: 8747779Abstract: A microfluidic cartridge including on-board dry reagents and microfluidic circuitry for determining a clinical analyte or analytes from a few microliters of liquid sample; with docking interface for use in a host workstation, the workstation including a pneumatic fluid controller and spectrophotometer for monitoring analytical reactions in the cartridge.Type: GrantFiled: October 13, 2011Date of Patent: June 10, 2014Assignee: Micronics, Inc.Inventors: Isaac Sprague, John E. Emswiler, C. Frederick Battrell, Joan Haab, Sean M. Pennell, Justin L. Kay, Zane B. Miller, Troy D. Daiber
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Publication number: 20140150929Abstract: Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.Type: ApplicationFiled: April 4, 2012Publication date: June 5, 2014Applicant: Micronic MyData ABInventor: Torbjorn Sandstrom
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Patent number: 8743165Abstract: The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.Type: GrantFiled: March 2, 2011Date of Patent: June 3, 2014Assignee: Micronic Laser Systems ABInventor: Torbjörn Sandström
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Publication number: 20140145741Abstract: A probe card comes in touch with a test object to perform an inspection. The probe card contains: a probe substrate provided with a plurality of probes on the first surface and a plurality of anchor receiving portions on the second surface; and a supporting body disposed to support the periphery of the probe substrate, with at least a plurality of anchor receiving portions located within a probe existence region being arranged regularly and at an equal distance from each other on the second surface of the probe substrate.Type: ApplicationFiled: November 27, 2013Publication date: May 29, 2014Applicant: Kabushiki Kaisha Nihon MicronicsInventors: Yoshiro NAKATA, Yoshinori KIKUCHI, Hirose FUJITA
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Patent number: 8736292Abstract: An automatic switching mechanism is controlled by a probe card independent from a tester without limitation of the number of control signals from the tester. A probe card and an inspection apparatus include probes to be brought into contact with electrodes of inspection targets and a power supply channel electrically connecting the probes to a tester. The automatic switching mechanism divides each of the power supply channels into a plurality of power supply wiring portions, which are respectively connected to the probes; and shuts off the power supply wiring responsive to electrical fluctuation such as overcurrent. An electrical fluctuation detection mechanism detects an electrical fluctuation due to a defective product among the inspection targets. A control mechanism, responsive to detection of an electrical fluctuation, shuts off the power supply wiring portion if the electrical fluctuation is caused by the automatic switching mechanism.Type: GrantFiled: May 27, 2010Date of Patent: May 27, 2014Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Tatsuo Ishigaki, Katsuji Hoshi, Akihisa Akahira
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Publication number: 20140138139Abstract: Provided is a method for manufacturing a multi-layer wiring board and the multi-layer wiring board that are capable of suppressing variation in resistance values. The method according to the present invention is the method for manufacturing a multi-layer wiring board. The method includes forming a resistor thin film, measuring resistance distribution of the resistor thin film, calculating resistor width adjustment rates of the plurality of resistors according to the resistance distribution, forming a pattern of a protective film on the resistor thin film, in which the pattern of the protective pattern has pattern width according to the resistor width adjustment rate, forming a pattern of a plating film on the resistor thin film at a position exposed from the protective film, and etching the resistor thin film at a position exposed from the plating film and the protective film so as to pattern the resistor thin film.Type: ApplicationFiled: November 13, 2013Publication date: May 22, 2014Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventors: Yoshiyuki FUKAMI, Toshinori OMORI, Katsushi MIKUNI, Noriko KON
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Publication number: 20140137055Abstract: The present invention relates to customizing individual workpieces, such as chip, flat panels or other electronic devices produced on substrates, by direct writing a custom pattern. Customization can be per device, per substrate, per batch or at some other small volume that makes it impractical to use a custom mask or mask set. In particular, it relates to customizing a latent image formed in a patterning sensitive layer over a substrate, merging standard and custom pattern data to form a custom pattern used to produce the customized latent image. A wide variety of substrates can benefit from the technology disclosed.Type: ApplicationFiled: January 17, 2014Publication date: May 15, 2014Applicant: Micronic MyData ABInventors: Lars IVANSEN, Anders OSTERBERG
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Patent number: 8721372Abstract: Respective plungers are slidably supported in a stable manner without fluctuation, and reliable electrical contact is achieved. In a contact of the present invention, a first plunger and a second plunger include tip end portions provided on tip end sides, slidably supported, and contacting two respective members and sliding portions provided on proximal end sides, formed in halved shapes of the respective plungers, slidably overlapped with each other, and inserted in a compression coil spring. Each of the sliding portions is set to have a length to be slidably supported together with the tip end portion of the other plunger.Type: GrantFiled: February 5, 2010Date of Patent: May 13, 2014Assignee: Kabushiki Kaisha Nihon MicronicsInventor: Yoshiei Hasegawa
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Publication number: 20140125000Abstract: A movable BF guide is provided in a movable-blade receiving area into which a movable blade slides along a fixed blade while being pressed against the fixed blade in a process of cutting recording paper. The movable-blade receiving area is blocked by the BF guide when the cutting process is not performed, thus preventing the entry of the end portion of the downstream connected recording paper into the movable-blade receiving area.Type: ApplicationFiled: January 9, 2014Publication date: May 8, 2014Applicant: STAR MICRONICS CO., LTD.Inventors: Yuji Suzuki, Masaaki Morishita
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Patent number: 8716007Abstract: An instrument for fluorometric assays in liquid samples is disclosed. The instrument may include multiple optical channels for monitoring a first fluorophore associated with a target analyte and a second fluorophore associated with a control. The disclosed instrument finds utility in any number of applications, including microfluidic molecular biological assays based on PCR amplification of target nucleic acids and fluorometric assays in general.Type: GrantFiled: June 28, 2012Date of Patent: May 6, 2014Assignee: Micronics, Inc.Inventors: C. Frederick Battrell, Troy D. Daiber, William Samuel Hunter
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Publication number: 20140118018Abstract: An inspection unit in which a probe card is united with a connection body via a vacuum chamber. It prevents flatness of tips of probes provided on the probe card from worsening when the probe card is united with a connection body by suction force (negative pressure) of the vacuum chamber. The inspection unit includes a probe card with probes on a first surface and a connection body united with a second surface of the probe card via a first vacuum chamber. The first chamber is formed with a plurality of chambers.Type: ApplicationFiled: October 29, 2013Publication date: May 1, 2014Applicant: Kabushiki Kaisha Nihon MicronicsInventors: Kenichi WASHIO, Norie YAMAGUCHI
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Publication number: 20140110372Abstract: A method for manufacturing a probe, includes forming a recess on a sacrificial layer with a resist matching a plane pattern of the probe and a fixing tab connected to the probe, the recess exposing the sacrificial layer, which is on a baseboard, forming the probe and the fixing tab connected to the probe by depositing a probe material in the recess, and removing the resist, removing a portion of the sacrificial layer in an etching process. The portion of the sacrificial layer under the probe is fully removed, while the portion of the sacrificial layer under the fixing tab is left to provide support portions of the sacrificial layer under the fixing tab. Then the probe is removed from the baseboard.Type: ApplicationFiled: October 21, 2013Publication date: April 24, 2014Applicant: Kabushiki Kaisha Nihon MicronicsInventor: Mika Nasu
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Patent number: 8702331Abstract: A movable BF guide is provided in a movable-blade receiving area into which a movable blade slides along a fixed blade while being pressed against the fixed blade in a process of cutting recording paper. The movable-blade receiving area is blocked by the BF guide when the cutting process is not performed, thus preventing the entry of the end portion of the downstream connected recording paper into the movable-blade receiving area.Type: GrantFiled: December 15, 2010Date of Patent: April 22, 2014Assignee: Star Micronics Co., Ltd.Inventors: Yuji Suzuki, Masaaki Morishita
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Patent number: 8697009Abstract: The present invention relates to microfluidic devices and methods for manipulating and analyzing fluid samples. The disclosed microfluidic devices utilize a plurality of microfluidic channels, inlets, valves, filter, pumps, liquid barriers and other elements arranged in various configurations to manipulate the flow of a fluid sample in order to prepare such sample for analysis.Type: GrantFiled: September 6, 2013Date of Patent: April 15, 2014Assignee: Micronics, Inc.Inventors: Patrick Saltsman, Mingchao Shen, Jeffrey M. Houkal, Christy A. Lancaster, C. Frederick Battrell, Bernhard H. Weigl
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Patent number: 8699035Abstract: An inspection apparatus and an inspection method is provided having a wafer chuck stage equipped with one or more wafer chucks; a position measurement unit for measuring the positions of the light emitting devices on each of the expanded wafers loaded respectively on the wafer chucks; a photodetector and at least one probe provided corresponding to each of the expanded wafers; and a control unit provided with means for moving the wafer chuck stage in the X axis and/or Y-axis directions such that the light emitting devices on each of the expanded wafers are sequentially brought under the corresponding probes, means for moving each of the probes to a place corresponding to the electrodes in the light emitting devices, and means for bringing the probes into contact with the corresponding electrodes.Type: GrantFiled: August 27, 2012Date of Patent: April 15, 2014Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Syu Jimbo, Norie Yamaguchi, Keita Koyahara
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Patent number: 8680880Abstract: An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.Type: GrantFiled: December 14, 2009Date of Patent: March 25, 2014Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Hidehiro Kiyofuji, Tetsuya Iwabuchi, Toshiyuki Kudo, Seiji Kanazawa
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Patent number: 8671567Abstract: A method for manufacturing a probed for an electrical test includes producing by a deposition technique a deposit including a probe main body portion made of a nickel-boron alloy and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from the probe main body portion. The method further includes annealing the deposit. The average grain diameter of the nickel-boron alloy is between 97 ? and 170 ?. The contained amount of boron is from 0.02 wt % to 0.20 wt %.Type: GrantFiled: November 4, 2010Date of Patent: March 18, 2014Assignee: Kabushiki Kaisha Nihon MicronicsInventors: Hideki Hirakawa, Satoshi Kaizuka
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Publication number: 20140072780Abstract: A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.Type: ApplicationFiled: August 28, 2013Publication date: March 13, 2014Applicant: KABUSHIKI KAISHA NIHON MICRONICSInventors: Takayasu SUGAI, Noboru OTABE
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Patent number: D702646Type: GrantFiled: February 12, 2013Date of Patent: April 15, 2014Assignees: Kabushiki Kaisha Nihon Micronics, Federal Signal CorporationInventors: Masatomo Uebayashi, Akira Souma