Patents Assigned to Micronics
  • Patent number: 8746117
    Abstract: Provided is a printer in which a cut-off paper is pushed into a paper stacking portion without an additional power source while reducing the maximum load applied to driving means for driving a movable blade. A printer includes a movable blade for cutting a paper disposed between a fixed blade and a movable blade as it moves in a forward direction and separating a printed part as a cut-off paper; driving means for moving the movable blade in a reciprocating manner; a pushing member which is driven to push a cut-off paper in a thickness direction of the cut-off paper; a paper stacking portion for stacking the cut-off paper pushed by the pushing member; and a driving force transferring mechanism for transferring a driving force of the driving means to the pushing member to drive the pushing member.
    Type: Grant
    Filed: April 4, 2012
    Date of Patent: June 10, 2014
    Assignee: Star Micronics Co., Ltd.
    Inventors: Tomoyuki Kondo, Takeshi Ogawa
  • Patent number: 8747779
    Abstract: A microfluidic cartridge including on-board dry reagents and microfluidic circuitry for determining a clinical analyte or analytes from a few microliters of liquid sample; with docking interface for use in a host workstation, the workstation including a pneumatic fluid controller and spectrophotometer for monitoring analytical reactions in the cartridge.
    Type: Grant
    Filed: October 13, 2011
    Date of Patent: June 10, 2014
    Assignee: Micronics, Inc.
    Inventors: Isaac Sprague, John E. Emswiler, C. Frederick Battrell, Joan Haab, Sean M. Pennell, Justin L. Kay, Zane B. Miller, Troy D. Daiber
  • Publication number: 20140150929
    Abstract: Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.
    Type: Application
    Filed: April 4, 2012
    Publication date: June 5, 2014
    Applicant: Micronic MyData AB
    Inventor: Torbjorn Sandstrom
  • Patent number: 8743165
    Abstract: The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: June 3, 2014
    Assignee: Micronic Laser Systems AB
    Inventor: Torbjörn Sandström
  • Publication number: 20140145741
    Abstract: A probe card comes in touch with a test object to perform an inspection. The probe card contains: a probe substrate provided with a plurality of probes on the first surface and a plurality of anchor receiving portions on the second surface; and a supporting body disposed to support the periphery of the probe substrate, with at least a plurality of anchor receiving portions located within a probe existence region being arranged regularly and at an equal distance from each other on the second surface of the probe substrate.
    Type: Application
    Filed: November 27, 2013
    Publication date: May 29, 2014
    Applicant: Kabushiki Kaisha Nihon Micronics
    Inventors: Yoshiro NAKATA, Yoshinori KIKUCHI, Hirose FUJITA
  • Patent number: 8736292
    Abstract: An automatic switching mechanism is controlled by a probe card independent from a tester without limitation of the number of control signals from the tester. A probe card and an inspection apparatus include probes to be brought into contact with electrodes of inspection targets and a power supply channel electrically connecting the probes to a tester. The automatic switching mechanism divides each of the power supply channels into a plurality of power supply wiring portions, which are respectively connected to the probes; and shuts off the power supply wiring responsive to electrical fluctuation such as overcurrent. An electrical fluctuation detection mechanism detects an electrical fluctuation due to a defective product among the inspection targets. A control mechanism, responsive to detection of an electrical fluctuation, shuts off the power supply wiring portion if the electrical fluctuation is caused by the automatic switching mechanism.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: May 27, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Tatsuo Ishigaki, Katsuji Hoshi, Akihisa Akahira
  • Publication number: 20140138139
    Abstract: Provided is a method for manufacturing a multi-layer wiring board and the multi-layer wiring board that are capable of suppressing variation in resistance values. The method according to the present invention is the method for manufacturing a multi-layer wiring board. The method includes forming a resistor thin film, measuring resistance distribution of the resistor thin film, calculating resistor width adjustment rates of the plurality of resistors according to the resistance distribution, forming a pattern of a protective film on the resistor thin film, in which the pattern of the protective pattern has pattern width according to the resistor width adjustment rate, forming a pattern of a plating film on the resistor thin film at a position exposed from the protective film, and etching the resistor thin film at a position exposed from the plating film and the protective film so as to pattern the resistor thin film.
    Type: Application
    Filed: November 13, 2013
    Publication date: May 22, 2014
    Applicant: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Yoshiyuki FUKAMI, Toshinori OMORI, Katsushi MIKUNI, Noriko KON
  • Publication number: 20140137055
    Abstract: The present invention relates to customizing individual workpieces, such as chip, flat panels or other electronic devices produced on substrates, by direct writing a custom pattern. Customization can be per device, per substrate, per batch or at some other small volume that makes it impractical to use a custom mask or mask set. In particular, it relates to customizing a latent image formed in a patterning sensitive layer over a substrate, merging standard and custom pattern data to form a custom pattern used to produce the customized latent image. A wide variety of substrates can benefit from the technology disclosed.
    Type: Application
    Filed: January 17, 2014
    Publication date: May 15, 2014
    Applicant: Micronic MyData AB
    Inventors: Lars IVANSEN, Anders OSTERBERG
  • Patent number: 8721372
    Abstract: Respective plungers are slidably supported in a stable manner without fluctuation, and reliable electrical contact is achieved. In a contact of the present invention, a first plunger and a second plunger include tip end portions provided on tip end sides, slidably supported, and contacting two respective members and sliding portions provided on proximal end sides, formed in halved shapes of the respective plungers, slidably overlapped with each other, and inserted in a compression coil spring. Each of the sliding portions is set to have a length to be slidably supported together with the tip end portion of the other plunger.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: May 13, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventor: Yoshiei Hasegawa
  • Publication number: 20140125000
    Abstract: A movable BF guide is provided in a movable-blade receiving area into which a movable blade slides along a fixed blade while being pressed against the fixed blade in a process of cutting recording paper. The movable-blade receiving area is blocked by the BF guide when the cutting process is not performed, thus preventing the entry of the end portion of the downstream connected recording paper into the movable-blade receiving area.
    Type: Application
    Filed: January 9, 2014
    Publication date: May 8, 2014
    Applicant: STAR MICRONICS CO., LTD.
    Inventors: Yuji Suzuki, Masaaki Morishita
  • Patent number: 8716007
    Abstract: An instrument for fluorometric assays in liquid samples is disclosed. The instrument may include multiple optical channels for monitoring a first fluorophore associated with a target analyte and a second fluorophore associated with a control. The disclosed instrument finds utility in any number of applications, including microfluidic molecular biological assays based on PCR amplification of target nucleic acids and fluorometric assays in general.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: May 6, 2014
    Assignee: Micronics, Inc.
    Inventors: C. Frederick Battrell, Troy D. Daiber, William Samuel Hunter
  • Publication number: 20140118018
    Abstract: An inspection unit in which a probe card is united with a connection body via a vacuum chamber. It prevents flatness of tips of probes provided on the probe card from worsening when the probe card is united with a connection body by suction force (negative pressure) of the vacuum chamber. The inspection unit includes a probe card with probes on a first surface and a connection body united with a second surface of the probe card via a first vacuum chamber. The first chamber is formed with a plurality of chambers.
    Type: Application
    Filed: October 29, 2013
    Publication date: May 1, 2014
    Applicant: Kabushiki Kaisha Nihon Micronics
    Inventors: Kenichi WASHIO, Norie YAMAGUCHI
  • Publication number: 20140110372
    Abstract: A method for manufacturing a probe, includes forming a recess on a sacrificial layer with a resist matching a plane pattern of the probe and a fixing tab connected to the probe, the recess exposing the sacrificial layer, which is on a baseboard, forming the probe and the fixing tab connected to the probe by depositing a probe material in the recess, and removing the resist, removing a portion of the sacrificial layer in an etching process. The portion of the sacrificial layer under the probe is fully removed, while the portion of the sacrificial layer under the fixing tab is left to provide support portions of the sacrificial layer under the fixing tab. Then the probe is removed from the baseboard.
    Type: Application
    Filed: October 21, 2013
    Publication date: April 24, 2014
    Applicant: Kabushiki Kaisha Nihon Micronics
    Inventor: Mika Nasu
  • Patent number: 8702331
    Abstract: A movable BF guide is provided in a movable-blade receiving area into which a movable blade slides along a fixed blade while being pressed against the fixed blade in a process of cutting recording paper. The movable-blade receiving area is blocked by the BF guide when the cutting process is not performed, thus preventing the entry of the end portion of the downstream connected recording paper into the movable-blade receiving area.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: April 22, 2014
    Assignee: Star Micronics Co., Ltd.
    Inventors: Yuji Suzuki, Masaaki Morishita
  • Patent number: 8697009
    Abstract: The present invention relates to microfluidic devices and methods for manipulating and analyzing fluid samples. The disclosed microfluidic devices utilize a plurality of microfluidic channels, inlets, valves, filter, pumps, liquid barriers and other elements arranged in various configurations to manipulate the flow of a fluid sample in order to prepare such sample for analysis.
    Type: Grant
    Filed: September 6, 2013
    Date of Patent: April 15, 2014
    Assignee: Micronics, Inc.
    Inventors: Patrick Saltsman, Mingchao Shen, Jeffrey M. Houkal, Christy A. Lancaster, C. Frederick Battrell, Bernhard H. Weigl
  • Patent number: 8699035
    Abstract: An inspection apparatus and an inspection method is provided having a wafer chuck stage equipped with one or more wafer chucks; a position measurement unit for measuring the positions of the light emitting devices on each of the expanded wafers loaded respectively on the wafer chucks; a photodetector and at least one probe provided corresponding to each of the expanded wafers; and a control unit provided with means for moving the wafer chuck stage in the X axis and/or Y-axis directions such that the light emitting devices on each of the expanded wafers are sequentially brought under the corresponding probes, means for moving each of the probes to a place corresponding to the electrodes in the light emitting devices, and means for bringing the probes into contact with the corresponding electrodes.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: April 15, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Syu Jimbo, Norie Yamaguchi, Keita Koyahara
  • Patent number: 8680880
    Abstract: An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.
    Type: Grant
    Filed: December 14, 2009
    Date of Patent: March 25, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hidehiro Kiyofuji, Tetsuya Iwabuchi, Toshiyuki Kudo, Seiji Kanazawa
  • Patent number: 8671567
    Abstract: A method for manufacturing a probed for an electrical test includes producing by a deposition technique a deposit including a probe main body portion made of a nickel-boron alloy and a probe tip portion projecting downward from the probe main body portion and made of a different conductive material from the probe main body portion. The method further includes annealing the deposit. The average grain diameter of the nickel-boron alloy is between 97 ? and 170 ?. The contained amount of boron is from 0.02 wt % to 0.20 wt %.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: March 18, 2014
    Assignee: Kabushiki Kaisha Nihon Micronics
    Inventors: Hideki Hirakawa, Satoshi Kaizuka
  • Publication number: 20140072780
    Abstract: A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.
    Type: Application
    Filed: August 28, 2013
    Publication date: March 13, 2014
    Applicant: KABUSHIKI KAISHA NIHON MICRONICS
    Inventors: Takayasu SUGAI, Noboru OTABE
  • Patent number: D702646
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: April 15, 2014
    Assignees: Kabushiki Kaisha Nihon Micronics, Federal Signal Corporation
    Inventors: Masatomo Uebayashi, Akira Souma