Abstract: The present invention relates to customizing individual workpieces, such as chip, flat panels or other electronic devices produced on substrates, by direct writing a custom pattern. Customization can be per device, per substrate, per batch or at some other small volume that makes it impractical to use a custom mask or mask set. In particular, it relates to customizing a latent image formed in a radiation sensitive layer over a substrate, merging standard and custom pattern data to form a custom pattern used to produce the customized latent image. A wide variety of substrates can benefit from the technology disclosed.

Abstract: The present invention describes a micro-mechanical light modulator including a two-dimensional array of modulating elements, in which small modulating elements are organized into larger modulating areas. Using smaller elements organized into larger areas increases the resonant frequency of the modulators and the modulation speed. In some implementations, multiple modulating elements are driven by shared signals, allowing the number of elements driven and the resulting area to increase without increasing the data traffic. In some implementations, an anamorphic optical path is used that leaves individual modulating elements of the micro-mechanical light modulator that are operated as a single area unresolved at an image plane of the workpiece being patterned. Devices and methods are described.

Abstract: A machine tool includes: a main spindle adapted to be rotatable with a workpiece chucked thereby; a tool spindle capable of moving in directions of three axes perpendicular to each other and capable of pivoting about one of the axes, the axis being perpendicular to the main spindle; an automatic tool changer adapted to detachably attach a first tool and a chucking unit to the tool spindle, the first tool being used for machining the workpiece chucked by the main spindle, the chucking unit being used for chucking the workpiece; and a tool post having a second tool mounted thereon, the second tool being used for machining the workpiece chucked by the chucking unit attached to the tool spindle.

Abstract: A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c.

Abstract: An embodiment of an electrical connecting apparatus includes a chip unit having a plurality of electronic components arranged on the upper side of a chip supporting body, a probe unit having a plurality of contacts arranged on the lower side of a probe supporting body, and a connecting unit arranged between the chip unit and the probe unit and having a connecting member supporting body and a plurality of connecting members electrically connecting the chip unit to the probe unit. The chip unit, the probe unit and the connecting unit are vacuum-coupled.

Abstract: A printer and a cutter apparatus configured to provide a sure full cut without producing an undesirable flake of paper. The cutter apparatus comprises a fixed blade, a first movable blade disposed on one side in a width direction of the paper and configured to move back and forth with respect to the fixed blade, a second movable blade disposed on the other side in the width direction of the paper with a gap provided with respect to the first movable blade and configured to move back and forth with respect to the fixed blade, and an urging member configured to urge each of the first movable blade and the second movable blade in a direction reducing the gap.

Abstract: An electrical connecting apparatus includes a wiring base plate having a first surface coupled with a reinforcing plate and provided on an opposite surface with first electrical connection portions, a probe base plate provided on a first surface with second electrical connection portions corresponding to the first electrical connection portions and provided on a second surface with probes electrically connected to the second electrical connection portions, anchor portions formed on the first surface of the probe base plate and provided with screw holes, cylindrical spacers having first ends removably coupled with the anchor portions, having screw grooves, and passing through the wiring base plate and the reinforcing plate, reference plates having reference planes to receive the spacers and removably coupled with the reinforcing plate, shims inserted between the respective reference plates and the reinforcing plate, and bolt screwed in the screw groove of the spacer.

Abstract: An embodiment of an electrical connecting apparatus comprises a probe base plate and a plurality of contacts provided with tips to be pressed against electrodes of a device under test and arranged on the underside of the probe base plate. The distance dimensions from an imaginary plane parallel to the probe base plate to the tips of the contacts are made the greater toward the center of the probe base plate.

Abstract: An inspection apparatus includes a probe card having a plurality of probes arranged to correspond to each chip of a semiconductor wafer under inspection and contacting a plurality of electrodes of each chip and a test head electrically connected to the respective probes of the probe card and applying test signals from a tester, and a plurality of tester lands of a probe substrate electrically connected respectively to the plurality of probes. A plurality of electrical connecting portions on the tester side of the test head, corresponding to the respective tester lands, are arranged to constitute a plurality of arrangement areas sectioned to correspond to the respective chips under inspection, and the plurality of probes of the probe substrate are connected to the corresponding tester lands provided in the arrangement areas in units of chips under inspection.

Abstract: The current invention relates to writing or reading a pattern on a surface, such as in microlithography or inspection of mircrolithographic patterns. In particular, Applicant discloses systems recording or reading images by scanning sparse 2D point arrays or grids across the surface, e.g., multiple optical, electron or particle beams modulated in parallel. The scanning and repeated reading or writing creates a dense pixel or spot grid on the workpiece. The grid may be created by various arrays: arrays of light sources, e.g., laser or LED arrays, by lenslet arrays where each lenslet has its own modulator, by aperture plates for particle beams, or arrays of near-field emitters or mechanical probes. For reading systems, the point grid may be created by a sparse point matrix illumination and/or a detector array where each detector element sees only one spot. The idea behind the use of large arrays is to improve throughput.

Abstract: A semiconductor chip module having high degree of freedom in assignment of a circuit to each semiconductor chip and in position of a connection terminal of each semiconductor chip is provided. The present invention relates to a semiconductor chip module in which a plurality of semiconductor chips, each provided on the side face thereof with a part of a connection terminal coupled with a circuit pattern formed on the front face, have been stacked and bonded. Connection terminal portions on the side faces of the respective semiconductor chips are interconnected by a wiring pattern. The connection terminal on the semiconductor chip is led from the front face to the side face and formed by applying spraying of a conductive material in a mist state.

Abstract: A lithographic workpiece processing tool includes a loading area for loading a workpiece; and a processing area for processing a workpiece. The workpiece processing tool further includes a multi-table system arranged between the loading area and the processing area. The multi-table system includes at least two tables configured to pass each other while moving between the loading area and the processing area. Each of the at least two tables is configured to hold a workpiece.

Abstract: A total water desalination system is disclosed that includes a centrifugal separator, a feed-water device controlled by a relative humidity sensor, an air pump, an evaporator core, an air dryer, a non-particulate coalescent air filter, and an air flow/brine gravity separating tank. The evaporator core typically contains multiple conical processing chambers and introduces a physical dynamic that increases the surface area of the water, using low-level thermal energy to vaporize micron-size water particles into a gaseous state, suitable for reconstitution into desalinated (or lower salt content) water. The evaporator core operation principles are based on creating a highly dynamic environment that separates impurities from sea, brackish, river, or turbid water; evaporating the water into a residual clean vapor, and returning the vapor to water composition with high efficiency.

Abstract: Apparatuses and methods for making and using a filter cloth assembly are described. A filter cloth assembly can have a liquid permeable filtering media attached to a connector ring. The liquid permeable filtering media separates at least one solid from at least one liquid in a slurry. The filtering media has a feed hole formed therein to allows passage of a slurry through the filtering media. The connector ring includes a flange having an upper flange section and a lower flange section. The lower flange section receives an edge of the feed hole to connect the filtering media to the connector ring such that the face of the filtering media is substantially flush with the upper flange section.

Abstract: One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members.

Abstract: A control apparatus of a machine tool is adapted to detect whether or not an NC program is stopped at an end of a block and whether or not a rotation of a handwheel for a manual pulse generator is stopped and restarted when both a manual pulse mode and a single block mode are selected. The NC program is accordingly automatically restarted from the next block in conjunction with the restart of the handwheel rotation. The operator thus can restart an operation of an NC unit only by rotating the handwheel when the operation is automatically stopped at the end of a block of the NC program.

Abstract: The technology disclosed relates to handling varying pixel overlaps long a first axis as a scanning head sweeps a curved path that is not parallel to the first axis. In particular, we teach use of a variable frequency pixel clock to produce equally spaced pixels along the first axis as a rotor arm scans a curved path that is not parallel to the first axis. The pixel clock has a varying frequency that varies approximately sinusoidally with the position of the scanning head relative to the first axis.

Abstract: A wafer prober is provided with a tray which supports a wafer at a set position, transports it to a processing position of the wafer and is placed at the processing position; one or more alignment units which position the wafer at the set position with respect to the tray; contact units arranged in number larger than that of the alignment units and performing inspection processing in contact with the wafer at the processing position; and a tray transport portion for transporting the tray supporting the wafer between the alignment unit and the contact unit. The tray is provided with three or more pin holes for allowing movement of the chuck pin in the XYZ? directions, an alignment mark for positioning the wafer, and an alignment portion for positioning the tray itself.

Abstract: A wire forming device for applying a paste material on an insulating substrate to form a wiring pattern. The wire forming device includes a paste material application unit which includes an atomizing unit atomizing the paste material and a nozzle spraying the atomized paste material onto the insulating substrate. The atomizing unit includes: a medium supplying portion which mixes a medium with a carrier gas to form a mixed gas and an atomizing portion. The atomizing portion holds the paste material and brings the mixed gas into contact with the paste material to atomize the paste material, thereby making a mist stream of the mixed gas and the paste material as the atomized paste material fed to the nozzle. The wire forming further includes a mixing ratio adjusting unit adjusting a mixing ratio of the paste material to the mixed gas in the mist stream.

Abstract: Quality of connection portions between respective probes and respective wires in a probe assembly is improved. Also, time required for work for connection between the probes and the wires is shortened. Further, improper connection between the probes and the wires is eliminated. A probe assembly includes an electric insulating substrate, a plurality of probes supported on one surface of the substrate, a plurality of through holes provided in the substrate to respectively correspond to the plurality of probes and filled with a conductive material attached to the respective probes, and a plurality of conductive membranes formed on the other surface of the substrate and respectively attached to the conductive material in the plurality of through holes.