Abstract: An embodiment of an electrical connecting apparatus comprises a support board having an upper surface and a lower surface, a block having an attachment surface directing downward and attached to the support board in a state where at least the attachment surface is located below the support board, a flexible circuit board having a contactor area in which a plurality of contactors are arranged and an outside area around the contactor area and attached at part of the outside area to the lower surface of the support board in a state where at least the contactor area is opposed to the attachment surface of the block, and a reference mark member having a lower end surface and a reference mark for positioning provided on the lower end surface and attached to the block in a state where the lower end surface is exposed to the lower side of the circuit board. Accordingly, the measurement accuracy of the probe tip position is heightened.

Abstract: The present invention provides an inexpensive semiconductor chip module enabling sufficient heat dissipation without complicating the manufacture process. A semiconductor chip module according to the present invention includes a plurality of semiconductor chips to be stacked provided at the side face with a connection terminal to be coupled with a circuit pattern formed on the front face, interlayer wiring mutually connecting the connection terminals on the side faces of the respective semiconductor chips by a wiring pattern, and a formation space contributing to heat dissipation, formed between at least some layers of the semiconductor chips, to secure a formation face of the interlayer wiring.

Abstract: An embodiment of an electrical connecting apparatus comprises a support board, a plate spring arranged on the support board, an attachment device attaching the plate spring to the support board, a block having an attachment surface directing downward, and a flexible circuit board in which a plurality of contactors are arranged. As for the block, the attachment surface for attaching the circuit board is protruded further to the lower side than the support board. The plate spring receives initial load to bring a state where at least a center area for attaching the block is biased toward the upper side. Thus, a good electrical contacting state can be obtained without increasing the overdriving amount.

Abstract: An embodiment of an electrical connecting apparatus includes a chip unit having a plurality of electronic components arranged on the upper side of a chip supporting body, a probe unit having a plurality of contacts arranged on the lower side of a probe supporting body, and a connecting unit arranged between the chip unit and the probe unit and having a connecting member supporting body and a plurality of connecting members electrically connecting the chip unit to the probe unit. The chip unit, the probe unit and the connecting unit are vacuum-coupled.

Abstract: Previously disclosed methods and devices are extended in this application by two-dimensional analysis of optical proximity interactions and by fashioning a computationally efficient kernel for rapid calculation of adjustments to be made. The computations can be made in realtime, whereby the use of OPC assist features can be reduced, with substantial savings in file size and computational requirements. Further aspects of the invention are disclosed in the descriptions, figures, claims and documents incorporated by reference.

Abstract: The present disclosure relates to fracturing of polygon data, with one application being microlithography. In particular, it relates to preserving data regarding edges and/or vertices of the original polygons as the polygons are triangulated and even if the results of triangulation are further fractured.

Abstract: A probe having an alignment mark that is hardly influenced by scraps of an electrode scraped by a probe tip is provided. A probe according to the present invention comprises a base portion having an attaching end and extending in a direction distanced from the attaching end, an arm portion extending from the base portion laterally with a space in the extending direction of the base portion from the attaching end, a probe tip portion protruded from the arm portion and having a probe tip formed on its protruding end, and an alignment mark for alignment of the probe tip. The arm portion has a flat surface area on the opposite side of a side where the attaching end of the base portion is located when seen along the extending direction of the arm portion. The probe tip portion is formed to be protruded from the flat surface area, and the alignment mark is constituted by at least a part of the flat surface area.

Abstract: The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.

Abstract: In an electrical connecting apparatus, a thermal deformation restriction member, a reinforcing plate, and an auxiliary member are made of materials having smaller thermal expansion coefficients in this order, and a wiring board supporting a probe assembly is coupled with the reinforcing plate. The auxiliary member has a void inside the coupling region with the reinforcing plate. The void receives the deformed part when the center portion of the wiring board is deformed toward the reinforcing plate. Thus, the thermal deformation restriction member, the reinforcing plate, and the auxiliary member function as a three-layer bimetal having a sandwich structure, and the thermal deformation of the wiring board is restricted effectively.

Abstract: A check valve includes: a base member provided with an inlet channel along which fluid flows in one direction; a valve unit disposed on a valve mounting surface and including a film valve body and a frame body; and a valve seating surface defined on the valve mounting surface at the periphery of the opening of the inlet channel, wherein one or more communicating grooves are formed on the valve mounting surface across the frame body so as to extend from the valve seating surface to the outside of the frame body, wherein the inlet channel is blocked by the film valve body when the film valve body is in contact with the valve seating surface, and wherein the inlet channel and the outside of the frame body are communicated via the communicating grooves when the film valve body is separated from the valve seating surface.

Abstract: An aspect of the present invention includes a method for patterning a workpiece covered at least partly with a layer sensitive to electromagnetic radiation by simultaneously using a plurality of exposure beams. In an example embodiment it is determined if any of the beams have an actual position relative to a reference beam which differs from its intended position. An adjustment of the exposure dose for a wrongly positioned beam is performed if said beam is printed at en edge of a feature. Other aspects of the present invention are reflected in the detailed description, figures and claims.

Abstract: The present invention relates to a method for determining the coordinates of an arbitrarily shaped pattern in a deflector system. The method basically comprises the steps of: moving the pattern in a first direction (X), calculating the position of the edge of the pattern by counting the number of micro sweeps, performed in a perpendicular direction (Y), until the edge is detected, and determining the coordinates by relating the number of counted micro sweeps to the speed of the movement of the pattern. The invention also relates to software implementing the method.

Abstract: A label peeling method for label sheet includes: conveying a label sheet including a base sheet and a label affixed to the base sheet along a conveying path that is bent at a bent portion; and performing a printing operation on the label from a beginning portion of printing while conveying the label sheet, wherein the conveying of the label sheet and the printing operation are stopped once in a state where the label sheet is conveyed until a conveying-direction leading end portion of the label reaches a downstream side of the bent portion of the conveying path, after a stopping state is held for a predetermined time, the conveying of the label sheet and the printing operation are resumed so that the label is peeled from the base sheet at the bent portion of the conveying path.

Abstract: A pattern generation system includes an optical system and a rotor. The optical system is configured to project a laser image onto an optical scanner. The rotor has a plurality of optical arms arranged at a first angle relative to one another, and further includes the optical scanner. The laser image is sequentially reflected by the optical scanner into each of the plurality of optical arms of the rotor to generate a pattern on a workpiece.

Abstract: An amplifier circuit with favorable linearity is provided. An amplifier of the present invention is provided with an amplifier MOS transistor, a diode-connected transistor block for negative feedback source impedance constituted by series-parallel connection of the limited number (including 0) of the diode-connected MOS transistors and connected to a source side of the amplifier MOS transistor, and a diode-connected transistor block for load constituted by series-parallel connection of the limited number of the diode-connected MOS transistors and connected to a drain side of the amplifier MOS transistor. A voltage gain is configured to be determined by a ratio of the sum of source impedance of the amplifier MOS transistor and the impedance of the diode-connected transistor block for negative feedback source impedance to the impedance of the diode-connected transistor block for load.

Abstract: A probe for current test is provided. The probe includes a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board, a solder layer formed on at least one side face of said connection portion, and a guide portion formed on the connection portion. The guide portion penetrates the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face. When the solder layer is melted, the guide portion guides a portion of the melted solder to the other side face.

Abstract: An IC device (10) held on an IC carrier (24) is a double-sided electrode type BGA IC device (10) provided with bump electrodes (14) on a first surface of a package. The IC device has, on a second surface opposite the first surface, (a) a central protrusion (30), (b) a peripheral portion (32) lower than the protrusion by one step, and (c) upper electrodes (18) formed on the peripheral portion of the IC device. The IC carrier is provided with a frame (36), a cover (40), and a holding means (42). The frame forms a device reception space (38) for receiving the IC device. The cover can cover the upper electrodes while in contact with the periphery of the IC device held on the IC carrier. The holding means can hold the IC device on the IC carrier with the cover covering the upper electrodes of the IC device. The IC device can be set in an IC socket while being mounted on the IC carrier.

Abstract: A test apparatus according to the present invention includes a probe card recognition unit that recognizes positions of at least two probe card marks formed to a probe card and assumes a probe card mark connection line connecting the positions of the probe card marks, a backing material recognition unit that recognizes positions of at least two backing material marks formed to a backing material where a semiconductor chip is fixed thereto and assumes a backing material mark connection line connecting the positions of the backing material mark, a positional relationship recognition unit that recognizes a positional relationship between the probe card and the backing material according to the probe card mark connection line and the backing material mark connection line, and a correction unit that corrects the position of at least one of the probe card and the backing material according to the positional relationship.

Abstract: An apparatus for testing an integrated circuit comprises: a chip unit with a plurality of electronic parts such as chip units arranged on the upside of a chip support; a probe unit having a plurality of contacts arranged on the underside of a probe support and spaced downward from the chip unit; a connection unit supporting the probe unit spaced downward from the chip unit on a pin support so as to penetrate the pin support in an up-down direction; and a coupling unit which couples separably the chip unit, the probe unit and the connection unit and displaces one of the chip support and the probe support and the pin support in a direction to approach each other and to be away from each other relative to the connection unit.

Abstract: In the magnetic ink character reading apparatus, a first determination section reads signal data sequentially from a signal data string corresponding to the output signals of a magnetic head and determines whether the signal data corresponds to a predetermined signal. A second determination section determines whether the determination results by the first determination section is obtained successively for at least a predetermined number of signal data. A determination counter section counts the number of times (count) the successive acquisition of the determination results each telling the disagreement of the signal data with the predetermined signal over at least the predetermined number of signal data has been confirmed by the second determination section. A character recognition processing execution limit section limits the execution of the character recognition processing according to the count result provided by the determination counter section.