Abstract: The present invention provides a semiconductor test apparatus that can reduce influence of noise in high-frequency measurement and that can be manufactured inexpensively by simplification of the constitution. A semiconductor test apparatus according to the present invention is one for use in an electrical test of a semiconductor wafer in which numerous integrated circuits each having electrode pads are incorporated. It comprises a probe card and a tester having a connection portion to the probe card. The probe card has numerous probes that can be connected to the electrode pads of the semiconductor wafer and a probe board having on one surface probe lands to which the probes are attached, having on the other surface tester lands corresponding to the probes, and having wiring paths each connecting the probe land and the tester land corresponding to each other. The tester is directly connected to the probe card as the connection portion contacts the tester lands.

Abstract: An electrical connecting device is disposed between a circuit board and a probe board opposing each other and used for connection between electrical connection terminals provided on the underside of said circuit board and electrical connection terminals provided on the probe board. In the electrical connecting device, an electrical insulating board has at least one of conductive earth patterns to be maintained at the earth potential on at least one selected from groups including the upside, underside and inside of the electrical insulating plate; a connecting pin disposed in each through hole of a first group is connected to the earth pattern, while a connecting pin disposed in each through hole of a second group is electrically separated from the earth pattern.

Abstract: An NC automatic lathe including abase board, a headstock provided with a main spindle and so arranged as to move in a direction of Z1 axis, a back attachment provided with a sub spindle which is so arranged as to be opposed to the headstock, the back attachment being so arranged as to move in directions of Z2 axis, X2 axis and Y2 axis, a guide bush, a first turret tool post arranged at a side of the guide bush so as to move in directions of X1 axis and Y1 axis, a second turret tool post arranged at a side of the guide bush so as to move in directions of Z3 axis, X3 axis and Y3 axis, and a fixed back machining tool unit arranged at a position offset with respect to at least one of the first turret tool post and second turret tool post, to the back attachment in a direction of Z axis, and provided with tool holding portions in at least two rows and two lines in directions of X axis and Y axis.

Abstract: The present invention provides a cleaning apparatus capable of removing foreign matters attached to a tip of a probe effectively without impairing the durability of the probe. The cleaning apparatus for the probe comprises a base plate having a rough surface and a surface layer formed to conform to and cover the rough surface for the purpose of providing a polishing surface for the probe and having lower hardness than hardness of the probe tip of the probe.

Abstract: A probe having a first and a second arm portion extending between first and second connecting portions connecting the first and second arm portions respectively at their front end portion and base end portion, and a needle point portion below the first connecting portion. At least one of the entire first and second arm portions or the upper or lower edge portions of the first and second arm portions are arcuate.

Abstract: In an electroacoustic transducer, a pair of coil terminals elongating from a voice coil are electrically connected to a pair of terminal members attached to a frame via a flexible printed circuit board, respectively. According to the configuration, even in a case where an electroacoustic transducer is used at a high sound pressure, breakage of the coil terminals hardly occurs. In the flexible printed circuit board, the width of an intermediate portion is set to be smaller than the widths of an end portion on the side of the coil terminals and an end portion on the side of the terminal members. Therefore, the flexibility of the intermediate portion can be enhanced, whereby transmission of characteristic vibration of the flexible printed circuit board to a diaphragm, and stress concentration in the vicinity of the end portions are effectively suppressed.

Abstract: An acousto-optic cell is used in a method and device for patterning a workpiece, for exposing a radiation sensitive layer on a workpiece such as a mask or a device substrate. The acousto-optic cell includes an array of transducers. The transducers may supply columns of ultrasound to the cell. They may produce a two dimensional modulation pattern within the cell. Electromagnetic radiation is modulated by the cell and related to a workpiece. The modulation of the cell may modulate the amplitude and/or phase of the electromagnetic radiation. In some embodiments, adjoining columns of ultrasound may be positioned so that portions of the electromagnetic radiation partially overlap and interfere, after they are modulated.

Abstract: A printing apparatus includes: a printing unit that allows a print head to print on a recording medium in a forward path and a return path by reciprocating the print head with respect to the recording medium; a correcting unit that performs correction for a misalignment between printing in the forward path and printing in the return path based on a correction value; an acquisition unit that acquires a temperature inside the printing apparatus or an ambient temperature thereof and/or a counter value which increases or decreases each time a predetermined operation is performed by the printing apparatus; a correction value candidate acquisition unit that acquires correction value candidates based on the temperature and/or the counter value; and a printing example output unit that outputs printing examples of which position discrepancies are corrected in accordance with correction value candidates for each correction value candidate.

Abstract: A condenser microphone includes: a casing including a sound hole; a vibration film disposed in the casing so as to face the sound hole; a back plate disposed opposed to the vibration film; a spacer disposed between the vibration film and the back plate; and a hold member including a spring member. The back plate has an outer peripheral shape that is smaller than an inner peripheral shape of the casing so as to provide a clearance between an outer peripheral surface of the back plate and an inner peripheral surface of the casing. The back plate is held by the hold member from an opposite side of the vibration fills.

Abstract: The present invention relates to a method and a system for predicting and/or measuring and correcting geometrical errors in lithography using masks, such as large-area photomasks or reticles, and exposure stations, such as wafer steppers or projection aligners, printing the pattern of said masks on a workpiece, such as a display panel or a semiconductor wafer. A method to compensate for process variations when printing a pattern on a workpiece, including determining a two-dimensional CD profile in said pattern printed on said workpiece, generating a two-dimensional compensation file to equalize fluctuations in said two-dimensional CD-profile, and patterning a workpiece with said two-dimensional compensation file.

Abstract: The present disclosure relates to fracturing of polygon data, with one application being microlithography. In particular, it relates to preserving data regarding edges and/or vertices of the original polygons as the polygons are triangulated and even if the results of triangulation are further fractured.

Abstract: The present invention relates to high speed datapaths, sometimes including mixed digital and analog voltage signals. In particular, it relates to error checking strategies for large data volumes, in digital and/or analog domains and to analog signal patterns that accelerate charge loading of micromirrors in an SLM. Particular aspects of the present invention are described in the claims, specification and drawings.

Abstract: In order to prevent negative effects of imprinting an the addressing accuracy of deformable actuators, a method for controlling deformable actuators has, during an event period, driving the first and the second deformable actuator for causing the deformable actuators to assume a first and a second deformation state, respectively; and, before or after the event period, driving the first and the second deformable actuator for causing the deformable actuators to assume deformations states to counteract an imprinting caused during the event period by approximating the loads applied to the deformable actuators to each other. According to an embodiment, before or after the event period, for a period substantially as long as the operation period, the first and the second deformable actuator are driven such that the first deformable actuator assumes the second deformation state and the second deformable actuator assumes the first deformation state.

Abstract: The present invention provides a probe manufacturing method in which, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily. A sacrificial layer is formed on a base table. The sacrificial layer is partially removed so as to form a recess in the sacrificial layer. A mask that exposes an area formed in a desired probe flat surface shape containing the recess is formed on the sacrificial layer. A probe material exhibiting different etching resistance characteristics from those of the sacrificial layer is deposited in the area exposed from the mask. By the deposition of the material, a coupling portion corresponding to the recess and a probe that is integral with the coupling portion are formed. After the mask is removed, the sacrificial layer is removed with use of etchant. Thereafter, the probe held on the base table at the coupling portion is detached from the base table together with the coupling portion.

Abstract: The present invention relates to microfluidic devices and methods for manipulating and analyzing fluid samples. The disclosed microfluidic devices utilize a plurality of microfluidic channels, inlets, valves, filter, pumps, liquid barriers and other elements arranged in various configurations to manipulate the flow of a fluid sample in order to prepare such sample for analysis.

Abstract: A multilayer wiring board has a ceramic substrate, on which a multilayer wiring section is formed. The ceramic substrate has an internal conductor layer, which is connected to a test pad. The first conductor layer is formed, and then an electric capacitance is measured between the test pad and a wiring pattern of the first conductor layer. On the other hand, an electrical capacitance is calculated under the normal wiring pattern condition. The measured value is compared to the calculated value to determine whether the wiring pattern is good or bad. Similar measurements and comparisons are carried out for each of the second through fifth conductor layers to determine whether a three-dimensional wiring path is good or bad. As the ceramic substrate has an internal conductor layer, the electric capacitance of the wiring can be measured without an overall grounded layer in the multilayer wiring section, which is a characteristic part different from others among a variety of the multilayer wiring boards.

Abstract: A multilayer wiring board has a ceramic substrate, on which a multilayer wiring section is formed. One of the conductor layers has a grounded pattern. Each of the conductor layers has a reference pattern, which is usable as a standard in calculation of an electric capacitance. An electric capacitance is measured between the grounded pattern and the three-dimensional wiring path. On the other hand, a theoretical electrical capacitance is calculated on the basis of a reference value of electric capacitance which has been measured between the reference pattern and the grounded pattern. The measured value for the wiring path is compared to the calculated value to determine whether the three-dimensional wiring path is good or bad. As the multilayer wiring section has the reference patterns, the electric capacitance for the normal wiring path can be obtained by calculation without preparing the normal acceptable product.

Abstract: A microfluidic system for isolation and amplification of DNA or RNA from aqueous solutions and detection of the DNA or RNA on a lateral flow detection strip, including a disposable microfluidic card for use in analysis of bacteria in platelets and an analysis of sexually transmitted diseases (STD) in urine. The card will include an embedded membrane that filters out cells and cellular debris. Any biological debris on the membrane will be lysed and the DNA or RNA amplified via PCR amplification protocol, including appropriate reagents and thermal cycling conditions. The amplified DNA or RNA are transferred to a lateral flow detection strip for a visual diagnostic read out. An alternate embodiment includes a microfluidic card for use in typing antiglobulin assays.

Abstract: To restrain misregistration of tips due to change in temperature, an electrical connecting apparatus is used for connection of a tester, and electrical connection terminals of a device under test to undergo electrical test by the tester. The electrical connecting apparatus comprises a probe board having a plurality of probe lands on its underside; and a plurality of contacts having tip portions to be brought into contact with a base end portion fixed at the respective probe lands and the connection terminals of the device under test. The measure from the tip of each contact and the probe land ranges from 1.1 to 1.3 mm, and the coefficient of thermal expansion of the probe board is greater than the coefficient of thermal expansion of the device under test within the range from 1 to 2 ppm/° C.