Abstract: The present invention provides a probe in which electrical short-circuit between the probes adjacent to each other is reliably prevented and that is manufactured relatively easily. The present invention provides a probe comprising a probe main body made of a plate-shaped member having an attachment region having an attachment end portion and extending in a direction distanced from the attachment end portion, an arm region continuing into the attachment region and extending in a direction intersecting with the extending direction of the attachment region, and a probe tip region intersecting with the longitudinal direction of the arm region, extending from the arm region to the opposite side of a side where the attachment end portion of the attachment region is located, seen from the arm portion, and having a probe tip at its extending end portion.

Abstract: An IC device (10) held on an IC carrier (24) is a double-sided electrode type BGA IC device (10) provided with bump electrodes (14) on a first surface of a package. The IC device has, on a second surface opposite the first surface, (a) a central protrusion (30), (b) a peripheral portion (32) lower than the protrusion by one step, and (c) upper electrodes (18) formed on the peripheral portion of the IC device. The IC carrier is provided with a frame (36), a cover (40), and a holding means (42). The frame forms a device reception space (38) for receiving the IC device. The cover can cover the upper electrodes while in contact with the periphery of the IC device held on the IC carrier. The holding means can hold the IC device on the IC carrier with the cover covering the upper electrodes of the IC device. The IC device can be set in an IC socket while being mounted on the IC carrier.

Abstract: The present invention relates to alignment of a writing system and a workpiece. In particular, it relates to alignment to write a second layer pattern on a workpiece that has a first layer pattern, using an SLM. It extends to producing a mask or reticle, and to producing a layer of a device using the mask or reticle. Particular aspects of the present invention are described in the claims, specification and drawings.

Abstract: A probe formed on a base table is detached from the base table without giving damage on the probe. The present invention provides a probe manufacturing method comprising the steps of forming on a sacrificial layer on a base table a recess exposing the sacrificial layer with a resist, depositing a probe material in the recess to form a probe and then removing the resist, leaving part of the sacrificial layer and removing the rest by an etching process, and detaching from the base table the probe held on the base table by the remaining part of the sacrificial layer. In the recess of the resist are formed a main body part corresponding to a flat surface shape of the probe and an auxiliary part continuing into the main body part. The probe is formed by deposition of the material at the main body part, and a holding portion is formed by deposition of the material at the auxiliary part.

Abstract: A probe tip section of an electrical test probe has a laminated structure consisting of a first deposition portion and a second deposition portion covering the first deposition portion, and by the laminated structure, a maximum cross-sectional area portion at which the cross-sectional area of the probe tip section is increased to a base portion is provided between a tip end of the probe tip section and the base portion in the probe tip section. At the maximum cross-sectional area portion, a dimension in the X direction as seen on a flat surface perpendicular to a protruding direction of the probe tip section is increased in a one-dimensional way, and in addition, a dimension in the Y direction perpendicular to the X direction is increased from the tip end toward the base portion, as a result of which the cross-sectional area of the probe tip section can be increased in a two-dimensional way.

Abstract: A contact block includes a contact having a pair of contact pieces spaced apart, and an electrically insulating combining block for combining the contact pieces. Each contact piece is provided with a horizontal U-shaped or a horizontal V-shaped intermediate region having a folded end portion and a pair of arm portions vertically spaced apart from the folded end portion; a first tip region extending downward from the tip portion of one of the arm portions; and a second tip region extending upward from the tip portion of the other arm portion. The folded end portions of both contact pieces are buried within the combining block and the remaining parts of both contact pieces are projected from the combining block. Thereby, in a state of being assembled into the electrical connecting apparatus, adjoining contacts are positioned by the combining block, and contacts can be exchanged by exchanging contact blocks.

Abstract: The present invention relates to a method for creating a pattern on a workpiece sensitive to electromagnetic radiation. Electromagnetic radiation is emitted onto a computer controlled reticle having a multitude of modulating elements (pixels). The pixels are arranged in said computer controlled reticle according to a digital description. An image of said computer controlled reticle is created on said workpiece, wherein said pixels in said computer controlled reticle are arranged in alternate states along at least a part of one feature edge in order to create a smaller address grid. The invention also relates to an apparatus for creating a pattern on a workpiece. The invention also relates to a semiconducting wafer and a mask.

Abstract: In a printer, when a cover is closed, a paper issuing path, and a paper setting path are formed downstream from a cutter mechanism in a paper transport path. The paths are switched over by a movable guide. During a normal printing process, the movable guide is swung by its own weight to close the paper setting path, and guides a paper to the paper issuing path. By contrast, during a process of setting paper, the movable guide is swung by the rigidity of the paper itself toward the paper issuing path, whereby the paper is prevented from being deformed with respect to the cutter mechanism.

Abstract: The two coil spring terminals have the structure of double coil spring terminal including a small diameter coil spring terminal and a large diameter coil spring terminal. In this case, a terminal holder is provided with a clamping portion for clamping the large diameter coil spring terminal between the terminal holder and an internal circuit board. Specifically, the terminal holder is formed, in an upper end portion of its outer peripheral surface, with an annular groove which is adapted to be engaged with a small diameter portion formed in an upper end portion of the large diameter coil spring terminal. This omits fixation of the large diameter coil spring terminal to the internal circuit board, and necessity of soldering the two coil spring terminals respectively to the internal circuit board as a conventional art, enhancing mounting workability of the terminal holder.

Abstract: A ceramic substrate has, on its surface, a multilayer wiring division, on which micro cantilever type probes are fixed. The multilayer wiring division has the first conductor layer, which includes through-hole junction pads, flatness improvement rings surrounding the through-hole junction pads and a grounding region further surrounding the flatness improvement rings. Since the flatness improvement rings are located around the through-hole junction pads, the surface of the first insulating layer, which is located above the first conductor layer, is free from severe undulation even near the through-hole junction pads. Accordingly, the multilayer wiring division has less irregularity in shape as a whole, and thus the probe mounting pads on the surface of the second insulating layer do not slope but keep almost horizontal. The probe unit substrate according to the invention has an advantage of less surface undulation and having non-sloping probe mounting pads without using a complicated manufacturing process.

Abstract: In a force cutting type paper cutter, a movable blade includes a pair of right and left edges having a V shape. These right and left edges are intersected and brought into pressure contact with a linear cutting edge of a fixed blade. The movable blade also includes a pair of right and left elastic pieces formed by a lateral slit and a division slit provided in the movable blade. These elastic pieces are held in an inclined state to the side of the fixed blade and such that the edges overlap with each other. During a cutting stroke, the elastic pieces are held a state in which the edges of the movable blade always make point contact with the edge of the fixed blade and uneven abutment is prevented.

Abstract: The present invention provides an electrical connecting apparatus in which no strong stress acts on a coupling portion of an arm portion continuing into a base portion by a moment force acting on the arm portion. A probe sheet comprising a probe sheet main body and a plurality of probes formed to be protruded from one surface of the probe sheet main body is provided. For formation of the arm portion of the probe, a metal material for an arm main body portion continuing into a probe tip portion is deposited on a base table with an approximately uniform height dimension. Also, a metal material for a reinforcing portion constituting an arm portion together with the arm main body portion is deposited at an area on the arm main body portion distanced from the probe tip portion with an approximately uniform height dimension.

Abstract: An electrical connecting apparatus is used for electrical inspection of a device under test having electrodes each of which a recess is formed on a flat upside. The electrical connecting apparatus is provided with a plurality of probes, each probe including a base portion combined with a probe board, an elastically deformable arm portion extending above the electrodes of the device under test from the base portion along the probe board and at a distance therefrom, and a tip portion projecting from the arm portion in a direction to be away from the probe board. The front end of the tip portion of each probe can abut a flat surface area except the recess on the upside of the electrode in a state that no flexural deformation is caused in the arm portion.

Abstract: The present invention provides a probe manufacturing method in which, after a metal material for a probe is deposited on a base table, the probe can be detached from the base table relatively easily without giving damage on the probe. A recess corresponding to a flat surface shape of a probe is formed by a resist mask on a sacrificial layer on a base table. By depositing a probe material in the recess, a probe made of the probe material is formed over the base table via the sacrificial layer. Thereafter, the resist mask is removed, and further the sacrificial layer is removed by an etching process with a part of the sacrificial layer remaining. For the purpose of forming an opening for control of the remaining part of the sacrificial layer in the etching process in the probe so as to let the opening pass through the probe in its plate thickness direction, a hole-forming portion for the opening is formed in the resist mask.

Abstract: An electrical connecting device is disposed between a circuit board and a probe board opposing each other and used for connection between electrical connection terminals provided on the underside of said circuit board and electrical connection terminals provided on the probe board. In the electrical connecting device, an electrical insulating board has at least one of conductive earth patterns to be maintained at the earth potential on at least one selected from groups including the upside, underside and inside of the electrical insulating plate; a connecting pin disposed in each through hole of a first group is connected to the earth pattern, while a connecting pin disposed in each through hole of a second group is electrically separated from the earth pattern.

Abstract: A capacitor microphone includes: a circuit substrate; a casing substrate fixed to an upper surface of the circuit substrate; a top cover substrate fixed to the upper surface; a capacitor part including a vibration film and a plate contained in the casing substrate; an impedance conversion element for converting variations in the electrostatic capacity of the capacitor part to electrical impedance; an electromagnetic shield portion electromagnetically shielding an inside of the casing substrate, the electromagnetic shield portion being formed in an outer surface of the casing substrate; a non-electromagnetic shield portion having no electromagnetic shield portion, the non-electromagnetic shield portion being formed in an outer surface of the casing substrate; and a through hole having a conductive property, the through hole being formed in the non-electromagnetic shield portion, wherein the inside of the casing substrate is shielded electromagnetically by the electromagnetic shield portion and the through hole

Abstract: In a force cutting type paper cutter, a movable blade includes a pair of right and left edges having a V shape. These right and left edges are intersected and brought into pressure contact with a linear cutting edge of a fixed blade. The movable blade also includes a pair of right and left elastic pieces formed by a lateral slit and a division slit provided in the movable blade. These elastic pieces are held in an inclined state to the side of the fixed blade and such that the edges overlap with each other. During a cutting stroke, the elastic pieces are held a state in which the edges of the movable blade always make point contact with the edge of the fixed blade and uneven abutment is prevented.

Abstract: The present invention relates to preparation of patterned workpieces in the production of semiconductor and other devices. Methods and devices are described utilizing resist and transfer layers over a workpiece substrate. The methods and devices produce small feature dimensions in masks and phase shift masks. The methods described may apply to both masks and direct writing on other workpieces having similarly small features, such as semiconductor, cryogenic, magnetic and optical microdevices.

Abstract: A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S1) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S1) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S2) wider than the arrangement area (S1) of the reinforcing plate.

Abstract: The invention relates to production and precision patterning of work pieces, including manufacture of photomask for photolithography and direct writing on other substrates, such as semiconductor substrates. In particular, it relates to applying corrections to pattern data, such as corrections for distortions in the field of an SLM exposure stamp. It may be used to produce a device on a substrate. Alternatively, the present invention may be practiced as a device practicing disclosed methods or as an article of manufacture, particularly a memory, either volatile or non-volatile memory, including a program adapted to carry out the disclosed methods.