Patents Assigned to NXP
  • Patent number: 9728600
    Abstract: A device includes a semiconductor substrate, a doped isolation barrier disposed in the semiconductor substrate and defining a core device area within the doped isolation barrier, an isolation contact region disposed in the semiconductor substrate outside of the core device area, and a body region disposed in the semiconductor substrate within the core device area, and in which a channel is formed during operation. The body region is electrically tied to the isolation contact region. The body region and the doped isolation barrier have a common conductivity type. The body region is electrically isolated from the doped isolation barrier within the core device area. The doped isolation barrier and the isolation contact region are not electrically tied to one another such that the doped isolation barrier is biased at a different voltage level than the isolation contact region.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: August 8, 2017
    Assignee: NXP USA, Inc.
    Inventors: Hongning Yang, Daniel J. Blomberg, Xu Cheng, Xin Lin, Zhihong Zhang, Jiang-Kai Zuo
  • Patent number: 9727767
    Abstract: Embodiments of a method for clock synchronization in a radio frequency identification (RFID) equipped device, an RFID equipped device, and a hand-held communications device are described. In one embodiment, a method for clock synchronization in an RFID equipped device involves measuring a difference between a field clock frequency generated from an external clock and an internal clock frequency generated from an internal clock and generating outgoing bits in the RFID equipped device in response to the measured difference. Generating the outgoing bits involves adjusting the bit length of at least one of the outgoing bits in response to the measured difference. Other embodiments are also described.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: August 8, 2017
    Assignee: NXP B.V.
    Inventors: Klemens Breitfuss, Peter Thueringer
  • Patent number: 9727526
    Abstract: A reconfigurable vector processor is described that allows the size of its vector units to be changed in order to process vectors of different sizes. The reconfigurable vector processor comprises a plurality of processor units. Each of the processor units comprises a control unit for decoding instructions and generating control signals, a scalar unit for processing instructions on scalar data, and a vector unit for processing instructions on vector data under control of control signals. The reconfigurable vector processor architecture also comprises a vector control selector for selectively providing control signals generated by one processor unit of the plurality of processor units to the vector unit of a different processor unit of the plurality of processor units.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: August 8, 2017
    Assignee: NXP USA, Inc.
    Inventors: Malcolm Stewart, Ali Osman Ors, Daniel Laroche
  • Patent number: 9729680
    Abstract: Methods and systems are disclosed to embed valid-field (VF) bits into classification keys for network packet frames. The embedded VF bits allow for extracted data from existing fields associated with frame data to be distinguished from default data used for missing fields where this extracted data and default data has been included within a frame classification key generated for a network packet frame. In certain embodiments, a valid-field field extraction command (VF-FEC) causes a key generator to embed VF bits into a frame classification key, and the logic state of the VF bits are used to distinguish extracted data from default data. Further, the disclosed embodiments allow VF bits to be selectively cleared based upon a bit mask applied prior to embedding of the VF bits. Still further, users can define VF-FECs and other field extraction commands (FECs) for key generation through one or more programmable key composition rules.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: August 8, 2017
    Assignee: NXP USA, Inc.
    Inventors: Ron Treves, Evgeni Ginzburg, Adi Katz
  • Patent number: 9729099
    Abstract: A method and apparatus are provided for controlling a sensorless alternating current induction motor (ACIM) having a rotor and a stator comprising a plurality of stator windings by applying a plurality of phase shifted voltages to the plurality of stator windings in the ACIM such that two energized stator windings are connected to first and second phase shifted voltages to cause rotation of the rotor relative to the stator while a third unconnected stator winding is floating so that a DC bus current and an inducted voltage can be measured from the ACIM and used to compute an estimated rotor speed.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: August 8, 2017
    Assignee: NXP USA, Inc.
    Inventors: Ivan Lovas, Pavel Sustek, Petr Staszko
  • Patent number: 9729329
    Abstract: Examples herein are directed to communicating on a communication bus in accordance with a message-based signal protocol. One or more messages are generated with a data field, in which a portion of the data field is reserved for a signature. The signature has a bit length corresponding to a bit length of the reserved portion of the data field. The signature is coded in the portion of the data field reserved for the signature, and at least one message is transmitted with the signature coded therein. Each message received on the communication bus and having a signature coded in a data field therein is authenticated based on the signature, and processed by removing the signature from the data field and decoding the message with the signature removed.
    Type: Grant
    Filed: May 19, 2015
    Date of Patent: August 8, 2017
    Assignee: NXP B.V.
    Inventor: Bernd Elend
  • Patent number: 9727408
    Abstract: An error detection system detects errors in data packets stored in a memory. A read signature generation circuit generates a read signature of a first data packet. A write signature generation circuit generates a write signature of a second data packet. When a trigger generation circuit generates a trigger signal, a first latching circuit stores a write address as a latch write address and a second latch stores the write signature as a latch write signature. A first synchronization and comparison circuit generates a comparison signal based on the latched write address and a read address. A second synchronization and comparison circuit generates a fault signal based on the comparison signal, the latched write signature, and the read signature.
    Type: Grant
    Filed: December 20, 2015
    Date of Patent: August 8, 2017
    Assignee: NXP USA, INC.
    Inventors: Aarul Jain, Dirk Wendel
  • Patent number: 9726519
    Abstract: The embodiments described herein include systems with a variable reluctance sensor (VRS) interface and methods of their operation. Embodiments of VRS interfaces include a clearing signal generator configured to generate a clearing signal corresponding with the timing of a noise event. The clearing signal may be configured to clear a post-processing circuit.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: August 8, 2017
    Assignee: NXP USA, INC.
    Inventors: Mike R. Garrard, William E. Edwards
  • Patent number: 9728410
    Abstract: A split gate memory device includes a semiconductor substrate and a select gate over the substrate. The select gate has a bottom portion and a top portion over the bottom portion, wherein the top portion has a top sidewall and the bottom portion has a bottom sidewall, and wherein the bottom sidewall extends beyond the top sidewall. The devices also includes a control gate adjacent the select gate, a charge storage layer located between the select gate and the control gate and between the control gate and the substrate, and an isolation region over the bottom portion of the select gate and between the top sidewall of the select gate and the charge storage layer. The bottom sidewall of the bottom portion extends to the charge storage layer.
    Type: Grant
    Filed: October 7, 2014
    Date of Patent: August 8, 2017
    Assignee: NXP USA, Inc.
    Inventors: Craig T. Swift, Asanga H. Perera
  • Publication number: 20170221728
    Abstract: Embodiments of a method for packaging Integrated Circuit (IC) dies and an IC device are described. In an embodiment, a method for packaging IC dies involves creating openings on a substrate, where side surfaces of the openings on the substrate are covered by metal layers, placing the IC dies into the openings on the substrate, applying a second metal layer to the substrate, where the IC dies are electrically connected to at least a portion of the second metal layer, and cutting the substrate into IC devices.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 3, 2017
    Applicant: NXP B.V.
    Inventors: Chung Hsiung Ho, Wen-Hsuan Lin
  • Patent number: 9721928
    Abstract: A packaged IC device in which a die is sandwiched between first and second substrates such that (i) peripheral electrical contact pads of the die are wire bonded to the first substrate, e.g., for routing functional input/output signals, and (ii) core-area electrical contact pads of the die are connected to the second substrate in a flip-chip arrangement, e.g., for routing one or more power supply voltages to the core area of the die. The second substrate has a shape and position that (i) expose the peripheral electrical contact pads of the die for unencumbered machine-implemented wire bonding during the assembly process, and (ii) enable direct electrical connections between the first and second substrates outside the footprint of the die, e.g., by way of the corresponding solder bumps attached between the two substrates.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: August 1, 2017
    Assignee: NXP USA, INC.
    Inventors: Navas Khan Oratti Kalandar, Lan Chu Tan, Chetan Verma
  • Patent number: 9720024
    Abstract: A sensor circuit includes at least one signal processing circuit connectable to at least one sensor operable on a channel and configured to receive and process a periodic sensor signal therefrom the sensor circuit further includes a switching device coupled between the signal processing circuit and the at least one sensor, at least one switch coupled to the switching device and a controller connected to the at least one switch and to an output of the signal processing circuit. The controller is operable to re-configure the switching device via control of the switch and determine whether a short condition exists on the at least one sensor or channel based on the output from the signal processing circuit.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: August 1, 2017
    Assignee: NXP USA, Inc.
    Inventors: Benoit Alcouffe, Sebastien Abaziou
  • Patent number: 9720847
    Abstract: A method and apparatus for calculating a victim way that is always the least recently used way. More specifically, in an m-set, n-way set associative cache, each way in a cache set comprises a valid bit that indicates that the way contains valid data. The valid bit is set when a way is written and cleared upon being invalidated, e.g., via a snoop address, The cache system comprises a cache LRU circuit which comprises an LRU logic unit associated with each cache set. The LRU logic unit comprises a FIFO of n-depth (in certain embodiments, the depth corresponds to the number of ways in the cache) and m-width. The FIFO performs push, pop and collapse functions. Each entry in the FIFO contains the encoded way number that was last accessed.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: August 1, 2017
    Assignee: NXP USA, INC.
    Inventors: Thang Q. Nguyen, John D. Coddington, Sanjay R. Deshpande
  • Patent number: 9720074
    Abstract: A circuitry for and a method of generating a frequency modulated radar transmitter signal are provided. The circuitry comprises a modulation signal generator for generating a modulation signal having a waveform describing a required frequency modulation of the frequency modulated radar transmitter signal and comprises a PLL circuitry for generating the frequency modulated radar transmitter signal in dependence of the modulation signal. In the PLL circuitry a controllable frequency divider controls the output frequency of the PLL circuitry in dependence of the modulation signal. The PLL circuitry further comprises a phase detector, a controllable oscillator and possibly a low pass filter. The PLL circuitry further comprises a calibration circuitry being configured to control a parameter of at least one of the phase detector and the controllable oscillator to maintain a loop gain of PLL circuitry.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: August 1, 2017
    Assignee: NXP USA, Inc.
    Inventors: Didier Salle, Olivier Doare, Christophe Landez
  • Patent number: 9719861
    Abstract: A temperature sensor circuit implemented in electronic circuitry that senses the temperature at a site, digitizes the sensed temperature, and then outputs a signal representing such a sensed temperature. The temperature sensor circuit converts a voltage signal that is proportional to the temperature to a first digital value. The temperature sensor circuit converts a voltage signal that is inversely proportional to the temperature to a second digital value. The sensed temperature is determined as a function of a difference between the first and second digital values.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: August 1, 2017
    Assignee: NXP USA, INC.
    Inventors: Ravindraraj Ramaraju, David R. Bearden
  • Patent number: 9722484
    Abstract: A noise filter circuit uses open loop signal processing to process the signal that causes the noise and generate a signal to be fed back into the system to cancel noise currents.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: August 1, 2017
    Assignee: NXP B.V.
    Inventors: Juergen Stahl, Thomas Antonius Duerbaum, Jens Goettle, Alexander Pawellek, Anton Cornelis Blom, Hans Halberstadt, Frans Pansier
  • Patent number: 9721881
    Abstract: A method of forming a semiconductor device assembly includes forming an interposer having an opening extending from a first major surface to a second major surface of the interposer and a plurality of external connectors on the second major surface. The method further includes attaching the first major surface of the interposer to a packaged semiconductor device, wherein the opening of the interposer exposes the packaged semiconductor device.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: August 1, 2017
    Assignee: NXP USA, Inc.
    Inventors: Zhiwei Gong, Wei Gao
  • Patent number: 9720427
    Abstract: A controller for a voltage regulator is disclosed. The controller is switchable between first and second modes of operation in which the controller is adapted to control the regulator to operate in switching and linear modes respectively. The controller is further adapted to respond to an input voltage to the voltage regulator to enter a third mode of operation in which the input voltage is coupled directly to an output terminal.
    Type: Grant
    Filed: April 2, 2013
    Date of Patent: August 1, 2017
    Assignee: NXP B.V.
    Inventor: Kim Li
  • Patent number: 9721844
    Abstract: A semiconductor device comprising a switch and a method of making the same. The device has a layout that includes one or more rectangular unit cells. Each unit cell includes a gate that divides the unit cell into four corner regions. Each unit cell also includes a source comprising first and second source regions located in respective opposite corner regions of the unit cell. Each unit cell further includes a drain comprising first and second drain regions located in respective opposite corner regions of the unit cell. Each unit cell also includes a plurality of connection members extending over the gate, source and drain for providing electrical connections to the gate, source and drain.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: August 1, 2017
    Assignee: NXP B.V.
    Inventors: Olivier Tesson, Hamza Nijjari
  • Patent number: 9722419
    Abstract: An electrostatic discharge protection circuit comprises at least two electrostatic discharge protection units connected in series between respective pairs of at least three input terminals, one of the input terminals being a reference input terminal. Each of the units comprises a silicon controlled rectifier and a current mirror. The output of the silicon controlled rectifier constitutes a first output of the respective unit and is connected to an input terminal of the circuit. The output of the current mirror constitutes a second output of the respective unit and is connected with the reference input terminal of the circuit. Thus the units are connected in series but the output terminals of the current mirrors are all connected with the reference input terminal, which may be a ground terminal, so as to minimize the breakdown resistance of the circuit.
    Type: Grant
    Filed: May 4, 2015
    Date of Patent: August 1, 2017
    Assignee: NXP USA, Inc.
    Inventors: Patrice Besse, Philippe Givelin, Jean Philippe Laine