Abstract: In an authentication method according to an embodiment, a server generates first authentication information configured by a value generated by using a pseudo ransom function using an identifier of an authentication target device and a common key as arguments and transmits the first authentication information to the authentication target device via an authentication proxy client.

Abstract: The size and thickness of a semiconductor device are reduced. A semiconductor package with a flip chip bonding structure includes: a semiconductor chip having a main surface with multiple electrode pads formed therein and a back surface located on the opposite side thereto; four lead terminals each having an upper surface with the semiconductor chip placed thereover and a lower surface located on the opposite side thereto; and a sealing body having a main surface and a back surface located on the opposite side thereto. In this semiconductor package, the distance between adjacent first lower surfaces of the four lead terminals exposed in the back surface of the sealing body is made longer than the distance between adjacent upper surfaces thereof.

Abstract: The semiconductor device including: two fins having rectangular parallelepiped shapes arranged in parallel in X-direction; and a gate electrode arranged thereon via a gate insulating film and extending in Y-direction is configured as follows. First, a drain plug is provided over a drain region located on one side of the gate electrode and extending in Y-direction. Then, two source plugs are provided over a source region located on the other side of the gate electrode and extending in Y-direction. Also, the drain plug is arranged in a displaced manner so that its position in Y-direction may not overlap with the two source plugs. According to such a configuration, the gate-drain capacitance can be made smaller than the gate-source capacitance and a Miller effect-based circuit delay can be suppressed. Further, as compared with capacitance on the drain side, capacitance on the source side increases, thereby improving stability of circuit operation.

Abstract: A BGA 9 includes a wiring substrate 2, a semiconductor chip 1 fixed on the wiring substrate 2, a sealing body 4 that seals the semiconductor chip 1, and a plurality of solder balls 5 provided on a lower surface of the wiring substrate 2. A degree of flatness of an upper surface 2ia of a first wiring layer 2i of the wiring substrate 2 of the BGA 9 is lower than a degree of flatness of a lower surface 2ib, and a first pattern 2jc provided in a second wiring layer 2j is arranged at a position overlapping a first pattern 2ic provided in the first wiring layer 2i. Also, an area of the first pattern 2ic provided in the first wiring layer 2i is larger than an area of a plurality of (for example, two) second patterns 2jd provided in the second wiring layer 2j in a plan view, and a first opening portion 2jm through which a part of a second insulating layer 2h is exposed is formed in the first pattern 2jc provided in the second wiring layer 2j.

Abstract: A semiconductor device includes a channel layer formed over a substrate, a barrier layer formed on the channel layer and a gate electrode. A second gate electrode section is formed on the gate electrode via a gate insulating film. It becomes possible to make an apparent threshold voltage applied to the second gate electrode of a MISFET higher than an original threshold voltage applied to the gate electrode for forming a channel under the gate electrode by providing an MIM section configured by the gate electrode, the gate insulating film and the second gate electrode in this way.

Abstract: A step down convertor with a distributed driving system. In one embodiment, an apparatus is disclosed that includes an inductor coupled to an output node. The apparatus also includes first and second circuits. The first circuit can transmit current to the output node via the inductor, and the second can transmit current to the output node via the inductor. The apparatus also includes a third circuit for modifying operational aspects of the first circuit or the second circuit based on a magnitude of current flowing through the inductor.

Abstract: A data storage method includes storing a plurality of pieces of 2-bit wide ternary data in one word, each of the plurality of pieces of 2-bit wide ternary data indicating +1 when a first bit indicates a first value, indicating ?1 when a second bit indicates the first value, and indicating 0 when both the first bit and the second bit indicate a second value.

Abstract: A MISFET is formed to include: a co-doped layer that is formed over a substrate and has an n-type semiconductor region and a p-type semiconductor region; and a gate electrode formed over the co-doped layer via a gate insulation film. The co-doped layer contains a larger amount of Mg, a p-type impurity, than that of Si, an n-type impurity. Accordingly, the carriers (electrons) resulting from the n-type impurities (herein, Si) in the co-doped layer are canceled by the carriers (holes) resulting from p-type impurities (herein, Mg), thereby allowing the co-doped layer to serve as the p-type semiconductor region. Mg can be inactivated by introducing hydrogen into, of the co-doped layer, a region where the n-type semiconductor region is to be formed, thereby allowing the region to serve as the n-type semiconductor region. By thus introducing hydrogen into the co-doped layer, the p-type semiconductor region and the n-type semiconductor region can be formed in the same layer.

Abstract: As one embodiment, a method of manufacturing a semiconductor device includes the following steps. That is, the method of manufacturing a semiconductor device includes a first step of applying ultrasonic waves to a ball portion of a first wire in contact with a first electrode of the semiconductor chip while pressing the ball portion with a first load. In addition, the method of manufacturing a semiconductor device includes a step of, after the first step, applying the ultrasonic waves to the ball portion while pressing the ball portion with a second load larger than the first load, thereby bonding the ball portion and the first electrode.

Abstract: A semiconductor device includes a first trench gate electrode and a second trench gate electrode which are electrically connected to a gate electrode, and a third trench gate electrode and a fourth trench gate electrode which are electrically connected to an emitter electrode. A plurality of p+ type semiconductor regions are formed in a part of a semiconductor layer between the first trench gate electrode and the second trench gate electrode. The plurality of p+ type semiconductor regions are arranged to be spaced apart from each other along an extending direction of the first trench gate electrode when seen in a plan view.

Abstract: A semiconductor integrated circuit is described. A. transmitter-receiver transmits and receives data to and from outside by a first external terminal and transmits a first control signal by a second external terminal. When another data is transmitted after the data is transmitted and when a data transmission interval from a time when the data is transmitted to a time when the another data is transmitted is equal to or smaller than a first threshold, the transmitter-receiver continuously outputs, from the first external terminal, a potential level of about ½ of a potential level obtained by adding a first potential level and a second potential level, during the data transmission interval, and changes the second potential level of the first control signal to the first potential level when the data transmission interval exceeds the first threshold.

Abstract: This invention provides a multi-pin semiconductor device as a low-cost flip-chip BGA. In the flip-chip BGA, a plurality of signal bonding electrodes in a peripheral area of the upper surface of a multilayer wiring substrate are separated into inner and outer ones and a plurality of signal through holes coupled to a plurality of signal wirings drawn inside are located between a plurality of rows of signal bonding electrodes and a central region where a plurality of bonding electrodes for core power supply are located so that the chip pad pitch can be decreased and the cost of the BGA can be reduced without an increase in the number of layers in the multilayer wiring substrate.

Abstract: A high side transistor is coupled between a high potential side power source node and an intermediate node, and a recirculation diode is coupled between a low potential side power source node and the intermediate node, thereby forming a recirculation path when the high side transistor is OFF. A power source supply line couples the high potential side power source node with one end of the high side transistor. A surge recirculation device causes a current to flow in one direction, and a surge recirculation line couples the one end of the high side transistor to the high potential side power source node through the surge recirculation device, and causes a surge generated at the one end of the high side transistor to recirculate toward the high potential side power source node.

Abstract: Provided is a semiconductor device including a DC/DC converter circuit, wherein the DC/DC converter circuit includes a transistor of a normally-off type, having a first drain electrode connected town input terminal and a first source electrode connected to an output terminal, which is formed in a first compound semiconductor substrate having a two-dimensional electron gas layer, and a transistor having a second drain electrode connected to the first source electrode and a grounded second source electrode.

Abstract: A performance of a semiconductor device is improved. A semiconductor device includes two element portions and an interposition portion interposed between the two element portions. The interposition portion includes a p-type body region formed in a part of a semiconductor layer, the part being located between two trenches, and two p-type floating regions formed in two respective parts of the semiconductor layer, the two respective portions being located on both sides of the p-type body region via the two respective trenches. A lower end of the p-type floating region is arranged on a lower side with reference to a lower end of the p-type body region.

Abstract: An improvement is achieved in the performance of a semiconductor device. A semiconductor device includes an n?-type semiconductor region formed in a p-type well, an n-type semiconductor region formed closer to a main surface of a semiconductor substrate than the n?-type semiconductor region, and a p?-type semiconductor region formed between the n?-type semiconductor region and the n-type semiconductor region. A net impurity concentration in the n?-type semiconductor region is lower than a net impurity concentration in the n-type semiconductor region. A net impurity concentration in the p?-type semiconductor region is lower than a net impurity concentration in the p-type well.

Abstract: To provide a semiconductor device having improved reliability. After formation of an n+ type semiconductor region for source/drain, a first insulating film is formed on a semiconductor substrate so as to cover a gate electrode and a sidewall spacer. After heat treatment, a second insulating film is formed on the first insulating film and a resist pattern is formed on the second insulating film. Then, these insulating films are etched with the resist pattern as an etching mask. The resist pattern is removed, followed by wet washing treatment. A metal silicide layer is then formed by the salicide process.

Abstract: Provided is a semiconductor device having a pad on a semiconductor chip, a first passivation film formed over the semiconductor chip and having an opening portion on the pad of a probe region and a coupling region, a second passivation film formed over the pad and the first passivation film and having an opening portion on the pad of the coupling region, and a rewiring layer formed over the coupling region and the second passivation film and electrically coupled to the pad. The pad of the probe region placed on the periphery side of the semiconductor chip relative to the coupling region has a probe mark and the rewiring layer extends from the coupling region to the center side of the semiconductor chip. The present invention provides a technology capable of achieving size reduction, particularly pitch narrowing, of a semiconductor device.

Abstract: To shorten a processing time at boot time without lowering a security level, an acquiring unit acquires a public key, a signature generated with a secret key corresponding to the public key, and a program associated with the signature. A signature verification unit performs signature verification by using the public key and the signature acquired by the acquiring unit, before the program acquired by the acquiring unit is booted. A calculation unit calculates a first MAC value by using a device eigenvalue and stores the first MAC value, when the result of signature verification by the signature verification unit is appropriate. A boot unit calculates a second MAC value by using the device eigenvalue, compares the second MAC value and the stored first MAC value with each other to determine that the program is legitimate, and executes boot based on the determination result.

Abstract: A flash memory refreshes at a time before a read error might occur. A controller performs a first read operation and a second read operation using a sense amplifier. In the second read operation, a bit line potential controller draws out a potential of a bit line feeding the sense amplifier so that, if memory cell degradation has occurred, the degradation can be detected. For example, when first data read by the first read operation and second data read by the second read operation are determined to be different, the memory cell is refreshed.