Abstract: A semiconductor memory cell having a word line, a bit line, a precharge line, an access transistor, and first and second cross-coupled inverters. The first inverter includes a first P-channel transistor and a first N-channel transistor, and the second inverter includes a second P-channel transistor and a second N-channel transistor. The access transistor selectively couples the bit line to an output of the first or second inverter, and one terminal of the first N-channel transistor is connected to the precharge line. In a preferred embodiment, a control circuit is provided that, during a writing operation, supplies data to be written to the memory cell to the bit line, supplies a pulse signal to the precharge line, and activates the word line. A method of writing data to a semiconductor memory cell that is coupled to a word line and single bit line is also provided.

Abstract: The integrated microactuator has a stator and a rotor having a circular extension with radial arms which support electrodes extending in a substantially circumferential direction and interleaved with one another. For the manufacture, first a sacrificial region is formed on a silicon substrate; an epitaxial layer is then grown; the circuitry electronic components and the biasing conductive regions are formed; subsequently a. portion of substrate beneath the sacrificial region is removed, forming an aperture extending through the entire substrate; the epitaxial layer is excavated to define and separate from one another the rotor and the stator, and finally the sacrificial region is removed to release the mobile structures from the remainder of the chip.

Abstract: The memory device has hierarchical sector decoding. A plurality of groups of supply lines is provided, one for each sector row, extending parallel to the sector rows. A plurality of switching stages are each connected between a respective sector and a respective group of supply lines; the switching stages connected to sectors arranged on a same column are controlled by same control signals supplied on control lines extending parallel to the columns of sectors. For biasing the sectors, modification voltages are sent to at least one selected group of biasing lines, and control signals are sent to the switching stages connected to a selected sector column.

Abstract: A circuit for biasing the bulk terminal of a first MOS transistor having a first terminal connected to a first line set to a first potential, and a second terminal connected to a second line set to a second potential. The biasing circuit includes a second and a third MOS transistors having first terminals connected respectively to the first line and to the second line, second terminals connected to the bulk terminal of the first MOS transistor, and control terminals connected respectively to the second and to the first line.

Abstract: A monocrystalline silicon substrate is subjected to the following operations: implantation of doping impurities in a high concentration to form a planar region of a first type; selective anisotropic etching in order to hollow out trenches to a depth greater than the depth of the planar region; oxidation of the silicon inside the trenches, starting a certain distance from the surface of the substrate, until a silicon dioxide plaque is formed, surmounted by residues of strongly-doped silicon; epitaxial growth between and on top of the silicon residues to close the trenches and to bring about a redistribution of the doping impurities into the silicon grown to produce a buried region with low resistivity in an epitaxial layer of high resistivity.

Abstract: A radiation hardened memory device includes active gate isolation structures placed in series with conventional oxide isolation regions between the active regions of a memory cell array. The active gate isolation structure includes a gate oxide and polycrystalline silicon gate layer electrically coupled to a voltage potential resulting in an active gate isolation structure that prevents a conductive channel extending from adjacent active regions from forming. The gate oxide of the active gate isolation structures is relatively thin compared to the conventional oxide isolation regions and thus, will be less susceptible to any adverse influence from trapped charges caused by radiation exposure.

Abstract: A multilevel memory stores words formed by a plurality of binary subwords in a plurality of cells, each cell having has a respective threshold value. The cells are arranged on cell rows and columns, are grouped into sectors divided into sector blocks, and are selected via a global row decoder, a global column decoder, and a plurality of local row decoders, which simultaneously supply a ramp voltage to a biasing terminal of the selected cells. Threshold reading comparators are connected to the selected cells, and generate threshold attainment signals when the ramp voltage reaches the threshold value of the selected cells; switches, are arranged between the global word lines and local word lines, opening of the switches is individually controlled by the threshold attainment signals, thereby the local word lines are maintained at a the threshold voltage of the respective selected cell, after opening of the switches.

Abstract: A motion estimator operating on a recursive mode reduces the number of operations per pixels required by the particular coding process being implemented. The coding process includes the MPEG standard. A method is based on the correlation existing among motion vectors associated to macroblocks in a common position in temporally adjacent images. The method is also associated to macroblocks belonging to the same picture and spatially adjacent to the current macroblock being processed. By using this double correlation, the calculation burden is reduced.

Abstract: A circuit implementing a non-integer order dynamic system includes a neural network that receives at least one input signal and generates therefrom at least one output signal. The input and output signals are related to each by a non-integer order integro-differential relationship through the coefficients of the neural network. A plurality of such circuits, implementing respective non-integer order controllers can be interconnected in an arrangement wherein any of the integral or differential blocks included in one of these circuits generates a signal which is fed to any of the integral or differential blocks of another circuit in the system.

Abstract: An electronic power device is integrated monolithically in a semiconductor substrate. The device has a first power region and a second region, each region comprising at least one P/N junction formed of a first semiconductor region with a first type of conductivity, which first semiconductor region extends through the substrate from the top surface of the device and is diffused into a second semiconductor region with the opposite conductivity from the first. The device also includes an interface structure between the two regions, of substantial thickness and limited planar size, comprising at least one trench filled with dielectric material.

Abstract: This invention relates to a method for manufacturing electronic devices integrated monolithically in a semiconductor substrate delimited by two opposed front and back surfaces of a semiconductor material wafer. The method comprises at least a step of implanting ions of a noble gas, followed by a thermal treatment directed to form gettering microvoids in the semiconductor by evaporation of the gas. The ion implanting step is carried out through the back surface of the semiconductor wafer prior to starting the manufacturing process for the electronic devices, and also can be before the step of cleaning the front surface of the wafer.

Abstract: The invention relates to a circuit architecture for processing multi-channel frames of broadband synchronous digital signals, in particular signals of the SONET/SDH standard. The circuit includes an input portion and an output portion. It also contains at least one modular component adapted to process frames comprising a single channel and connectable modularly to N further identical components corresponding to the number of frame channels.

Abstract: A process for the integration in a semiconductor chip of an integrated circuit including a high-density integrated circuit components portion and a high-performance logic integrated circuit components portion, providing for: over a semiconductor substrate, insulatively placing a silicidated polysilicon layer that includes a polysilicon layer selectively doped in accordance to a conductivity type of at least the high-performance logic integrated circuit components, covered by a silicide layer; selectively covering the silicidated polysilicon layer with a hard mask; defining gate structures for the high-density integrated circuit components and for the high-performance logic integrated circuit components using said hard mask, the gate structures comprising the silicidated polysilicon layer covered with the hard mask; in a dielectric layer formed over the chip, forming contact openings for electrically contacting the high-density integrated circuit components and the high-performance logic integrated circuit com

Abstract: An interleaved memory includes an array of memory cells divided into a first bank of memory cells and a second bank of memory cells. The interleaved memory operates in a burst access mode. A first address counter is coupled to the first bank of memory cells, and an address register is coupled to the first address counter and to the second bank of memory cells. A timing circuit generates increment pulses to the first address counter so that a first random access asynchronous read cycle starts with the first bank of memory cells. A function of an address counter for the second bank of memory cells is being performed by coping contents of the first address counter to the address register.

Abstract: The converter uses the energy stored in the output filter of a step-down (or buck) converter and in the inductor of a step up/down (or buck-boost) converter to supply a second output of opposite sign. In particular, the converter has a first input receiving an input voltage; a first output supplying a first output voltage of a first sign; a second output supplying a second output voltage of opposite sign; a controlled switch connected between the first input and a first intermediate node; an inductor connected between the first intermediate node and the first output; a diode connected between the first intermediate node and a second intermediate node; and a dual voltage generating circuit connected between the second intermediate node and the second output.

Abstract: A high-voltage level shifting circuit with optimized response time, comprising: an inverter having an input and an output, the inverter being connected between a first voltage and a second voltage whose difference remains constant over time; a resistor, in which one terminal is connected to the first voltage and a second terminal is connected to the input of the inverter; a high-voltage transistor, which is connected between the second terminal of the resistor and a current source whose switching on and off determine the level shifting of a digital signal; and a clamp transistor, which is connected between the first voltage and a node that is common to the resistor and to the high-voltage transistor. The gate terminal of the clamp transistor is connected to the output of the inverter.

Abstract: A voltage boosting device having a charge pump circuit formed by a plurality of voltage boosting stages cascade-connected together.

Abstract: A process of fabricating a floating-gate memory device, the process including the steps of: forming a stack of superimposed layers including a floating gate region, a dielectric region, and a control gate region; and forming an insulating layer of oxynitride to the side of the floating gate region to completely seal the floating gate region outwards and improve the retention characteristics of the memory device. The insulating layer is formed during reoxidation of the sides of the floating gate region, after self-align etching the stack of layers and implanting the source/drain of the cell.

Abstract: The method comprises the steps of: forming an integrated device including a microactuator in a semiconductor material wafer; forming an immobilization structure of organic material on the wafer; simultaneously forming a securing flange integral with the microactuator and electrical connections for connecting the integrated device to a read/write head; bonding a transducer supporting the read/write head to the securing flange; connecting the electrical connections to the read/write head; cutting the wafer into dices; bonding the microactuator to a suspension; and removing the immobilization structure.

Abstract: An electronic power device is integrated on a substrate of semiconductor material having a first conductivity type, on which an epitaxial layer of the same type of conductivity is grown. The power device comprises a power stage PT and a control stage CT, this latter enclosed in an isolated region having a second type of conductivity type. The power stage PT comprises a first buried area having the second type of conductivity type and a second buried area, partially overlapping the first buried area and having the first conductivity type. The isolation region and the control stage CT comprise respectively a third buried area, having the second conductivity type, and a fourth buried area, partially overlapped to the third buried area and having the first conductivity type. Said first, second, third and fourth buried areas are formed in the epitaxial layers at a depth sufficient to allow the power stage PT and the control stage CT to be entirely formed in the epitaxial layers.