Abstract: A method of manufacturing a semiconductor device having recessed active trenches by providing a substrate with STI and active regions, forming a first oxide layer on the substrate, forming an nitride layer on the first oxide layer, employing a photolithographic process to create at least one recessed active trench through the first oxide layer and the nitride layer and into the substrate to create an isolation region, wherein the at least one trench is perpendicular to at least one gate structure in an active area of the substrate, layering the trench with a second oxide layer, removing the first oxide layer and second oxide layer, forming a third oxide layer on the planar substrate with recessed active trench, and forming the at least one circuitous gate structure on the third oxide layer connecting at least one electronic source and drain.

Abstract: An integrated circuit (100) includes a current mode write driver (105). The write driver (105) includes a switching control circuit (110) including (i) a DC current control circuit (111) operable to directly convert a received ECL differential signal into first, second, third and fourth DC output currents (a, b, c, and d) and (ii) a boost current control circuit (112) operable to directly convert a received level shifted version of the ECL differential voltage signal and a delayed version of the ECL differential voltage signal into first, second, third and fourth boost output currents (a1, b1, c1, and d1). An H-bridge circuit (120) includes an output stage (125) including first and second current sourcing control nodes (126, 127) and first and second current sinking control nodes (128, 129). A first output node (131) is between the first sourcing and first sinking nodes (126, 128) and second output node between the second sourcing and the second sinking nodes (127, 129).

Abstract: In a method, system and apparatus for measuring an idle value of a Central Processing Unit (CPU) in an embedded system, the CPU increments a hardware counter in accordance with clock signals. The CPU also increments an idle counter during a predetermined period of time in accordance with the clock signals while an idle task is running. The CPU calculates the idle value as a ratio of total increments of the idle counter to total increments of the hardware counter after the predetermined period of time has expired.

Abstract: Various cryptographic locks for securing assets, secure containers and methods of operating a cryptographic lock. One embodiment of a cryptographic lock includes: (1) a shape memory alloy (SMA) having a first and second phase, wherein the first phase inhibits access to an asset and the second phase allows access to the asset and (2) an RFID transponder, coupled to the SMA, configured to receive an authentication signal from an RFID transceiver and, based thereon, energize the SMA to temporarily change the SMA from the first phase to the second phase.

Abstract: A linear voltage regulator is provided which has a pair of complementary power transistors connected “back to back” in series between a voltage input and a voltage output. A current sense circuit is connected in parallel across one of the power transistors, such as the one connected to the voltage input. The current sense circuit includes a current sense resistor. A reference current path has a reference resistor connected in series with a current sink between the voltage input and a reference terminal, usually ground. A comparator has a first input connected to a terminal of the current sense resistor and a second input connected to a node between the reference resistor and the current sink. The comparator compares the voltage drop across the current sense resistor with the constant voltage drop across the reference resistor and provides an output signal indicative of an open load condition when the voltage drop across the current sensor falls below that of across the reference resistor.

Abstract: In one aspect, an integrated circuit device including a first-level module configurable to receive and transmit control information, said first level module including a first sub-level module, a second sub-level module operably coupleable to the first sub-level module, and a third sub-level module operably coupleable to the second module; and a second-level module operably coupleable to the first-level module is disclosed.

Abstract: An electronic device includes a low drop-out regulator for providing a regulated output voltage. The low drop-out regulator generally comprises a power MOSFET transistor having a gate coupled to a driver. The driver has a first path including an NMOS transistor and being coupled to the gate of the power MOSFET, a second path having a PMOS transistor and being coupled to the gate of the power MOSFET, and a switch for alternately switching between the first and second paths so as to provide a voltage to the gate of the power MOSFET ranging from ground to a power supply level.

Abstract: A method of forming fully silicided NMOS and PMOS semiconductor devices having independent polysilicon gate thicknesses, and related device. At least some of the illustrative embodiments are methods comprising forming an N-type gate over a semiconductor substrate (the N-type gate having a first thickness), forming a P-type gate over the semiconductor substrate (the P-type gate having a second thickness different than the first thickness), and performing a simultaneous silicidation of the N-type gate and the P-type gate.

Abstract: A method for film reconstruction includes identifying motion tear artifacts within a plurality of video fields of a stream of video fields. The motion tear artifacts identified by analyzing the video fields using fuzzy logic. The method also includes comparing the analysis of one video field to the analysis of an immediately preceding video field to determine whether there is a relatively high level of motion tear artifacts within the video field or a relatively low level of motion tear artifacts within the video field. The method further includes identifying a pattern of temporal periodicity for the comparisons. The method also includes determining the cadence of the stream of video fields based on the pattern of temporal periodicity.

Abstract: One embodiment of the present invention relates to a scribe seal integrity detector. In this embodiment a scribe seal integrity detector is formed in an integrated circuit chip die. The scribe seal integrity comprises a scribe seal structure that extends along at least a portion of the periphery of the integrated chip die and a detector test structure. The detector test structure and the scribe seal form an electrical system configured to be accessed for a monitoring of one or more electrical parameters to determine and characterize scribe seal integrity of the integrated circuit chip die. The results of the electric measurements are analyzed for statistically relevant reliability characterization. Other methods and circuits are also disclosed.

Abstract: A wireless communications device (110) has a digital section (800) and a radio frequency section (840). The digital section (800) does setup and execution on a set of data in at least first and second threads concurrently in a series of overlapping iterations by dividing the set of data into at least two different subsets and concurrently reading and writing in both subsets. A state machine (1010, 1100) is shared by the setup and execution iterations. Two or more memory units (930, 940) segregate the set of data, the predetermined size of the set of data in the memories (930, 940) combined comprehending the total number of addresses occupied by the set of data utilized in operation of circuitry (910). Dirty bits (1430) are accessible at addresses corresponding to addresses in the memory. A selector circuit (1412) has a selector output selectively coupled to an address line, and to a data line.

Abstract: Attaching a semiconductor chip to a substrate by applying mechanical vibrations (150) to a polymeric compound (130) and the contacting areas (114, 124) of a first (113) and a second (121) metallic member immersed in the compound, while the two metallic members approach (140) each other until they touch. The mechanical vibration causes displacements of the first member relative to the second member, and the vibration includes displacements (150) oriented at right angles to the direction (140) of the approach. The polymeric compound (130) includes a non-conductive adhesive resin paste (NCP) and filler particles; the paste is deposited before the attaching step. The first member (113) is affixed to the chip and the second member (121) to the substrate.

Abstract: An F-RAM package having a semiconductor die containing F-RAM circuitry, a mold compound, and a stress buffer layer that is at least partially located between the semiconductor die and the mold compound. Also, a method for making an F-RAM package that includes providing a semiconductor die containing F-RAM circuitry, forming a patterned stress buffer layer over the semiconductor die, and forming a mold compound coupled to the stress buffer layer.

Abstract: Methods and apparatus to perform hard-disk drive head proximity detection in a preamplifier are described. One example method of detecting head position in a hard-disk drive includes obtaining a read signal from a head reading information from a disk; determining a signal envelope of the read signal; comparing the signal envelope to a first threshold to produce a first comparison; filtering the signal envelope; comparing the filtered signal envelope to a second threshold to produce a second comparison; combining the first comparison and the second comparison; and determining if the combination of the first comparison and the second comparison indicates head position oscillation.

Abstract: In a method and system for data retention, a data input is latched by a first latch. A second latch coupled to the first latch receives the data input for retention while the first latch is inoperative in a standby power mode. The first latch receives power from a first power line that is switched off during the standby power mode. The second latch receives power from a second power line. A controller receives a clock input and a retention signal and provides a clock output to the first latch and the second latch. A change in the retention signal is indicative of a transition to the standby power mode. The controller continues to hold the clock output at a predefined voltage level and the second latch continues to receive power from the second power line in the standby power mode, thereby retaining the data input.

Abstract: Various systems and methods for pulse width modulated clocking in a temperature measurement are disclosed. For example, some embodiments of the present invention provide temperature measurement systems with a variable current source, a transistor, and a pulse width modulation circuit. The variable current source is operable to provide a first current and a second current that are applied to the transistor. A first base-emitter voltage occurs on the transistor when the first current is applied, and a second base-emitter voltage occurs on the transistor when the second current is applied. The first base emitter voltage is associated with a first sample period, and a second base-emitter voltage is associated with a second sample period. The pulse width modulation circuit provides a pulse width modulated clock including a combination of the aforementioned first period and second period.

Abstract: The present invention provides a method for manufacturing a semiconductor device. In one embodiment, the method for manufacturing the semiconductor device includes a method for manufacturing a zener diode, including among others, forming a doped well (240) within a substrate (210) and forming a suppression implant (420) within the substrate (210). The method for manufacturing the zener diode may further include forming a cathode (620) and an anode (520) within the substrate (210), wherein the suppression implant (420) is located proximate the doped well (240) and configured to reduce threading dislocations.

Abstract: A system and method for providing a fuel dispenser with radio frequency customer identification capabilities. The system and method determines whether a transponder containing customer identification data is within range of a dispenser, the dispenser requiring activation by the customer to initiate a transaction and including a reader associated therewith for emitting radio frequency signals within the dispenser range, and for receiving customer identification data from the transponder responsive to the emitted radio frequency signals received by the transponder. When the transponder is within range of the dispenser, an in-range indication is provided to the customer. A determination is made whether the dispenser has been activated by the customer following a determination that the transponder is within the dispenser range.

Abstract: According to one embodiment of the invention, a silicon-on-insulator device includes an insulative layer formed overlying a substrate and a source and drain region formed overlying the insulative layer. The source region and the drain region comprise a material having a first conductivity type. A body region is disposed between the source region and the drain region and overlying the insulative layer. The body region comprises a material having a second conductivity type. A gate insulative layer overlies the body region. This device also includes a gate region overlying the gate insulative layer. The device also includes a diode circuit conductively coupled to the source region and a conductive connection coupling the gate region to the diode circuit.

Abstract: In an apparatus and method for reducing current leakage in a phase locked loop (PLL), a pair of resistive divider circuit is coupled to receive a pair of differential input signals and provide a pair of differential output signals. A timing control circuit controls a pair of switches, the pair of switches being operable to conduct the pair of differential output signals in response to at least one signal of the pair of differential input signals being present. An operational amplifier (OA) includes a pair of OA input terminals and an OA output terminal. The pair of OA input terminals is coupled to receive the pair of differential output signals conducted by the pair of switches. A feedback circuit is coupled between the OA output terminal and a first one of the pair of OA input terminals. The pair of switches is disabled by the timing control circuit to block a current leakage from the feedback circuit.