Patents Examined by Minh Trinh
  • Patent number: 7461448
    Abstract: A crimping tool with a quick-change crimp head for sealing and electrically crimping electrical contacts to insulated wires. The crimping tool includes a base unit with a receptacle that is configured to actuate and removably and replaceably receive the quick-change crimp head. A crimping die holder body includes a plurality of crimp-seal and continuity-crimping dies. These dies are mounted for movement in the crimping die holder body between an open configuration and a fully crimped configuration. The crimp-seal dies have arcuate die faces that define a substantially closed generally cylindrical form when the dies are in the fully crimped configuration. Actuators are mounted in the base unit. The actuators are adapted to cause the dies to move in the body. A sensor system is configured to prevent the crimping tool from unintentionally repeating a crimping operation on the electrical contact, and to verify continuity-crimp depth of indentation.
    Type: Grant
    Filed: August 17, 2005
    Date of Patent: December 9, 2008
    Inventors: Simon Schwartzman, Alex Kerner
  • Patent number: 7454830
    Abstract: The present invention relates to apparatus for manufacturing a harness of electrically conductive wire segments, the apparatus comprising a twisting tool (20) having at least two cavities (31 to 38), each cavity being associated with retaining means (43, 44) enabling at least a portion of a wire segment to be retained in the cavity, release means enabling said wire segment portion to be extracted from the cavity, and opening means (46) enabling said wire segment portion to be inserted into the cavity.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: November 25, 2008
    Assignee: Eurocopter
    Inventors: Serge Pittau, Christian Tourenq
  • Patent number: 7451538
    Abstract: In accordance with one embodiment, the present technique provides an apparatus for assembling a rotor. The exemplary apparatus includes a base that has a central aperture and a seating surface for receiving the rotor. An arbor then extends through the central aperture, the arbor having a longitudinal axis that is substantially orthogonal to the seating surface, and including threaded ends opposite with respect to one another. The exemplary apparatus also includes at least one member of a family of fixtures coupleable to the arbor, the family including a pressure fixture that has first and second piston assemblies disposed at diametrically opposite locations to one another, the family also including a support fixture coupleable the arbor and having members extending axially therefrom, the members being configured to support securing members of the rotor.
    Type: Grant
    Filed: September 20, 2005
    Date of Patent: November 18, 2008
    Assignee: Reliance Electric Technologies, LLC
    Inventor: William P. Pizzichil
  • Patent number: 7448125
    Abstract: According to embodiments of the present invention, a method for manufacturing an array of radio frequency identification (RFID) antennas is provided. The method comprises applying an anti-sticking agent onto selective areas of a substrate. These areas are substantially complementary to antenna-areas having the shape of the RFID array. Then, the process continues by depositing in a vacuum chamber a first electrically conductive layer onto said antenna-areas. The substrate is then immersed in an electrolyte solution in which the electrically conductive layer is electroplated to form a metal layer having a desired thickness.
    Type: Grant
    Filed: February 22, 2006
    Date of Patent: November 11, 2008
    Assignee: Hanita Coatings R.C.A. Ltd
    Inventors: Yoash Carmi, Dany Eisenstadt
  • Patent number: 7448129
    Abstract: A peel-off device for an electronic-part delivery system has a front end portion and a recess that is indented inwardly from the front end portion, that is formed through upper and lower surfaces of the front end portion and that has a width larger than that of an electronic part of predetermined specification.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: November 11, 2008
    Assignee: Asustek Computer, Inc.
    Inventors: Cheng-Wei Chiu, Kuo-Chou Cheng, Chin-Chan Chen, En-Hsien Lee, Wei-Sheng Hung
  • Patent number: 7444727
    Abstract: A method for forming embedded capacitors on a printed circuit board is disclosed. The capacitor is formed on the printed circuit board by a depositing a first dielectric layer over one or more electrodes situated on the PCB. Another electrode is formed on top of the first dielectric layer and a second dielectric layer is deposited on top of that electrode. A third electrode is formed on top of the second dielectric layer. The two dielectric layers are abrasively delineated in a single step by a method such as sand blasting to define portions of the first and second dielectric layers to create a multilayer capacitive structure.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: November 4, 2008
    Assignee: Motorola, Inc.
    Inventors: Jovica Savic, Remy J. Chelini, Gregory J. Dunn
  • Patent number: 7444743
    Abstract: A connecting device that connects at least one foil conductor to at least one connection line comprises an insulative connector housing having a pressed screen arranged in an interior thereof. The pressed screen electrically connects the foil conductor to the connection line. A first clamping spring configured for resilient attachment to a first connection web extending from the pressed screen. The first clamping spring fixes the foil conductor to the first connection web in an electrically conductive manner.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: November 4, 2008
    Assignee: Tyco Electronics AMP GmbH
    Inventors: Günter Feldmeier, Andreas Woeber, Heinz Scherer, Daniel Reitmayer
  • Patent number: 7444744
    Abstract: A multi-use tool for assembly of electrical connectors includes a main tool body having an electrical connector assembly holder. The holder includes first and second cavities. The first cavity includes spaced anvils and removably retains an electrical connector end cap between the anvils. A cutting ram is opposed to the first cavity and includes two cutting blades that are translatable between disengaged and engaged positions to trim and sever excess wire lengths from the electrical connector end cap. The second cavity removably retains the electrical connector end cap and a jack housing. A termination ram is opposed to the second cavity and movably mounted between disengaged and engaged positions to terminate the jack housing with the end cap. A trigger mechanism is operably connected to both the cutting ram and the termination ram.
    Type: Grant
    Filed: April 13, 2006
    Date of Patent: November 4, 2008
    Assignee: Panduit Corp.
    Inventors: Jack E. Caveney, Roger D Segroves, Lawrence A. Hillegonds
  • Patent number: 7444737
    Abstract: A method of manufacturing an antenna. First and second laminate stackups are provided. Each stackup comprises laminated layers of conductive and dielectric materials stacked together to form a multi-layer board. A heatsink is coupled to the first laminate stackup. A thermally conductive standoff is coupled to the heatsink. An integrated circuit (IC) is coupled to the standoff such that the standoff is disposed between the heatsink and the IC, and the standoff provides heat conduction between the IC and the heatsink. The first laminate stackup is combined with the second laminate stackup to define an enclosed space therebetween in which the IC and the standoff are located. A plurality of antenna apertures are coupled to a bottom side of the second laminate stackup.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: November 4, 2008
    Assignee: The Boeing Company
    Inventor: Robert T. Worl
  • Patent number: 7444736
    Abstract: A method for making a horn antenna array includes the steps of making planar boards with surface conductor or metallization defining a plurality of side-by-side horns, and with horn feed conductors extending to an edge of the boards. The edges of the board are metallized in a pattern to define feed pads in contact with the feed conductors. Slots are cut in the boards on the axes of the horns so that two orthogonal boards can be joined together for “radiation” in mutually orthogonal planes. A surface-conducive dielectric support defines surface pads in a pattern that matches the pattern of feed pads in a set of joined boards, and through vias connect from the surface pads to lower layers, which may include a beamformer, for making individual connections to the horns.
    Type: Grant
    Filed: April 27, 2006
    Date of Patent: November 4, 2008
    Assignee: Lockheed Martin Corporation
    Inventor: Fred W. Warning
  • Patent number: 7441328
    Abstract: An insulator-combining apparatus which can correctly detects whether or not insulators are lined up in a predetermined sequence is provided. The plate-combining apparatus includes a plate-setting jig which includes a frame, holder, combining part and erroneous attaching-preventing part. The holders hold insulating plates and are provided being spaced from each other and supported by the frame capable of approaching and leaving each other. The combining part includes a pair of nipping members which positions the holder therebetween so as to cause the holders to approach each other. The erroneous attaching-preventing part prevents the holders from approaching each other when an incorrect insulating plate is attached on the holder.
    Type: Grant
    Filed: August 31, 2007
    Date of Patent: October 28, 2008
    Assignee: Yazaki Corporation
    Inventor: Hiroshi Hasegawa
  • Patent number: 7437819
    Abstract: A method for sealing an electrical connector having a transition end and a cable. A protective coating is applied to the transition end of the connector. The connector, transition end and cable are positioned within halves of a mold. An annular resilient seal is positioned about the transition end within the mold. When the mold is filed with castable material the annular resilient seal compresses against the connector, preventing leakage of the castable material along the connector. The mold can then be separated leaving a waterproof boot formed on the transition end of the connector. The invention also provides a mold and sealing means for this process.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: October 21, 2008
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventor: Rudolph B. Escobedo
  • Patent number: 7430798
    Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: October 7, 2008
    Assignee: Fujitsu Limited
    Inventors: Daisuke Koizumi, Shigeyuki Maruyama, Kazuhiro Tashiro, Naoyuki Watanabe
  • Patent number: 7432504
    Abstract: A system and apparatus that removes and collects non-functional wire assemblies from dicorotron units is described. It has a removal tool mounted on the top of a storage box. The removal tool has an open top and bottom, the open bottom is aligned with an opening in the top of the box to permit a dislodged wire assembly to fall therethrough.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: October 7, 2008
    Assignee: Xerox Corporation
    Inventors: Bruce J. Parks, Jamie S. Clayfield, Douglas S. Smith, James D. Walsh, Eliud Robles Flores, Gerald F. Daloia
  • Patent number: 7426781
    Abstract: A placement unit for mounting electric components onto substrates has means for moving perpendicularly to the substrate, a housing, a built-in, rotatable holder for the components, and a rotary drive for the holder mounted within the housing. The holder is connected via an axially elastic coupling to the rotary drive in a manner which is at least temporarily torsionally rigid, wherein the coupling includes a separable coupling having coupling elements arranged to be uncoupled in an axial direction. The holder is pre-stressed axially toward the component against the rotary drive by an adjustable pressure device, wherein the coupling surfaces of the coupling elements form an axial stop for the holder, and wherein the coupling surfaces separate from one another by an axial application force that acts on the holder and prevails over the axial pre-stress.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: September 23, 2008
    Assignee: Siemens Aktiengesellschaft
    Inventor: Stefan Burger
  • Patent number: 7424775
    Abstract: A method for wiring a test fixture comprised of two parallel fixture plates wherein the wires are wired randomly from locations on one plate to locations on a second plate using a system of software algorithms and positioning apparatus to control the motion of one plate relative to the other to allow the wires to be passed directly through the hole locations to be wired together, while previously woven locations are allowed to slide in the hole in the fixture plate to allow reaching subsequent hole pair locations. After the fixture is wired, a termination is added to the wire end emerging from the hole in the fixture plates. The resultant assembly consists of contacts on one outer surface electrically connected to contacts on a second outer surface with all of the wiring sandwiched between the two fixture plates.
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: September 16, 2008
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Gregory Miczek, Thomas Newhall, Gary St. Onge, David P. Rogers
  • Patent number: 7421779
    Abstract: A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.
    Type: Grant
    Filed: February 13, 2004
    Date of Patent: September 9, 2008
    Assignee: Fujikura Ltd.
    Inventors: Osamu Nakao, Reiji Higuchi, Syouji Ito, Masahiro Okamoto
  • Patent number: 7421774
    Abstract: According to a nozzle winding method of causing a nozzle (41) to pass between adjacent magnetic poles (12) and rotating the nozzle (41) around the magnetic pole (12), winding is carried out until the rotating nozzle (41) interferes with wound coils (201 to 242), so that a high space factor is obtained. Thereafter, according to a cam winding method, winding is carried out in a space remaining in a slot while rotating the nozzle (41) in an area not interfering with the coils (201 to 242) in the slot, thereby achieving winding with a high space factor of coils in the entire space of the slot.
    Type: Grant
    Filed: September 29, 2003
    Date of Patent: September 9, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akihiko Yamazaki, Kenzi Sasaki, Yasutake Seki, Koh Kajita
  • Patent number: 7421776
    Abstract: A clamp for attaching a clip to an end of a stator bar including: an anchor adapted to fit into an open end of the clamp; a bracket having a first leg extending radially from the anchor and a second leg substantially perpendicular to the first leg, wherein the second leg has a distal end with a pivot point; at least one alignment post on an inside surface of the second leg; a lever arm pivotably attached to the pivot point on the second leg of the bracket, the lever arm further including a lip on a first end of the arm and adapted to releasably engage an edge of a cover to clip, and an adjustment screw threaded through the lever arm and having a first screw end abutting an outside surface of the second leg of the bracket, wherein turning the screw pivots the lever arm and moves the lip towards or away from the cover.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: September 9, 2008
    Assignee: General Electric Company
    Inventors: Yu Wang, David Robert Schumacher, Lawrence Lee Sowers
  • Patent number: 7421775
    Abstract: A method of easily and inexpensively manufacturing an antenna for an RFID tag by forming the antenna using magnets of a pattern corresponding to a shape of the antenna is provided. One example method includes a) placing a substrate above a level of a fluid containing a conductive substance, b) placing a magnet (e.g., an electromagnet including an electrode) formed in a shape of an antenna pattern above a surface of the substrate, and adhering the conductive substance to a bottom of the substrate in the shape of the antenna pattern by a magnetic force, and c) fixing the conductive substance adhered to the bottom of the substrate.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: September 9, 2008
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Jae-hyun Kwak, Se-jin Lim, Soo-ho Kim