Abstract: A method of making an orientation-insensitive ultra-wideband coupling capacitor, including the steps of securing an unterminated multi-layer capacitor of a low frequency portion of the orientation-insensitive ultra-wideband coupling capacitor, coating completely the unterminated multi-layer capacitor of the low frequency portion with an adhesion layer having opposing ends, creating a circumferential slot around the adhesion layer and thereby electrically separating the opposing ends of the adhesion layer from each other thereby restoring capacitance and forming a slotted body, applying a solder dam coating to all surfaces defining the circumferential slot to protect the circumferential slot, and plating the opposing ends of the adhesion layer so as to form solderable connections and thereby form the orientation-insensitive ultra-wideband coupling capacitor.

Abstract: A folding stand adapted to be secured to the bottom wall of a portable crimping device which, in a folded position, is substantially flat against a wall portion thereof and, in an unfolded position, vertically raises the crimping device to a predetermined working height, the folding stand including a base portion, having a rear pivot axis, a mounting portion, having a front pivot axis, and a pair of elongated cross members for interconnecting the base and mounting portions, via oppositely directed fastening members, with opposed ends of the cross members being adapted to pivot, relative to the adjoining base and mounting members, between respective first and second stop point folding surfaces, in a folded position, and first and second stop point standing surfaces, in an unfolded position, the respective stop point folding and stop point standing surfaces being angularly spaced therebetween via first and second predetermined reflex angles.

Abstract: When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

Abstract: A method of manufacturing a radial core type double rotor brushless direct-current motor is provided. A double rotor structure is employed with inner and outer rotors which are doubly disposed such that a stator core is completely divided. A rotational shaft is rotatably mounted on a housing of an apparatus, cylindrical inner and outer yokes are rotatably mounted on the center of the housing, inner and outer rotors including a number of magnets which are mounted with opposing polarities on the outer surface of the inner yoke and the inner surface of the outer yoke, and a number of cores assemblies are installed between the inner and outer rotors in which a number of coils are wound around a number of division type cores, respectively.

Abstract: A modular multi-component power distribution system is provided having a plurality of modular components which includes a bus-bar-like power distribution assembly (PDA), branching connectors, flex connectors, and receptacles. A manufacturing process relates to the manufacture of extruded power distribution assemblies and the insertion of multiple, lengths of conductor wire along the longitudinal length thereof. In such PDA's, multiple parallel bores are formed interiorly of the PDA casing or housing wherein such conductors are not inserted into the bores until after the PDA extrusions are cut to length and plug ports are formed therein.

Abstract: A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets or voids in the receiving layer and can be used, for example, to provide interlayer connections in laminated wiring boards. Preferably, the conductive material is provided by fine conductive particles, organometallic compounds or mixtures thereof.

Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

Abstract: Method for fabricating a textured dielectric substrate (400) for an RF circuit. The method can include the step (104) of selecting a plurality of dielectric substrate materials, each having a distinct combination or set of electrical properties that is different from the combination of electrical properties of every other one of dielectric substrate materials. Selecting a textured substrate patter (106) which is comprised of at least two types of distinct areas respectively having the distinct sets of electrical properties, with each distinct area dimensioned much smaller than a wavelength at a frequency of interest. Cutting the dielectric substrate materials (202, 204) into a size and shape consistent with the distinct areas of the selected pattern so as to form a plurality of dielectric pieces (206, 208). Arranging the dielectric pieces on a base plate (302) in accordance with the selected pattern to form the textured dielectric substrate.

Abstract: A component mounting apparatus includes one head unit which has a component holding member capable of holding a component and which is selected from among a plurality of types of head units according to a type of the fed component, a head moving unit which has a head fitting portion onto which the selected one head unit is removably loaded and which moves the head unit loaded on the head fitting portion in a direction extending generally along a surface of the board, and a head control unit which is provided for each of the head units and which performs control for component mounting operation by a head unit corresponding to the loaded head unit.

Abstract: A method and a structure for reducing socket warpage in an embodiment by forming at least one groove in a socket housing contiguous to a surface mount region for an electrical device and securing a rigid bar in the groove.

Abstract: A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method includes pre-routing a portion of an adhesive meeting the optical waveguide to remove the portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.

Abstract: A method for stringing a conductive element through a hollow sheath to assemble an electrical cable is provided by injecting compressed gas into the sheath to propel the conductive element therethrough. The conductive element is loaded into a closed channel in fluid communication with a source of compressed gas. A first end of the channel terminating in a needle is inserted into the sheath. The sheath is sealed around the needle and secured into position. Compressed gas, for example, air or nitrogen, is injected in pulses into the channel towards the sheath. The compressed gas radially expands the sheath and forms an air bearing on an inner surface of the sheath. The conductive element is propelled through the sheath over the air bearing. Upon removal of the pressurized gas, the sheath contracts to a normal position to secure the conductive element therein.

Abstract: A compression device has a frame sized to accept an integrated circuit package and a pressor. The frame includes a surface defining an opening with an axis and at least one ramp extending from the surface. The ramp or ramps have upper and lower flat portions, substantially parallel with a plane perpendicular to the axis, and a sloped portion at an angle relative to the plane, the sloped portion connecting the upper and lower flat portions. The pressor is configured to engage the ramp and rotate in response to applied force. When the pressor is engaged with the sloped portion(s) of the ramp(s), this rotation causes movement of the pressor along the axis. However, when engagement between the ramps and the pressor is in the flat portions of the ramp, continued movement of the pressor along the axis is limited in spite of any continued rotation.

Abstract: A method of manufacturing a speaker using a voice coil insertion jig including providing a voice coil insertion jig, deforming a plurality of moving pieces from a first position elastically toward a central boss side to a second position, inserting the voice coil insertion jig into a voice coil, and restoring the plurality of moving pieces to the first position and holding the voice coil using the plurality of moving pieces. Moreover, the method includes inserting the voice coil insertion jig into a magnetic gap forming a magnetic circuit of the speaker, adhering an inner circumference of a diaphragm of the speaker to the voice coil, adhering an outer circumference of the diaphragm to a frame of the speaker, and deforming the plurality of moving pieces elastically from the first position from toward the center boss side to the second position and extracting the voice coil insertion jig from the magnetic gap.

Abstract: Methods for winding energy transfer element cores are disclosed. In one aspect, a method includes winding a plurality of layers of an input winding around an energy transfer element core. One layer of the input winding is wound with a number of turns different than a number of turns included in other layers of the input winding. An output winding is wound around the energy transfer element core with substantially the same number of turns as the number of turns of the one layer of the input winding to reduce substantially a capacitive displacement current flowing between the input and output windings.

Abstract: A textured dielectric patch antenna is fabricated by applying a first mask pattern (310, 510, 610, 710, 915, 1015, 1210) to a first side of a solid panel made of a first material that is a ceramic dielectric and then sandblasting the solid panel through the first mask pattern from the first side to at least partially generate a shaped cavity (315, 920, 1040). The shaped cavity of the solid panel may be filled with a second material (330, 740). The first and second materials have substantially differing dielectric constants. The first side and second side of the solid panel are metallized (325), forming a patch antenna. The shaped cavities can be made more complex by using additional masking and/or sandblasting steps.

Abstract: Ceramic adhesive is applied inside the slots of an electric machine squirrel cage rotor prior to casting or insertion of rotor conductors. This heat-resistant insulation provides superior electrical insulation that is also mechanically rugged, thus enabling casting of squirrel cage rotors by die or cost-effective consumable pattern casting. The consumable pattern cast copper rotors are electrically well insulated, thus minimizing rotor losses. The ceramic insulation in cast rotors enables longer conductors to be cast by thermally insulating the molten metal from the cooler laminations. The ceramic insulation in fabricated rotors withstands the high temperatures of end ring attachment.

Abstract: The apparatus is for securely fetching and positioning an SMD chip on a printed circuit board and soldering the same to the board. Two spring plates form the clasping fingers which are wedged apart to a width larger than the width of the SMD chip by an expander formed on an elongated rod slidably mounted within a vertical tubular housing. An SMD chip may be safely fetched by pressing the rod on the top of the SMD with a continuous depressing motion until the fingers clasp the SMD chip safely therebetween. A soldering unit with a bifurcate soldering head located juxtaposed to the fingers is operative to solder the SMD chip to the printed circuit board while the SMD chip is safely held in place.

Abstract: A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

Abstract: A method for making an integrated circuit substrate having embedded passive components provides a reduced cost and compact package for a die and one or more passive components. An insulating layer of the substrate is embossed or laser-ablated to generate apertures for insertion of a paste forming the body of the passive component. A resistive paste is used to form resistors and a dielectric paste is used for forming capacitors. A capacitor plate may be deposited at a bottom of the aperture by using a doped substrate material and activating only the bottom wall of the aperture, enabling plating of the bottom wall without depositing conductive material on the side walls of the aperture. Vias may be formed to the bottom plate by using a disjoint structure and conductive paste technology. Connection to the passive components may be made by conductive paste-filled channels forming conductive patterns on the substrate.