Abstract: Disclosed is an electronic-component mounting apparatus 1 for mounting a plurality of electronic components onto a printed-wiring board 10, which comprises a component mounting head 4 adapted to suck up the electronic component and mount the sucked up electronic component on the printed-wiring board 10 while moving along an X-axis direction, a table 8 adapted to move the printed-wiring board 10 along a Y-axis direction, an electronic-component feeding device 12, 14 attached to the table 8 and adapted to move in sync with the movement of the printed-wiring board 10, and component image-recognition/correction means 16 for correcting a posture of the electronic component in accordance with image recognition of the posture, during the time between the sucking up and mounting of the electronic component by the component mounting head, wherein respective positions of the sucking of the electronic component, the mounting of the electronic component and the image recognition are located on the X-axis.

Abstract: It is an object of the present invention to provide a contact press-fitting apparatus which can perform the press-fitting of all of the contacts with high reliability, without leading to problems such as buckling of the contacts, even in cases where the array pitch of the contacts is uneven. The contact press-fitting apparatus comprises a supporting member which is inserted into the press-fitting head from a direction perpendicular to the press-fitting direction of the press-fitting head, and which supports the side surfaces of the contacts on the sides that the abutting part does not abut against.

Abstract: Disclosed is an apparatus for separating culls coupled to a lead frame when a semiconductor chip is molded. The apparatus includes a lower plate, on which culls coupled to a lead frame are placed, an upper plate pressing culls placed on the lower plate in order to separate culls from the lead frame, a pilot pin installed in the upper plate by passing through the upper plate in order to press culls together with the upper plate when the upper plate presses the culls, and a sensor unit installed adjacent to the movement path of the pilot pin so as to detect a movement of the pilot pin. When culls are separated, faults of articles caused by a molding material insufficiently filled in a mold are checked through detecting a movement of the pilot pin.

Abstract: Sealing material is injected into a cap receiving an electric cable joint without remaining air bubbles. The cap has an opening at both ends and receives the joint, the electric cable being in the upper side and the joint being in the lower side. The sealing material is injected into the cap from the lower opening. The joint is inserted into the cap from the upper opening. Or, the joint is received in the cap, the sealing material is injected into the cap from the upper opening, and the cap position is reversed. Or, the sealing material is injected into the cap, from the upper opening, the joint is inserted into the cap, and the cap is reversed. A cap holder receives the cap such that the upper and/or lower opening of the cap is covered.

Abstract: A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern, thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.

Abstract: A disassembling tool pushes first and second coupling members out of a process cartridge that also has an electrophotographic photosensitive member, and first and second coupling members for rotatably coupling first and second frames of the cartridge together. The disassembling tool includes first and second base bodies, first and second engagement portions provided on the first and second base bodies respectively, and engageable with the cartridge to position the cartridge when the tool is mounted on the cartridge, and first and second pushing-out portions provided for movement relative to the first and second base bodies, respectively, for pushing out the first and second coupling members, respectively. The first and second engagement portions are provided at a location opposed to the first and second pushing-out portions, respectively, in a movement direction in which the first and second pushing-out portions are moved, respectively.

Abstract: Disclosed is a method of fabricating rigid flexible PCBs. In the method, a self-detachable adhesive tape is used to separate a wafer and a substrate from each other in the course of conventionally fabricating a semiconductor wafer, is employed to avoid inherent problems occurring in the conventional method of fabricating rigid flexible PCBs.

Abstract: A method of manufacturing a rotary electric machine stator includes inserting straight portions of conductor segments into a plurality of slots of a stator core. The conductor segments are then bent so that connection ends of the conductor segments that are disposed adjacent to each other in a radial direction can incline in opposite circumferential directions to cross one another. Pairs of the connection ends crossing each other are then welded.

Abstract: A method of manufacturing a both-side metallized insulation film comprises steps of: depositing zinc or a blend of zinc and aluminum onto both sides of an insulation film; and winding this metallized film into a product roll. The method is characterized in spraying an oxidizing gas onto a deposited layer on an inner side of the insulation film to be wound, during the winding step. During a vacuum deposition step, an oil layer is formed on at least one side of the metallized film. In addition, an oxide layer is formed by exposing a deposited layer on at least one side to oxygen, or by spraying an oxygen-containing gas onto the deposited layer on at least one side during the winding of the metallized film into the product roll.

Abstract: A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material; and sintering the ceramic material. A method including forming a ceramic material directly on a sheet of a first conductive material; forming a second conductive material on the ceramic material so that the ceramic material is disposed between the first conductive material and the second conductive material; thermal processing at a temperature sufficient to sinter the ceramic material and form a film of the second conductive material; and coating an exposed surface of at least one of the first conduct material and the second conductive material with a different conductive material. An apparatus including first and second electrodes; and a ceramic material between the first electrode and the second electrode, wherein the ceramic material is sintered directly on one of the first and second electrode.

Abstract: A system including a circuit board and several pluggable modules coupled to the circuit board. The several pluggable modules are insertable through side-by-side slots in an enclosure in which the circuit board resides. A first pluggable module is coupled to the circuit board via a first connector, while a second pluggable module is coupled to the circuit board via a second connector such that the second pluggable module is laterally offset from the first pluggable module. The first and second connectors are right angle connectors, and the second right angle connector is inverted relative to the first right angle connector. The first and second pluggable modules are I/O modules for transporting high speed differential signals, and wherein the first pluggable module includes several XFP connectors, and wherein the second pluggable module includes several SFP connectors. The second pluggable module includes several SFP connectors arranged on both sides of the pluggable module.

Abstract: A manufacturing method of a stator for vehicular rotary electric machine includes: forming an indentation in a radial direction in a side face of each of electrical conductors in the machine by pressing; inserting the electrical conductors in a radially side-by-side relationship with each other in slots of the machine; bending each of the electrical conductors and radially adjacent electrical conductors in different circumferential directions by a predetermined pole pitch such that the indentations formed in respective side faces of the adjacent electrical conductors pass each other in a face-to-face relationship; and bonding on each of the electrical conductors to one end of the adjacent electrical conductors.

Abstract: Disclosed are a damascene and dual damascene processes both of which incorporate the use of a release layer to remove trace amounts of residual material between metal interconnect lines. The release layer is deposited onto a dielectric layer. The release layer comprises an organic material, a dielectric material, a metal or a metal nitride. Trenches are etched into the dielectric layer. The trenches are lined with a liner and filled with a conductor. The conductor and liner materials are polished off the release layer. However, trace amounts of the residual material may remain. The release layer is removed (e.g., by an appropriate solvent or wet etching process) to remove the residual material. If the trench is formed such that the release layer overlaps the walls of the trench, then when the release layer is removed another dielectric layer can be deposited that reinforces the corners around the top of the metal interconnect line.

Abstract: Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.

Abstract: A compliant contact pin assembly method for making is provided. The compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

Abstract: In a method of manufacturing a rotor of a rotary electric machine, a rotor core is formed by preparing a material sheet in a form of a belt. The material sheet has teeth extending from a first side of a middle portion of the material sheet and projections projecting from a second side of the middle portion in a direction opposite to the teeth. The projections define recesses therebetween. Each projection and each recess has substantially the same dimension with respect to a centerline between a first line passing through tops of the projections and a second line passing through bottoms of the recesses. The material sheet is helically wound so that the projections are located on an inner diameter side of a rotor core.

Abstract: An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member having an intrinsic stress profile. The intrinsic stress profile biases a free portion away from the substrate forming a loop winding. An anchor portion remains fixed to the substrate. The free portion end becomes a second anchor portion which may be connected to the substrate via soldering or plating. A series of individual coil structures can be joined via their anchor portions to form inductors and transformers.

Abstract: A method of simultaneously fabricating a plurality of circuit blocks is presented. Each circuit block is configured for aligned positioning onto a housing of an individual electrical connector. The method includes simultaneously fabricating a plurality of circuits on a single sheet of material and cutting a repeating pattern of holes across the sheet of material. Then the sheet is separated into individual identical sections that have one or more peripheral edge. A circuit board is defined by each section. Each of the sections has a peripheral shape that is defined by the one or more peripheral edges. The peripheral shape is sized and configured to be receivable in only one orientation into a housing of an electrical connector. The holes are cut in the sheet of material such that holes are associated with each peripheral edge of each section.

Abstract: A system and method for implementing an antenna system for multiple antennas using a single core. The method may include providing a first core, a first winding would about the first core for transmitting/receiving electromagnetic signals, and a second winding for transmitting/receiving electromagnetic signals would about the first core and the first winding. The first winding and the second winding may be wound such that a direction of a first magnetic field generated by the first winding is different than a direction of a second magnetic field generated by the second winding. The method may also include proving for activation circuitry connected to the first winding and the second winding. The activation circuitry may activate the first winding separately from the second winding. The method may provide three or more coils/antennas disposed on a single core. The method may choose stronger of the received magnetic fields from the first or the second coil, for processing.

Abstract: The present invention is for laminated and interconnected multiple substrates forming a multilayer package or other circuit component. A solder bump may be situated on the conductive pad of at least one of two or more substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). Adhesive films may be positioned between the surfaces of the substrates having the conductive pads, where the adhesive films include apertures located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The two or more substrates pressed together via the adhesive films are mechanically bonded. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the conductive pads through the aperture in the adhesive films.