Abstract: An automated wire harness machine is capable of manufacturing a wire harness in an automated process. The wire harness is generally a plurality of bundled, preferably un-stripped, insulated wires. Each un-stripped end portion of each wire is preferably terminated by an electrical terminal in one of a series of electrical connectors of the wire harness. Each connector has at least one wafer which houses a plurality of terminals. The wire harness machine utilizes a pallet that holds all of the wafers of one wire harness. A conveyor transports the pallet and wafers through a series of stations which perform automated manufacturing steps. The first station is a terminal inserter which inserts and locks the terminals within pre-assigned cavities of the wafers. The next station is an automated wire loader which measures, cuts and crimps the two ends of each wire into the respective terminals of the loaded wafer assembly.

Abstract: Provided is a method and system for placing components by means of at least one component placement unit wherein the component placement unit is moved over a distance between a component pickup position and a component placement position located on a substrate. In addition, a total distance to be covered by the component placement unit is calculated for the number of components to be placed, wherein the number of components to be placed is determined beforehand. This total distance value is subsequently compared with a reference value. If the total distance value is greater than the reference value, the substrate to be provided with the components is rotated with respect to the component pickup position about an axis that extends perpendicularly to the substrate.

Abstract: A multilayer circuit board that has electrodes only on one surface is manufactured as follows. A plurality of conductor layers are formed on a resin film made of thermoplastic resin to form a single-sided conductor layer film. Then, a plurality of via-holes 24, which are bottomed by the conductor layers, are formed in the resin film. Then interlayer connecting material is packed in the via-holes 24 to form a single-sided conductor layer film having the interlayer connecting material. A plurality of single-sided conductor layer films are formed and stacked such that surfaces having the conductor layers face in the same direction. Then, the single-sided conductor layer films are pressed and heated to complete the multilayer circuit board. The multilayer circuit board is formed by using only the single-sided conductor layer films and pressing once, so the manufacturing process is simplified.

Abstract: Apparatus for making circuitized substrates using a continuous roll format in which layers of conductor and dielectric are fed into the apparatus, bonded, and passed on to other nearby work stations in which various processes such as hole formation, circuitization and, finally, segmentation occur. The resulting substrates can then be individually bonded to other, like substrates to form a larger multi-layered substrate with a plurality of conductive thru-holes, conductive and dielectric layers as part thereof.

Abstract: A method for fabricating a multi-layer printed circuit board can include forming an etching resist layer on a first metal layer having plating grooves that selectively expose the first metal layer, forming a plated layer at the surface of the first metal layer exposed by the plating groove through a plating process to form connection protrusion, removing the etching resist layer, forming an insulation layer at the first metal layer and positioning a second metal layer at the surface of the insulation layer coupled to an end portion of the connection protrusion. By forming the connection protrusion through the plating process, a loss of material can be reduced and a strength of the connection protrusion can be increased. Further, a complexity of the fabrication process is reduced to reduce costs and increase productivity.

Abstract: The invention relates to a method of manufacturing a coil component uses as a major part of a common mode choke coil or a transformer, and there is provided a method of manufacturing a compact and low height coil component in which deterioration of impedance characteristics is low and reliability is high. An insulating film is formed on a magnetic substrate, and open regions are formed in the insulating film. A lead terminal portion is formed on the insulating film, and a planarizing film is formed on the open regions. An insulating film is formed and openings are formed in the insulating film at the open regions. A coil conductor is formed on the insulating film, and a planarizing film is further formed on the planarizing film. After a coil conductor is further formed on the coil conductor through the insulating film, the planarizing films are removed.

Abstract: A method for producing a pH measuring probe includes: providing an electrode wire protruding out of both sides of a recording device, the electrode wire being fixed to the recording device with the first end thereof, placing a glass tube over a second end of the electrode wire until reaching a cavity of the recording device, the glass tube and the recording device being fixed together; providing another electrode wire protruding from both sides of a base plate including a recess for the recording device, the other electrode wire being fixed to the base plate with its end protruding; providing a casing comprising first and second openings, the casing and base plate being sealed together, forming the housing; and guiding the glass tube through the recess in the base plate until it protrudes out of an opening in the casing and the recording device is inserted into the base plate.

Abstract: A process and device for assembling a connector is provided, by which the production efficiency can be improved by preventing the problem of insertion error from occurring in a step of terminal insertion into a connector housing in the manufacturing process of the wiring harness by using an automatic assembly machine or in a step of the operation by the human hands. The process includes the steps of: provisionally locking the spacer in the connector housing; inserting a jig rod into the connector housing before inserting the terminal into the connector housing, the jig rod being for releasing the locking of the spacer which is completely locked in the connector housing; pulling the jig rod out from the connector housing; and inserting the terminal into the connector housing.

Abstract: A method of making a flat-plate antenna having thinner shape and excellent productivity, reducing labor for installation in an electrical apparatus or on a wall, and exhibiting desired antenna characteristics stably. The method includes forming a conductive flat-plate having a slit portion, a radiating element portion, and a ground portion formed by press punching a lead-frame. The method also includes laminating over the lead-frame with a resinous film. The method further includes forming first and second connecting holes through which a part of the lead-frame is exposed. The method also includes press punching the laminated lead-frame including the slit portion, the radiating element portion and the ground portion. The method still further includes connecting first and second conductors of a power supply line with the radiating element portion and the ground portion, respectively.

Abstract: A method is provided for fitting waterproof seals onto outer peripheries of end portions of electric wires. The method feeds seals along the axis line of the wire and into a seal cavity. A passage forming member forms a feeding passage to feed the seal into the seal cavity with a posture to receive the electric wire. The seal then is locked in the seal cavity. The wire then is moved along the axis line and into the seal.

Abstract: A method of coupling a shunt to a printed circuit board (PCB) of an energy management system is provided. The method includes coupling flexible electrical connectors to the shunt and soldering the flexible electrical connectors to connection points on the PCB of the energy management system. An energy management system that includes a shunt coupled to a printed circuit board using the above method is also provided.

Abstract: A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three dimensional array of chips. The system includes a chip carrier pallet that holds and moves the chip carriers for the automatic assembly of a circuit board. The system also may include a print fixture pedestal that works in combination with the chip carrier pallet to position chip carriers for automatic deposition of solder on a multitude of carriers at once, and then position them for addition to a circuit board.

Abstract: Methods and apparatus are provided for removing plating from a device. The method and apparatus may be used for preparing an electrical connector for connecting at least one wire or other terminus thereto where the electrical connector has at least one electrical contact with a metal coating thereon. The method includes the steps of applying molten solder to the electrical contact whereby the coating dissolves into the molten solder to thereby create a molten coating-solder mixture and rotating the electrical connector whereby the molten coating-solder mixture is removed from the electrical contact.

Abstract: A method is provided for effectively manufacturing a piezoelectric device equipped with a piezoelectric film with a crystal orientation that is aligned in a desired direction. An interlayer which partially has a layer formed by an ion beam assisted laser ablation method while controlling a temperature rise accompanied by an ion beam irradiation by a cooling device and is bi-axially oriented as a whole, is formed on a surface of a substrate. A lower electrode is formed on the interlayer. A piezoelectric film is formed on the lower electrode. An upper electrode is formed on the piezoelectric film. The lower electrode and the piezoelectric film are formed by epitaxial growth.

Abstract: Power supply switching regulator electrical circuit trimming methods. A trimming method includes assembling one or more components of a power supply switching regulator electrical circuit onto a printed circuit board having one or more electrical connections coupled to the said one or more components. An electrical parameter of the power supply switching regulator electrical circuit is then trimmed after the assembling of the one or more components of the power supply switching regulator electrical circuit onto the printed circuit board. The trimming of the electrical parameter of the power supply switching regulator electrical circuit includes removing a portion of the printed circuit board to break the electrical connection on the printed circuit board.

Abstract: A method for production of a multi-layer carbon brush including at least two electrically-conducting functional layers made from carbon material and at least one insulation layer made from an electrically-insulating material, running between consecutive functional layers. According to the invention, the corresponding multi-layer carbon brushes and the layers with desired thickness can be produced by applying the carbon material and the electrically-insulating material in a mold in a sequence corresponding to the layer sequence of the multi-layer carbon brush for production in powder form, then pressed and finally heat-treated.

Abstract: A method for manufacturing a wiring substrate includes the steps of: (a) forming a ground layer precursor having reactive groups including nitrogen atoms in first and second areas of a substrate; (b) irradiating light energy to remove the reactive groups from the ground layer precursor to thereby form a ground layer charged in cathode; (c) patterning a cationic surface-active agent of anode to be left on the first area of the substrate with the ground layer as a ground; (d) providing a catalyst at the surface-active agent; and (e) forming a wiring along the first area of the substrate by precipitating a metal layer to the catalyst.

Abstract: A method of fabricating a radio frequency identification (RFID) antenna on a substrate is disclosed. The antenna is fabricated on a substrate that includes already fabricated RFID chips. The substrate is connected with a carrier substrate and singulated to separate the plurality of RFID chips into a plurality of diesites. The antenna is connected to a RFID chip in an assembly order to form an a RFID tag. The method is repeated such that each successively connected antenna overlaps a previously connected antenna.

Abstract: Provided is a component mounter having a plurality of revolving nozzle spindles, which can simultaneously pick up and mount two or more electronic components. A head assembly for the component mounter includes: a base frame; a rotary housing rotatably mounted on the base frame and having spindle receiving holes vertically formed at regular intervals at the same radius from a center thereof; a plurality of nozzle spindles having lower ends to which nozzles for picking up electronic components are coupled, and received in the spindle receiving holes such that the plurality of nozzle spindles rotate on the same axis when the rotary housing rotates; a housing rotating mechanism rotating the rotary housing; and a nozzle lifting mechanism including a nozzle lift driving unit, and a clutch part that moves according to the operation of the nozzle lift driving unit and can simultaneously press down and lower the plurality of nozzle spindles.

Abstract: A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of stock material (800) relative to the plane of the stock material (800) and a second linkage member (826) displaced from the strip (800) relative to the plane. The first and second linkage members (822, 826) are then joined while secured to the strip (800). At least one severable connecting member (870a-c) securing the linkage member to the strip (800) is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly (140).