Abstract: A method for forming bonding pads on a printed circuit board (PCB) with circuit patterns is provided. A plurality of copper patterns are formed on the PCB which are electrically connected to the circuit patterns, and a filler is filled between the copper patterns such that an upper surface of the copper pattern is exposed. A plating layer is then applied to the exposed upper surface of the copper patterns. Protrusion of the plating layer at a lower portion of a copper pattern is prevented, thus reducing an interval between the wire bonding pad(s) and potentially increasing the number of bonding pads which may be effectively formed on a given PCB.

Abstract: A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and reprocessing. The semiconductor device holder holds each individual die in a separate processing cavity configured to hold each individual die in a predetermined processing position. In one embodiment, a vacuum force is used to hold one or more dies in respective processing cavities with a predetermined level of force even if other adjacent die processing cavities are unoccupied by other individual dies.

Abstract: A tool for engaging a telecommunications connector within a slot so that a releasable latch of the connector is released by the tool. The tool may be used to remove a telecommunications connector from a mating opening of a receptacle or may be used to insert a connector within a receptacle.

Abstract: A spring system arrangement and a related connector are disclosed. The purpose is to allow the use of contact springs, such as coil contact springs, with relatively large size body, to be located on a small center distance, i.e. pitch, and to electrically connect with contact pads of high density electronic devices, having a small device pitch. The device pitch can be smaller than the diameter of the spring body itself. In order to achieve this desired small spring pitch and high density, the contact springs are located in a nested head-to-toe and/or staggered orientation. Furthermore, the connectors utilize guide plates, referred to as combs, to accurately control the alignment of the contact springs tips to the contact pads of the electronic devices.

Abstract: The present invention provides a method for sealing a metal housing member. A housing through hole is formed in a housing member for a lead wire sealing device. The housing member is provided with a housing through hole formed on the metal housing member and penetrates from a closed space to an open space. A resin coating layer is formed to cover a lower surface of the housing member. A metal surface exposed part is formed on a part of the resin coating layer. The circuit board having a board aperture is mounted on the metal surface exposed part via an adhesive layer while overlapping with the board aperture on the housing through hole. The lead wire is inserted in the housing through hole and the board aperture that are overlapped with each other. The sealing material is provided on the circuit board to cover the board aperture.

Abstract: A method of fabricating a heat sink includes preparing a surface of a graphite-based substrate and removing particulate matter generated from the preparation of the surface of the substrate. A metal-based coating is applied at the surface of the prepared substrate. The prepared substrate having the metal-based coating is arranged to form a heat sink structure.

Abstract: A resonant circuit having a circuit coil formed on each surface of a dielectric film. Each coil has a line-width and an outer periphery in which the line-width of each circuit is 1/50 or more of the length of the outermost periphery of that circuit. Each coil has at least three complete turns, and the coils are provided on the faces of a dielectric film in such a manner that the coils are faced to each other.

Abstract: A laminate is formed from a carrier layer and an electrically conductive layer. In one section, the conductive layer is formed into an antenna structure. The laminate is formed by placing a mask onto a packaging film and vapor-depositing aluminum onto the packaging film and the mask. After removal of the mask, only a desired antenna structure remains on a section of the packaging film. Then a microchip, is adhesively bonded to the packaging film and conductively connected to an end of the antenna structure, so that data can be written in or read out without contact in a wireless transponder system.

Abstract: A first electronic component having two alignment holes perforated at predetermined positions thereof at a predetermined interval is held with a receiving table, and also a second electronic component having two alignment marks formed at predetermined positions thereon at an interval therebetween in agreement with that between the two alignment holes is held with a position-adjusting mechanism. In a state in which the alignment marks of the second electronic component are introduced in the corresponding alignment holes of the first electronic component, the mark-recognition apparatus captures the alignment marks and the alignment holes in the same fields of view thereof and measures the positions of the two components, and the position-adjusting mechanism adjusts the position of the second electronic component such that the alignment marks of the second electronic component lie at predetermined positions in the alignment holes of the first electronic component.

Abstract: Disclosed is a method of manufacturing a surface acoustic wave device comprising the steps of forming a drive electrode having a surface acoustic wave element function on a piezoelectric substrate wafer, providing a resist coat on an upper region of the drive electrode, covering the resist coat with a metal film, removing the resist coat lying within the metal film so that the metal film is formed in a dome form having a hollow portion covering the drive electrode, and providing a resin seal on the metal film.

Abstract: An installation, insulation displacement, and terminating power tool, for inserting electrical wires into, and for electrically connecting the electrical wires to electrical contact members disposed within, an electrical connector, comprises a piston-cylinder driving assembly for inserting the electrical wires into the electrical connector. More particularly, the piston-cylinder driving assembly comprises a three-chamber pneumatic piston-cylinder driving assembly for developing an enhanced level of driving force necessary for inserting the electrical wires into the electrical connector.

Abstract: Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.

Abstract: A system for splicing together heavy duty electric cables, especially underground cables, consisting of a static friction block and a clamping friction block located on ends of cables to be spliced. A block and tackle mechanism is interposed between the friction block and the clamping block to provide a force to move various elements on the cables to various and final predetermined locations to make up the splice. The block and tackle mechanism has a wind-up spool thereon to wind-up ends of cords of the block and tackle mechanism. The wind-up spool provides the necessary force to accomplish the move of the various elements.

Abstract: A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion pivots with respect to a first portion of the substrate.

Abstract: A piezoelectric actuator is provided, including comb-shape piezoelectric actuators, each including a plurality of piezoelectric layers. The actuators are made by a process including the steps of (1) preparing a plurality of piezoelectric material green sheets on which electrode films are formed and forming slits on a first green sheet using a punch and a die, (2) pulling up the first green sheet using a stripper, (3) pulling up a top portion of the punch slightly from the lowest portion of the pulled up first green sheet, (4) forming second slits in a second green sheet by the punch, (5) pulling up the second green sheet jointly with the first green sheet, (6) pulling up the top portion of the punch slightly from the lowest portion of the pulled up second green sheet, and thereafter laminating green sheets by repeating steps (4) through (6). The layers are thereafter fired.

Abstract: A fixing tool for quickly setting up a secure device with an engaging member and a secure unit is used for mounting the secure device to an electronic component. The fixing tool includes a main member, a driving member with an extending part pivotally connected to the main member and an ejection member with an ejecting part disposed at the bottom cover of the main member. The bottom cover defines a moving direction and a rotating direction and the driving member rotates between a prior-trigger position and a trigger position along the rotating direction and the ejection member moves between a prior-ejecting position and an ejection position. When the driving member is disposed at the prior-trigger position, the ejection member is at the prior-ejecting position. When the driving member is disposed at the trigger position, the ejection member is disposed at the ejection position and the engaging member in the containing chamber is pushed by the ejection member to join with the secure unit.

Abstract: A structure of a press-contacting holding part is not complicated so that press-contacting operation of press-contacting an electric wire to the press-contacting terminal is easily and precisely performed. According to the invention, an apparatus of press-contacting of electric wire includes a case holding part for holding case provided with a press-contacting terminal, an electric wire holding part for holding the electric wire positioned by the positioning part, a press-contacting driving mechanism for driving the electric wire held by the electric wire holding part so that the electric wire is pushed into a slot part of the press-contacting terminal to provide pressure contact therebetween.

Abstract: An equipping installation introduces fitted-out cable ends into plug housings and is arranged downstream from a fitting-out installation. A contact for the first plug housing is arranged at the leading cable end and a contact for the second plug housing is arranged at the trailing cable end. A feeder unit takes over the cable loop fitted-out to a finished state from a second transfer unit and transfers the leading cable end to a positioning unit and the trailing cable end either to a rotatable store or, after the positioning unit is again free of cable, to the positioning unit in accordance with a cable plan. An equipping unit takes over the cable ends in succession at the positioning unit and introduces the cable ends into the corresponding plug housings.

Abstract: An apparatus for facilitating the insertion and extraction of a PC board into and from a card cage, comprising a mounting body, an engager, and an actuator. In a preferred embodiment, the apparatus has a ring-shaped mounting body having a clearance hole therethrough. The apparatus is sliadably and rotatably mounted on a cylindrical rod through the clearance hole such that the apparatus is slidably rotatable along the length of the cylindrical rod. In operation, the engager is positioned in physical contact with the PC board in a notch in the board such that when a force is applied to the actuator, the engager is effected to urge the board to move in the direction of the force.

Abstract: The present invention involves a spark plug boot removal tool having a handle portion, an extension portion, and a grasping portion. The handle portion includes a spring-loaded trigger. The grasping portion includes a fixed grasping member and a rotatable grasping member. The extension portion includes an elongated flexible shaft enclosing a control rod that is attached to a triangular block. When the grasping portion is positioned over a spark plug boot, the trigger is compressed, causing the control rod to pull the block, causing the rotatable grasping member to join with the fixed grasping member to clamp around the spark plug boot. Both grasping members have an angular bend that allows the user to position the elongated flexible shaft outside of the engine compartment when exerting a force on the handle portion to remove the spark plug boot, thus minimizing the risk of injury.