Abstract: A method for mounting electronic components is provided. The method comprises: rotating at least one rotation housing, and thereby correcting positions of a plurality of nozzle spindles depending on specified absorption positions of the electronic components; absorbing the electronic components by descending at least one nozzle spindle; rotating at least one rotation housing and rotating nozzle spindles to which the electronic components are absorbed, thereby correcting positions of the electronic components absorbed to the nozzle spindles depending on an inclination angle of specified positions for mounting the electronic components to a printed circuit board; moving the absorbed electronic components over the printed circuit board; and mounting the absorbed electronic components to the specified mounting positions of the printed circuit board.

Abstract: An electric-component holding apparatus including a component holder which holds an electric component and includes an engaging portion, a holder-holding member to which the component holder is detachably attached, a lock member which consists of a substantially rigid body, and which is supported by the holder-holding member such that the lock member is movable relative to the holder-holding member, and is engaged with the engaging portion of the component holder to lock the component holder to the holder-holding member, and a locked-state maintaining device which includes an operable member and an elastic member and which maintains, owing to an elastic force of the elastic member, a locked state in which the lock member is engaged with the engaging portion of the component holder.

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

Abstract: A method for manufacturing clad superconducting wire for use in superconducting coils, such wire having improved resistance to electromagnetic forces by using composite superconducting wires that are clad with selected high-stiffness high-strength materials.

Abstract: An unlocking jig (40) is fit on a female housing (10) from below. As a result, a guide groove (43A) on a bottom portion (43) of the unlocking jig (40) engages a convexity (22C) on a lower surface of the female housing (10) and a guide groove (43B) on an arm (45) engages a convexity (22B) on a side surface of the female housing (10). The unlocking jig (40) has unlocking claws (a1, a2) that engage short locking pieces (38B, 38C) when the unlocking jig (40) is moved and unlock the short locking pieces (38B, 38C) from locks (22B, 22C) on the housing (10).

Abstract: In an electronic component mounting apparatus for taking out a chip 6 from a component supply portion 4 to mount to a board 16 held by a board holding portion 10, an image of a supply portion reference mark provided at a mark post 18 of the component supply portion 2 is taken by a second camera 35 moved by a camera moving mechanism, a camera coordinates system is calibrated based on a result of taking the image, thereafter, a position of the chip 6 is recognized by the second camera 35 and the chip 6 is picked up by a mounting head based on a result of the recognition. Thereby, stable pick up accuracy can be ensured by calibrating an aging variation of the coordinates system owing to thermal elongation or contraction of the camera moving mechanism.

Abstract: The process for stator bar rewinds includes disassembly of the stator bars at the generator site, measurement of the stator bars, forwarding digital representations of the measurements to a manufacturing center and forming 3-Dimensional models of the stator bars requiring replacement and the stator. The stator bar 3D model is placed in the stator 3D model to insure accuracy of fit. Tooling and stator bar drawings are generated and sample stator bars are manufactured. 3D modeling of the manufactured sample stator bars are compared to the nominal 3D models to insure accuracy. The replacement stator bars are manufactured and forwarded in batches for assembly into the extant generator.

Abstract: The specification discloses an apparatus comprising an alignment plate having a plurality of depressions therein, each depression being sized to receive a packaging cap therein and to prevent its movement, and a force applicator to apply a force to press the packaging caps and a substrate firmly together. Also disclosed is a process comprising inserting a plurality of packaging caps in a plurality of depressions on an alignment plate, each depression being sized to receive a packaging cap and prevent its movement, aligning the plurality of packaging caps with individual devices on a substrate, placing the substrate in contact with the packaging caps, and applying a force to press the caps against the substrate. Other embodiments are disclosed and claimed.

Abstract: A capacitor and a method for manufacturing the same provide a branched capacitor with a large capacitance and a super-slim structure. The method includes sintering a ceramic substrate; forming a plurality of troughs in the sintered ceramic substrate, the plurality of troughs including first and second sets of troughs corresponding to opposing electrodes; and filling the troughs with metal to form a plurality of metal lines arranged alternately in the plurality of troughs.

Abstract: A method of producing a laminated dielectric element of high quality, free of delamination. A method of producing a laminated dielectric element 1 by alternately laminating dielectric ceramic layers 12 and base metal electrode layers 13, comprising the steps of printing electrodes by applying a paste material for the base metal electrodes onto the surfaces of at least one side of the ceramic green sheets, laminating and press-adhering the ceramic green sheets to fabricate a laminate thereof, dewaxing the laminate, reducing the electrodes to form base metal electrode layers by heating the laminate while flowing an atmospheric gas and by reducing the paste material for the base metal electrodes, and sintering the laminate.

Abstract: A manufacturing process of a stacked semiconductor device, comprising the following steps: integrating a plurality of electronic devices in a plurality of active areas realized in a semiconductor wafer; distributing an adhesive layer on active areas, splitting the semiconductor wafer into a plurality of first dies, each one comprising at least one of the active areas; mounting the plurality of first dies, which are already equipped with the adhesive layer, on a support; and mounting a plurality of second dies on the adhesive layer.

Abstract: A method and apparatus for connecting a plurality of coaxial cables to a printed circuit board in a compact connector. The apparatus is generally comprised of a flexible carrier, means for attaching the cable to the flexible carrier, a conductive base plate and a rigid beam providing pressure such that the electrical contact between the coaxial cable and the printed circuit board is maintained. The method generally comprises the steps of stripping the coaxial cables, bonding the coaxial cable to a flexible carrier, positioning the coaxial cables over traces of a printed circuit board providing pressure such that electrical contact is maintained between the cables and the printed circuit board.

Abstract: A tweezer-type hand-held device for installing and removing an electric part on and from a substrate. The device is provided with a pair of legs biased to close such that the part is held between the legs by the biasing force when the part is installed on the substrate. In an embodiment, one of the legs may be biased in two directions, i.e. in a direction to open and in another direction to close, and a switching member is disclosed to switch the biasing direction. The biasing member may include a spring commonly used for the biasing in the two directions. Manipulation portions are provided for open or close the legs against the force of the biasing member.

Abstract: A system provides a zero interconnection height in a board-to-board interconnect while maintaining efficient space allocation for multiple axis connections by providing a floating connection in one plane thereby enabling a connection in another plane. A first circuit board having a first plurality of through-holes is aligned with a second circuit board having a second plurality of through-holes so that the first plurality of through-holes is matched with the second plurality of through-holes. An interconnection height of zero is provided between the first circuit board and the second circuit board. At least one pass-through socket, which includes pass-through socket through-holes, is aligned with the combination of the first circuit board and second circuit board. One or more pins disposed on a pin header are inserted through the pass-through socket, the first circuit board, and the second circuit board.

Abstract: A method for making a stator assembly includes forming several continuous conductors with generally-coplanar parallel-spaced straight segments interconnected by end loop segments, as by winding each of several conductors on a peg board, and then pressing the conductors to form either one, two, or three generally-orthogonal “jogs” in a given end loop segment. The conductors are interpositioned with their straight segments staggered and with a first leg of each subsequent conductor's end loop segments generally overlying a second leg of the immediately-prior conductor's end loop segments, except for the two end loop segments following the first conductor's “nth” straight segment, and multiples thereof, where the stacking order is reversed (“n” being equal to the number of stator core slots divided by the number of conductors that will form a given winding layer).

Abstract: Methods and systems of assembling and making laminated electro-mechanical systems and structures are described. A plurality of structural layers are formed that include at least one structural layer having a movable element formed therein. The plurality of structural layers are stacked and aligned into a stack. Each structural layer in the stack is attached to an adjacent structural layer of the stack.

Abstract: The wedge removal apparatus includes an elongated frame having telescopic elements at opposite ends with cylinders to engage pads along opposite sides of the frame against diametrically opposed wedges of stator core slots. The frame mounts a linear drive assembly carrying a carriage for longitudinal movement relative to the drive assembly and frame. The carriage mounts diametrically opposed heads and a cylinder displaces the heads radially outwardly to engage the wedges and compress underlying ripple springs. Saws carried by the heads cut through the wedges as the carriage is displaced along the frame and without binding because of the force applied to the wedges compressing the ripple springs. The linear drive assembly is rotated to discrete circumferential positions to cut the wedges of additional diametrically opposed slots.

Abstract: A method of fabricating a ridge waveguide filter having a slow-wave structure. The ridge waveguide is formed of a conductive sidewall-from metallic materials and may be in the form of a hollow tube, such as a rectangular hollow tube or a circular hollow tube, for example. The method comprises the steps of: forming a conductive body portion of an elongate hollow tube, wherein the body portion has an open top a bottom wall, two opposing side walls and an open top; providing a substrate having a top surface onto which a plurality of photoresist layers are formed; etching the top surface of the substrate to form a plurality of trenches in the substrate; plating the etched substrate surface with a layer of conductive material; and attaching the etched substrate to the conductive body portion to cover the open top of the conductive body portion.

Abstract: The present invention features a novel design for a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided.

Abstract: Methods for making electronic devices with small functional elements supported on a carrier are presented. One method of making an electronic assembly is by first providing the following: a web of flexible material having a plurality of recesses, where each of the recesses containing an RFID chip, a flexible substrate having antennas, straps from the web by a web process, where each of the straps includes at least one RFID chip and a portion of the flexible material. The electronic assembly is formed by attaching the straps to the antennas so that each of the straps is coupled to one of the antennas and the density of the RFID chips on the web is higher than a density of the antennas on the flexible substrate. Other methods of making electronic devices with small functional elements supported on a carrier are disclosed.