Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.

Abstract: A method for producing internal antenna components for small radio devices. A radiator is supported by a flat-topped protrusion formed in a plastic blank—e.g., by pressing with a hot tool. The length of the protrusion sets the height of the planar antenna. The radiator and its conductors are formed by removing material from a conducting film attached to the top of the protrusion. A feed and a shorting conductor are formed as extensions of the radiator. Contacts are attached to the feed and the shorting conductor to connect the antenna component to the radio device. Elongated gaps made in the plastic blank around the edges of the protrusion can facilitate loosening of the component. A plurality of antenna components can be formed on a uniform plastic blank and placed in a common package. The method results in low manufacturing costs and quick production time.

Abstract: A process is provided for the production of a superconducting cable having a single cable core that contains at least one elongated superconducting element and a flexible tube that which surrounds the cable core. The process includes continuously pulling the single cable core from a supply unit, continuously pulling a metal strip from a strip supply unit and continuously forming a slotted tube around the cable care with the metal strip to form a slotted tube. The longitudinal slot of the slotted tube is welded shut corrugating the welded tube with the cable core inside the tube. The then semi-finished superconducting cable is wound in at least one turn on a cable drum, and the ends of the cable core are mechanically joined to the ends of the corrugated tube while the cable is on the cable drum.

Abstract: A method and apparatus are provided for servicing a telecommunication junction box. The method enables a reduced number of tools to be utilized to service a telecommunication junction box.

Abstract: Conductive circuits and methods of making conductive circuits are disclosed.

Abstract: A method and electrical structure for separating electronic components from one another joined by solder interconnections. An electronic module is joined to a substrate via a solder interconnection, whereby the electronic module has an electrical heating component residing within a bottom layer thereof adjacent a solder interconnection. Preferably, a chip carrier is joined to a board whereby the chip carrier has an electrical mesh plane for heating adjacent the solder interconnection. Resistive heat is generated within this electrical heating component either by applying an electrical current to the electrical heating component, or by non-contact inductively heating the layer in which such electrical heating component resides to generate resistive heat within the electrical heating component. The resistive heat is transferred to the solder interconnection to allow for localized melting of the solder interconnection and removal of the electronic components from one another.

Abstract: Disclosed is a method of manufacturing a catheter or lead having electrically conductive traces and external electrical contacts. Each trace may be in electrical connection with one or more external electrical contacts. More specifically, each trace is typically electrically connected to a single contact. The traces and contacts may assist in diagnosis and/or detection of bio-electric signals emitted by organs, and may transmit such signals to a connector or diagnostic device affixed to the catheter. The external contacts may detect bioelectric energy or may deliver electrical energy to a target site.

Abstract: An iron core of a rotating-electric machine and a manufacturing method for the same permit a uniform curvature to be easily obtained over an entire circumference of the iron core. The iron core has laminated magnetic plate strips, a cylindrical core proximal portion, a plurality of teeth projecting in a substantially radial direction from the core proximal portion, and slots for accommodating a winding that are located between the teeth adjacent to each other. The iron core is fabricated by curving both end portions of a substantially hexahedral laminate so that the core proximal portion obtains a predetermined curvature, forming the entire laminate into a cylindrical shape by wrapping it around a cylindrical core member so that distal ends of the teeth project from the core proximal portion, and joining both end portions of the laminate.

Abstract: A method of producing at least one thick film element, including depositing a material on a surface of at least one first substrate to form at least one thick film element structure having a thickness of approximately greater than 10 ?m to 100 ?m. Then, then the at least one thick film element structure is bonded to a second substrate, and the at least one first substrate is removed from the at least one thick film element structure using a lift-off process employing radiation energy. The lift-off process including emitting, from a radiation source, a radiation beam through the first substrate to an attachment interface formed between the first substrate and the at least one thick film element structure at the first surface of the first substrate. The first substrate being substantially transparent at the wavelength of the radiation beam, permitting the radiation beam to generate sufficient energy at the interface to break the attachment.

Abstract: A method for producing and tuning a packaged integrated circuit a) incorporates into a packaged integrated circuit design, at least one tunable circuit feature; b) fabricates a packaged integrated circuit in accordance with said packaged integrated circuit design; c) identifies a trimming point on the tunable circuit feature of said packaged integrated circuit, using an x-ray inspection system; d) relates coordinates of the trimming point to coordinates of a visible reference marker; e) utilizes the relationship between the visible reference marker and the trimming point to position a cutting tool over the trimming point; and f) utilizes the cutting tool to make one or more cuts into the packaged integrated circuit, until the tunable circuit feature has been acceptably modified at the trimming point.

Abstract: An apparatus for securing wire connectors includes a rotatable cylindrical member defining at least one chamber configured to store at least one wire connector. A frame supporting the rotatable cylindrical member is detachably mountable on a drill. A dispensing housing mounted on the frame receives the wire connector from the chamber and dispenses the wire connector though an outlet after a rotator twistably engages and secures the wires onto the wire connector. The rotator is selectively rotatable by actuating the drill when the end of a wire is inserted into the wire connector, the wire connector thereby engaging the rotator.

Abstract: The invention relates to a method for manufacturing a permanent-magnet excited rotor for a high speed electric motor, according to which method a support sleeve (1) is mounted with a pre-tension around the rotor body (2), characterised in that the sleeve is expanded by a liquid that solidifies and is solid at the working temperatures of the rotor, said liquid is injected under pressure between the sleeve and the rotor body and held under pressure during solidification.

Abstract: A method and machine-readable medium are described for a flexible tape constructed of a material suitable to convey electronic devices through an entire manufacturing process without removing the electronic packages from the tape. According to one embodiment, part receiving areas are located within the tape. Each part receiving area is suitable to hold an electronic device. A retention channel encompasses each part receiving area. The retention channel extends substantially an entire length along each edge of each part receiving area. The retention channel comprises an upper tab and a lower tab wherein the upper tab is flush with an upper surface of the flexible tape and extends into the part receiving area and the lower tab extends below a lower surface of the flexible tape and into the part receiving area.

Abstract: An index head assembly for a semiconductor device test handler is provided which allows for precise positioning of a device in a test socket, as well as accurate testing of the device once properly positioned in the test socket. The head portion of the index head assembly includes a holding part which absorbs and holds the device using a vacuum force, a heating part which generates heat to maintain the device at the appropriate temperature, and a compliance part which accurately aligns and positions the index head relative to the test socket so that the device may be properly connected to the test socket. The downward force used to connect the semiconductor device to the test socket is controlled by a force transducer, and the temperature of the semiconductor device is accurately controlled through direct heat transfer from an electric heater provided within the head portion of the index head assembly.

Abstract: A method of producing a winding from electric conductors received in slots formed in a stator core has the steps of forming a first copying surface at an end of each slot on the end surface of the stator core so as to be curved along a bending direction of the electric conductors, a step of forming a second copying surface on each of bending members, inserting each bending member into an area between two slots adjacent to each other such that the second copying surface is curved along the bending direction of the electric conductors and a successively-curved shape is formed out of both the first copying surface and the second copying surface, and bending each electric conductor along the first copying surface and the second copying surface in the successively-curved shape.

Abstract: A bonding device. A plurality of bonding units each has a base and a fastening member. Each base has a first connecting portion, a second connecting portion, and a stopper. An electronic device has a circuit unit and a predetermined element. The circuit unit has several first positioning portions and the predetermined element has several second positioning portions. The first positioning portions and the second positioning portions are through holes. When the predetermined element is attached to the upper surface of the circuit unit by aligning the second positioning portions with the corresponding first positioning portions, the second connecting portion of the base is first fit into the first positioning portions of the circuit unit, then the fastening member passes through the second positioning portion of the predetermined element to couple with the fastening member by several turns. Thus, the predetermined element is fixed on the circuit unit.

Abstract: A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert molding the former into the latter to form recessed circuitry; then baked and solidified, sandblasted to remove film for the conductive material to become conducted circuitry; the lamination made by layer for achieving even thinner PBC circuitry while maintaining sufficient structural strength.

Abstract: A stacked piezoelectric element is produced by alternately stacking a piezoelectric layer and an inner electrode layer. The method includes producing a green sheet 110 for a base, forming a unit body 3 having a narrow stacked part 30 where a narrow piezoelectric material layer 115 having an area smaller than the green sheet 110 for base and an electrode material layer 20 having an area smaller than the green sheet 110 for base are stacked, the unit body being formed by disposing the narrow stacked part 30 on the green sheet 110 for base; forming a stacked body having groove parts by stacking a plurality of the unit bodies 3, the groove part having the bottom being defined by the side face of the narrow stacked part 30; and firing the stacked body.

Abstract: Methods for manufacturing electrochemical sensors are described. The sensors have a working electrode and a counter electrode, which are planar, and optionally an indicator electrode. The sensor includes a sample chamber to hold a sample of no more than 1 ?L in electrolytic contact with the working electrode. The methods provide sensors that can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry.

Abstract: A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A metal paste is filled into the conductive openings and the thermal conductive openings. The green tapes are stacked together so that the metal paste inside the conductive openings and the thermal conductive openings of every green tape is in contact respectively with its neighboring metal paste within the conductive openings and thermal conductive openings of the green tapes. Cofire those green tapes and the metal paste to form a pre-substrate. The pre-substrate comprises an insulating structure, a plurality of thermal conductive plugs and conductive plugs.