Patents by Inventor Ping Wang

Ping Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12128504
    Abstract: The present invention discloses a method of constructing a high-frequency vibratory stress relief device for eliminating residual stress of a small work-piece. The method comprises the following steps: fabricating a high-frequency vibration energy amplification device; fabricating a clamping device; mounting the high-frequency vibration energy amplification device; obtaining surface residual stress distribution on the small work-piece by means of X-ray diffraction; establishing a finite element model of the small work-piece; determining a target frequency f, determining the structural dimensions of the high-frequency vibration energy amplification device; analyzing the displacement mode to obtain loci of the vibration node lines and number of the vibration node lines; clamping the small work-piece; attaching strain gauges; connecting all devices.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: October 29, 2024
    Inventors: Bangping Gu, Ping Wang, Haoran Wu, Xiong Hu, Jiayi Zhuang, Siqi Wang, Zhipeng Huo, Zhongshan Wang
  • Patent number: 12133474
    Abstract: A method of fabricating magnetoresistive random access memory, including providing a substrate, forming a bottom electrode layer, a magnetic tunnel junction stack, a top electrode layer and a hard mask layer sequentially on the substrate, wherein a material of the top electrode layer is titanium nitride, a material of the hard mask layer is tantalum or tantalum nitride, and a percentage of nitrogen in the titanium nitride gradually decreases from a top surface of top electrode layer to a bottom surface of top electrode layer, and patterning the bottom electrode layer, the magnetic tunnel junction stack, the top electrode layer and the hard mask layer into multiple magnetoresistive random access memory cells.
    Type: Grant
    Filed: September 27, 2023
    Date of Patent: October 29, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Chin-Yang Hsieh, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, Jing-Yin Jhang, I-Ming Tseng, Yu-Ping Wang, Chien-Ting Lin, Kun-Chen Ho, Yi-Syun Chou, Chang-Min Li, Yi-Wei Tseng, Yu-Tsung Lai, Jun Xie
  • Patent number: 12132247
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: October 29, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yen-Ping Wang, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu, Chung-Yi Hsu
  • Publication number: 20240353452
    Abstract: A voltage detection method includes: outputting a corresponding one of voltages to be an input voltage according to a clock signal, a first detection signal, a reset signal and multiple first bits; generating the reset signal according to the clock signal and multiple currents, wherein the voltages and the currents are generated based on a power supply voltage; comparing the input voltage with a reference voltage to generate a second detection signal, and generating the first detection signal according to the second detection signal and an enable signal; and adjusting the first bits by a digital circuit according to the second detection signal during a trimming phase to determine the first bits, and outputting the first bits by the digital circuit and resetting the digital circuit according to the first detection signal during a voltage detection phase.
    Type: Application
    Filed: March 29, 2024
    Publication date: October 24, 2024
    Inventors: Jian Feng XUE, Xiang ZHANG, Zhun CHEN, Wei-Ping WANG, Chih Liang WANG
  • Publication number: 20240353815
    Abstract: Automatic methods and robotic system for processing workpieces are provided. A method for locally re-shaping a moldable workpiece includes receiving data in an input module indicating a present form of the workpiece; providing a robot configured to pass the workpiece through a machine; determining, with a control module, a path of the robot based on the present form of the workpiece and a target form of the workpiece; and performing a finishing process by passing, with the robot, the workpiece through the machine along the path, wherein the machine re-shapes the workpiece with the target form.
    Type: Application
    Filed: April 21, 2023
    Publication date: October 24, 2024
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Joshua Solomon, Hui-ping Wang, Lu Huang, Joel S. Hooton, Dohyun Leem
  • Publication number: 20240354999
    Abstract: A scene encoding generating apparatus is configured to execute the following operations. The scene encoding generating apparatus generates a local coordinate system based on a position and a movement state corresponding to each of a plurality of obstacles in a time point. The scene encoding generating apparatus transforms the position and the movement state corresponding to each of the obstacles to the corresponding local coordinate system to generate a local position and a local movement state. The scene encoding generating apparatus generates an obstacle tensor corresponding to the obstacles based on the local positions and the local movement states corresponding to the obstacles, wherein the obstacle tensor is corresponding to the time point. The scene encoding generating apparatus inputs the obstacle tensor into a scene encoder to generate a scene encoding, wherein the scene encoding is configured to be inputted into a decoder to generate a trajectory prediction.
    Type: Application
    Filed: April 12, 2024
    Publication date: October 24, 2024
    Inventors: Zi-Kang ZHOU, Jian-Ping WANG, Yung-Hui LI
  • Patent number: 12127143
    Abstract: The present invention relates to a consensus-based clock synchronization skew estimation method based on sequential least squares, and belongs to the technical field of wireless sensor networks. The method is to establish a relationship model of clock information and time delay between nodes with respect to a bounded random communication time delay scenario subject to arbitrary distribution, fully consider all clock information received by a node from a neighbor, build a clock parameter estimation model and a cost function based on a least squares principle, iteratively estimate relative clock skew by a sequential least squares method, and update logical clock parameters of nodes by a consensus-based clock synchronization method, so as to achieve global clock consistency of all nodes in a network in a completely distributed way.
    Type: Grant
    Filed: June 15, 2021
    Date of Patent: October 22, 2024
    Assignee: Chongqing University of Posts and Telecommunications
    Inventors: Heng Wang, Pengfei Gong, Ping Wang
  • Patent number: 12123134
    Abstract: The present disclosure discloses application of a deep eutectic solvent in textile dyeing, belonging to the technical field of ecological dyeing and finishing of textiles. A natural hydrophobic deep eutectic solvent system (HDES) is first used as a dyeing medium to perform reactive dyeing on cotton. Firstly, the prepared natural hydrophobic deep eutectic solvent is mixed with a small amount of dye aqueous solution at high speed to prepare dye liquor, and then cotton fabric soaked with alkali liquor is put into a dye bath for dyeing. The dyeing method doesn't require addition of inorganic salts and other dyeing auxiliaries, but uses a small amount of water and alkali agent to achieve the same dyeing effect as traditional water bath, and the dyeing medium is safe and environment-friendly. After dyeing, cyclic dyeing can be achieved by simply separating the dye bath, which truly realizes green dyeing of reactive dyes.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: October 22, 2024
    Assignee: Jiangnan University
    Inventors: Qiang Wang, Yimin Wei, Ping Wang, Yuanyuan Yu, Man Zhou, Zhe Jiang
  • Publication number: 20240349259
    Abstract: Systems and methods for wireless sidelink communications may include a first wireless communication device which establishes a sidelink (SL) session with a second wireless communication device. The first wireless communication device may reserve a block of SL slots for transmission of traffic between the first wireless communication device and the second wireless communication device. The first wireless communication device may transmit, to the second wireless communication device, the traffic of the SL session in the block of SL slots.
    Type: Application
    Filed: February 13, 2024
    Publication date: October 17, 2024
    Applicant: Meta Platforms Technologies, LLC
    Inventors: Yi Lu, Qi Qu, Ping Wang, Qing Zhao
  • Patent number: 12116472
    Abstract: Disclosed is a molded article, wherein the article has at least one layer having a wood grain-like appearance, wherein the layer comprises: a) a first thermoplastic material that is selected from the group consisting of: polyethylene (PE), polypropylene (PP), copolymers thereof, and any combinations thereof; and b) a second polymer material that is at least partially immiscible with said first thermoplastic material, in which said second polymer material is selected from the group consisting of: polyamide, polyethylene terephthalate (PET), copolymers thereof, and any combinations thereof; wherein said second polymer material has a Solubility Parameter (?) of from about 10 (cal1/2cm?3/2) to about 20 (cal1/2cm?3/2), and a melting point of from about 194° C. to about 280° C. The present invention also relates to a mixture of masterbatches used for manufacturing the above molded articles, and a method of manufacturing the above molded articles.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: October 15, 2024
    Assignee: The Procter & Gamble Company
    Inventors: Liang Yang, Ping Wang, Ruizhi Pei
  • Patent number: 12119268
    Abstract: A method for forming a semiconductor device includes: forming a gate structure over a fin, where the fin protrudes above a substrate; forming an opening in the gate structure; forming a first dielectric layer along sidewalls and a bottom of the opening, where the first dielectric layer is non-conformal, where the first dielectric layer has a first thickness proximate to an upper surface of the gate structure distal from the substrate, and has a second thickness proximate to the bottom of the opening, where the first thickness is larger than the second thickness; and forming a second dielectric layer over the first dielectric layer to fill the opening, where the first dielectric layer is formed of a first dielectric material, and the second dielectric layer is formed of a second dielectric material different from the first dielectric material.
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: October 15, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Ping Wang, Ting-Gang Chen, Bo-Cyuan Lu, Tai-Chun Huang, Chi On Chui
  • Publication number: 20240340986
    Abstract: A data transmission management method is applied to a first electronic device that has a first link with a wireless access point. The method includes: determining, in response to a user operation, a second electronic device that performs data transmission with the first electronic device, where a second link exists between the second electronic device and the wireless access point; establishing a third link configured to perform data transmission with the second electronic device; and when a first preset condition is met, establishing a fourth link connected to the second electronic device and disconnecting the first link; or when a first preset condition is met, establishing a fourth link connected to the second electronic device and maintaining the first link, where a frequency band in which the third link is located is different from a preset frequency band. In embodiments of this application, data transmission efficiency can be improved.
    Type: Application
    Filed: April 23, 2023
    Publication date: October 10, 2024
    Inventors: Zhongli Zhang, Ping Wang
  • Patent number: 12111293
    Abstract: A system for evaluating a rigidity of an angle bracket includes a test system having a first test fixture and a second test fixture. The system includes an angle bracket coupon including a first wall, a second wall coupled to the first wall at a bend to define an angle between the first wall and the second wall, and at least one three dimensional feature defined at the bend that extends between the first wall and the second wall. The angle bracket coupon is to be coupled to at least one of the first test fixture and the second test fixture to evaluate the rigidity of the angle bracket.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: October 8, 2024
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Joshua Lee Solomon, Hui-ping Wang, Bradley J Blaski, Vivian Vasquez, Lu Huang, Dohyun Leem, Jian Cao
  • Patent number: 12113122
    Abstract: A method includes forming isolation regions extending into a semiconductor substrate, wherein semiconductor strips are located between the isolation regions, and forming a dielectric dummy strip between the isolation regions, recessing the isolation regions. Some portions of the semiconductor strips protrude higher than top surfaces of the recessed isolation regions to form protruding semiconductor fins, and a portion of the dielectric dummy strip protrudes higher than the top surfaces of the recessed isolation regions to form a dielectric dummy fin. The method further includes etching the dielectric dummy fin so that a top width of the dielectric dummy fin is smaller than a bottom width of the dielectric dummy fin. A gate stack is formed on top surfaces and sidewalls of the protruding semiconductor fins and the dielectric dummy fin.
    Type: Grant
    Filed: March 3, 2023
    Date of Patent: October 8, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Yao Lin, Pei-Hsiu Wu, Chih Ping Wang, Chih-Han Lin, Jr-Jung Lin, Yun Ting Chou, Chen-Yu Wu
  • Publication number: 20240329037
    Abstract: Provided are systems and methods pertaining to analyte detection, including analytes related to SARS-COV-2, such as nucleocapsid protein. The disclosed systems and methods operate by forming a complex between an analyte, a promoter tag, and an anchor and detecting a reaction product that results from the reaction between a reaction substrate and a reaction promoter of the complex. Also provided are systems and methods that allow for quantification of analyte presence by way of monitoring indicator that is displaced by a reaction associate with the analyte.
    Type: Application
    Filed: March 12, 2021
    Publication date: October 3, 2024
    Inventors: Ping Wang, Zhao Li, Hui Chen
  • Patent number: 12108680
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a cap layer adjacent to the MTJ and extended to overlap a top surface of the MTJ, a top electrode on the MTJ, a metal interconnection under the MTJ, a first inter-metal dielectric (IMD) layer around the MTJ, and a second IMD layer around the metal interconnection. Preferably, the cap layer is adjacent to the top electrode and the MTJ and on the second IMD layer and a top surface of the cap layer is higher than a top surface of the first IMD layer.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: October 1, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Hung-Yueh Chen, Yu-Ping Wang
  • Patent number: 12105705
    Abstract: Embodiments of the present disclosure describe an approach for database query processing with database clients. According to the approach, a first set of queries are obtained from a plurality of clients in communication with a database server. A second set of queries are generated by normalizing the first set of queries. A set of access paths corresponding to the second set of queries are determined for retrieving data from at least one of the plurality of clients and the database server. Data is retrieved from at least one of the plurality of clients and the database server based on the set of access paths.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: October 1, 2024
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shuo Li, Xiaobo Wang, Sheng Yan Sun, Ping Wang
  • Publication number: 20240321591
    Abstract: An electronic package and a method for fabrication the same are provided. The method includes: disposing an electronic component on a substrate; forming an encapsulant layer on the substrate to encapsulate the electronic component; and forming a shielding layer made of metal on the encapsulant layer. The shielding layer has an extending portion extending to a lateral side of the substrate along a corner of the encapsulant layer, without extending to a lower side of the substrate. Therefore, the present disclosure prevents the shielding layer from coming into contact with conductive pads disposed on the lower side of the substrate and thereby avoids a short circuit from occurrence.
    Type: Application
    Filed: June 3, 2024
    Publication date: September 26, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Shu-Chi CHANG, Wei-Ping WANG, Hsien-Lung HSIAO, Kaun-I CHENG
  • Publication number: 20240324472
    Abstract: A semiconductor device includes: a substrate comprising a magnetic tunneling junction (MTJ) region and a logic region; a first MTJ on the MTJ region; a first metal interconnection on the logic region; and a cap layer extending from a sidewall of the first MTJ to a sidewall of the first metal interconnection. Preferably, the cap layer on the MTJ region and the cap layer on the logic region comprise different thicknesses.
    Type: Application
    Filed: May 30, 2024
    Publication date: September 26, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Hui-Lin Wang, Yu-Ping Wang, Chen-Yi Weng, Chin-Yang Hsieh, Si-Han Tsai, Che-Wei Chang, Jing-Yin Jhang
  • Publication number: 20240314636
    Abstract: Disclosed herein are systems and method for providing quality of service to data streams transmitted via a single protocol stream. A scheduler of a sender can receive profiles corresponding to streams of data generated by an application of the sender. The scheduler can receive, from a receiver receiving the streams of data, congestion information of some the streams of data. The scheduler can determine, according to the congestion information and the profiles, a priority of a first stream with respect to a second stream of the streams of data, for a single protocol stream. An assembler of the sender can generate a plurality of packets of the single protocol stream using first packets of the first stream and second packets of the second stream in accordance with the priority. The sender can transmit to the receiver, the single protocol stream comprising the plurality of packets.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 19, 2024
    Inventors: Jimin Liu, Curt Wong, Yi Lu, Jiansong Wang, Ping Wang, Qi Qu