Abstract: An intelligent bed monitoring device and method are provided in this disclosure. The device is applied to a bed frame, and the bed frame includes a first bed board and a second bed board. The intelligent bed monitoring device includes a plurality of audio sensors, a processor and a controlling module. The processor is electrically connected to the audio sensors and the controlling module. The audio sensors are configured to detect a plurality of audio signals. The processor is configured to receive the audio signals, and calculate an audio source direction according to the audio signals. The controlling module is configured to control one of the first bed board and the second bed board according to the audio source direction to adjust one of the first bed board and the second bed board into a plurality of modes.

Abstract: A wiring structure includes an upper conductive structure, a lower conductive structure, an intermediate layer and at least one through via. The upper conductive structure includes at least one upper dielectric layer and at least one upper circuit layer in contact with the upper dielectric layer. The lower conductive structure includes at least one lower dielectric layer and at least one lower circuit layer in contact with the lower dielectric layer. The intermediate layer is disposed between the upper conductive structure and the lower conductive structure and bonds the upper conductive structure and the lower conductive structure together. The through via extends through the upper conductive structure, the intermediate layer and the lower conductive structure.

Abstract: A lens driving apparatus is for driving a lens assembly and includes a base, a metal cover, a carrier, a first coil, at least one first magnet, at least one second magnet, a frame and a spring set. At least one lower leaf spring of the spring set includes a frame connecting section, a carrier connecting section and a resilient section. The carrier connecting section and the second magnet are arranged along the first direction. The carrier connecting section includes an opening portion and a shielding portion, and the opening portion and the shielding portion both corresponding to the second magnet along the first direction are respectively for a part of the second magnet to be exposed through the opening portion and another part of the second magnet to be shielded by the shielding portion.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; removing the sacrificial layer to form a recess; forming a barrier layer and a free layer in the recess; forming a top electrode layer on the free layer; and patterning the top electrode layer and the free layer to form a second MTJ.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a metal interconnection in the first IMD layer; forming a bottom electrode layer and a pinned layer on the first IMD layer; forming a sacrificial layer on the pinned layer; patterning the sacrificial layer, the pinned layer, and the bottom electrode layer to form a first magnetic tunneling junction (MTJ); forming a second IMD layer around the first MTJ; and removing the sacrificial layer.

Abstract: A lens assembly module includes a base, a cover, a lens unit, an elastic element, at least two conductive elements, at least one AF coil element and at least two first magnetic elements. The cover is coupled to the base. The lens unit is movably disposed in the cover. The elastic element is coupled to the lens unit. The conductive elements are coupled to the lens unit. The AF coil element is disposed on the lens unit, and two ends of the AF coil element are electrically connected to the conductive elements, respectively. The first magnetic elements are disposed in the cover. A part of each of the inner portions is overlapped along a direction parallel to an optical axis and electrically connected to each conductive element. The AF coil element and the conductive elements are electrically connected by a welding method.

Abstract: A camera module includes a plastic carrier, an imaging lens assembly, a reflective element and a plurality of auto-focusing elements. The plastic carrier includes an inner portion and an outer portion, wherein an inner space is defined by the inner portion, and the outer portion includes at least one mounting structure. The imaging lens assembly is disposed in the inner space of the plastic carrier. The reflective element is for folding an image light by a reflective surface of the reflective element into the imaging lens assembly. The auto-focusing elements include at least two magnets and at least one wiring element, wherein the auto-focusing elements are for moving the plastic carrier along a second optical axis of the imaging lens assembly, and the magnets or the wiring element can be disposed on the mounting structure of the outer portion.

Abstract: A method for fabricating a static random access memory (SRAM) includes the steps of: forming a gate structure on a substrate; forming an epitaxial layer adjacent to the gate structure; forming a first interlayer dielectric (ILD) layer around the gate structure; transforming the gate structure into a metal gate; forming a contact hole exposing the epitaxial layer, forming a barrier layer in the contact hole, forming a metal layer on the barrier layer, and then planarizing the metal layer and the barrier layer to form a contact plug. Preferably, a bottom portion of the barrier layer includes a titanium rich portion and a top portion of the barrier layer includes a nitrogen rich portion.

Abstract: The disclosure provides a light cabinet, including multiple light boards and multiple light-board controllers. The light boards form a first light-board array of the light cabinet. The light-board controllers are arranged one-to-one on the light boards. The light-board controllers of the light boards in a first column of the first light-board array are connected in series to form a first controller string. The output terminal of the first controller string is connected electrically to an input terminal of a second controller string in a corresponding column of a second light-board array of another light cabinet. The input terminal of the first controller string is connected electrically to a first output terminal of a video data splitter (or an output terminal of a third controller string in a corresponding column of a third light-board array of yet another light cabinet).

Abstract: A camera module includes a metal yoke, a holding base, a plastic barrel, a plurality of plastic lens elements, a leaf spring pair and a coil element. The holding base is connected to the metal yoke and defines an inner space. The holding base has a through hole which is corresponding to an opening of the metal yoke. The plastic barrel is movably disposed in the inner space. The plastic lens elements are disposed in the plastic barrel. The leaf spring pair includes two leaf springs which are located on a same plane and connected to the plastic barrel. The coil element surrounds an outer surface of the plastic barrel and electrically connected to the leaf spring pair, wherein two ends of the coil element is connected to the leaf springs by a thermal pressing method.

Abstract: The present invention provides a wireless communication method of a wireless device, wherein the wireless device includes a first wireless module and a second wireless module, and the wireless communication method includes the steps of: using the first wireless module to receive frame exchange information from the second wireless module, wherein the frame exchange information comprises timing of signal transmission and signal reception of the second wireless module; and scheduling signal transmission and signal reception of the first wireless module according to the frame exchange information of the second wireless module.

Abstract: The disclosure provides a drive device including a gear, a bearing, and a motor rotor. The gear includes an installation hole. The bearing is disposed in the installation hole of the gear and includes a rotation hole, a sliding groove, and a drive assembly. The sliding groove communicates with the rotation hole, and the drive assembly is movably disposed in the sliding groove. The motor rotor rotatably passes through the rotation hole of the bearing. The drive assembly is moved to lock the bearing by the rotation of the motor rotor, and the torsion force of the motor rotor is transmitted to the gear through the bearing.

Abstract: An imaging lens module includes an imaging lens unit, an optical folding component and a sensing magnet group. The imaging lens unit has an optical axis. The optical folding component is configured to fold an incident optical path into the imaging lens unit to coincide with the optical axis. The sensing magnet group includes two sensing magnets that are sequentially disposed on the imaging lens unit along a direction in parallel with the optical axis. The sensing magnets are located at the same side with respect to a reference plane that passes through the optical axis and has a normal direction perpendicular to the optical axis. When the sensing magnets are observed from the direction in parallel with the optical axis, images of the sensing magnets are at least partially overlapped. Two adjacent magnetic poles of the sensing magnets are like poles between which there is a repulsive force.

Abstract: A packaging semiconductor device, such as a fan-out Wafer-Level Packaging (FOWLP) device, is fabricated by providing a semiconductor device (20) having conductive patterns (22) disposed on a first surface and then forming, on the conductive patterns, photoresist islands (24) having a first predetermined shape defined by a first critical width dimension and a minimum height dimension so that a subsequently-formed dielectric polymer layer (26) surrounds but does not cover each photoresist island (24), thereby allowing each photoresist island to be selectively removed from the one or more conductive patterns to form one or more via openings (28) in the dielectric polymer layer such that each via opening has a second predetermined shape which matches at least part of the first predetermined shape of the photoresist islands.

Abstract: A MOSFET structure including stacked vertically isolated MOSFETs and a method for forming the same are disclosed.

Abstract: A speaker includes a sound box, a speaker module, and a heat pipe. The sound box includes a first opening and a second opening. The speaker module is hermetically connected to the first opening. The heat pipe is hermetically connected to the second opening. The heat pipe includes a first end and a second end. The first end is located in the sound box. The second end is exposed to the second opening. The speaker module is fixedly connected to at least part of an outer wall of the heat pipe. In the speaker, a hollow heat pipe is fixedly connected to the speaker module, and vibration of the speaker module drives air in the heat pipe to flow to dissipate heat from the heat pipe. Further, the cold heat pipe carries heat away from the speaker module through heat transfer, thereby dissipating heat from the speaker.

Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.

Abstract: The disclosure provides an image uniformity compensation device. The image uniformity compensation device includes a local pre-compensation circuit, a chromaticity uniformity compensation circuit, a local post-compensation circuit, and a luminance uniformity correction circuit. A local pre-conversion performed by the local pre-compensation circuit includes the following. An image frame is divided into multiple regions, and each of the regions is converted from an optical non-linear domain to an optical linear domain to generate a corresponding region in multiple regions of a converted frame. A local post-conversion performed by the local post-compensation circuit includes the following. An image frame is divided into multiple regions, and each of the regions is converted from the optical linear domain to the optical non-linear domain to generate a corresponding region in multiple regions of a converted frame.

Abstract: A quick-release tool connection rod is provided, including a main member, a sleeve and at least one locking mechanism. The sleeve is movably on the main member. The at least one locking mechanism includes a skew guide face, an elongate hole and a locking ball, the skew guide face is disposed on the sleeve, the elongate hole is disposed on the main member, and the locking ball is disposed in the elongate hole.

Abstract: A camera driving module includes: a base including a central opening; a casing disposed on the base and including an opening hole corresponding to the central opening; a lens unit movably disposed on the casing; and a focus driving part. The focus driving part includes a carrier, an AF coil element, at least two permanent magnets and a Hall element. The carrier is disposed on the lens unit and movable in a direction parallel to an optical axis. The AF coil element is fixed to the base and faces toward the carrier. The permanent magnets are fixed on one side of the carrier facing toward the base and disposed opposite to each other about the optical axis. The Hall element faces toward a corresponding surface of one of the permanent magnets. The AF coil element and the corresponding surfaces are arranged in the direction parallel to the optical axis.