Semiconductor module

- ROHM CO., LTD.
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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor module showing my design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a tight side view thereof, the left side vim being an identical image of FIG. 7.

Claims

The ornamental design for a semiconductor module, as shown and described.

Referenced Cited
U.S. Patent Documents
5337216 August 9, 1994 McIver
D359028 June 6, 1995 Siegel
D459705 July 2, 2002 Yokota
D466485 December 3, 2002 Maehara
D505400 May 24, 2005 Kawafuji
D770994 November 8, 2016 Hasegawa
D859334 September 10, 2019 Yokoyama
D902877 November 24, 2020 Hirata
20210217741 July 15, 2021 Ishimatsu
Other references
  • International Registration No. DM/209,494, Date of the international registration: Jul. 22, 2020 (49 pages).
  • Office Action issued for Chinese Patent Application No. 202230025877.1, dated Jul. 19, 2023, 3 pages including English machine translation.
Patent History
Patent number: D1031652
Type: Grant
Filed: Jan 20, 2022
Date of Patent: Jun 18, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Hideo Hara (Kyoto)
Primary Examiner: Derrick E Holland
Application Number: 29/823,890