Semiconductor module
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Description
Claims
The ornamental design for a semiconductor module, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
5337216 | August 9, 1994 | McIver |
D359028 | June 6, 1995 | Siegel |
D459705 | July 2, 2002 | Yokota |
D466485 | December 3, 2002 | Maehara |
D505400 | May 24, 2005 | Kawafuji |
D770994 | November 8, 2016 | Hasegawa |
D859334 | September 10, 2019 | Yokoyama |
D902877 | November 24, 2020 | Hirata |
20210217741 | July 15, 2021 | Ishimatsu |
- International Registration No. DM/209,494, Date of the international registration: Jul. 22, 2020 (49 pages).
- Office Action issued for Chinese Patent Application No. 202230025877.1, dated Jul. 19, 2023, 3 pages including English machine translation.
Patent History
Patent number: D1032517
Type: Grant
Filed: Jan 20, 2022
Date of Patent: Jun 25, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Hideo Hara (Kyoto)
Primary Examiner: Derrick E Holland
Application Number: 29/823,888
Type: Grant
Filed: Jan 20, 2022
Date of Patent: Jun 25, 2024
Assignee: ROHM CO., LTD. (Kyoto)
Inventor: Hideo Hara (Kyoto)
Primary Examiner: Derrick E Holland
Application Number: 29/823,888
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)