Semiconductor module

Description

FIG. 1 is a front, top and right side perspective view of a first embodiment of a semiconductor module showing my design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a tight side view thereof, the left side view being an identical image of FIG. 7;

FIG. 8 is a front, top and right side perspective view of a second embodiment of a semiconductor module showing my design;

FIG. 9 is a rear, bottom and left side perspective view thereof;

FIG. 10 is a front view thereof;

FIG. 11 is a rear view thereof;

FIG. 12 is a top plan view thereof;

FIG. 13 is a bottom plan view thereof; and,

FIG. 14 is a right side view thereof, the left side view being an identical image of FIG. 14.

The broken lines illustrate portions of the semiconductor module that form no part of the claimed design. The member illustrated with fine, diagonal, parallel lines is transparent.

Claims

The ornamental design for a semiconductor module, as shown and described.