Gripper for semiconductor wafer housing cassette
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The even dashed broken lines shown in the drawings represent portions of the gripper for the semiconductor wafer housing cassette that form no part of the claimed design. The long dashed and short dashed line indicates only a boundary between the claimed and unclaimed surface and forms no part of the claimed design.
Claims
The ornamental design for a gripper for a semiconductor wafer housing cassette, as shown and described.
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Type: Grant
Filed: May 7, 2021
Date of Patent: Oct 15, 2024
Assignee: OMRON CORPORATION (Kyoto)
Inventors: Tomohiro Okada (Ritto), Takahiro Inoue (Kusatsu), Takeshi Maehiro (Neyagawa)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/782,610